Laser diode power supply structure
By introducing a flexible power supply board combined with a heat sink into the laser diode power supply structure, the problem of poor heat dissipation caused by traditional power supply boards is solved, achieving better heat dissipation and product stability, and supporting diverse laser diode arrangements.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-03-13
AI Technical Summary
In existing laser diode power supply structures, the fixed shape of traditional power supply boards results in a single arrangement of laser chips, and the heat sink and heat radiator are largely isolated, leading to poor heat dissipation and affecting product stability.
By combining a flexible power supply board with a heat sink, and through the design of mounting holes and mounting slots, the laser diode and the heat sink are tightly integrated. The electrodes are led out by bending the flexible power supply board, which increases the contact area between the heat sink and the heat sink and improves the heat dissipation effect.
It improves the heat dissipation performance of laser diodes, enhances product stability, provides a better power supply solution for complex non-planar laser diode arrangements, and expands the beam shaping possibilities of high-power light sources.
Smart Images
Figure CN223993473U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electrical device technology, and specifically relates to a laser diode power supply structure. Background Technology
[0002] In recent years, the laser field has developed rapidly, and the application scenarios of high-power laser sources have continued to expand. Due to the limited power of a single laser diode, high-power laser sources still need to be combined to obtain lasers. However, due to the fixed shape of traditional power supply boards, the laser chip arrangement is simple. Moreover, due to the insertion of the power supply board, the heat sink and heat sink are largely isolated, resulting in high heat dissipation of laser diodes, which in turn reduces the overall stability of the product.
[0003] Existing non-planar laser diode power supply structures, such as Figure 1 As shown, the device includes laser diode I4, laser diode II5, power supply board I6, power supply board II7, and a heat sink. The heat sink has mounting holes. Laser diodes I4 and II5 are vertically arranged and placed into the mounting holes of the heat sink, tightly integrated with it. The laser diode pins are exposed on the back of the heat sink, but not protruding from the back of the heat sink. A horizontal groove is provided on the back of the heat sink to embed power supply boards I6 and II7. Power supply boards I6 and II7 are inserted into the horizontal groove on the back of the heat sink and connected to the laser diode pins. Power supply boards I6 and II7 lead the power supply ports of laser diodes I4 and II5 to an open area. The positive and negative terminals of laser diodes I4 and II5 are connected in series via connecting wires. The back of the heat sink is connected to a heat sink 3 for heat dissipation. Utility Model Content
[0004] The purpose of this invention is to provide a laser diode power supply structure to solve the problem of high heat dissipation in existing laser diode power supply structures.
[0005] This utility model is achieved using the following technical solution:
[0006] A laser diode power supply structure includes a heat sink. A mounting hole is provided on one side of the heat sink along its thickness direction. The mounting hole extends from the surface of the heat sink into its interior. A mounting groove is connected to the mounting hole along its axis into the heat sink. The height of the mounting groove plus the depth of the mounting hole is less than the thickness of the heat sink. A flexible power supply board is placed inside the mounting groove. A portion of the flexible power supply board extends into the mounting groove, and another portion extends out of the mounting hole to reach the surface of the heat sink. A heat sink is connected to the other side of the heat sink along its thickness direction.
[0007] In application, after the laser diode pins are soldered to the flexible power supply board, the laser diode is fixed in the mounting hole. At this time, the laser diode pins extend into the mounting hole and mounting groove, and part of the flexible power supply board falls into the mounting groove. After the laser diode is installed in the mounting hole, the other part of the flexible power supply board is bent to expose the mounting groove and reach the heat sink surface.
[0008] More preferably, the edge of the mounting hole is provided with a protrusion, which can fix the mounting position of the laser diode and prevent it from rotating.
[0009] In a further preferred embodiment, the mounting groove extends into the heat sink with a blind hole. The size of the blind hole is smaller than the bottom size of the mounting groove. By setting the blind hole, the heat sink can avoid the position of the laser diode pin, and at the same time reduce the depth of the mounting groove, thus avoiding excessive slotting in the heat sink and reducing its heat dissipation performance.
[0010] This invention solves the problem that existing power supply boards, which isolate the heat sink and heat sink over a large area due to beam shaping requirements, cause heat accumulation and thus reduce the stability of the laser diodes when laser diodes are arranged in series with different planes. Moreover, it provides a solution for power supply of more complex laser diode arrangements, making beam shaping of high-power light sources more possible. Attached Figure Description
[0011] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.
[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0013] Figure 1 This is a schematic diagram of the existing power supply structure.
[0014] Figure 2 This is one of the schematic diagrams of the power supply structure of this utility model.
[0015] Figure 3 This is the second schematic diagram of the power supply structure of this utility model.
[0016] Figure 4 This is the third schematic diagram of the power supply structure of this utility model.
[0017] Figure 5 This is a schematic diagram of the heat sink structure of this utility model.
