Water cooling plate with micro-channel structure

Abstract

The utility model discloses a water cooling plate with a micro-channel structure. The water cooling plate comprises a cover plate and a channel cavity plate, a cavity is formed in the runner cavity plate; inner partition plates for dividing the cavity into a plurality of heat exchange cavities are arranged in the cavity, and a confluence opening is formed in each inner partition plate; a flow guide block is arranged in each heat exchange cavity; the left side and the right side of the flow guide block in each heat exchange cavity are each provided with a heat exchange mechanism, each heat exchange mechanism comprises two sets of heat exchange fins, a confluence channel is formed between the two sets of heat exchange fins of each heat exchange mechanism, and each set of heat exchange fins are provided with a plurality of flow guide gaps communicating the flow guide channels with the confluence channel. And the cover plates are two plate bodies which are respectively fixed on the upper surface and the lower surface of the runner cavity plate and cover the cavity. According to the utility model, cooling and heat exchange can be simultaneously carried out on a plurality of power semiconductor devices, the flow channel structure adopts series-parallel-series-parallel... series, the overlarge temperature difference of the power semiconductor devices at the water inlet and the water outlet is avoided, the hidden danger of uneven flow distribution is reduced, the space utilization rate is high, the cooling efficiency is high, and the cooling is rapid.

Description

TECHNICAL FIELD

[0001] The utility model belongs to power semiconductor device heat exchange technical field, concretely relates to a micro -channel structure water cooling plate. BACKGROUND

[0002] Power semiconductor devices (such as MOSFET, IGBT, etc.) as the core components of electric energy conversion and circuit control in electronic devices are widely used in the electronic and electrical industry, almost covering all electronic industry chain, and are widely used in automobile, charging pile, power generation, consumer electronics, rail transit, energy storage, aerospace and military field, power semiconductor industry is in the rapid development stage, and the double driving of technological innovation and market demand brings broad development space for the industry.

[0003] Power semiconductor devices will generate high heat loss in the process of conduction and switching, and with the increase of temperature, the electrical performance of semiconductor devices will degrade, and long-time high-temperature operation will accelerate the aging of devices and reduce their service life, in addition, too high temperature will trigger the protection mechanism of the system, affect the continuous operation of the equipment, therefore, heat exchange and cooling treatment are needed to make it work in a stable temperature range.

[0004] Through the search, the patent with the application number 202420210680.9 discloses a water cooling plate for high-power heating pipe, which can only cool two heating modules at the same time and needs to be designed separately. The flow channel structure, the cooling water in the copper pipe is only used for flow guiding, and the space utilization rate of the water cooling plate is low. The patent with the application number 202322405222.9 discloses a composite metal water cooling plate, the heat exchange fins of the water cooling plate are installed outside the water cooling plate, and the heat is directly conducted to the air through the fins, not directly contacted with the cooling water, therefore, the heat exchange efficiency will be greatly reduced. The patent with the application number 202122281650.6 discloses a power module water cooling plate heat exchange device, a plurality of shunt water ports are arranged on the substrate of the heat exchange device, which can effectively avoid the uneven heat exchange of inlet and outlet water ports, but too many shunt water ports will cause uneven flow distribution when the flow channel structure is designed or blocked. The patent with the application number 202111544443.3 discloses a water cooling plate, the fins and the substrate of the water cooling plate are integrally manufactured, therefore, it is difficult to reduce the thickness and spacing of the fins in the process, and the cooling effect is not obvious for high-power module devices.

[0005] In addition, for high-power semiconductor devices, the cooling efficiency of the water cooling plate with ordinary structure is not high, and it is difficult to effectively cool. UTILITY MODEL CONTENTS

[0006] To address the aforementioned problems, the purpose of this utility model is to provide a microchannel structure water-cooled plate with high space utilization, uniform cooling water flow distribution, high cooling efficiency, and rapid temperature reduction.

[0007] The objective of this utility model is achieved through the following technical solution.

