Protection circuit board and battery module

Abstract

The embodiment of the utility model provides a protection circuit board and a battery module. The protection circuit board comprises a circuit board main body and a fusing assembly connected with the circuit board main body, the fusing assembly comprises a fuse, a cover body and a carrier substrate, the cover body and the carrier substrate form an accommodating cavity, the fuse is arranged in the accommodating cavity, and at least one of the carrier substrate and the cover body is provided with a through hole communicated with the accommodating cavity; and the plastic package colloid is provided with a receding groove, and the fusing assembly is embedded in the receding groove. Therefore, the plastic package colloid with pressure can be prevented from entering the fuse through the through hole when flowing in the mold cavity, the fuse is further prevented from being damaged by the plastic package colloid, the fuse can be protected, and the fusing effect of the fuse is ensured.

Description

Technical Field

[0001] This utility model relates to the field of battery manufacturing technology, and in particular to a protective circuit board and battery module. Background Technology

[0002] As smart products continue to develop, their battery capacities are also increasing. With this increase in capacity comes increased weight, making the protective circuit board at the battery tip more susceptible to damage during drops.

[0003] Based on this, in related technologies, the service life of the protection circuit board at the battery end is improved by encapsulating it with plastic and installing a fuse.

[0004] However, when the protective circuit board is encapsulated, the encapsulating material can flow into the fuse through the through-holes on the periphery of the fuse, thus affecting the fuse's fusing effect. Utility Model Content

[0005] To solve or partially solve the above problems, this utility model discloses a protective circuit board and battery module to solve the problem in the prior art that the encapsulating adhesive will flow into the fuse through the through hole opened on the periphery of the fuse, thereby affecting the fuse's fusing effect.

[0006] To address the aforementioned problems, in a first aspect, embodiments of the present invention provide a protective circuit board, the protective circuit board comprising:

[0007] The circuit board body and the fuse assembly connected to the circuit board body, the fuse assembly includes a fuse, a cover and a carrier substrate, the cover and the carrier substrate form a receiving cavity, the fuse is disposed in the receiving cavity, and at least one of the carrier substrate and the cover has a through hole communicating with the receiving cavity.

[0008] A molding compound, wherein the molding compound is provided with a void-avoiding groove, and the fusible component is embedded in the void-avoiding groove.

[0009] Optionally, the through hole is formed on the side wall of the cover, wherein the side wall of the cover faces the groove wall of the clearance groove.

[0010] Optionally, the clearance groove is a groove structure with an open top, and the top wall of the cover is close to the opening of the clearance groove, wherein the top wall of the cover and the carrier substrate are opposite to each other.

[0011] Optionally, the sidewall of the cover and the wall of the clearance groove are bonded together with an adhesive.

[0012] Optionally, the opening of the anti-cavity groove is covered with a first adhesive tape;

[0013] The area of ​​the first adhesive tape projected onto the circuit board body along a first direction is greater than the area of ​​the top wall of the cover projected onto the circuit board body along the first direction, wherein the first direction is a direction perpendicular to the plane where the circuit board body is located.

[0014] Optionally, the through hole is formed on the top wall of the cover, and the top wall of the cover is opposite to the carrier substrate.

[0015] Optionally, the clearance groove is a groove structure with an opening at the top, and the plane on which the top wall of the cover is located is the same plane as the plane on which the opening of the clearance groove is located;

[0016] The top wall of the cover is covered with a second adhesive tape, and the area of ​​the second adhesive tape projected onto the circuit board body along a first direction is equal to the area of ​​the top wall of the cover projected onto the circuit board body along the first direction, wherein the first direction is a direction perpendicular to the plane where the circuit board body is located.

[0017] Optionally, electrical connection lines are provided on the surface of the circuit board body facing the carrier substrate, and solder pads are provided on the surface of the carrier substrate facing the circuit board body.

[0018] The pads and the electrical connection lines are electrically connected.

