Printed circuit board and battery protection board
By designing a first copper layer and a second copper layer of different thicknesses on the printed circuit board, the problem of insufficient current carrying capacity of the copper layer is solved, achieving a balance between device spacing and current carrying capacity in the control module, and meeting the current transmission requirements of large-capacity batteries.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2026-03-13
AI Technical Summary
While the copper layer of the printed circuit board meets the device spacing requirements of the control module, its current carrying capacity is relatively small and cannot meet the current carrying capacity requirements of large-capacity batteries.
Design a printed circuit board including a first copper layer and a second copper layer with different thicknesses. The first copper layer is used for power module connection and has a larger thickness to meet current carrying requirements. The second copper layer is used for control module connection and has a smaller thickness to meet device spacing requirements.
It simultaneously meets the device spacing and current carrying requirements of the control module, achieving efficient current transmission on the printed circuit board.
Smart Images
Figure CN223993762U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of printed circuit board technology, and in particular to a printed circuit board and a battery protection board. Background Technology
[0002] A battery protection circuit module (PCM) is a crucial component that protects batteries from damage caused by overcharging, over-discharging, and short circuits. A PCM consists of a flexible printed circuit board (FPC) and a printed circuit board (PCB), with the power module and control module located on the same copper layer of the PCB.
[0003] As battery capacity increases, the power required by the battery protection board also increases, leading to increased current-carrying requirements for the printed circuit board (PCB) and the copper layers used to house the power modules. However, the control module requires smaller device spacing, and the PCB's copper layers, while meeting the spacing requirements of the control module, have limited current-carrying capacity, which cannot meet the current-carrying requirements of larger capacity batteries. Utility Model Content
[0004] In view of this, this application provides a printed circuit board and a battery protection board to solve the problem that the copper layer of the printed circuit board has a small current carrying capacity when the device spacing required by the control module is small, which cannot meet the current carrying capacity requirements of a large-capacity battery.
[0005] According to one aspect of this application, a printed circuit board is provided, the printed circuit board including a first copper layer and a second copper layer, the first copper layer and the second copper layer being stacked along the thickness direction of the printed circuit board, and the thickness of the first copper layer being greater than the thickness of the second copper layer.
[0006] The first copper layer has a first conductive pattern, and the second copper layer has a second conductive pattern. The first conductive pattern is used to connect to the power module, and the second conductive pattern is used to connect to the control module.
[0007] Preferably, the thickness of the first copper layer is greater than or equal to 5 oz, and the thickness of the second copper layer is less than or equal to 1 / 3 oz.
[0008] Preferably, the first copper layer includes a first surface and a second surface that are opposite to each other in the thickness direction. A first etch groove and a second etch groove are formed on the first copper layer. The first etch groove extends from the first surface toward the interior of the first copper layer along the thickness direction, and the second etch groove extends from the second surface toward the interior of the first copper layer along the thickness direction.
[0009] Preferably, the dimension of the first etching groove in the thickness direction is equal to the dimension of the second etching groove in the thickness direction.
[0010] Preferably, the first conductive pattern includes a plurality of first wires, wherein the minimum distance between any two adjacent first wires is less than or equal to 0.25 mm; and / or,
[0011] The second conductive pattern includes a plurality of second conductors, wherein the minimum distance between any two adjacent second conductors is less than or equal to 0.1 mm.
[0012] Preferably, the printed circuit board includes a core board and a third copper layer, the thickness of the third copper layer being equal to the thickness of the first copper layer, and the third copper layer and the first copper layer being respectively pressed onto both sides of the core board in the thickness direction.
[0013] Preferably, the printed circuit board further includes a first PP layer, a second PP layer, and a fourth copper layer, wherein the fourth copper layer is laminated to the side of the third copper layer opposite to the core board in the thickness direction through the first PP layer, and the second copper layer is laminated to the side of the fourth copper layer opposite to the first PP layer in the thickness direction through the second PP layer.