[0008] A microchannel water-cooled plate includes a cover plate and a flow channel cavity plate. The flow channel cavity plate has cavities extending through its upper and lower surfaces. At each end of the flow channel cavity plate are a water inlet and an outlet, each communicating one-to-one with the ends of the cavity. At least one inner partition plate is provided within the cavity, dividing it into multiple heat exchange chambers. Each inner partition plate has a confluence port connecting two adjacent heat exchange chambers. A flow guide block is provided within each heat exchange chamber, with its front and rear ends not contacting the inner wall of the heat exchange chamber and forming a flow channel. A heat exchange mechanism is provided on each of the left and right sides of the flow guide block inside the hot cavity. Each heat exchange mechanism includes two sets of heat exchange fins. There is a flow converging channel between the two sets of heat exchange fins of the heat exchange mechanism. Each set of heat exchange fins has multiple flow guide gaps that connect the flow guide channel and the flow converging channel. The flow converging channel located in the middle of the cavity is also connected to the flow converging port, while the flow converging channels located at both ends of the cavity are respectively connected to the water inlet and the water outlet. The cover plate consists of two plates that are respectively fixed to the upper and lower surfaces of the flow channel cavity plate and cover the cavity. The heat exchange fins and the flow guide block abut against the inner wall of the cover plate.

[0009] Furthermore, to limit the position and flow rate of cooling water entering and exiting the heat dissipation area, an inlet guide plate and an outlet guide plate are respectively installed at both ends inside the cavity; wherein, an inlet guide plate and the inner wall of the cavity form an inlet flow channel connecting the inlet and the cavity, and an outlet guide plate and the inner wall of the cavity form an outlet flow channel connecting the outlet and the cavity.

[0010] Furthermore, the cover plate includes an outer plate and an inner plate, wherein the outer plate is a U-shaped plate fixed on the flow channel cavity plate; the inner plate is pressed against the flow channel cavity plate by the outer plate, and the inner wall of the inner plate abuts against the heat exchange fins.

[0011] Furthermore, cavity plate positioning posts are provided on the surface where the flow channel cavity plate contacts the inner plate, and guide block positioning posts are provided on the surface where the guide block contacts the inner plate. Multiple inner plate positioning holes are provided on the inner plate, corresponding one-to-one with the cavity plate positioning posts and guide block positioning posts. After the cavity plate positioning posts and guide block positioning posts are respectively fitted and passed through the corresponding inner plate positioning holes, they extend into the inner hole of the outer plate.

[0012] Furthermore, both the cavity plate positioning post and the guide block positioning post are provided with internal threads for mounting power semiconductor devices.

[0013] Furthermore, the cavity plate positioning post and the guide block positioning post are both provided with sealing rubber sleeves, and sealing rubber rings are provided between the outer plate and the inner plate and between the inner plate and the flow channel cavity plate.

[0014] Furthermore, each heat exchange fin group consists of two heat exchange fins, one above the other, and each heat exchange fin is composed of multiple layers of fin plates, with a flow guide gap formed between adjacent fin plates.

[0015] Furthermore, the number of heat exchange fins, inner partition plates, and flow guide blocks varies depending on the number of heating modules. A set of heat exchange fins can exchange heat for up to two heating modules, and the number of heat source modules on one side of the cover plate is 4n, where n is a natural number greater than or equal to 1. Therefore, there are at least 4n sets of heat exchange fins, at least n-1 inner partition plates, and at least n flow guide blocks (40).

[0016] The objective of this utility model is achieved through the following technical solution:

[0017] This invention features high space utilization, uniform cooling water flow distribution, high cooling efficiency, and rapid temperature reduction. The microchannel structure water-cooled plate can simultaneously cool and exchange heat for multiple power semiconductor devices. The flow channel structure adopts a series-parallel-series-parallel...series configuration, which can reduce pressure loss, avoid excessive temperature difference between the power semiconductor devices at the inlet and outlet, and reduce the risk of uneven flow distribution. The heat exchange fins are manufactured separately from the substrate and fixed by welding, which can give the fins a denser structural feature and better heat exchange effect for high-power semiconductor devices. Attached Figure Description

[0018] The structure of this utility model will be further described in detail below with reference to the accompanying drawings.

