Electroplating jet flow device

Abstract

The utility model relates to the technical field of printed circuit board production, and discloses an electroplating jet flow device which comprises a frame body, a jet pipe mechanism and a transmission mechanism, an electroplating cavity is formed in the frame body; the two spray pipe mechanisms are arranged in the electroplating cavity in a relatively sliding manner; the transmission mechanism comprises a rotating shaft and a supporting frame slidably connected to the rotating shaft, the rotating shaft spans the two opposite sides of the frame, and the spraying pipe mechanism is connected to the supporting frame. Wherein the circuit board is arranged across the two opposite sides of the frame body and located between the two spraying pipe mechanisms, and the rotating shaft rotates to drive the supporting frame to slide so as to drive the spraying pipe mechanisms to be close to or away from the circuit board. According to the electroplating jet flow device disclosed by the utility model, different requirements of through hole electroplating and blind hole electroplating can be effectively met according to different product requirements by adjusting the distance between the jet pipe mechanism and the circuit board, so that the production requirements of circuit boards with high AR through holes and high AR blind holes can be met.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit board manufacturing technology, and in particular to an electroplating spray device. Background Technology

[0002] The development of AI and 5G technologies has increased the demand for high-end servers and 5G communication base stations. The rollout of 5G requires more communication base station infrastructure to increase signal coverage, which in turn increases the demand for high-order MLB (multilayer board) PCBs with higher routing density. These high-layer PCBs have a high number of layers, a high via aperture ratio, and some also have blind vias with high arc radius (AR), posing significant challenges to electroplating technology.

[0003] In existing technologies, the plating tanks of gantry electroplating lines are usually designed with air injection or bottom spray, which have a good electroplating effect on through-hole electroplating; the plating tanks of VCP electroplating lines are designed with counter-spray, which have a good electroplating effect on blind-hole electroplating; however, these two types of equipment cannot simultaneously meet the production needs of circuit boards with high AR through-holes and high AR blind-holes. Utility Model Content

[0004] To address the shortcomings of the existing technology, this utility model provides an electroplating jetting device. By adjusting the distance between the jetting mechanism and the circuit board, it can effectively meet the different requirements of through-hole electroplating and blind-hole electroplating according to different product needs, thereby satisfying the production needs of circuit boards with high AR through holes and high AR blind holes.

[0005] The technical effect to be achieved by this utility model is realized through the following technical solution:

[0006] This utility model provides an electroplating spray device, comprising:

[0007] The frame has an electroplating chamber inside;

[0008] The nozzle mechanism, wherein two nozzle mechanisms are slidably disposed relative to each other within the electroplating chamber; and

[0009] The transmission mechanism includes a rotating shaft and a support frame slidably connected to the rotating shaft. The rotating shaft spans across opposite sides of the frame, and the nozzle mechanism is connected to the support frame.

[0010] The circuit board is positioned across the opposite sides of the frame and between the two nozzle mechanisms. The rotation of the shaft causes the support frame to slide, thereby causing the nozzle mechanism to move closer to or away from the circuit board.

[0011] In some implementations, the rotating shaft is provided with a first transmission structure, and the support frame is provided with a second transmission structure that cooperates with the first transmission structure to drive the support frame to move during the rotation of the rotating shaft.

[0012] In this implementation, the second transmission structure cooperates with the first transmission structure. When the rotating shaft rotates, the second transmission structure slides relative to the first transmission structure, causing the support frame to rotate relative to the rotating shaft, thereby causing the nozzle mechanism to move closer to or away from the circuit board, ensuring the reliability of the overall structure.

[0013] In some implementations, the first transmission structure includes a gear sleeved on the rotating shaft, and the second transmission structure includes a rack connected to the support frame and meshing with the gear.

[0014] In this implementation, the rotation of the shaft drives the gear to rotate. Since the gear and rack mesh, when the gear rotates, it will drive the rack to move relative to the gear. The direction of the rack's movement is parallel to the circumferential rotation direction of the shaft, that is, the direction of the rack's movement is perpendicular to the axial extension direction of the shaft. This causes the rack to move closer to or away from the circuit board, thereby driving the support plate closer to or away from the circuit board.

[0015] In some implementations, the support frame is further provided with a guide rod for guiding the movement direction of the rack.

[0016] In some implementations, the inner bottom wall of the frame is provided with a first sliding structure, and the bottom of the nozzle mechanism is provided with a second sliding structure that is slidably connected to the first sliding structure.

[0017] In this implementation, the second sliding structure is slidably connected to the first sliding structure, making the nozzle mechanism slide more stably and smoothly in the electroplating chamber, thereby improving the electroplating jet efficiency of the nozzle mechanism.

