On-line dressing structure for micro-hemisphere grinding and polishing grinding wheel

Abstract

The utility model discloses a micro hemisphere polishing grinding wheel on-line finishing structure which comprises a clamping mechanism, a finishing mechanism and an ejector pin mechanism, a moving mechanism of micro hemisphere polishing equipment is fixedly connected with the clamping mechanism, drives the clamping mechanism to move up and down and back and forth and rotates in a vertical plane, and the clamping mechanism comprises a mounting frame and a rotating shaft. The trimming mechanism comprises a trimming frame detachably and fixedly connected to the bottom of the rotating shaft and a plurality of trimmers fixed to the bottom of the trimming frame, the ejector pin mechanism is arranged on the mounting frame and comprises an ejector pin, and the ejector pin can move towards the rotating shaft relative to the mounting frame to abut against the rotating shaft so as to limit circumferential movement of the rotating shaft. The grinding wheel dressing and micro-hemisphere polishing efficiency can be greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of micro-hemispherical resonant gyroscope manufacturing technology, specifically to an online dressing structure for a micro-hemispherical polishing wheel. Background Technology

[0002] Micro-hemispherical gyroscopes belong to the category of hemispherical resonant gyroscopes. They are solid-state wave gyroscopes based on the Coriolis effect, offering the advantage of low cost and representing an important direction for future gyroscope development. Conventional micro-hemispherical gyroscopes are formed by blowing planar quartz sheets. Before becoming a finished product for assembly, the excess skirt after forming needs to be ground to remove excess mass, forming a smooth, chipped, and uniform lip to ensure a high quality factor (Q value).

[0003] Chinese patent CN221364367U discloses a grinding and polishing device for micro-hemispherical resonators. This device, through a single-sided double grinding and polishing disc design and a dual-linkage mechanism along the X and Z axes, enables the grinding and polishing of the micro-hemispherical surface in a single operation. Chinese patent CN118559515B discloses a method for grinding and polishing the lip edge of a micro-hemispherical surface. Building upon CN221364367U, this method incorporates a rotatable clamping mechanism, allowing the outer circle of the micro-hemispherical skirt's bottom surface to make point contact with the grinding disc of the device, thus performing point grinding on the skirt edge and minimizing localized chipping at the outermost edge. However, during application, it was found that the micro-hemispherical surface is made of quartz, which has high hardness. The grinding disc uses a diamond wheel, while the polishing disc uses a resin wheel. The hard quartz causes significant wear on the grinding and polishing discs, requiring frequent replacements, which not only affects the grinding and polishing efficiency but also increases costs. Utility Model Content

[0004] To address the problems in the background art, this utility model proposes an online dressing structure for micro-hemispherical polishing grinding wheels to improve the efficiency of grinding wheel dressing and micro-hemispherical polishing.

[0005] The present invention adopts the following technical solution:

[0006] An online dressing structure for a micro-hemispherical polishing wheel includes a clamping mechanism, a dressing mechanism, and an ejector mechanism.

[0007] The clamping mechanism includes a mounting frame and a rotating shaft. The mounting frame is fixedly connected to the moving mechanism of the micro-hemispherical polishing equipment. The moving mechanism can drive the mounting frame to move up and down, back and forth, and rotate the mounting frame in a vertical plane. The rotating shaft is circumferentially rotatable and mounted on the mounting frame.

[0008] The dressing mechanism includes a dressing frame and multiple dressing devices. The dressing frame is detachably fixed to the bottom of the rotating shaft, and the multiple dressing devices are fixed to the bottom of the dressing frame and arranged at intervals along the circumference of the rotating shaft.

[0009] The ejector mechanism is mounted on the mounting bracket and includes an ejector pin that can move relative to the mounting bracket toward the rotating shaft until it abuts against the rotating shaft to restrict the circumferential movement of the rotating shaft.

[0010] The ejector mechanism also includes an ejector cylinder, which is fixedly connected to the mounting frame and has a sealed cavity. The ejector includes a piston end and an ejector end. The piston end slides in the sealed cavity, and the ejector end extends out of the sealed cavity and is arranged toward the rotating shaft. The end of the ejector cylinder opposite to the ejector end has an air switch for connecting to a pneumatic device. When the pneumatic device is turned on, it can push the ejector to move toward the rotating shaft until the ejector end abuts against the rotating shaft.