[0019] Figure 1 This is a schematic diagram of the microchannel structure water-cooled plate described in this utility model.

[0020] Figure 2 This is an exploded view of the microchannel structure water-cooled plate described in this utility model.

[0021] Figure 3 This is an exploded view of the flow channel cavity plate described in this utility model.

[0022] Figure 4 This is a schematic diagram of the heat exchange fin structure described in this utility model.

[0023] Figure 5 for Figure 3 A partially enlarged schematic diagram of the heat exchange fin installation method at point A.

[0024] Figure 6 This is a cross-sectional schematic diagram of the flow guide block described in this utility model.

[0025] As shown in the figure:

[0026] 10-Cover plate, 11-Outer plate, 12-Outer plate mounting hole, 13-Inner plate, 14-Inner plate positioning hole, 20-Flow channel cavity plate, 21-Cavity plate positioning post, 22-Cavity plate mounting hole, 23-Inlet, 24-Outlet, 25-Inlet guide plate, 26-Outlet guide plate, 27-First inner partition plate, 28-Second inner partition plate, 30-Heat exchange fins, 40-Guide block, 41-First guide block, 42-Second guide block, 43-Third guide block. Detailed Implementation

[0027] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. The described embodiments are merely some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0028] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and to facilitate understanding. They are not intended to limit the scope of this invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, provided they do not affect the effectiveness or purpose of this invention, should still fall within the scope of the technical content disclosed herein. Furthermore, terms such as "upper," "lower," "left," "right," and "middle" used in this specification are merely for clarity and not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0029] In the description of this utility model, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" or "linked" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. It should be noted that the terms "comprising," "including," or any other variations are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Example 1

[0030] like Figures 1-6 As shown, this embodiment provides a microchannel structure water-cooled plate, including a cover plate 10, a flow channel cavity plate 20, heat exchange fins 30, and a flow guide block 40.

[0031] The flow channel cavity plate 20 is a flat plate with a cavity extending through its upper and lower surfaces. At both ends of the front side of the flow channel cavity plate 20, there are water inlets 23 and water outlets 24 that are connected to the two ends of the cavity one-to-one. The water inlet 23 is located on the left side of the flow channel cavity plate 20 and is connected to the left end of the cavity. A water inlet nozzle is installed on the water inlet 23 and is connected to the water outlet of the external cooling system. The water outlet 24 is located on the right side of the flow channel cavity plate 20 and is connected to the right end of the cavity. A water outlet nozzle is installed on the water outlet 24 and is connected to the water inlet of the external cooling system.

[0032] Two inner partition plates, namely a first inner partition plate 27 and a second inner partition plate 28, are longitudinally arranged inside the cavity of the flow channel cavity plate 20. The first inner partition plate 27 and the second inner partition plate 28 are integrally fixed inside the cavity. The inner partition plates divide the cavity into three heat exchange chambers: a first heat exchange chamber, a second heat exchange chamber, and a third heat exchange chamber. The first heat exchange chamber is located on the left side of the cavity and is connected to the inlet 23. The second heat exchange chamber is located in the middle of the cavity. The third heat exchange chamber is located on the right side of the cavity and is connected to the outlet 24. Each inner partition plate has a confluence port connecting two adjacent heat exchange chambers. The confluence port is located in the middle of the inner partition plate.