[0014] Preferably, the printed circuit board has at least one first connection hole, which extends from the side where the second copper layer is located to one of the first copper layer, the second copper layer, and the fourth copper layer; and / or,
[0015] The printed circuit board has at least one second connection hole, which extends from the side where the fourth copper layer is located to one of the first copper layer, the second copper layer and the third copper layer.
[0016] Preferably, the printed circuit board further includes a solder resist layer and an insulating layer, wherein the solder resist layer is bonded to the side of the first copper layer opposite to the core board, and the insulating layer is bonded to the side of the second copper layer opposite to the fourth copper layer.
[0017] According to another aspect of this application, a battery protection board is provided, the battery protection board including the printed circuit board described above.
[0018] The printed circuit board of this application includes a first copper layer and a second copper layer, the first copper layer being thicker than the second copper layer. A first conductive pattern is present on the first copper layer, and a power module is connected to the first conductive pattern. Due to the greater thickness of the first copper layer, it can meet the current-carrying requirements of the printed circuit board. A second conductive pattern is present on the second copper layer, and a control module is connected to the second conductive pattern. Due to the smaller thickness of the second copper layer, it can meet the device spacing requirements of the control module. Thus, the printed circuit board can simultaneously meet the device spacing and current-carrying requirements of the control module. Attached Figure Description
[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 A schematic diagram of a printed circuit board according to an embodiment of the present invention is shown;
[0021] Figure 2 This diagram shows the state of the first and third copper layers after step S1 is completed.
[0022] Figure 3 This diagram shows the state of the first and third copper layers after step S2 is completed.
[0023] Figure 4 This diagram illustrates the states of the first, second, third, and fourth copper layers after step S3 is completed.
[0024] Icons: 100 - First copper layer; 200 - Second copper layer; 300 - Third copper layer; 400 - Fourth copper layer; 510 - First resin layer; 520 - Second resin layer; 530 - Third resin layer; 540 - Fourth resin layer; 610 - First PP layer; 620 - Second PP layer; 630 - Third PP layer; 700 - FR4 layer; 800 - First connecting hole; 900 - Solder mask layer; L - Thickness direction. Detailed Implementation
[0025] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; changes that will be apparent after understanding the disclosure of this application are possible, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.
[0026] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding the disclosure of this application.
[0027] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, it may be directly "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, "directly bonded to" another element, "directly on" another element, or "directly covering" another element, there may be no other elements in between.
[0028] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.
[0029] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.
[0030] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relation terms used herein will be interpreted accordingly.
[0031] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.
[0032] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.
[0033] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have a wide variety of constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application.
[0034] According to one aspect of this application, a printed circuit board is provided, the printed circuit board including a first copper layer 100 and a second copper layer 200, the first copper layer 100 and the second copper layer 200 being stacked along the thickness direction L of the printed circuit board, the thickness of the first copper layer 100 being greater than the thickness of the second copper layer 200; the first copper layer 100 having a first conductive pattern, the second copper layer 200 having a second conductive pattern, the first conductive pattern being used for connection with a power module, and the second conductive pattern being used for connection with a control module.
[0035] The printed circuit board of this application includes a first copper layer 100 and a second copper layer 200, wherein the thickness of the first copper layer 100 is greater than the thickness of the second copper layer 200. A first conductive pattern is present on the first copper layer 100, and a power module is connected to the first conductive pattern. Due to the greater thickness of the first copper layer 100, it can meet the current-carrying requirements of the printed circuit board. A second conductive pattern is present on the second copper layer 200, and a control module is connected to the second conductive pattern. Due to the smaller thickness of the second copper layer 200, it can meet the device spacing requirements of the control module. Thus, the printed circuit board can simultaneously meet the device spacing and current-carrying requirements of the control module.
[0036] Optionally, the battery protection board may include a PCB (Printed Circuit Board).
