Laser radar module and electronic equipment
By optimizing the spacing between the transmitting and receiving modules in the lidar module to 6mm~15.5mm, the problem of unbalanced spacing between the laser transmitter and the optical receiver was solved, improving the performance and reliability of the lidar and avoiding increased costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2026-03-13
AI Technical Summary
In existing technologies, the spacing between the laser transmitter and the optical receiver cannot effectively balance interference and blind zones, resulting in poor performance and reliability of lidar.
By optimizing the spacing between the transmitting and receiving modules in the lidar module to 6mm~15.5mm, the transmitting and receiving modules are located on opposite sides of the control module, and the control module is electrically connected to both the transmitting and receiving modules, thereby reducing signal interference and minimizing blind spots.
This achieves a balance between signal interference and blind spots in the lidar module, improving the performance and reliability of the lidar while avoiding the cost of increasing components or complex structures.
Smart Images
Figure CN223992961U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of lidar technology, and more specifically, to a lidar module and electronic device. Background Technology
[0002] Laser radar (LiDAR) is a radar system that uses laser beams to detect the position, velocity, and other characteristics of targets. Its working principle involves emitting a detection signal (laser beam) towards the target, then comparing the received signal reflected back from the target (target echo) with the emitted signal. After appropriate processing, relevant information about the target is obtained, such as its distance, azimuth, altitude, speed, attitude, and even shape. This allows for the detection, tracking, and identification of targets such as aircraft.
[0003] Generally, a lidar system consists of a laser transmitter (also known as a transmitting module), an optical receiver (also known as a receiving module), and an information processing system (also known as a control module). The laser transmitter converts electrical pulses into light pulses and transmits them. The optical receiver then converts the light pulses reflected from the target back into electrical pulses, and the information processing system processes them to obtain relevant information.
[0004] Currently, laser transmitters, optical receivers, and information processing systems are generally integrated on a PCB (Printed Circuit Board). However, because laser transmitters and optical receivers can interfere with each other, the distance between them needs to be relatively far during setup. But too far a distance will result in an excessively large blind zone.
[0005] In summary, the existing technology cannot effectively balance interference and blind zones by adjusting the spacing between the laser transmitter and the optical receiver. Utility Model Content
[0006] The purpose of this application is to provide a lidar module and electronic device to solve the problem in the prior art where the spacing between the laser transmitter and the optical receiver cannot effectively balance interference and blind zone.
[0007] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:
[0008] On one hand, this application provides a lidar module, which includes a PCB board, a transmitting module, a receiving module, and a control module. The transmitting module, the receiving module, and the control module are all located on the front side of the PCB board, and the control module is electrically connected to the transmitting module and the receiving module, respectively.
[0009] The transmitting module and the receiving module are located on opposite sides of the control module, and the distance between the transmitting module and the receiving module is 6mm to 15.5mm.
[0010] Optionally, the minimum distance between the transmitting module and the receiving module is 6mm to 7mm.
[0011] Optionally, the minimum distance between the transmitting module and the receiving module is 6.16 mm.
[0012] Optionally, the maximum distance between the transmitting module and the receiving module is 15~15.5mm.
[0013] Optionally, the maximum distance between the transmitting module and the receiving module is 15.22 mm.
[0014] Optionally, the distance between the center point of the transmitting module and the center point of the receiving module is 9~10mm.
[0015] Optionally, the distance between the center point of the transmitting module and the center point of the receiving module is 9.92 mm.
[0016] Optionally, the PCB board is rectangular in shape, and the line connecting the center points of the transmitting module and the receiving module is parallel to the long or short side of the PCB board.
[0017] Optionally, the center points of the transmitting module and the receiving module are symmetrical about the center point of the PCB board.
[0018] Optionally, the PCB board is further provided with a clearance area, which is located on one side of the receiving module and is far away from the transmitting module.
[0019] Optionally, the first distance between the center point of the control module and the center point of the receiving module is smaller than the second distance between the center point of the control module and the center point of the transmitting module.
[0020] Optionally, the PCB board is rectangular in shape, and the side of the transmitting module is set at a 45° angle to the long side of the PCB board.
[0021] Optionally, the lidar module further includes a power module, which is disposed on the back of the PCB board and is electrically connected to the control module.