[0011] Optionally, a spring is inserted through the portion of the ejector pin located in the sealed cavity. The spring is compressed as the ejector pin moves toward the rotating shaft. After the pneumatic device is turned off, the compressed spring pushes the ejector pin to move in the opposite direction until the ejector pin disengages from the rotating shaft.

[0012] Optionally, the upper part of the side wall of the rotating shaft is provided with multiple circumferentially arranged side holes, each of which corresponds to a multiple dressing device. When the pneumatic device is turned on, it can push the ejector pin toward the rotating shaft until the ejector pin end abuts against the wall of the side hole opposite to it.

[0013] Optionally, the mounting frame includes a horizontally arranged first plate, and a second and third plate connected to the first plate and arranged vertically. A rotating shaft passes through the first plate and is rotatably connected to the first plate. The second plate is vertically rotatably mounted on the moving mechanism of the micro-hemispherical polishing equipment, and the ejector cylinder of the ejector mechanism is fixed on the third plate.

[0014] Optionally, the rotating shaft is circumferentially rotatable on the first plate via an upper bearing assembly and a lower bearing assembly, with the upper bearing assembly and the lower bearing assembly located at opposite ends of the thickness direction of the first plate.

[0015] Optionally, the upper bearing assembly includes an upper bearing and an upper bearing sleeve, the upper bearing being disposed in the upper bearing sleeve and sleeved on the rotating shaft; the lower bearing assembly includes a lower bearing and a lower bearing sleeve, the lower bearing being disposed in the lower bearing sleeve and sleeved on the rotating shaft.

[0016] Optionally, the rotating shaft is rotatably connected to the upper bearing via the upper bushing and to the lower bearing via the lower bushing.

[0017] Optionally, the bottom of the trimming frame is provided with a receiving hole that matches the base of the trimmer, and the side is provided with a screw hole that corresponds to the receiving hole. The base of the trimmer is inserted into the receiving hole, and then a screw is passed through the screw hole to abut against the base to fix the trimming frame and the trimmer base.

[0018] Optionally, the multiple dressing tools include a diamond dressing tool and multiple sandpaper dressing tools, with the multiple sandpaper dressing tools having different sandpaper grits.

[0019] Optionally, the diamond dressing device includes a stainless steel base, which is detachably fixed to the dressing frame. The bottom of the stainless steel base has four bevels, two of which are opposite first bevels with an angle of 38°-41° and two of which are opposite second bevels with an angle of 45°-50°. A diamond layer is sintered on each bevel.

[0020] Optionally, the sandpaper dressing tool includes a metal base, which is detachably fixed to the dressing frame. The bottom surface of the metal base is a third inclined surface with an inclination angle of 8°-15°. Sandpaper is fixed on the third inclined surface, and the inclination angle of the third inclined surface is different for each metal base.

[0021] Optionally, the moving mechanism of the micro-hemispherical polishing equipment includes a horizontal sliding mechanism and a vertical sliding mechanism mounted on the horizontal sliding mechanism.

[0022] Optionally, the horizontal sliding mechanism is mounted on the frame of the micro-hemispherical polishing equipment and is used to drive the vertical sliding mechanism to move in the front-to-back direction. The mounting frame can be vertically rotated and mounted on the vertical sliding mechanism, and the vertical sliding mechanism drives the mounting frame to slide in the vertical direction.

[0023] Optionally, the second plate is rotatably connected to the back plate of the vertical sliding mechanism via a positioning post. The second plate has an oblong hole, and the back plate of the vertical sliding mechanism has multiple threaded holes. The mounting bracket can rotate around the positioning post until at least one threaded hole is exposed in the oblong hole. The mounting bracket and the vertical sliding mechanism are fastened together by fasteners passing through the oblong hole and the threaded holes.

[0024] Compared with the prior art, the advantages of this utility model are:

[0025] After the assembled online dressing structure of the micro-hemispherical polishing wheel of this utility model is installed on the moving mechanism of the micro-hemispherical polishing equipment, the dressing device required for the first process is first moved to the dressing position by rotating the shaft. Then, the pneumatic device pushes the ejector pin to move until it abuts against the shaft to restrict the circumferential rotation of the shaft. Then, the moving mechanism drives the dressing structure to move up and down, back and forth, and rotate in the vertical plane, so that the dressing device on the dressing position abuts against the polishing disc of the micro-hemispherical polishing equipment. The micro-hemispherical polishing equipment is turned on, the polishing disc rotates, and the dressing device dresses the polishing disc online. After the first process is completed, the pneumatic device is turned off, the shaft is rotated, and the dressing device required for the second process is moved to the dressing position. The second process can be completed by referring to the above process, and so on until the grinding wheel is dressed. Dressing can be performed by linking the Y-axis and Z-axis motors, which ensures that the entire surface of the resin grinding wheel can be effectively ground, ensuring the flatness of the entire surface. At the same time, the original method of dressing the grinding wheel after grinding each micro-hemispherical has been changed to dressing the grinding wheel after grinding 30 to 50 micro-hemisphericals, which greatly improves efficiency. Attached Figure Description

[0026] To facilitate understanding of this invention, it will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of this invention and should not be considered as limiting the scope of protection of this invention.