[0037] In the embodiments of this application, the first conductive pattern is a collection of multiple first wires formed by etching the first copper layer 100. The power module may include devices such as MOS (Metal-Oxide-Semiconductor Field-Effect Transistor), FUSE (fuse), and precision resistors. The devices in the power module can be connected to the first wires in the first conductive pattern. The second conductive pattern is a collection of multiple second wires formed by etching the second copper layer 200. The control module may include devices such as IC (integrated circuit), fuel gauge, and capacitor / resistor components. The components in the control module can be connected to the second wires in the second conductive pattern.
[0038] Optionally, the thickness of the first copper layer 100 is greater than or equal to 5 oz (that is, the thickness of the first copper layer 100 is greater than or equal to 155 μm). For example, the thickness of the first copper layer 100 can be 5 oz, 6 oz, or 7 oz, etc. The thickness of the first copper layer 100 within the above range can reduce internal resistance and carry large current, thereby meeting the current carrying requirements of large-capacity batteries. The thickness of the second copper layer 200 is less than or equal to 1 / 3 oz (that is, the thickness of the second copper layer 200 is less than or equal to 11.67 μm). For example, the thickness of the second copper layer 200 can be 1 / 3 oz, 1 / 4 oz, or 1 / 5 oz, etc. The thickness of the second copper layer 200 within the above range can achieve smaller device spacing, line width, and line spacing.
[0039] Preferably, the thickness of the first copper layer 100 is 5 oz, and the thickness of the second copper layer 200 is 1 / 3 oz.
[0040] In embodiments of this application, the first copper layer 100 includes a first surface and a second surface that are opposite to each other in the thickness direction L. A first etch groove and a second etch groove are formed on the first copper layer 100. The first etch groove extends from the first surface along the thickness direction L toward the interior of the first copper layer 100, and the second etch groove extends from the second surface along the thickness direction L toward the interior of the first copper layer 100. This allows the first copper layer 100 to form a first conductive pattern after two etching operations. Specifically, firstly, etching is performed on the first surface of the first copper layer 100 according to a circuit to form the first etch groove, which may include multiple spaced portions. Then, etching is performed on the second surface of the first copper layer 100 according to a circuit to form the second etch groove, which may include multiple spaced portions. Multiple portions in the first etch groove correspond one-to-one with multiple portions in the second etch groove, and one portion in the first etch groove is connected to its corresponding portion in the second etch groove. Thus, after two etchings, the first copper layer 100 forms a first conductive pattern including multiple first wires. The first copper layer 100 is etched twice, which enables the first copper layer 100 to achieve a smaller etch pitch, that is, the minimum distance between two adjacent first wires can be smaller.
[0041] Preferably, the size of the first etching trench in the thickness direction L is equal to the size of the second etching trench in the thickness direction L, that is, when etching the first copper layer 100, the depths of the two etchings are equal.
[0042] Preferably, the thickness of the first copper layer 100 is 5 oz, the dimension of the first etching trench in the thickness direction L is 2.5 oz, and the dimension of the second etching trench in the thickness direction L is 2.5 oz. That is, the thickness of the first copper layer 100 is 155 μm, the dimension of the first etching trench in the thickness direction L is 87.5 μm, and the dimension of the second etching trench in the thickness direction L is 87.5 μm. Thus, the first copper layer 100 is etched twice, with each etching depth being 2.5 oz, thereby forming a conductive pattern including multiple first wires. When etching the first copper layer 100, the etching spacing is less than or equal to 0.25 mm, that is, the minimum distance between any two adjacent first wires among the multiple first wires is less than or equal to 0.25 mm.
[0043] Furthermore, the first etching trench formed after the first etching of the first copper layer 100 needs to be filled with resin to form the first resin part 510, and the second etching trench formed after the second etching also needs to be filled with resin to form the second resin part 520.