[0018] In some implementations, the first sliding structure includes a guide rail perpendicular to the nozzle mechanism, and the second sliding structure includes a caster wheel slidably connected to the guide rail.

[0019] In this implementation, the caster wheel is slidably connected to the guide rail, thereby allowing the nozzle mechanism to be slidably connected to the bottom wall of the frame. When the support frame moves the nozzle mechanism closer to or further away from the circuit board, the caster wheel of the nozzle mechanism slides along the guide rail.

[0020] In some implementations, the nozzle mechanism includes a spray disc, a nozzle assembly, and a nozzle assembly, wherein the nozzle assembly is vertically connected to the spray disc, the nozzle assembly is vertically connected to the nozzle assembly, and the support frame is connected to the spray disc.

[0021] In this implementation, the support frame moves, which in turn moves the spray disc, further moving the nozzle assembly closer to or away from the circuit board.

[0022] In some implementations, the nozzle assembly includes multiple nozzles vertically connected to the spray disk, and the nozzle assembly includes multiple nozzles vertically connected to the nozzles.

[0023] In some implementations, the nozzle is positioned toward and perpendicular to the circuit board.

[0024] In some implementations, the electroplating spray device further includes a swing frame, which is connected to the circuit board and slidably connected to the outer periphery of the frame.

[0025] In this implementation, during the electroplating process, the swing frame slides repeatedly relative to the frame, thereby causing the circuit board to move repeatedly along the axial extension direction of the rotating shaft within the electroplating chamber. This allows the electroplating medium in the through holes and blind holes on the circuit board to exchange, thereby improving the electroplating spray effect of the circuit board.

[0026] In summary, this utility model has at least the following advantages:

[0027] The electroplating jetting device provided by this utility model has an electroplating chamber inside the frame. Two nozzle mechanisms are slidably disposed in the electroplating chamber. A circuit board is straddling the opposite sides of the frame and located between the two nozzle mechanisms. A rotating shaft is straddling the opposite sides of the frame and arranged parallel to the circuit board. A support frame is slidably connected to the rotating shaft. The nozzle mechanisms are connected to the support frame. The rotation of the rotating shaft drives the support frame to move relative to the rotating shaft, thereby causing the nozzle mechanisms to move closer to or away from the circuit board. By adjusting the distance between the nozzle mechanisms and the circuit board, different requirements for through-hole electroplating and blind-hole electroplating can be effectively met according to different product needs, thus satisfying the production needs of circuit boards with high AR through-holes and high AR blind holes. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the electroplating jetting device in Example 1;

[0029] Figure 2 for Figure 1 A partially enlarged schematic diagram of the electroplating jet device at point A;

[0030] Figure 3 for Figure 2 The diagram shows the structure of the gear and rack.

[0031] Figure 4 This is a schematic diagram of the electroplating spray device in Example 2;

[0032] Figure 5 This is a schematic diagram of the electroplating jetting device in Example 3.

[0033] Marked in the image:

[0034] 1. Frame; 11. Electroplating chamber; 12. First sliding structure; 121. Guide rail;

[0035] 2. Nozzle mechanism; 21. Second sliding structure; 211. Caster wheel; 22. Spray disc; 23. Nozzle assembly; 24. Nozzle head assembly;

[0036] 3. Transmission mechanism; 31. Rotating shaft; 311. First transmission structure; 312. Gear; 32. Support frame; 321. Second transmission structure; 322. Rack; 323. Guide rod;

[0037] 4. Swing frame;

[0038] 5. Circuit board. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are some, but not all, of the embodiments of this utility model.

[0040] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0041] Example 1:

[0042] Please see the appendix Figure 1 ~Appendix Figure 3 The electroplating spray device of this utility model includes a frame 1, a spray pipe mechanism 2 and a transmission mechanism 3.

[0043] In this regard, please combine Figure 1 and Figure 2 , Figure 1 The diagram illustrates the structural relationship between the frame 1, the nozzle mechanism 2, and the transmission mechanism 3 in this embodiment of the invention. Figure 2 The diagram illustrates the specific structure of the transmission mechanism 3 in this embodiment of the invention. Specifically, an electroplating chamber 11 is provided inside the frame 1; two nozzle mechanisms 2 are slidably disposed within the electroplating chamber 11; the transmission mechanism 3 includes a rotating shaft 31 and a support frame 32 slidably connected to the rotating shaft 31. The rotating shaft 31 spans across opposite sides of the frame 1, and the nozzle mechanisms 2 are connected to the support frame 32. The circuit board 5 spans across opposite sides of the frame 1 and is located between the two nozzle mechanisms 2. The rotation of the rotating shaft 31 causes the support frame 32 to slide, thereby causing the nozzle mechanisms 2 to move closer to or further away from the circuit board 5.