[0019] Optionally, a through groove is formed on the carrier substrate, the through groove penetrating the first surface and the second surface of the carrier substrate, wherein the first surface and the second surface are two surfaces of the carrier substrate facing each other in a first direction, the first direction being a direction perpendicular to the plane where the circuit board body is located;

[0020] The wiring in the fuse assembly passes through the through slot and is electrically connected to the pad. The top wall of the cover, when projected onto the carrier substrate along the first direction, does not overlap with the area where the through slot is located.

[0021] Secondly, this utility model embodiment also provides a battery module, the battery module including a battery cell and a protection circuit board as described in any embodiment of the first aspect;

[0022] The protective circuit board is mounted on top of the battery cell.

[0023] In this embodiment of the utility model, the circuit board body and the fuse assembly connected to the circuit board body are included. The fuse assembly includes a fuse, a cover, and a carrier substrate. The cover and the carrier substrate form a receiving cavity. The fuse is disposed in the receiving cavity. At least one of the carrier substrate and the cover has a through hole communicating with the receiving cavity. The encapsulant is provided with a clearance groove. The fuse assembly is embedded in the clearance groove. Therefore, the encapsulant is first made into an injection-molded clearance groove, and then the fuse assembly is located in the injection-molded clearance groove. In this way, the pressurized encapsulant can be prevented from entering the interior of the fuse through the through hole when flowing in the mold cavity, thereby preventing the encapsulant from damaging the fuse and protecting the fuse to ensure the fusing effect of the fuse. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is one of the structural schematic diagrams of a protective circuit board provided in this embodiment of the utility model;

[0026] Figure 2 This is a second schematic diagram of the structure of a protective circuit board provided in this embodiment of the present invention;

[0027] Figure 3 This is the third schematic diagram of a protective circuit board provided in this embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram of a circuit board structure provided in an embodiment of the present invention.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1: Protective circuit board; 11: Circuit board body; 111: Electrical connection line; 12: Fuse assembly; 121: Fuse; 122: Cover; 123: Carrier substrate; 1231: Solder pad; 13: Receiving cavity; 14: First adhesive tape; 15: Second adhesive tape; 16: Adhesive; 2: Encapsulating adhesive; 21: Void relief groove; 3: Battery cell; 4: Top seal; 5: Hot melt adhesive; 6: Electrode tab; 7: Nickel sheet. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0033] like Figures 1 to 3 As shown, this embodiment of the utility model provides a protective circuit board, which includes:

[0034] The circuit board body 11 and the fuse assembly 12 connected to the circuit board body 11. The fuse assembly 12 includes a fuse 121, a cover 122 and a carrier substrate 123. The cover 122 and the carrier substrate 123 form a receiving cavity 13. The fuse 121 is disposed in the receiving cavity 13. At least one of the carrier substrate 123 and the cover 122 has a through hole communicating with the receiving cavity 13.

[0035] The encapsulating material 2 is provided with a cavity groove 21, and the fusible component 12 is embedded in the cavity groove 21.

[0036] As can be seen from the above embodiments, in this utility model embodiment, due to the circuit board body 11 and the fuse assembly 12 connected to the circuit board body 11, the fuse assembly 12 includes a fuse 121, a cover 122 and a carrier substrate 123, the cover 122 and the carrier substrate 123 form a receiving cavity 13, the fuse 121 is disposed in the receiving cavity 13, and at least one of the carrier substrate 123 and the cover 122 has a through hole communicating with the receiving cavity 13, and the encapsulating material 2 is disposed... There is a cavity relief groove 21, and the fuse component 12 is embedded in the cavity relief groove 21. Therefore, the encapsulant 2 is first formed into the injection-molded cavity relief groove 21, and then the fuse component 12 is located in the injection-molded cavity relief groove 21. In this way, the pressurized encapsulant 2 can be prevented from entering the interior of the fuse 121 through the through hole when flowing in the mold cavity, thereby preventing the encapsulant 2 from damaging the fuse 121, and can also protect the fuse 121 and ensure the fusing effect of the fuse 121.