[0022] Optionally, the lidar module further includes a power module, which includes a first power unit and a second power unit. The first power unit is disposed on the front side of the PCB board, and the second power unit is disposed on the back side of the PCB board. The first power unit is electrically connected to the control module.
[0023] Optionally, the power module is located away from the receiving module.
[0024] Optionally, the power module is located at the edge of the PCB board.
[0025] Optionally, the lidar module further includes a digital processing module, which is disposed on the back of the PCB board and is electrically connected to the control module.
[0026] Optionally, the digital processing module is located away from the receiving module.
[0027] Optionally, the receiving module includes a receiving device, a matching capacitor, and a shielding shell. The shielding shell covers the receiving device and the matching capacitor, and the matching capacitor is located close to the receiving device.
[0028] Optionally, the transmitting module includes a transmitting device and a filtering capacitor, wherein the filtering capacitor is disposed near the transmitting device and on the side away from the receiving module.
[0029] Optionally, the lidar module further includes a connector module disposed on the back of the PCB board; the connector module includes a connector electrically connected to the control module, and the connector is disposed at the edge of the PCB board.
[0030] On the other hand, embodiments of this application also provide an electronic device, which includes the aforementioned lidar module.
[0031] Compared with the prior art, the embodiments of this application have the following beneficial effects:
[0032] This application provides a lidar module, which includes a PCB board, a transmitting module, a receiving module, and a control module. The transmitting module, receiving module, and control module are all located on the front side of the PCB board. The control module is electrically connected to both the transmitting and receiving modules. The transmitting and receiving modules are located on opposite sides of the control module, with a spacing of 6mm to 15.5mm between them. The applicant's research has found that a spacing of 6mm to 15.5mm between the transmitting and receiving modules effectively prevents interference between them and also effectively prevents excessively large blind spots.
[0033] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0034] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0035] Figure 1 This is a schematic diagram showing the layout of the transmitting module, receiving module, and control module provided in an embodiment of this application.
[0036] Figure 2 This is a schematic diagram showing the layout of components on the front side of a PCB board provided in an embodiment of this application.
[0037] Figure 3 This is a schematic diagram showing the layout of components on the back side of a PCB board provided in an embodiment of this application.
[0038] Figure 4 This is a schematic diagram of the front layout of the PCB board provided in an embodiment of this application.
[0039] Figure 5 This is a schematic diagram of the back layout of the PCB board provided in an embodiment of this application.
[0040] Label:
[0041] 110-PCB board; 111-Clearance area; 112-Mounting hole; 120-Receiver module; 130-Control module; 140-Transmitter module; 150-Power supply module; 160-Digital processing module; 170-Connector module. Detailed Implementation
[0042] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0043] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0044] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0045] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0046] In the description of this application, it should be noted that the terms "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0047] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0048] As described in the background section, the physical distance between the laser transmitter and the optical receiver has a significant impact on the performance of lidar. Specifically, when the laser transmitter and optical receiver are very close, the close-range blind zone of the lidar may increase. This is because the laser beam diverges rapidly after emission, and if the receiving module is too close to the source, it may not be able to receive sufficient reflected signals, especially in the initial stage of laser beam divergence. Furthermore, when the distance between them is small, signal interference can occur between the laser transmitter and the optical receiver, meaning the emitted laser light directly enters the receiving module, leading to increased background noise. This can affect the lidar's ability to detect reflected signals, especially at close range.
[0049] However, if the physical distance between the laser transmitter and the optical receiver is too large or the angle is mismatched, the optical receiver may miss the reflected laser beam, thus increasing the blind zone. Furthermore, increasing the spacing between the laser transmitter and the optical receiver can increase the complexity of the system setup, requiring more precise alignment and calibration. Additionally, a larger spacing may necessitate more complex mechanical structures to maintain the module's stability and alignment.
[0050] Therefore, if the distance between the laser transmitter and the optical receiver is appropriate, it can be ensured that the field of view of the receiving module covers the divergence area of the laser beam, thereby reducing blind spots and interference. However, in the existing technology, the spacing between the laser transmitter and the optical receiver cannot effectively balance interference and blind spots, resulting in poor performance and reliability of the lidar.