[0044] In this embodiment, two nozzle mechanisms 2 are slidably disposed within the electroplating chamber 11 of the frame 1. The circuit board 5 spans across the opposite sides of the frame 1 and is located between the two nozzle mechanisms 2, so that the two nozzle mechanisms 2 can respectively perform jet electroplating on both sides of the circuit board 5, thereby improving the electroplating efficiency of the circuit board 5. The rotating shaft 31 of the transmission mechanism 3 spans across the opposite sides of the frame 1 and is arranged parallel to the circuit board 5. The support frame 32 is slidably connected to the rotating shaft 31, and the nozzle mechanism 2 is connected to the support frame 32. The rotation of the rotating shaft 31 drives the support frame 32 to slide relative to the rotating shaft 31, so that the support frame 32 moves closer to or away from the circuit board 5, thereby driving the nozzle mechanism 2 to move closer to or away from the circuit board 5. Thus, by adjusting the distance between the nozzle mechanism 2 and the circuit board 5 and the jet flow rate of the nozzle mechanism 2, different requirements for through-hole electroplating and blind-hole electroplating on the circuit board 5 can be met, thereby achieving better through-hole electroplating copper thickness and depth plating capabilities and blind-hole electroplating copper thickness and depth plating capabilities.

[0045] Specifically, in actual operation, the circuit board 5 is first placed across the opposite sides of the frame 1 and positioned between the two nozzle mechanisms 2. The driving component drives the rotating shaft 31 to rotate, which in turn moves the support frame 32, causing the two nozzle mechanisms 2 to move closer to the circuit board 5. The nozzle mechanisms 2 are then activated to perform electroplating on both sides of the circuit board 5. After electroplating is completed, the driving component drives the rotating shaft 31 to rotate again, which in turn moves the support frame 32, causing the two nozzle mechanisms 2 to move away from the circuit board 5. By adjusting the distance between the nozzle mechanisms 2 and the circuit board 5, different requirements for through-hole electroplating and blind-hole electroplating on the circuit board 5 can be met, thus making the electroplating jetting device suitable for the electroplating needs of more different products.

[0046] The aforementioned electroplating jetting device has an electroplating chamber 11 inside the frame 1. Two nozzle mechanisms 2 are slidably disposed within the electroplating chamber 11. A circuit board 5 spans across opposite sides of the frame 1 and is located between the two nozzle mechanisms 2. A rotating shaft 31 spans across opposite sides of the frame 1 and is parallel to the circuit board 5. A support frame 32 is slidably connected to the rotating shaft 31. The nozzle mechanisms 2 are connected to the support frame 32. The rotation of the rotating shaft 31 causes the support frame 32 to move relative to the rotating shaft 31, thereby causing the nozzle mechanisms 2 to move closer to or further away from the circuit board 5. By adjusting the distance between the nozzle mechanisms 2 and the circuit board 5, different requirements for through-hole electroplating and blind-hole electroplating can be effectively met according to different product needs, thus satisfying the production requirements of circuit boards 5 with high AR through holes and high AR blind holes.

[0047] In some preferred embodiments, please refer to Figure 2 , Figure 2The diagram illustrates the structural relationship between the first transmission structure 311 and the second transmission structure 321 in this embodiment of the present invention. Specifically, the rotating shaft 31 is provided with the first transmission structure 311, and the support frame 32 is provided with the second transmission structure 321, which cooperates with the first transmission structure 311 to drive the support frame 32 to move during the rotation of the rotating shaft 31. The second transmission structure 321 cooperates with the first transmission structure 311. When the rotating shaft 31 rotates, the second transmission structure 321 slides relative to the first transmission structure 311, causing the support frame 32 to rotate relative to the rotating shaft 31, thereby causing the nozzle mechanism 2 to move closer to or away from the circuit board 5, ensuring the reliability of the overall structure.

[0048] In some preferred embodiments, please refer to Figure 3 , Figure 3 The diagram illustrates the structural relationship between the gear 312 and the rack 322 in this embodiment of the present invention. Specifically, the first transmission structure 311 includes a gear 312 sleeved on the rotating shaft 31, and the second transmission structure 321 includes a rack 322 connected to the support frame 32 and meshing with the gear 312. The rotation of the rotating shaft 31 drives the gear 312 to rotate. Since the gear 312 and the rack 322 are meshed, when the gear 312 rotates, it will drive the rack 322 to move relative to the gear 312. The direction of movement of the rack 322 is parallel to the circumferential rotation direction of the rotating shaft 31, that is, the direction of movement of the rack 322 is perpendicular to the axial extension direction of the rotating shaft 31. Therefore, the rack 322 moves closer to or away from the circuit board 5, thereby driving the support plate closer to or away from the circuit board 5.