[0044] In embodiments of this application, the printed circuit board includes a core board and a third copper layer 300. The core board includes an FR4 layer 700 (FR4, Flame-Retardant 4, Class 4 epoxy fiberglass board) and two third PP layers 630 (PP, Polypropylene). The thickness of the third copper layer 300 is equal to the thickness of the first copper layer 100. The third copper layer 300 can be etched to form a third conductive pattern. The two third PP layers 630 are respectively laminated on both sides of the FR4 layer 700 in the thickness direction L. The third copper layer 300 and the first copper layer 100 are respectively laminated on both sides of the core board in the thickness direction L. The third copper layer 300 can serve as a trace and filler.
[0045] Furthermore, the thickness of the second copper layer 200 is less than or equal to 1 / 3 oz, and the etching pitch when etching the second copper layer 200 is less than or equal to 0.1 mm. That is, the minimum distance between any two adjacent first wires among the multiple second wires is less than or equal to 0.1 mm, thereby meeting the device spacing requirements of the control module.
[0046] In addition, the thickness of the second copper layer 200 is less than or equal to 1 / 3 oz, and its line width and line spacing can both reach 0.1 mm, which allows the devices in the control module to be centrally arranged on the second copper layer 200.
[0047] In the embodiments of this application, such as Figure 1 As shown, the printed circuit board also includes a first PP layer 610, a second PP layer 620, and a fourth copper layer 400. The fourth copper layer 400 is bonded to the side of the third copper layer 300 facing away from the core board in the thickness direction L by the first PP layer 610. The second copper layer 200 is bonded to the side of the fourth copper layer 400 facing away from the first PP layer 610 in the thickness direction L by the second PP layer 620. The fourth copper layer 400 can form a fourth conductive pattern through a single etching process. The fourth copper layer 400 can serve as a trace and filler.
[0048] Furthermore, the printed circuit board has at least one first connection hole 800, which extends from the side where the second copper layer 200 is located to one of the first copper layer 100, the second copper layer 200, and the fourth copper layer 400, thereby enabling conduction between different copper layers. For example, in Figure 1 In the middle, the first connecting hole 800 on the left extends to the third copper layer 300, and the first connecting hole 800 on the right extends to the first copper layer 100.
[0049] Optionally, at least one second connection hole may be provided on the printed circuit board. The second connection hole extends from the side where the fourth copper layer 400 is located to one of the first copper layer 100, the second copper layer 200 and the third copper layer 300, so that conduction between different copper layers can also be achieved.
[0050] In addition, such as Figure 1 As shown, the printed circuit board also includes a solder mask layer 900 and an insulating layer ( Figure 1 (Not shown in the diagram), the solder mask layer 900 is bonded to the side of the first copper layer 100 opposite to the core board, and the insulating layer is bonded to the side of the second copper layer 200 opposite to the side of the fourth copper layer 400. The insulating layer can be a cover film, and the insulating layer can be bonded to the second copper layer 200 by an adhesive layer.
[0051] The following describes the manufacturing process of a printed circuit board (PCB) using an example where the first copper layer 100 is 5 oz thick and the second copper layer 200 is 1 / 3 oz thick. The PCB manufacturing process is as follows:
[0052] S1. The first copper layer 100 and the third copper layer 300 are etched once each, forming a first etch groove on the first copper layer 100 and a third etch groove on the third copper layer 300. Resin is then filled into the first etch groove and the third etch groove, respectively, to form a first resin part 510 and a third resin part 530. After that, the surfaces are ground and roughened, and pre-lamination treatment is performed. At this time, the state of the first copper layer 100 and the third copper layer 300 is as follows. Figure 2 As shown;
[0053] S2. The first copper layer 100 and the third copper layer 300 are laminated together using two third PP layers 630 and an FR4 layer 700. The side of the first copper layer 100 containing the first etch groove faces one of the third PP layers 630, and the side of the third copper layer 300 containing the third etch groove faces the other third PP layer 630. Then, the first copper layer 100 and the third copper layer 300 are etched a second time to form a second etch groove and a fourth etch groove. Resin is then filled into the second etch groove and the fourth etch groove to form a second resin portion 520 and a fourth resin portion 540. Thus, a first conductive pattern and a third conductive pattern are formed on the first copper layer 100 and the third copper layer 300. At this time, the state of the first copper layer 100 and the third copper layer 300 is as follows. Figure 3 As shown;
[0054] S3. The second copper layer 200 and the fourth copper layer 400 are pressed onto the first copper layer 100 through the first PP layer 610 and the second PP layer 620, and the circuit is etched to form a second conductive pattern on the second copper layer 200 and a fourth conductive pattern on the fourth copper layer 400. At this time, the states of the first copper layer 100, the second copper layer 200, the third copper layer 300, and the fourth copper layer 400 are as follows. Figure 4 As shown;
[0055] S4. A first connection hole 800 or a second connection hole is opened on the structure formed in step S3 above to achieve interconnection.