[0051] To address the above issues, the following two improvement approaches are proposed:
[0052] The first approach, in some advanced LiDAR systems, is to use multiple transmitting and receiving modules to cover different fields of view, thereby reducing blind spots. This configuration provides more comprehensive environmental awareness, but it also increases the complexity and cost of the system.
[0053] The second approach is to consider dynamically adjusting the spacing or angle between the transmitting and receiving modules based on some advanced lidar systems to adapt to different environmental conditions and target characteristics, thereby optimizing the blind zone and measurement range.
[0054] However, both of these methods lead to a significant increase in the cost of the lidar system, thus limiting its applicability.
[0055] In view of this, in order to improve the above problems, this application provides a lidar module that optimizes the distance (physical distance) between the transmitting module and the receiving module in the lidar to achieve a balance between blind zone, range, system complexity, interference and cost. In this way, by optimizing the distance between the transmitting module and the receiving module, the performance and reliability of the lidar can be improved.
[0056] The lidar module provided in this application is illustrated below:
[0057] As an optional implementation, please refer to Figure 1 The lidar module includes a PCB board 110, a receiver module 120, a control module 130, and a transmitter module 140. The receiver module 120, control module 130, and transmitter module 140 are all located on the front side of the PCB board 110. The control module 130 is electrically connected to both the transmitter module 140 and the receiver module 120. The transmitter module 140 and receiver module 120 are located on opposite sides of the control module 130, with a spacing of 6mm to 15.5mm between them.
[0058] On the one hand, the applicant's research found that optimizing the distance between the transmitting and receiving modules to 6mm~15.5mm avoids both excessively small distances leading to significant signal interference and excessively large blind zones. This achieves a balance between signal interference and excessive blind zones, thus improving the performance and reliability of the lidar. On the other hand, compared to existing lidar systems, this method eliminates the need for additional components or complex structures; it only requires adjusting the distance between the transmitting and receiving modules, resulting in lower costs.
[0059] Further research by the applicant revealed that the minimum distance between the transmitting module 140 and the receiving module 120 can be set to 6mm~7mm, with a preferred value of 6.16mm. By setting this minimum distance, signal interference between the transmitting module 140 and the receiving module 120 can be minimized, thus ensuring the performance of the lidar.
[0060] Furthermore, the maximum distance between the transmitting module 140 and the receiving module 120 can be 15~15.5mm, with a preferred value of 15.22mm. By setting this maximum distance, the blind zone can be minimized, ensuring the performance and reliability of the lidar.
[0061] Furthermore, the distance between the center point of the transmitting module 140 and the center point of the receiving module 120 can be 9~10mm, with a preferred value of 9.92mm. By setting the distance between the center points, an effective balance between signal interference and blind spots is achieved, further improving the performance and reliability of the lidar.
[0062] Generally, the PCB board 110 is rectangular in shape, including a long side and a short side. To facilitate signal transmission, in this application, the side of the transmitting module 140 is set at a 45° angle to the long side of the PCB board 110. Based on this, the minimum distance between the transmitting module 140 and the receiving module 120 is the distance between the inner edge of the receiving module 120 and the inner corner of the transmitting module 140. The maximum distance between the transmitting module 140 and the receiving module 120 is the distance between the outer edge of the receiving module 120 and the outer corner of the transmitting module 140. The inner and outer edges of the receiving module 120 refer to the edges of the receiving module 120 closest to the control module 130 and furthest from the control module 130, respectively. The inner and outer corners of the transmitting module 140 refer to the corners of the transmitting module 140 closest to the control module 130 and furthest from the control module 130, respectively.
[0063] For example, please refer again Figure 1 In the figure, PCB board 110 is set as a rectangle, with the side in the horizontal direction being the long side and the side in the vertical direction being the short side, and the dashed line in the figure is an auxiliary line parallel to the long side.
[0064] Figure 1 In the diagram, the transmitting module 140 and the receiving module 120 are located on either side of the control module 130, with the control module 130 situated in the central area of the entire PCB board 110. The transmitting module 140 is positioned at a 45° angle, with each side of it perpendicular to the dotted line in the diagram. For the transmitting module 140, the closest point to the control module 130 is B1, which is the vertex of its interior angle. The farthest point from the control module 130 is B3, which is the vertex of its exterior angle. Point B2 is the center point of the transmitting module 140. Of course, in actual layout design, the angle of the transmitting module 140 can be adjusted according to requirements; for example, it can be set to 40°~45° or 45°~50°, without limitation here.