[0027] Figure 1 This is a three-dimensional structural diagram of the online dressing structure of the micro-hemispherical polishing wheel according to an embodiment of the present invention.

[0028] Figure 2 This is a cross-sectional schematic diagram of the online dressing structure of the micro-hemispherical polishing wheel according to an embodiment of the present invention.

[0029] Figure 3 This is a three-dimensional structural diagram of the trimming mechanism.

[0030] Figure 4 This is a front view of the micro-hemispherical polishing wheel online dressing structure installed on a micro-hemispherical polishing device according to an embodiment of the present invention.

[0031] Figure 5 A three-dimensional structural diagram of the online dressing structure of the micro-hemispherical polishing wheel of this utility model, installed on the micro-hemispherical polishing equipment.

[0032] Figure label:

[0033] 1. Clamping mechanism; 11. Mounting frame; 111. First plate; 112. Second plate; 113. Third plate; 12. Rotating shaft; 121. Side hole; 13. Upper bearing; 14. Upper bushing; 15. Upper bearing sleeve; 16. Lower bearing; 17. Lower bushing; 18. Lower bearing sleeve; 2. Dressing mechanism; 21. Dressing frame; 22. Dresser; 221. Stainless steel substrate; 222. Diamond layer; 223. Metal substrate; 224. Sandpaper; 3. Ejector mechanism; 31. Ejector cylinder; 311. Sealed cavity; 32. Ejector; 321. Piston end; 322. Ejector end; 33. Spring; 34. Air switch; 4. Moving mechanism; 41. Horizontal sliding mechanism; 42. Vertical sliding mechanism; 43. Positioning pin; 44. Waist-shaped hole; 45. Threaded hole; 5. Frame. Detailed Implementation

[0034] The embodiments of the present invention are described below with reference to the accompanying drawings, so that those skilled in the art can better understand and implement the present invention. However, the listed embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments can be combined with each other, wherein the same components are indicated by the same reference numerals.

[0035] like Figure 1 and Figure 2As shown, this embodiment provides an online dressing structure for a micro-hemispherical polishing wheel, including a clamping mechanism 1, a dressing mechanism 2, and a pin mechanism 3.

[0036] The clamping mechanism 1 includes a mounting frame 11 and a rotating shaft 12. The mounting frame 11 is fixedly connected to the moving mechanism 4 of the micro-hemispherical polishing equipment. The moving mechanism 4 can drive the mounting frame 11 to move up and down, back and forth, and rotate the mounting frame 11 in a vertical plane. The rotating shaft 12 is rotatably mounted on the mounting frame 11.

[0037] The trimming mechanism 2 includes a trimming frame 21 and a plurality of trimmers 22. The trimming frame 21 is detachably fixed to the bottom of the rotating shaft 12, and the plurality of trimmers 22 are fixed to the bottom of the trimming frame 21 and arranged at intervals along the circumference of the rotating shaft 12.

[0038] The ejector mechanism 3 includes an ejector pin 32 and an ejector pin cylinder 31. The ejector pin cylinder 31 is fixedly connected to the mounting bracket 11 and has a sealed cavity 311. The ejector pin 32 includes a piston end 321 and an ejector pin end 322. The piston end 321 is slidably disposed in the sealed cavity 311, and the ejector pin end 322 extends out of the sealed cavity 311 and is arranged toward the rotating shaft 12. The end of the ejector pin cylinder 31 opposite to the ejector pin end 322 has an air switch 34 for connecting with a pneumatic device. When the pneumatic device is turned on, it can push the ejector pin 32 toward the rotating shaft 12 until the ejector pin end 322 abuts against the rotating shaft 12, thereby restricting the circumferential movement of the rotating shaft 12.