[0056] In addition, after completing step S4, a solder resist layer 900 and an insulating layer can be applied.
[0057] According to another aspect of this application, a battery protection board is provided, which includes the printed circuit board described above and has the same technical effects as the printed circuit board described above, which will not be repeated here.
[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.
Claims
1. A printed circuit board, characterized by The printed circuit board comprises a first copper layer and a second copper layer, the first copper layer and the second copper layer are stacked along a thickness direction of the printed circuit board, a thickness of the first copper layer is greater than a thickness of the second copper layer; The first copper layer has a first conductive pattern thereon, and the second copper layer has a second conductive pattern thereon, the first conductive pattern is configured to be connected with a power module, and the second conductive pattern is configured to be connected with a control module.
2. Printed circuit board according to claim 1, characterized in that The thickness of the first copper layer is greater than or equal to 5 oz, and the thickness of the second copper layer is less than or equal to 1 / 3 oz.
3. The printed circuit board of claim 1, wherein, The first copper layer comprises a first surface and a second surface opposite to each other in the thickness direction, and the first copper layer is formed with a first etching groove and a second etching groove, the first etching groove extends from the first surface toward an inside of the first copper layer along the thickness direction, and the second etching groove extends from the second surface toward the inside of the first copper layer along the thickness direction.
4. Printed circuit board according to claim 3, characterized in that The size of the first etching groove in the thickness direction is equal to the size of the second etching groove in the thickness direction.
5. Printed circuit board according to claim 3 or 4, characterized in that The first conductive pattern comprises a plurality of first conductive lines, and a minimum distance between any two adjacent first conductive lines in the plurality of first conductive lines is less than or equal to 0.25 mm; and / or, The second conductive pattern comprises a plurality of second conductive lines, and a minimum distance between any two adjacent second conductive lines in the plurality of second conductive lines is less than or equal to 0.1 mm.
6. The printed circuit board of claim 1, wherein, The printed circuit board comprises a core board and a third copper layer, the thickness of the third copper layer is equal to the thickness of the first copper layer, and the third copper layer and the first copper layer are respectively laminated on two sides of the core board in the thickness direction.
7. Printed circuit board according to claim 6, characterized in that The printed circuit board further comprises a first PP layer, a second PP layer, and a fourth copper layer, the fourth copper layer is laminated on a side of the third copper layer opposite to the core board in the thickness direction through the first PP layer, and the second copper layer is laminated on a side of the fourth copper layer opposite to the first PP layer in the thickness direction through the second PP layer.
8. Printed circuit board according to claim 7, characterized in that The printed circuit board is provided with at least one first connecting hole, the first connecting hole extends from a side where the second copper layer is located to one of the first copper layer, the second copper layer, and the fourth copper layer; and / or, The printed circuit board is provided with at least one second connecting hole, the second connecting hole extends from a side where the fourth copper layer is located to one of the first copper layer, the second copper layer, and the third copper layer.
9. The printed circuit board of claim 7, wherein, The printed circuit board further comprises a solder mask layer and an insulating layer, the solder mask layer is attached to a side of the first copper layer opposite to the core board, and the insulating layer is attached to a side of the second copper layer opposite to the fourth copper layer.
10. A battery protection plate, characterized in that, The battery protection board comprises the printed circuit board according to any one of claims 1-9.