[0065] Figure 1 In the diagram, for the receiving module 120, the edge closest to the control module 130 is the edge containing A3, which is the inner edge. The edge farthest from the control module 130 is the edge containing A1, which is the outer edge. The intersections of the outer edge, the inner edge, and the dashed line determine points A1 and A3. A2 is the center point of the receiving module 120. Meanwhile, O1 is the center point of the entire PCB board 110, and O2 is the center point of the control module 130.
[0066] Combination Figure 1As an example, it can be understood that the minimum distance between the transmitting module 140 and the receiving module 120 is the distance between point A3 and point B1. The maximum distance between the transmitting module 140 and the receiving module 120 is the distance between point A1 and point B3. The distance between the center points of the transmitting module 140 and the receiving module 120 is the distance between point A2 and point B2.
[0067] Furthermore, to achieve a more coordinated distribution between the transmitting module 140 and the receiving module 120, and to make the overall layout of the PCB board 110 more aesthetically pleasing and rational, in one implementation, the line connecting the center points of the transmitting module 140 and the receiving module 120 is parallel to either the long or short side of the PCB board 110. For example... Figure 1 As shown, the line connecting points A2 and B2 is parallel to the long side of PCB board 110. It should be noted that... Figure 1 This is just an example; Figure 1 In this embodiment, the transmitting module 140, the control module 130, and the receiving module 120 are distributed along the long side of the PCB board 110. Of course, in other implementations, the transmitting module 140, the control module 130, and the receiving module 120 can also be distributed along the short side of the PCB board 110, that is, the line connecting point A2 and point B2 is parallel to the short side of the PCB board 110, which is not limited here.
[0068] Furthermore, the center points of the transmitting module 140 and the receiving module 120 are symmetrical about the center point of the PCB board 110, which ensures the aesthetics and rationality of the layout of the transmitting module 140 and the receiving module 120, that is, points A2 and B2 are symmetrical about point O1. Understandably, when points A2 and B2 are symmetrical about point O1, the distance between points A2 and O1 is equal to the distance between points B2 and O1.
[0069] The location of the control module 130 is not limited in this application; it only needs to be located between the transmitting module 140 and the receiving module 120. In one implementation, the control module 130 can be located at the center of the PCB board 110, i.e., point O2 coincides with point O1. In another implementation, the control module 130 can also be configured such that point O2 does not coincide with point O1.
[0070] It should be noted that research has found that the receiving module 120 is more susceptible to signal interference in lidar. Therefore, to reduce interference with the receiving module 120, the first distance between the center point of the control module 130 and the center point of the receiving module 120 can be set to be smaller than the second distance between the center point of the control module 130 and the center point of the transmitting module 140. That is, in this application, the distance between point A2 and point O2 can be smaller than the distance between point O2 and point B2. This setting further reduces the wiring between the receiving module 120 and the control module 130, thereby reducing interference from the wiring to the receiving module 120, ensuring signal stability at the receiving module 120, and improving the overall performance of the lidar module.
[0071] Furthermore, in the specific layout, components can be placed on one side of the transmitting module 140 as much as possible, thereby minimizing interference with the receiving module 120. For example, please refer to... Figure 2 The diagram shows the component layout on the front of the PCB board 110. Capacitors and resistors are mainly located around the control module 130 and the transmitting module 140, while fewer resistors and capacitors are located on the receiving module 120 side, ensuring that the receiving module 120 is subjected to as little interference as possible when the lidar is working.
[0072] Based on this, a clearance area 111 is also provided on the PCB board 110. The clearance area 111 is located on one side of the receiving module 120 and is far away from the transmitting module 140. On the one hand, by setting the clearance area 111 on the left side of the receiving module 120, as few components as possible can be arranged around the receiving module 120, minimizing signal interference to the receiving module 120 during the operation of the lidar. On the other hand, the clearance area 111 can also serve as a reserved area to facilitate the addition of components in subsequent product iterations. For example, when it is necessary to add new functions to the lidar, new circuits need to be added, and these circuits can be arranged in the clearance area 111.