[0039] Therefore, after installing the assembled online dressing structure of the above-mentioned grinding wheel on the moving mechanism of the micro-hemispherical polishing equipment, the dressing device required for the first process is first moved to the dressing position by rotating the shaft. Then, the pneumatic device pushes the ejector pin to move to abut against the shaft to restrict the circumferential rotation of the shaft. Then, the moving mechanism drives the dressing structure to move up and down, back and forth, and rotate in the vertical plane, so that the dressing device on the dressing position abuts against the polishing disc of the micro-hemispherical polishing equipment. The micro-hemispherical polishing equipment is turned on, the polishing disc rotates, and the dressing device dresses the polishing disc online. After the first process is completed, the pneumatic device is turned off, the shaft is rotated, and the dressing device required for the second process is moved to the dressing position. Referring to the above process, the dressing of the second process can be completed, and so on until the grinding wheel is dressed. Dressing can be performed by linking the Y-axis and Z-axis motors, which ensures that the entire surface of the resin grinding wheel can be effectively ground, ensuring the flatness of the entire surface. At the same time, the original method of dressing the grinding wheel after grinding each micro-hemispherical has been changed to dressing the grinding wheel after grinding 30 to 50 micro-hemisphericals, which greatly improves efficiency.

[0040] In this embodiment, a spring 33 is inserted through the part of the ejector pin 32 located in the sealed cavity 311. The spring 33 is compressed during the movement of the ejector pin 32 toward the rotating shaft 12. After the pneumatic device is turned off, the compressed spring 33 pushes the ejector pin 32 to move in the opposite direction until the ejector pin 32 disengages from the rotating shaft 12.

[0041] In this embodiment, the upper part of the side wall of the rotating shaft 12 is provided with a plurality of circumferentially arranged side holes 121, and the plurality of side holes 121 correspond one-to-one with a plurality of trimmers 22. When the pneumatic device is turned on, it can push the ejector pin 32 toward the rotating shaft 12 until the ejector pin end 322 abuts against the hole wall of its opposite side hole 121.

[0042] By limiting the end of the ejector pin through the side hole, the phenomenon of the shaft disengaging from the ejector pin restraint caused by equipment vibration during grinding wheel dressing can be avoided.

[0043] The rotating shaft rotates to switch between multiple dressers. After the dresser is in position, its corresponding side hole aligns with the end of the ejector pin. Then, the pneumatic ejector pin is pushed into the corresponding side hole using an air switch. Once the mandrel position and dresser positioning are complete, grinding wheel dressing can begin.

[0044] In this embodiment, the mounting frame 11 includes a horizontally arranged first plate 111, and a second plate 112 and a third plate 113 connected to the first plate 111 and arranged vertically. The rotating shaft 12 passes through the first plate 111 and is rotatably connected to the first plate 111. The second plate 112 can be vertically rotatably mounted on the moving mechanism 4 of the micro-hemispherical polishing equipment. The ejector cylinder 31 of the ejector mechanism 3 is fixed on the third plate 113.

[0045] In this embodiment, the rotating shaft 12 is circumferentially rotatable on the first plate 111 via the upper bearing assembly and the lower bearing assembly, which are respectively located at both ends of the first plate 111 in the thickness direction.

[0046] In this embodiment, the upper bearing assembly includes an upper bearing 13 and an upper bearing sleeve 15. The upper bearing 13 is disposed in the upper bearing sleeve 15 and sleeved on the rotating shaft 12. The lower bearing assembly includes a lower bearing 16 and a lower bearing sleeve 18. The lower bearing 16 is disposed in the lower bearing sleeve 18 and sleeved on the rotating shaft 12.

[0047] In this embodiment, the rotating shaft 12 is rotatably connected to the upper bearing 13 via the upper bushing 14, and rotatably connected to the lower bearing 16 via the lower bushing 17.

[0048] The rotating shaft can be the same as the original micro-hemispherical clamping mechanism. The interface between the trimming frame and the rotating shaft adopts the same pipe connection method as the grinding and polishing interface of the fixed micro-hemispherical, so that the port of the grinding and polishing equipment can be shared, saving costs.

[0049] In this embodiment, the bottom of the trimming frame 21 is provided with a receiving hole that matches the base of the trimmer 22, and the side is provided with a screw hole corresponding to the receiving hole. The base of the trimmer 22 is inserted into the receiving hole, and then a screw is passed through the screw hole to abut against the base to fix the trimming frame 21 and the base of the trimmer 22.

[0050] In this embodiment, as Figure 3 As shown, the multiple dressing tools 22 include a diamond dressing tool 22 and multiple sandpaper dressing tools 22, with the sandpaper 224 having different grit numbers.