[0033] A flow guide block 40 is provided longitudinally in each heat exchange cavity, namely a first flow guide block 41, a second flow guide block 42, and a third flow guide block 43. The first flow guide block 41 is located in the first heat exchange cavity, the second flow guide block 42 is located in the second heat exchange cavity, and the third flow guide block 43 is located in the third heat exchange cavity. The front and rear ends of the flow guide block 40 do not contact the inner wall of the heat exchange cavity in which they are located and form two flow guide channels located on the front and rear sides of the flow guide block 40. The two flow guide channels are respectively located on both sides of the confluence port.

[0034] Each heat exchange chamber has a heat exchange mechanism on both the left and right sides of the guide block. Each heat exchange mechanism includes two sets of heat exchange fins 30. There is a flow channel between the two sets of heat exchange fins 30. Each set of heat exchange fins 30 includes at least one heat exchange fin. Each heat exchange fin 30 is composed of multiple layers of fin plates arranged in parallel to each other. Adjacent fin plates do not contact each other, thus forming multiple flow guide gaps in each heat exchange fin 30. The flow guide gaps are arranged longitudinally and connect the two flow guide channels in each heat exchange chamber with the flow channel in the middle. The flow channel in the middle of the cavity is aligned with and connected to the flow port near it. The leftmost flow channel in the heat exchange chamber on the left side of the cavity is connected to the inlet 23, and the rightmost flow channel in the heat exchange chamber on the right side of the cavity is connected to the outlet 24.

[0035] The cover plate 10 consists of two plates that are fixed to the upper and lower surfaces of the flow channel cavity plate 20 respectively and seal the cavity.

[0036] The upper and lower surfaces of the heat exchange fins 30 and the upper and lower surfaces of the guide blocks 40 abut against the inner walls of the two cover plates 10, respectively. The left and right sides of the heat exchange fins 30 abut against the inner wall of the heat exchange chamber and the guide blocks 40, respectively.

[0037] The power semiconductor device is mounted on the outer wall of the cover plate 10. The power semiconductor device transfers heat to the cover plate 10, and then the cover plate 10 conducts it to the heat exchange fins 30. The heat exchange fins 30 exchange heat with the continuously flowing cooling water to cool down, and the cooling water carries the heat out to the external cooling system for cooling.

[0038] In practical applications, the cooling water flowing from the cooling system enters the confluence channel on the left side of the first heat exchange chamber at the left end of the cavity through the inlet 23. Blocked by the first guide block 41, the cooling water splits into two streams, which enter the two sets of heat exchange fins 30 on the left side of the first heat exchange chamber through the confluence channel on the left side of the first heat exchange chamber. Then, it flows along the guide gaps between these two sets of heat exchange fins 30 through the guide channels at both ends of the first guide block 41, and then flows through the guide channels to the two sets of heat exchange fins 30 on the right side of the first guide block 41. Afterward, it flows along the guide gaps between these two sets of heat exchange fins 30 through the confluence channel on the right side of the first guide block 41 (between these two sets of heat exchange fins 30) and converges. The cooling water passes through the heat exchange fins 3... When the flow gap is 0, the heat on the heat exchange fins 30 is carried away by the cooling water through forced convection. Then, the cooling water that gathers in the right confluence channel of the first guide block 41 flows to the confluence port in the middle of the first inner partition plate 27. Under the guidance of the confluence port in the middle of the first inner partition plate 27, it gathers again into a stream and then continues to enter the confluence channel on the left side of the second heat exchange chamber. It is then divided into two streams by the second guide block 42, repeating the previous flow pattern. The flow alternates between splitting and converging in the second and third heat exchange chambers to dissipate heat from the heat dissipation fins. After the cooling water performs forced convection heat dissipation on all the heat dissipation fins, it finally gathers into a stream in the right confluence channel of the rightmost heat exchange chamber and flows out from the outlet 24. Example 2

[0039] To limit the location and flow rate of cooling water entering and exiting the heat dissipation area, the following settings were made in this embodiment based on Embodiment 1.