[0073] Please continue reading. Figure 2 , Figure 2The PCB board 110 shown has mounting holes 112 at its four corners for easy installation in the subsequent lidar housing. The receiving module 120 mainly includes a photodiode D5, a matching capacitor C12, and a shielding shell S1. The shielding shell S1 covers the photodiode D5 and the matching capacitor C12, with the matching capacitor C12 positioned close to the photodiode D5. This implementation allows for interference signal isolation using the shielding shell S1. The proximity of the matching capacitor C12 to the photodiode D5 facilitates signal matching and allows for a smaller shielding shell S1, contributing to the miniaturization of the entire receiving module 120. Furthermore, to minimize the wiring between the receiving module 120 and the control module 130, the receiving module 120 can be positioned close to the corresponding pin of the control module 130. For example, the control module 130 generally includes an AFE (Analog Front End) chip U2, whose PIN25 and PIN26 are used to connect to the receiving module 120. The receiving module 120 should be positioned close to PIN25 and PIN26 of the AFE chip U2 to reduce the amount of wiring between them.
[0074] For the transmitting module 140, the transmitting module 140 generally includes a transmitting device and a related filtering capacitor; wherein, the transmitting device provided in this application is a light-emitting device D2, and the filtering capacitor is disposed near the light-emitting device D2 and on the side away from the receiving module 120, so as to minimize signal interference to the receiving module 120.
[0075] For example, C5, C23, C15, C16, and C17, as labeled in the diagram, are all filter capacitors for the transmitting module 140. These filter capacitors can be placed close to the transmitting module 140. Specifically, C5 and C23 serve as energy storage filter capacitors for the driving signal of the light-emitting device D2, and they need to be placed on the return path of the light-emitting device D2. C15, C16, and C17 serve as energy storage filters for the positive terminal of the light-emitting device D2, and they can be placed close to the positive terminal of the light-emitting device D2, the closer the better.
[0076] For the control module 130, it generally includes an AFE chip U2 and surrounding resistors and capacitors. The surrounding capacitors include C3, C8, C9, C10, C11, C18, C19, and C25, and the surrounding resistors include R2, R3, R10, and R11. Understandably, the surrounding capacitors and resistors are generally positioned close to the corresponding pins of the AFE chip U2. For example, C8 and C9 are placed at pin PIN21 of the AFE chip U2 as energy storage and filtering capacitors. For ease of placement, capacitors C8 and C9 are placed one by one vertically. Similarly, capacitors C18 and C19 are placed at pin PIN20 of the AFE chip U2 as energy storage and filtering capacitors. Since pin PIN20 is adjacent to pin PIN21, and capacitors C8 and C9 already occupy this area, based on the principle of proximity, capacitors C8, C9, C19, and C18 are placed one by one vertically. Furthermore, if other components are already placed around the corresponding pins of the AFE chip U2, the capacitors or resistors that need to be placed can be placed at a slightly farther location or on the back of the PCB board 110. For example, C5 and C23, as energy storage and filtering capacitors for PIN9 and PIN10, need to be placed close to PIN9 and PIN10 of the AFE chip U2. However, since the placement of the light-emitting device D2 already occupies this space, C5 and C23 need to be placed to the right of the light-emitting device D2, and as close to the chip as possible. Figure 3 As shown, it is relatively difficult to place capacitors C10 and C11, resistors R2, R3, R10 and R11 on the front side of PCB board 110. Therefore, capacitors C10 and C11, resistors R2, R3, R10 and R11 can be placed on the back side of PCB board 110.
[0077] It should be noted that, based on the specific structures of the aforementioned transmitting module, receiving module, and control module, the positional relationships between these modules described in this application are defined based on the light-emitting device D2, photodiode D5, and AFE chip U2. For example, the distance between the center point of the transmitting module and the center point of the receiving module represents the distance between the center point of the light-emitting device D2 and the center point of the photodiode D5. The first distance between the center point of the control module and the center point of the receiving module represents the distance between the center point of the AFE chip U2 and the center point of the photodiode D5. The second distance between the center point of the control module and the center point of the transmitting module represents the distance between the center point of the AFE chip U2 and the center point of the light-emitting device D2.
[0078] In addition, please see Figure 4In order to make full use of the space of the PCB board 110 and achieve miniaturization of the lidar, the lidar crystal X1 is located at the right edge of the PCB board 110 and is located between the two mounting holes 112 on the right side.