[0051] In this embodiment, the diamond trimmer 22 includes a stainless steel substrate 221, which is detachably fixed to the trimmer frame 21. The bottom of the stainless steel substrate 221 has four inclined surfaces, of which the inclination angle of the two opposing first inclined surfaces is 38°-41°, and the inclination angle of the other two opposing second inclined surfaces is 45°-50°. A diamond layer 222 is sintered on each inclined surface.

[0052] The diamond layer is used to dress the grinding wheel, forming continuous sawtooth grooves to facilitate cutting and water cooling. Depending on the wear of the grinding wheel, different diamond bevels are rotated for dressing. Generally, a smaller diamond bevel is used for rough dressing first, followed by a larger diamond bevel for further dressing to reduce the amount of protrusion on the grinding wheel.

[0053] In this embodiment, the sandpaper dressing tool 22 includes a metal base 223, which is detachably fixed to the dressing frame 21. The bottom surface of the metal base 223 is a third inclined surface with an inclination angle of 8°-15°. Sandpaper 224 is fixed on the third inclined surface. The inclination angle of the third inclined surface of each metal base 223 is different.

[0054] The metal substrate can be stainless steel or aluminum, with an inclination angle of 8°-15°. By linking it with the oscillating mechanism on the polishing machine, the sandpaper can be made to adhere to the grinding wheel surface. After one process is completed, the mandrel and air pin on the oscillating mechanism can be adjusted to change to a finer grit sandpaper dresser, thus allowing for the next process.

[0055] like Figure 4 and Figure 5 As shown, in this embodiment, the moving mechanism 4 of the micro-hemispherical polishing equipment includes a horizontal sliding mechanism 41 and a vertical sliding mechanism 42 mounted on the horizontal sliding mechanism 41.

[0056] The horizontal sliding mechanism 41 is mounted on the frame 5 of the micro-hemispherical polishing equipment and is used to drive the vertical sliding mechanism 42 to move in the front and back direction. The mounting frame 11 can be vertically rotated and mounted on the vertical sliding mechanism 42. The vertical sliding mechanism 42 drives the mounting frame 11 to slide in the vertical direction.

[0057] In this embodiment, the second plate 112 is rotatably connected to the back plate of the vertical sliding mechanism 42 via the positioning post 43. The second plate 112 has an oblong hole 44, and the back plate of the vertical sliding mechanism 42 has multiple threaded holes 45. The mounting bracket 11 can rotate around the positioning post 43 until at least one threaded hole 45 is exposed in the oblong hole 44. The mounting bracket 11 and the vertical sliding mechanism 42 are fastened together by fasteners passing through the oblong hole 44 and the threaded hole 45.

[0058] The embodiments described above are merely preferred embodiments of this utility model. The terms "in one embodiment," "in another embodiment," "in yet another embodiment," or "in still another embodiment" used in this specification all refer to one or more of the same or different embodiments according to this disclosure. Ordinary variations and substitutions made by those skilled in the art within the scope of this utility model's technical solution should be included within the protection scope of this utility model.

Claims

1. A micro-hemisphere lapping wheel on-line dressing structure, characterized in that, The clamping mechanism (1), the trimming mechanism (2) and the ejector pin mechanism (3), The clamping mechanism (1) comprises a mounting frame (11) and a rotating shaft (12), the mounting frame (11) is used for being fixedly connected with a moving mechanism (4) of a micro-hemisphere polishing device, the moving mechanism (4) can drive the mounting frame (11) to move up and down, move back and forth, and rotate in a vertical plane, and the rotating shaft (12) is circumferentially rotatable mounted on the mounting frame (11), The trimming mechanism (2) comprises a trimming frame (21) and a plurality of trimmers (22), the trimming frame (21) is detachably fixedly connected to the bottom of the rotating shaft (12), and the plurality of trimmers (22) are fixedly arranged on the bottom of the trimming frame (21) and spaced apart along the circumference of the rotating shaft (12), The ejector pin mechanism (3) is arranged on the mounting frame (11) and comprises an ejector pin (32), the ejector pin (32) can move towards the rotating shaft (12) relative to the mounting frame (11) to abut against the rotating shaft (12) to limit the circumferential movement of the rotating shaft (12).