[0040] like Figure 3As shown, an inlet guide plate 25 and an outlet guide plate 26 are respectively installed at both ends inside the cavity. The inlet guide plate 25 forms a water inlet channel connecting the inlet 23 and the cavity wall. The outlet end of the water inlet channel is located in the middle of the leftmost heat exchange chamber and connects to the left confluence channel of the leftmost heat exchange chamber. When cooling water enters from the inlet 23, it is guided into the cavity by the inlet guide plate 25, which restricts the cooling water from entering the heat dissipation area. The location and flow rate of the area are controlled by adjusting the width of the inlet channel. The outlet guide plate 26 forms an outlet channel connecting the outlet 24 and the cavity with the inner wall of the cavity. The inlet end of the outlet channel is located in the middle of the rightmost heat exchange cavity and is connected to the right confluence channel of the rightmost heat exchange cavity. The water is guided out of the cavity by the outlet guide plate 26. The location and flow rate of the cooling water flowing out of the heat dissipation area are limited by the outlet guide plate 26 (the flow rate is controlled by adjusting the width of the outlet channel). Example 3

[0041] To facilitate the positioning and fixing of the flow channel cavity plate 20 and the flow guide block 40, and to facilitate the installation of power semiconductor devices, this embodiment, based on embodiment 1 or 2, makes the following modifications.

[0042] like Figure 2 As shown, the cover plate 10 includes an outer plate 11 and an inner plate 13. The outer plate 11 is a U-shaped plate fixed on the flow channel cavity plate 20. The four corners of the outer plate 11 are respectively provided with outer plate fixing holes 12. The corresponding flow channel cavity plate 20 is provided with cavity plate fixing holes 22. The position and size of the outer plate fixing holes 12 correspond to the cavity plate fixing holes 22. The outer plate 11 is fixed to the flow channel cavity plate 20 by bolts passing through the outer plate fixing holes 12 and the cavity plate fixing holes 22. The inner plate 13 is pressed against the flow channel cavity plate 20 by the outer plate 11, and the inner wall of the inner plate 13 abuts against the heat exchange fins 30 (upper or lower surface). The inner plate 13 is provided with a plurality of inner plate positioning holes 14.

[0043] Cavity plate positioning posts 21 are provided on the upper and lower surfaces of the flow channel cavity plate 20 (the surface in contact with the inner plate 13). Four cavity plate positioning posts 21 are evenly arranged on each of the upper and lower surfaces of the flow channel cavity plate 20. Guide block positioning posts 44 are provided on the upper and lower surfaces of the guide block 40 (the surface in contact with the inner plate 13). One guide block positioning post 44 is provided at the front and rear ends of the upper and lower surfaces of each guide block 40. Multiple inner plate positioning holes 14 are provided on each inner plate 13, corresponding one-to-one with the cavity plate positioning posts 21 and the guide block positioning posts 44. The cavity plate positioning posts 21 and the guide block positioning posts 44 are respectively fitted and passed through the corresponding inner plate positioning holes 14 on the inner plate 13 on the same side, and then extend into the inner hole (the square hole in the middle) of the outer plate 11. To facilitate the installation of power semiconductor devices, the cavity plate positioning posts 21 and the guide block positioning posts 44 are provided with internal threads for installing power semiconductor devices.

[0044] The size and position of the heat dissipation fins 30 are specifically determined by the location of the heat source of the power semiconductor device. Therefore, when the size and position of the power semiconductor change, the size and position of the heat dissipation fins 30, the cavity structure of the cavity plate 20, and the position of the inner plate positioning hole 14 can be changed to adapt to the situation. Example 4

[0045] To facilitate sealing, this embodiment is based on embodiment 3 with the following modifications.

[0046] Both ends of the cavity plate positioning post 21 and the guide block positioning post 44 are provided with sealing rubber sleeves, and sealing rubber rings are provided between the outer plate 11 and the inner plate 13 and between the inner plate 13 and the flow channel cavity plate 20. Example 5

[0047] To improve heat exchange efficiency, this embodiment makes the following adjustments based on any one of embodiments 1-4.