[0037] In the above embodiments, the circuit board body 11 may include a printed circuit board and a flexible circuit board. The circuit board body 11 is mainly used to ensure that the battery operates within a safe range and protect the battery from damage, including but not limited to the following functions: limiting the minimum discharge voltage, controlling the maximum charging current, and monitoring the battery temperature during the charging process. In addition, the circuit board body 11 and the fuse assembly 12 can be stacked in the first direction Z, that is, the fuse assembly 12 can be disposed on the top of the circuit board body 11.

[0038] The fuse assembly 12 includes a cover 122, which is a shell structure with an inner cavity. The cover 122 and the carrier are connected to form a receiving cavity 13, which provides a certain receiving cavity 13 for the fuse 121. In some embodiments, the cover 122 can be a cylindrical shell structure, a square shell structure, or a shell structure of other shapes. For example, the cover 122 is a shell structure with an open bottom. The bottom of the cover 122 is fastened to the carrier substrate 123, so that a sealed space is formed between the cover 122 and the carrier substrate 123, thereby forming the receiving cavity 13.

[0039] Since the gas pressure inside the accommodating cavity 13 and other external pressures need to be consistent during the fabrication and testing of the fuse 121, in this embodiment, a through hole can be provided on the cover 122, on the carrier substrate 123, or both the cover 122 and the carrier substrate 123. This embodiment does not limit the specific type of through hole. When the through hole is provided on the carrier substrate 123, it can extend along the first and second surfaces of the carrier substrate 123 in the first direction Z. That is, the through hole can penetrate both surfaces of the carrier substrate 123 in the first direction Z, allowing external gas to pass through the carrier substrate 123 and reach the interior of the accommodating cavity 13. When the through hole is provided on the cover 122, it allows the cover 122 to communicate with the accommodating cavity 13, allowing external gas to pass through the cover 122 and reach the interior of the accommodating cavity 13.

[0040] The encapsulant 2 simultaneously encapsulates both the fuse assembly 12 and the circuit board body 11, thereby protecting both from external environmental influences, improving the safety of the circuit board 1, and ensuring pressure balance between the inside and outside of the circuit board 1. In this embodiment, to prevent the pressurized encapsulant 2 from entering the fuse 121 through the through-hole while flowing within the mold cavity, the structure of the encapsulant 2 is improved. Specifically, in some embodiments, the mold for the encapsulant 2 may include a front mold and a rear mold. After injection molding, the front mold forms a clearance cavity, and then the front and rear molds are fitted together to form a single mold, thereby creating a clearance groove 21 within the encapsulant 2. The fuse assembly 12 can then be embedded within the clearance groove 21.

[0041] Regarding the location of the through hole, in some embodiments, the through hole is opened on the side wall of the cover 122, wherein the side wall of the cover 122 faces the groove wall of the clearance groove 21.

[0042] In this embodiment, since the through hole is opened on the side wall of the cover 122 and the side wall of the cover 122 faces the groove wall of the clearance groove 21, the opening position of the through hole is located on the side of the fuse component 12. In this way, during the molding process, it is only necessary to ensure that no flowing molding compound 2 flows into the side of the fuse component.

[0043] Based on this, in some embodiments, the clearance groove 21 is a groove structure with an open top, and the top wall of the cover 122 is close to the opening of the clearance groove 21, wherein the top wall of the cover 122 is opposite to the carrier substrate 123.

[0044] In this embodiment, since the vent groove 21 is a groove structure with an open top, the top wall of the cover 122 is close to the opening of the vent groove 21, and the top wall of the cover 122 is opposite to the carrier substrate 123. Therefore, after the fuse assembly 12 is embedded in the vent groove 21, the side wall of the cover 122 is opposite to the groove wall of the vent groove 21, and the groove wall of the vent groove 21 covers both the cover 122 and the carrier substrate 123. In this way, the groove wall of the vent groove 21 can form a barrier to the flow of the encapsulating colloid 2 into the through hole.