2. The online trimming structure of the micro-hemisphere polishing wheel according to claim 1, wherein The ejector pin mechanism (3) further comprises an ejector pin cylinder (31), the ejector pin cylinder (31) is fixedly connected with the mounting frame (11) and has a closed cavity (311), the ejector pin (32) comprises a piston end (321) and an ejector pin end (322), the piston end (321) is slidably arranged in the closed cavity (311), the ejector pin end (322) is arranged towards the rotating shaft (12) after extending out of the closed cavity (311), one end of the ejector pin cylinder (31) opposite to the ejector pin end (322) is provided with an air switch (34) for being communicated with a pneumatic device, and the pneumatic device can drive the ejector pin (32) to move towards the rotating shaft (12) to abut against the rotating shaft (12) when the pneumatic device is turned on.

3. The micro-hemisphere lapping wheel on-line dressing structure according to claim 2, characterized in that, The part of the ejector pin (32) located in the closed cavity (311) is provided with a spring (33), the spring (33) is compressed during the movement of the ejector pin (32) towards the rotating shaft (12), and the spring (33) drives the ejector pin (32) to move reversely to disengage from the abutment against the rotating shaft (12) after the pneumatic device is turned off.

4. The micro-hemisphere lapping wheel on-line dressing structure according to claim 2, wherein, A plurality of side holes (121) are arranged on the upper part of the side wall of the rotating shaft (12) in a circumferential direction, the plurality of side holes (121) correspond to the plurality of trimmers (22) one by one, and the pneumatic device can drive the ejector pin (32) to move towards the rotating shaft (12) to abut against the hole wall of the side hole (121) opposite to the ejector pin end (322) when the pneumatic device is turned on.

5. The on-line dressing structure of the micro-hemisphere lapping wheel according to any one of claims 1-4, characterized in that, The mounting frame (11) comprises a first plate (111) arranged horizontally, and a second plate (112) and a third plate (113) arranged vertically and connected with the first plate (111), the rotating shaft (12) penetrates through the first plate (111) and is rotatably connected with the first plate (111), the second plate (112) is vertically rotatably mounted on the moving mechanism (4) of the micro-hemisphere polishing device, and the ejector pin cylinder (31) of the ejector pin mechanism (3) is fixed on the third plate (113).

6. The on-line dressing structure of the micro-hemisphere lapping wheel according to any one of claims 1-4, characterized in that, The plurality of trimmers (22) comprise a diamond trimmer (22) and a plurality of sandpaper trimmers (22), and the sandpaper (224) of the plurality of sandpaper trimmers (22) has different mesh numbers.

7. The micro-hemisphere lapping wheel on-line dressing structure according to claim 6, characterized in that, The diamond dresser (22) comprises a stainless steel base (221) detachably connected with the dresser holder (21), the bottom of the stainless steel base (221) is provided with four inclined surfaces, two opposite first inclined surfaces have an angle of 38-41 degrees, and two opposite second inclined surfaces have an angle of 45-50 degrees, and a diamond layer (222) is sintered on each inclined surface.

8. The micro-hemisphere lapping wheel on-line dressing structure according to claim 6, wherein, The sandpaper dresser (22) comprises a metal base (223) detachably connected with the dresser holder (21), the bottom of the metal base (223) is a third inclined surface having an angle of 8-15 degrees, and a sandpaper (224) is fixed on the third inclined surface, and the angle of the third inclined surface of each metal base (223) is different.

9. The micro-hemisphere lapping wheel on-line dressing structure according to claim 5, wherein, The moving mechanism (4) of the micro-hemisphere polishing equipment comprises a horizontal sliding mechanism (41) and a vertical sliding mechanism (42) mounted on the horizontal sliding mechanism (41), The horizontal sliding mechanism (41) is mounted on the rack (5) of the micro-hemisphere polishing equipment and is used for driving the vertical sliding mechanism (42) to move in the front-rear direction, the mounting rack (11) is vertically rotatably mounted on the vertical sliding mechanism (42), and the vertical sliding mechanism (42) drives the mounting rack (11) to slide in the vertical direction.

10. The micro-hemisphere lapping wheel on-line dressing structure according to claim 9, characterized in that, The second plate (112) is rotatably connected with the back plate of the vertical sliding mechanism (42) through the positioning column (43), the second plate (112) is provided with a waist-shaped hole (44), the back plate of the vertical sliding mechanism (42) is provided with a plurality of threaded holes (45), the mounting rack (11) can be rotated around the positioning column (43) to expose at least one threaded hole (45) from the waist-shaped hole (44), and the mounting rack (11) and the vertical sliding mechanism (42) are tightly connected through fasteners penetrating through the waist-shaped hole (44) and the threaded hole (45).

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