[0048] Each heat exchange fin group 30 consists of two heat exchange fins 30, one upper and one lower. Two heating modules can be installed on the upper and lower sides of each heat exchange fin group 30, respectively. The length and width of the heat exchange fins 30 are equal to those of the heating modules. Example 6

[0049] The difference between this embodiment and embodiment 2 is that...

[0050] The number of heat exchange fins 30, inner partition plates, and flow guide blocks 40 is not limited to the number specified in the above embodiments, depending on the number of heating modules. The number of heat exchange fins 30, inner partition plates, and flow guide blocks 40 varies according to the number of heating modules. A set of heat exchange fins 30 can exchange heat for a maximum of two heating modules, one above the other. If the number of heat source modules on one side of the cover plate 10 is 4n (n is a natural number greater than or equal to 1), then there are at least 4n sets of heat exchange fins 30, at least n-1 inner partition plates, at least n flow guide blocks 40, and at least n heat exchange cavities.

[0051] In practical applications, the cooling water flowing from the cooling system enters the inlet guide plate 25 through the inlet 23. The guide plate 25 then guides the water into the confluence channel on the left side of the heat exchange chamber at the far left end of the cavity. Blocked by the guide block within the heat exchange chamber, the cooling water splits into two streams, flowing from the confluence channel on the left side of the heat exchange chamber into the two sets of heat exchange fins 30 on the left side of the chamber. Then, it flows along the guide gaps between these two sets of heat exchange fins 30 into the guide channels at both ends of the guide block, and then flows through the guide channels to the two sets of heat exchange fins 30 on the right side of the guide block. Finally, it flows along the guide gaps between these two sets of heat exchange fins 30 into the confluence channel on the right side of the guide block 41 (between these two sets of heat exchange fins 30), where it converges. The cooling water then... When the heat exchange fins 30 are separated by a flow guide gap, the heat on the heat exchange fins 30 is carried away by the cooling water through forced convection. Then, the cooling water that gathers in the flow channel on the right side of the guide block flows to the flow port in the middle of the inner partition plate. Under the guidance of the flow port in the middle of the inner partition plate, it gathers back into a stream and then continues to enter the flow channel on the left side of the next heat exchange chamber. It is then divided into two streams by the guide block inside, repeating the previous flow pattern. The flow alternates between splitting and gathering in the subsequent heat exchange chambers to dissipate heat from the heat dissipation fins. After the cooling water dissipates heat from all the heat dissipation fins through forced convection, it finally gathers into a stream in the flow channel on the right side of the rightmost heat exchange chamber. It is then guided into the outlet 24 by the outlet guide plate 26 and flows out from the outlet 24.

[0052] Other aspects of this utility model that are not detailed herein are all conventional techniques known to those skilled in the art.

[0053] It should be noted that the terms “comprising,” “including,” or any other variations are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0054] The scope of protection of this utility model is not limited to the technical solutions disclosed in the specific embodiments. Any modifications, equivalent substitutions, improvements, etc., made to the above embodiments based on the technical essence of this utility model shall fall within the scope of protection of this utility model.

Claims

1. A micro-channel structure water-cooled plate, comprising a cover plate (10) and a flow channel cavity plate (20); characterized in that: the flow channel cavity plate (20) is provided with a cavity penetrating through its upper and lower surfaces, and a water inlet (23) and a water outlet (24) are respectively arranged at two ends of the flow channel cavity plate (20) and communicate with the two ends of the cavity one by one; at least one inner partition plate is arranged in the cavity to divide the cavity into multiple heat exchange cavities, and each inner partition plate is provided with a flow collecting port communicating with two adjacent heat exchange cavities; a flow guide block (40) is arranged in each heat exchange cavity, and the front and rear ends of the flow guide block (40) are not in contact with the inner walls of the heat exchange cavity and form a flow guide channel; a heat exchange mechanism is arranged on the left and right sides of the flow guide block in each heat exchange cavity, and each heat exchange mechanism comprises two groups of heat exchange fins (30), a flow collecting channel is arranged between the two groups of heat exchange fins (30), each group of heat exchange fins (30) is provided with multiple flow guide gaps communicating the flow guide channel and the flow collecting channel, the flow collecting channel located in the middle of the cavity further communicates with the flow collecting port, and the flow collecting channels located at the two ends of the cavity respectively correspond to the water inlet (23) and the water outlet (24); the cover plate (10) is two plate bodies respectively fixed on the upper and lower surfaces of the flow channel cavity plate (20) and covers the cavity, and the heat exchange fins (30) and the flow guide block (40) respectively abut against the inner walls of the cover plate (10).