[0018] In the diagram: 1-heat sink, 11-mounting hole, 12-mounting groove, 13-protrusion, 14-blind hole, 2-flexible power supply board, 3-heat sink, 4-laser diode I, 5-laser diode II, 6-power supply board I, 7-power supply board II. Detailed Implementation
[0019] To better understand the above-mentioned objectives, features, and advantages of this utility model, the solution of this utility model will be further described below. It should be noted that, unless otherwise specified, the embodiments of this utility model and the features thereof can be combined with each other.
[0020] In this description, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. It should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joint" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.
[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some embodiments of the present invention, and not all embodiments.
[0022] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.
[0023] Example 1: A laser diode power supply structure includes a heat sink 1. A mounting hole 11 is provided on one side of the heat sink 1 in the thickness direction. The mounting hole 11 extends from the surface of the heat sink 1 into the interior of the heat sink 1. A mounting groove 12 is connected to the mounting hole 11 along the axis into the heat sink 1. The height of the groove 12 plus the depth of the mounting hole 11 is less than the thickness of the heat sink 1. A flexible power supply board 2 is placed inside the mounting groove 12. A portion of the flexible power supply board 2 extends into the mounting groove 12, and another portion extends out of the mounting hole 11 to reach the surface of the heat sink 1. A heat sink 3 is connected to the other side of the heat sink 1 in the thickness direction.
[0024] The mounting hole 11 has a protrusion 13 on its edge. The protrusion 13 in the mounting hole 11 can fix the mounting position of the laser diode and prevent it from rotating.
[0025] The mounting slot 12 extends into the heat sink 1 with a blind hole 14. The size of the blind hole 14 is smaller than the bottom size of the mounting slot 12. By setting the blind hole 14, the position of the laser diode pin can be avoided, and the depth of the mounting slot 12 can be reduced, thus avoiding excessive slotting in the heat sink 1 and reducing the heat dissipation performance of the heat sink 1.
[0026] Example 2: A laser diode power supply structure, such as... Figure 2-5 As shown, it includes laser diode I4, laser diode II5, flexible power supply board 2 and heat sink 1.
[0027] Laser diodes I4 and II5 are arranged vertically and their pins are connected to the same flexible power supply board 2. Laser diodes I4 and II5, which are connected to the flexible power supply board 2, are inserted into the mounting hole 11 of the heat sink 1, so that the flexible power supply board 2 falls into the mounting groove 12, and laser diodes I4 and II5 are tightly bonded to the heat sink 1.
[0028] The flexible power supply board 2 can be bent at will to accommodate laser diode pins in different positions. The flexible power supply board 2 is placed between laser diode I4 and laser diode II5 and heat sink 1. In addition, in order to ensure that the contact area between laser diode I4 and laser diode II5 and heat sink 1 is as small as possible, the contact area between heat sink 1 and heat sink 3 in this power supply structure is larger than that in the existing power supply structure, thereby achieving better heat transfer.
[0029] Working principle: The heat sink 1 is installed with laser diode I4 and laser diode II5 to ensure that the heat sink 1 is tightly connected with laser diode I4 and laser diode II5. The mounting slot 12 can accommodate the flexible power supply board 2 but is not connected to the flexible power supply board 2. The flexible power supply board 2 is not connected to the heat sink 1. The blind hole 14 is not connected to the pins of laser diode I4 and laser diode II5. The back of the heat sink 1 is connected to the heat sink 3 for heat dissipation.
[0030] This utility model has the following advantages:
[0031] (1) Inserting a flexible power supply board 2 between the laser diode and the heat sink 1 can realize the series connection of the laser diode pins.
[0032] (2) The flexible power supply board 2 can utilize the small space between the laser diode and the heat sink 1 to supply power, thus alleviating the problem of heat dissipation of the laser diode through the heat sink 1.
[0033] The above description is merely a specific embodiment of this utility model, enabling those skilled in the art to understand or implement it. Although detailed descriptions have been provided with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments, and all should be covered by the protection scope of the claims.
Claims
1. A laser diode power supply structure, characterized by: The heat sink (1) is provided with a mounting hole (11) on one side in the thickness direction, the mounting hole (11) is arranged from the surface of the heat sink (1) to the inside of the heat sink (1), the mounting hole (11) is connected with a mounting groove (12) in the heat sink (1) along the axis, the height of the groove depth of the mounting groove (12) plus the hole depth of the mounting hole (11) is less than the thickness of the heat sink (1), a flexible power supply plate (2) is arranged in the mounting groove (12), one part of the flexible power supply plate (2) extends into the mounting groove (12), and the other part extends out of the mounting hole (11) to the surface of the heat sink (1), and the other side of the heat sink (1) is connected with a radiator (3).
2. A laser diode power supply structure according to claim 1, wherein: The edge of the mounting hole (11) is provided with a protrusion (13).
3. A laser diode power supply structure according to claim 1, wherein: The mounting groove (12) extends a blind hole (14) into the heat sink (1), and the size of the blind hole (14) is smaller than the size of the groove bottom of the mounting groove (12).
4. A laser diode power supply structure according to claim 3, wherein: The edge of the mounting hole (11) is provided with a protrusion (13).