[0079] Of course, to provide power to the system, the LiDAR module also includes a power module 150. In one implementation, the power module 150 may be located only on the back of the PCB board 110, and the power module 150 is electrically connected to the control module 130 and provides power to the control module 130. In another implementation, the power module 150 includes a first power unit and a second power unit. The first power unit is located on the front of the PCB board 110, and the second power unit is located on the back of the PCB board 110. The first power unit is electrically connected to the control module 130.
[0080] Since the power module 150 may cause signal interference to the receiving module 120 during operation, the power module 150 needs to be located away from the receiving module 120. For example, the power module 150 can be located at the edge of the PCB board.
[0081] Taking the power module 150, which includes a first power unit and a second power unit, as an example, please refer to [link / reference]. Figure 4 The first power supply unit is located at the upper edge of the PCB board, so that the first power supply unit is as far away from the photodiode D5 as possible while meeting the setting requirements.
[0082] The first power supply unit primarily powers the transmitting module, control module, and receiving module. It includes a first power chip U1 and peripheral components, such as capacitors C1, C2, and C14, resistors R14 and R16, and power filters FB3 and FB6. Capacitors C1 and C14 serve as energy storage and filtering capacitors for the first power chip U1, positioned near their corresponding pins. Resistors R14 and R16, along with capacitor C2, form the feedback network of the first power chip U1, located in the same position and close to its corresponding pin. Power filters FB3 and FB6 are positioned on the return path of the first power chip U1.
[0083] Please see Figure 5 Similarly, the second power supply unit is also positioned as close to the upper edge as possible. The second power supply unit includes the second power chip U4 and surrounding components, such as capacitors C4, C7, and C26, and power filters FB1, FB2, and FB4. C4, C7, and C26 serve as energy storage and filtering capacitors for the second power chip U4 and are positioned close to the second power chip U4. Power filters FB1, FB2, and FB4 are positioned in different loop paths.
[0084] In addition, the lidar module may also include a digital processing module 160, which is disposed on the back of the PCB board. The digital processing module 160 is electrically connected to the control module and is used to send corresponding control commands to the control module and perform digital signal processing. Furthermore, the second power supply unit is mainly used to supply power to the digital processing module 160.
[0085] Because the digital processing module 160 can cause significant interference to the receiving module 120 during operation, it is also located away from the receiving module 120. The digital processing module 160 includes a digital processing chip U3 and peripheral components, including capacitors C13, C20, C21, C22, and C24, resistors R1, R4, R5, R9, and R13, and a crystal oscillator X1. Capacitors C22 and C24 serve as energy storage and filtering capacitors for the digital processing chip U3 and are positioned close to their corresponding pins. Resistor R5 and capacitor C13 serve as the reset circuit for the digital circuit and are positioned close to their corresponding pins. Resistors R1 and R9 serve as pull-up circuits for the digital circuit, and C20, C21, R13, and crystal oscillator X1 serve as the clock network for the digital processing chip U3 and are positioned close to their corresponding pins.
[0086] In addition, to enable power supply and external communication, the lidar module also includes a connector module 170, which is located on the back of the PCB board. The connector module 170 includes a connector J9, which is electrically connected to the control module 130 and is positioned at the edge of the PCB board 110. By placing the connector J9 at the edge, the area occupied by the connector J9 on the PCB board 110 can be minimized, and connection to external circuits can be facilitated. Furthermore, since the connector J9 primarily serves as a power supply and external communication device, placing it at the edge also minimizes interference to the receiving module 120 during power supply and signal transmission.
[0087] Of course, connector module 170 also includes peripheral components, such as capacitors C6 and C27, resistors R12 and R15, and diode D3. Capacitors C6 and C27, resistors R12 and R15 serve as communication filtering circuits, and diode D3 serves as a protection device, and are arranged at the corresponding pin positions of connector J9.
[0088] Based on the above implementation, this application also provides an electronic device, which includes the aforementioned lidar module. For example, the electronic device described in this application can be an airplane, a car, etc.