[0049] In some more preferred embodiments, the support frame 32 is further provided with a guide rod 323 for guiding the movement direction of the rack 322. When the rack 322 moves relative to the gear 312, the guide rod 323 ensures the accuracy of the movement direction of the rack 322, avoids displacement of the rack 322, and prevents deviation of the movement direction of the support frame 32 and the nozzle mechanism 2, thereby ensuring the reliability of the electroplating jet of the nozzle mechanism 2.

[0050] Example 2:

[0051] The difference between this embodiment and Embodiment 1 is that this embodiment further optimizes the structure of the electroplating spray device of this utility model. Please refer to the appendix. Figure 4 .

[0052] The inner bottom wall of the frame 1 is provided with a first sliding structure 12, and the bottom of the nozzle mechanism 2 is provided with a second sliding structure 21 that is slidably connected to the first sliding structure 12.

[0053] In this embodiment, the second sliding structure 21 is slidably connected to the first sliding structure 12, making the nozzle mechanism 2 more stable and smooth when sliding in the electroplating chamber 11, thereby improving the electroplating spray efficiency of the nozzle mechanism 2 and avoiding the problem that the nozzle mechanism 2 is unstable when it is close to the circuit board 5, resulting in positional deviation and affecting the electroplating spray effect of the circuit board 5.

[0054] In some preferred embodiments, the first sliding structure 12 includes a guide rail 121 perpendicular to the nozzle mechanism 2, and the second sliding structure 21 includes a caster wheel 211 slidably connected to the guide rail 121. The caster wheel 211 is slidably connected to the guide rail 121, thereby allowing the nozzle mechanism 2 to be slidably connected to the bottom wall of the frame 1. When the support frame 32 moves the nozzle mechanism 2 closer to or away from the circuit board 5, the caster wheel 211 of the nozzle mechanism 2 slides along the guide rail, making the nozzle mechanism 2 more stable and smoother when approaching or moving away from the circuit board 5, thus ensuring the reliability of the overall structure. It can be understood that the first sliding structure 12 can also be a guide rail, and the second sliding structure 21 can also be a slider slidably connected to the guide rail.

[0055] Example 3:

[0056] The difference between this embodiment and Embodiment 2 is that this embodiment further optimizes the structure of the electroplating spray device of this utility model. Please refer to the appendix. Figures 4-5 .

[0057] Please see below. Figure 5 , Figure 5 The diagram illustrates the structural relationship between the spray disc 22, the nozzle assembly 23, and the nozzle assembly 24 in this embodiment of the present invention. Specifically, the nozzle mechanism 2 includes a spray disc 22, a nozzle assembly 23, and a nozzle assembly 24. The nozzle assembly 23 is vertically connected to the spray disc 22, the nozzle assembly 24 is vertically connected to the nozzle assembly 23, and the support frame 32 is connected to the spray disc 22.

[0058] In this embodiment, the support frame 32 moves, thereby driving the spray disc 22 to move, which in turn drives the nozzle assembly 23 to move closer to or further away from the circuit board 5. The nozzle assembly 23 is used to transport the electroplating medium, and the electroplating medium is sprayed out through the nozzle assembly 24. Since the nozzle assembly 24 is vertically connected to the nozzle assembly 23, the reliability of the nozzle assembly 24 spraying the electroplating medium is enhanced, thereby making the electroplating effect of the circuit board 5 better.

[0059] In some preferred embodiments, the nozzle assembly 23 includes multiple nozzles vertically connected to the spray disk 22, and the nozzle assembly 24 includes multiple nozzles vertically connected to the nozzles. The multiple nozzles are vertically arranged inside the electroplating chamber 11 and connected to the spray disk 22, and the multiple nozzles are connected to a single nozzle, so as to simultaneously electroplat each area of ​​the circuit board 5, thereby improving the electroplating efficiency of the circuit board 5.

[0060] In some preferred embodiments, the nozzle is positioned towards and perpendicular to the circuit board 5. This ensures that the plating medium is sprayed perpendicularly onto the circuit board 5, thereby ensuring the effectiveness of the plating process on the circuit board 5.