2. The microchannel structure water-cooling plate according to claim 1, characterized in that: a water inlet flow guide plate (25) and a water outlet flow guide plate (26) are respectively arranged at the two ends inside the cavity; wherein, the water inlet flow guide plate (25) and the inner wall of the cavity form a water inlet flow channel communicating the water inlet (23) and the cavity, and the water outlet flow guide plate (26) and the inner wall of the cavity form a water outlet flow channel communicating the water outlet (24) and the cavity.

3. The microchannel structure water-cooling plate according to claim 1, characterized in that: the cover plate (10) comprises an outer plate (11) and an inner plate (13), wherein the outer plate (11) is a back-shaped plate fixed on the flow channel cavity plate (20); the inner plate (13) is pressed on the flow channel cavity plate (20) by the outer plate (11), and the inner wall of the inner plate (13) abuts against the heat exchange fins (30).

4. The microchannel structure water-cooling plate according to claim 3, characterized in that: a cavity plate positioning column (21) is arranged on the surface of the flow channel cavity plate (20) in contact with the inner plate (13), a flow guide block positioning column (44) is arranged on the surface of the flow guide block (40) in contact with the inner plate (13), and a plurality of inner plate positioning holes (14) corresponding to the cavity plate positioning column (21) and the flow guide block positioning column (44) are arranged on the inner plate (13), the cavity plate positioning column (21) and the flow guide block positioning column (44) are respectively sleeved and pass through the corresponding inner plate positioning holes (14), and then extend into the inner hole of the outer plate (11).

5. The microchannel structure water-cooling plate according to claim 4, characterized in that: the cavity plate positioning column (21) and the flow guide block positioning column (44) are both provided with internal threads for mounting power semiconductor devices.

6. The microchannel structure water-cooling plate according to claim 4, characterized in that: the cavity plate positioning column (21) and the flow guide block positioning column (44) are both provided with sealing rubber sleeves, and sealing rubber rings are arranged between the outer plate (11) and the inner plate (13) and between the inner plate (13) and the flow channel cavity plate (20).

7. The microchannel structure water-cooling plate according to claim 1, characterized in that: Each group of heat exchange fins (30) comprises two heat exchange fins (30) combined together, each heat exchange fin (30) is composed of multiple fin plates, and a flow guiding gap is formed between adjacent two fin plates.

8. The microchannel structure water-cooling plate according to claim 7, characterized in that: The left and right sides of the heat exchange fin (30) respectively abut against the inner wall of the heat exchange cavity and the flow guiding block (40).

9. The microchannel structure water-cooling plate according to claim 1, characterized in that: The confluence port is arranged in the middle of the inner partition plate.

10. The microchannel-structured water-cooling plate according to any one of claims 1 to 9, characterized by: The number of the heat exchange fins (30), the inner partition plates and the flow guiding blocks (40) changes according to the number of the heat generating modules, one group of heat exchange fins (30) can exchange heat with two heat generating modules at most, the number of the heat source modules on one side of the cover plate (10) is 4n, n is a natural number greater than or equal to 1, then the heat exchange fins (30) have at least 4n groups, the inner partition plates have at least n-1 blocks, and the flow guiding blocks (40) have n blocks.

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