[0045] In one possible implementation, such as Figure 2 As shown, the side wall of the cover 122 and the groove wall of the clearance groove 21 are bonded together by adhesive 16.

[0046] In this embodiment, since the sidewall of the cover 122 and the groove wall of the clearance groove 21 are bonded together by adhesive 16, not only can the cover 122 and the encapsulating material 2 be bonded together to form an integral structure, but the adhesive can also fill the gap between the sidewall of the cover 122 and the groove wall of the clearance groove 21, preventing the flowing encapsulating material 2 from flowing into the through hole through the gap between the sidewall of the cover 122 and the groove wall of the clearance groove 21. It should be noted that the sidewall of the cover 122 and the groove wall of the clearance groove 21 can be bonded by dispensing adhesive, thereby preventing the adhesive from avoiding the location of the through hole on the sidewall of the cover 122.

[0047] In another possible implementation, such as Figure 1 As shown, the opening of the clearance groove 21 is covered with a first adhesive tape 14. The area of ​​the first adhesive tape 14 projected onto the circuit board body 11 along the first direction is greater than the area of ​​the top wall of the cover 122 projected onto the circuit board body 11 along the first direction. The first direction is the direction perpendicular to the plane where the circuit board body 11 is located.

[0048] In this embodiment, since the opening of the clearance groove 21 is covered with a first adhesive tape 14, the area of ​​the first adhesive tape 14 projected onto the circuit board body 11 along the first direction is larger than the area of ​​the top wall of the cover 122 projected onto the circuit board body 11 along the first direction. Therefore, the opening of the clearance groove 21 can be covered by the first adhesive tape 14, thereby blocking the top wall of the cover 122 and preventing the flowing encapsulating adhesive 2 from flowing into the through hole through the gap between the side wall of the cover 122 and the groove wall of the clearance groove 21.

[0049] Regarding the location of the through hole, in some embodiments, the through hole is formed on the top wall of the cover 122, and the top wall of the cover 122 is opposite to the carrier substrate 123.

[0050] In this embodiment, since the through hole is formed on the top wall of the cover 122, and the top wall of the cover 122 is opposite to the carrier substrate 123, it is only necessary to prevent the flowing encapsulant 2 from entering the interior of the fuse 121 through the through hole formed on the top wall of the cover 122.

[0051] Based on this, in some embodiments, such as Figure 3 As shown, the clearance groove 21 is a groove structure with an opening at the top. The plane on which the top wall of the cover 122 is located is the same plane as the groove opening of the clearance groove 21. The top wall of the cover 122 is covered with a second adhesive tape 15, and the area of ​​the orthographic projection of the second adhesive tape 15 on the circuit board body 11 along the first direction is equal to the area of ​​the orthographic projection of the top wall of the cover 122 on the circuit board body 11 along the first direction. The first direction is the direction perpendicular to the plane on which the circuit board body 11 is located.

[0052] In this embodiment, since the clearance groove 21 is a groove structure with an open top, the plane of the top wall of the cover 122 and the plane of the groove opening of the clearance groove 21 are on the same plane. The top wall of the cover 122 is covered with a second adhesive tape 15, and the area of ​​the orthographic projection of the second adhesive tape 15 on the circuit board body 11 along the first direction is equal to the area of ​​the orthographic projection of the top wall of the cover 122 on the circuit board body 11 along the first direction. Therefore, the through hole on the top wall of the cover 122 can be sealed by the second adhesive tape 15, which can also prevent the pressurized encapsulant 2 from entering the interior of the fuse 121 through the through hole when it flows in the mold cavity.