[0061] In some more preferred embodiments, please refer to Figure 4 , Figure 4 The diagram illustrates the structural relationship between the swing frame 4 and the circuit board 5 in this embodiment of the invention. Specifically, the electroplating spray device further includes the swing frame 4, which is connected to the circuit board 5 and slidably connected to the outer periphery of the frame 1. During the electroplating process, the swing frame 4 repeatedly slides relative to the frame 1, thereby driving the circuit board 5 to move repeatedly within the electroplating chamber 11 along the axial extension direction of the rotating shaft 31. This causes the electroplating medium in the through holes and blind holes of the circuit board 5 to exchange, thereby improving the electroplating spray effect of the circuit board 5.

[0062] The electroplating spray device of this utility model has an electroplating chamber 11 inside the frame 1. Two spray nozzle mechanisms 2 are slidably disposed in the electroplating chamber 11. A circuit board 5 spans across the opposite sides of the frame 1 and is located between the two spray nozzle mechanisms 2. A rotating shaft 31 spans across the opposite sides of the frame 1 and is arranged parallel to the circuit board 5. A support frame 32 is slidably connected to the rotating shaft 31. The spray nozzle mechanism 2 is connected to the support frame 32. The rotation of the rotating shaft 31 drives the support frame 32 to move relative to the rotating shaft 31, thereby causing the spray nozzle mechanism 2 to move closer to or away from the circuit board 5. By adjusting the distance between the spray nozzle mechanism 2 and the circuit board 5, different requirements for through-hole electroplating and blind-hole electroplating can be effectively met according to different product requirements, thereby satisfying the production requirements of circuit boards 5 with high AR through holes and high AR blind holes.

[0063] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0064] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0065] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0066] In this invention, unless otherwise expressly specified and limited, "above or below" the first feature may include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on" the first feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the first feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0067] Although the description of this utility model has been given in conjunction with the specific embodiments described above, it is obvious to those skilled in the art that many substitutions, modifications, and variations can be made based on the above description. Therefore, all such substitutions, modifications, and variations are included within the spirit and scope of the appended claims.

Claims

1. An electroplating jet device, characterized by, The utility model relates to a kind of electroplating jet flow devices, including: Frame (1), internally set with electroplating cavity (11); Spray pipe mechanism (2), two described spray pipe mechanism (2) are oppositely slidably arranged in the electroplating cavity (11);And Transmission mechanism (3), including shaft (31) and the support frame (32) slidably connected to the shaft (31), the shaft (31) is across and arranged on the opposite side of the frame (1), the spray pipe mechanism (2) is connected to the support frame (32); Wherein, circuit board (5) is across and arranged on the opposite side of the frame (1) and located between two described spray pipe mechanism (2), the shaft (31) rotation drives the support frame (32) to slide, in turn, drive the spray pipe mechanism (2) to be close to or away from the circuit board (5).

2. The electroplating jet device of claim 1, wherein, The shaft (31) is equipped with first transmission structure (311), and the support frame (32) is equipped with second transmission structure (321) with the first transmission structure (311) to make the shaft (31) drive the support frame (32) to move during rotation.

3. The electroplating jet stream apparatus of claim 2, wherein, The first transmission structure (311) includes gear (312) sleeved on the shaft (31), and the second transmission structure (321) includes rack (322) connected to the support frame (32) and engaged with the gear (312).

4. The electroplating jet stream apparatus of claim 3, wherein, The support frame (32) is further provided with a guide rod (323) for guiding the moving direction of the rack (322).

5. The electroplating jet according to claim 1, wherein The inner bottom wall of the frame (1) is provided with a first sliding structure (12), and the bottom of the spray pipe mechanism (2) is provided with a second sliding structure (21) slidably connected with the first sliding structure (12).

6. The electroplating jet device of claim 5, wherein, The first sliding structure (12) includes a guide rail (121) perpendicular to the spray pipe mechanism (2), and the second sliding structure (21) includes a universal wheel (211) slidably connected with the guide rail (121).

7. The electroplating jet stream apparatus of claim 1, wherein, The spray pipe mechanism (2) includes a spray disc (22), a spray pipe assembly (23) and a spray head assembly (24), the spray pipe assembly (23) is vertically connected to the spray disc (22), the spray head assembly (24) is vertically connected to the spray pipe assembly (23), and the support frame (32) is connected to the spray disc (22).

8. The electroplating jet device of claim 7, wherein, The spray pipe assembly (23) includes a plurality of spray pipes vertically connected to the spray disc (22), and the spray head assembly (24) includes a plurality of spray heads vertically connected to the spray pipes.

9. The electroplating jet device of claim 8, wherein, The spray head is arranged towards the circuit board (5) and perpendicular to the circuit board (5).

10. The electroplating jet according to claim 1, wherein, The electroplating jet flow device further comprises a swing frame (4) connected to the circuit board (5) and slidably connected to the outer periphery of the frame (1).

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