[0089] In summary, this application provides a lidar module comprising a PCB board, a transmitting module, a receiving module, and a control module. The transmitting module, receiving module, and control module are all located on the front side of the PCB board, and the control module is electrically connected to both the transmitting module and the receiving module. The transmitting module and receiving module are located on opposite sides of the control module, with a spacing of 6mm to 15.5mm between them. The applicant's research has found that a spacing of 6mm to 15.5mm between the transmitting module and the receiving module effectively prevents interference between them and also effectively prevents excessively large blind spots.
[0090] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
[0091] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A laser radar module, characterized by comprising: The laser radar module comprises a PCB board, a transmitting module, a receiving module and a control module, the transmitting module, the receiving module and the control module are located on the front face of the PCB board, and the control module is electrically connected with the transmitting module and the receiving module respectively. The transmitting module and the receiving module are located on the two sides of the control module, and the distance between the transmitting module and the receiving module is 6mm-15.5mm.
2. The lidar module of claim 1, wherein, The minimum distance between the transmitting module and the receiving module is 6mm-7mm.
3. The lidar module of claim 2, wherein the lidar module is configured to be mounted to a vehicle. The minimum distance between the transmitting module and the receiving module is 6.16mm.
4. The lidar module of claim 1, wherein the lidar module is configured to be mounted to a vehicle. The maximum distance between the transmitting module and the receiving module is 15-15.5mm.
5. The lidar module of claim 4, wherein the lidar module is configured to be mounted to a vehicle. The maximum distance between the transmitting module and the receiving module is 15.22mm.
6. The lidar module of claim 1, wherein, The distance between the center point of the transmitting module and the center point of the receiving module is 9-10mm.
7. The lidar module of claim 6, wherein the lidar module is configured to be mounted to a vehicle. The distance between the center point of the transmitting module and the center point of the receiving module is 9.92mm.
8. The lidar module of claim 1, wherein, The shape of the PCB board is rectangular, and the line connecting the center points of the transmitting module and the receiving module is parallel to the long side or the short side of the PCB board.
9. The lidar module of claim 1, wherein, The center points of the transmitting module and the receiving module are symmetrical about the center point of the PCB board.
10. The lidar module of claim 9, wherein, The PCB board is further provided with a clearance area, the clearance area is located on one side of the receiving module, and the clearance area is away from the transmitting module.
11. The lidar module of claim 9, wherein the lidar module is configured to be mounted to a vehicle. The first distance between the center point of the control module and the center point of the receiving module is smaller than the second distance between the center point of the control module and the center point of the transmitting module.
12. The lidar module of claim 1, wherein, The shape of the PCB board is rectangular, and the edge of the transmitting module is arranged at an angle of 45° with the long side of the PCB board.
13. The lidar module of claim 1, wherein, The laser radar module further comprises a power module, the power module is arranged on the back face of the PCB board, and the power module is electrically connected with the control module.
14. The lidar module of claim 1, wherein, The laser radar module further comprises a power module, the power module comprises a first power unit and a second power unit, the first power unit is arranged on the front face of the PCB board, the second power unit is arranged on the back face of the PCB board, and the first power unit is electrically connected with the control module.
15. The lidar module of claim 13 or 14, wherein, The power module is arranged at a position away from the receiving module.
16. The lidar module of claim 15, wherein, The power module is arranged at a position on the edge of the PCB board.
17. The lidar module of claim 1, wherein, The laser radar module further comprises a digital processing module, the digital processing module is arranged on the back face of the PCB board, and the digital processing module is electrically connected with the control module.
18. The lidar module of claim 17, wherein, The digital processing module is arranged at a position away from the receiving module.
19. The lidar module of claim 1, wherein, The receiving module comprises a receiving device, a matching capacitor and a shielding shell, the shielding shell covers the outside of the receiving device and the matching capacitor, and the matching capacitor is arranged close to the receiving device.
20. The lidar module of claim 1, wherein, The transmitting module comprises a transmitting device and a filtering capacitor, the filtering capacitor is arranged close to the transmitting device, and the filtering capacitor is arranged on a side away from the receiving module.
21. The lidar module of claim 1, wherein, The laser radar module further comprises a connector module arranged on the back of the PCB board; the connector module comprises a connector electrically connected with the control module, and the connector is arranged at the edge of the PCB board.
22. An electronic device, comprising: The electronic device comprises the laser radar module as claimed in any one of claims 1 to 21.