[0053] In some embodiments, an electrical connection line 111 is provided on the surface of the circuit board body 11 facing the carrier substrate 123, and a pad 1231 is provided on the surface of the carrier substrate 123 facing the circuit board body 11. The pad 1231 and the electrical connection line 111 are electrically connected.

[0054] In this embodiment, since electrical connection lines 111 are provided on the surface of the circuit board body 11 facing the carrier substrate 123, and pads 1231 are provided on the surface of the carrier substrate 123 facing the circuit board body 11, and the pads 1231 and the electrical connection lines 111 are electrically connected, the electrical connection between the circuit board body 11 and the carrier substrate 123 can be indirectly achieved through the electrical connection between the pads 1231 and the electrical connection lines 111. It should be noted that the pads 1231 are the basic building blocks for electrically connecting the circuit board body 11 and the carrier substrate 123, used to form the pattern of the pads 1231 on the carrier substrate 123. The pattern of the pads 1231 can be circular, elliptical, square, etc., and this embodiment of the present invention does not limit this. Furthermore, the position of the pads 1231 needs to be opposite to the position of the electrical connection lines 111 on the surface of the circuit board body 11 facing the carrier substrate 123 to reduce the difficulty of soldering.

[0055] In some embodiments, a through groove is formed on the carrier substrate 123, which penetrates the first surface and the second surface of the carrier substrate 123. The first surface and the second surface are two surfaces of the carrier substrate 123 that are opposite each other in a first direction. The first direction is the direction perpendicular to the plane where the circuit board body 11 is located. The wiring in the fuse assembly 12 passes through the through groove and is electrically connected to the pad 1231. The top wall of the cover 122 is projected onto the carrier substrate 123 along the first direction and does not overlap with the area where the through groove is located.

[0056] In this embodiment, since the through-slot penetrates the first and second surfaces of the carrier substrate 123, the circuit in the fuse 121 passes through the through-slot and connects to the pad 1231. Therefore, the fuse assembly 12 can be connected through the through-slot and the pad 1231, and then the electrical connection between the pad 1231 and the electrical connection line 111 is achieved through the electrical connection between the circuit board body 11 and the fuse 121. In addition, since the orthographic projection of the top wall of the cover 122 along the first direction Z on the carrier substrate 123 does not overlap with the area where the through-slot is located, the area covered by the cover 122 is not within the opening area of ​​the through-slot, which can ensure that there is no gap between the cover 122 and the carrier substrate 123, thereby ensuring the protective effect of the cover 122.

[0057] As can be seen from the above embodiments, in this utility model embodiment, due to the circuit board body 11 and the fuse assembly 12 connected to the circuit board body 11, the fuse assembly 12 includes a fuse 121, a cover 122 and a carrier substrate 123, the cover 122 and the carrier substrate 123 form a receiving cavity 13, the fuse 121 is disposed in the receiving cavity 13, and at least one of the carrier substrate 123 and the cover 122 has a through hole communicating with the receiving cavity 13, and the encapsulating material 2 is disposed... There is a cavity relief groove 21, and the fuse component 12 is embedded in the cavity relief groove 21. Therefore, the encapsulant 2 is first formed into the injection-molded cavity relief groove 21, and then the fuse component 12 is located in the injection-molded cavity relief groove 21. In this way, the pressurized encapsulant 2 can be prevented from entering the interior of the fuse 121 through the through hole when flowing in the mold cavity, thereby preventing the encapsulant 2 from damaging the fuse 121, and can also protect the fuse 121 and ensure the fusing effect of the fuse 121.

[0058] In addition, as shown in the figure, this utility model embodiment also provides a battery module, which includes a battery cell 3 and a protection circuit board 1 of any of the above embodiments; the protection circuit board 1 is disposed on the top of the battery cell 3.

[0059] In this embodiment, the battery module includes a battery cell 3 and a protection circuit board 1 as described in any of the above embodiments. The protection circuit board 1 is disposed on the top of the battery cell 3. Therefore, with the enhanced protection strength of the fuse 121 included in the protection circuit board 1 assembly, the circuit protection function of the battery module through the fuse 121 is more complete, further ensuring the safety of battery use. Furthermore, hot melt adhesive 5, a top seal 4, tabs 6, a nickel sheet 7, a circuit board, and a fuse assembly 12 are sequentially disposed on the top of the battery cell 3. A molding compound simultaneously seals the hot melt adhesive 5, the top seal 4, the tabs 6, the nickel sheet 7, the circuit board, and the fuse assembly 12. In the above embodiments, the battery cell 3 can be a single cell 3 or a dual cell 3. The battery cell 3 can be a cylindrical structure, a cuboid structure, or other shapes; this embodiment does not limit these shapes. The battery cell 3 has a top surface, on which the top seal 4 can be connected. Tabs 6 are connected to the top seal 4. The protection circuit board 1 contacts the top surface, and the tabs 6 are electrically connected to the protection circuit board.

[0060] The various embodiments in the specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0061] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0062] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0063] The present invention has been described in detail above. Specific examples have been used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A protection circuit board, characterized by, The protection circuit board comprises: The circuit board body and the fuse assembly connected with the circuit board body, the fuse assembly comprising a fuse, a cover body and a carrier substrate, the cover body and the carrier substrate forming a containing cavity, the fuse being arranged in the containing cavity, at least one of the carrier substrate and the cover body being provided with a through hole communicating with the containing cavity; The plastic sealing glue body is provided with a hollow groove, and the fuse assembly is embedded in the hollow groove.

2. The protection circuit board according to claim 1, characterized by The through hole is arranged on the side wall of the cover body, and the side wall of the cover body faces the groove wall of the hollow groove.

3. The protection circuit board according to claim 2, characterized in that, The hollow groove is a groove structure with an open top, and the top wall of the cover body is close to the groove opening of the hollow groove, wherein the top wall of the cover body is opposite to the carrier substrate.

4. The protection circuit board according to claim 3, characterized by The side wall of the cover body and the groove wall of the hollow groove are bonded by the adhesive glue.

5. The protection circuit board according to claim 3, characterized by The groove opening of the hollow groove is covered with a first adhesive paper. The area of the first adhesive paper on the circuit board body in the first direction is greater than the area of the top wall of the cover body on the circuit board body in the first direction, wherein the first direction is perpendicular to the plane where the circuit board body is located.

6. The protection circuit board according to claim 1, characterized by The through hole is arranged on the top wall of the cover body, and the top wall of the cover body is opposite to the carrier substrate.

7. The protection circuit board according to claim 6, characterized in that, The hollow groove is a groove structure with an open top, and the plane where the top wall of the cover body is located is in the same plane as the plane where the groove opening of the hollow groove is located. The top wall of the cover body is covered with a second adhesive paper, and the area of the second adhesive paper on the circuit board body in the first direction is equal to the area of the top wall of the cover body on the circuit board body in the first direction, wherein the first direction is perpendicular to the plane where the circuit board body is located.

8. The protection circuit board according to claim 1, characterized by The circuit board body is provided with an electric connection line on the surface facing the carrier substrate, and the carrier substrate is provided with a solder pad on the surface facing the circuit board body; The solder pad and the electric connection line are electrically connected.

9. The protection circuit board according to claim 8, characterized in that, The carrier substrate is provided with a through groove, and the through groove penetrates the first surface and the second surface of the carrier substrate, wherein the first surface and the second surface are two surfaces of the carrier substrate opposite in the first direction, and the first direction is perpendicular to the plane where the circuit board body is located; The wire in the fuse assembly is electrically connected through the through groove and the solder pad, and the top wall of the cover body is not overlapped with the area where the through groove is located in the first direction.

10. A battery module, characterized by The battery module comprises a battery cell and the protection circuit board according to any one of claims 1 to 9; The protection circuit board is arranged on the top of the battery cell.

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