Inverted high-luminous-efficiency lamp bead
By using a one-piece metal stamping bracket and injection molding design, the problems of white glue obscuring the chip edge and glue overflow in flip-chip LEDs are solved, achieving high luminous efficiency and long lifespan LED effects.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-01
- Publication Date
- 2026-03-13
AI Technical Summary
The existing flip-chip LED cannot control the molding surface and amount of white glue during the white glue application process, which causes the chip edges to be blocked, affecting the light output efficiency and brightness. In addition, the white glue is prone to overflow and delamination, which affects the luminous efficacy and lifespan of the LED.
The bracket and injection molded parts are designed with one-piece metal stamping. The sidewalls of the groove are set at an angle to form a flared opening. Combined with the one-piece molded plastic layer, the white glue process for encapsulation is reduced, the bonding and airtightness are enhanced, and the problems of white glue covering the chip edges and the light-emitting surface being rough are avoided.
It improves the light emission efficiency and brightness of the LED beads, increases the light emission angle, avoids the white glue layer from delaminating and turning black, improves production efficiency, and extends the lifespan of the LED beads.
Smart Images
Figure CN223993860U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED packaging, and in particular to a flip-chip high-efficiency LED chip. Background Technology
[0002] With the widespread application of LEDs, the low-end market for standard LED products has reached saturation. Flip-chip high-efficiency products are quietly impacting the mid-to-high-end lighting market, and the requirements are becoming increasingly stringent. Customers are not only demanding high specifications from customers, but also increasingly prioritizing product performance.
[0003] In LED packaging, to improve product brightness and reduce light absorption by the silver plating layer in functional areas, a process of applying white adhesive is generally used to shield the functional areas, thereby increasing the light reflection intensity and thus improving product brightness.
[0004] In the existing technology, existing flip-chip LEDs (such as...) Figures 1-2 The fabrication process (shown) includes, in sequence: die bonding, reflow soldering, Zener bonding, Zener wire bonding, white glue application, baking, phosphor application, blanking, beam splitting, and tape taping. However, during the white glue application process, it is impossible to control the forming surface and amount of white glue 1, which can easily block the edges of the chip, affecting the light emission efficiency and brightness. Alternatively, the light emission surface of white glue 1 may not be smooth enough, affecting the refraction of light. Furthermore, white glue 1 is prone to overflow during the Zener bonding process, resulting in low efficiency. Additionally, the white glue layer of the LED chip is prone to delamination and blackening after long-term use, leading to low brightness or dead LEDs. Utility Model Content
[0005] Therefore, the purpose of this utility model is to provide an inverted high-efficiency LED bead, which can effectively solve the shortcomings of the prior art.
[0006] A flip-chip high-efficiency LED includes a metal stamping bracket, an LED chip disposed at the center of the top of the bracket, and an integrally molded injection molded part disposed around the LED chip on the top of the bracket. The injection molded part and the bracket form a groove, the sidewalls of the groove are inclined and the top of the groove forms a funnel-shaped opening, the LED chip is disposed at the center of the bottom of the groove, an integrally molded plastic layer is disposed in the groove, the plastic layer covers the LED chip and the thickness of the plastic layer is between the height of the top of the injection molded part and the height of the top of the LED chip, a lens is disposed on the top of the injection molded part, and a phosphor layer is disposed between the lens and the plastic layer.
[0007] Compared with the prior art, the beneficial effects of this utility model are as follows: By setting the sidewall of the groove at an inclination and forming a trumpet-shaped opening at the top of the groove, the light-emitting angle of the LED chip is increased; by setting a metal stamping integrally formed bracket, by setting an integrally formed injection molded part around the LED chip on the top of the bracket, and by setting an integrally formed plastic layer in the groove, the bonding between the bracket and the injection molded part and between the injection molded part and the plastic layer can be increased, making the injection molded part and the bracket and the injection molded part and the plastic layer more tightly bonded, thereby increasing the airtightness of this utility model; by setting an integrally formed plastic layer in the groove, the encapsulation white glue application process can be reduced, avoiding the white glue from obscuring the edges of the chip and affecting the light emission efficiency and brightness, and also avoiding the light refraction affected by the insufficient smoothness of the white glue light emission surface, and improving production efficiency. Moreover, not using white glue can also avoid the white glue layer from delaminating and turning black due to long-term use of the LED beads, and avoid low brightness or dead LEDs.
[0008] Furthermore, a Zener structure is provided on the top of the bracket, the Zener structure being disposed on one side of the LED chip and wrapped by the plastic layer.
[0009] Furthermore, a substrate is disposed between the LED chip and the bracket, and the LED chip is connected to the bracket through the substrate.
[0010] Furthermore, an arc-shaped adhesive groove is formed on the top of the injection molded part, the adhesive groove is arranged around the recess, and the lens is disposed in the adhesive groove.
[0011] Furthermore, an insulating groove is provided at the center of the bottom of the bracket.
[0012] Furthermore, a pin is provided at the bottom of the bracket, and a waterproof line structure is provided inside the pin.
[0013] Furthermore, a Mark point is also provided on the top of the bracket.
[0014] Furthermore, the sidewall of the groove has an inclination angle of 60°. Attached Figure Description
[0015] Figure 1 A top view of an existing inverted LED chip;
[0016] Figure 2 A cross-sectional view of an existing flip-chip LED;
[0017] Figure 3 This is a top view schematic diagram of the inverted high-efficiency lamp bead in an embodiment of this utility model;
[0018] Figure 4This is a cross-sectional schematic diagram of the inverted high-efficiency LED bead in an embodiment of this utility model;
[0019] Explanation of key component symbols:
[0020]
[0021]
[0022] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation
[0023] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.
[0024] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.
[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0026] Please see Figures 3 to 4The inverted high-efficiency LED bead in this embodiment includes a metal stamping bracket 10, an LED chip 11 disposed at the top center of the bracket 10, and an integrally molded injection molded part 12 disposed around the LED chip 11 on the top of the bracket 10. The injection molded part 12 and the bracket 10 form a groove 13. The sidewalls of the groove 13 are inclined, and the top of the groove 13 forms a funnel-shaped opening. The LED chip 11 is disposed at the bottom center of the groove 13. An integrally molded plastic layer 14 is disposed in the groove 13. The plastic layer 14 wraps around the LED chip 11, and the thickness of the plastic layer 14 is between the height of the top of the injection molded part 12 and the height of the top of the LED chip 11. A lens 15 is disposed on the top of the injection molded part 12, and a phosphor layer 16 is disposed between the lens 15 and the plastic layer 14.
[0027] Furthermore, a Zener structure 17 is also provided on the top of the bracket 10. The Zener structure 17 is disposed on one side of the LED chip 11 and is wrapped by the plastic layer 14.
[0028] It is understandable that the Zener structure 17 is configured to provide electrostatic discharge protection and overvoltage protection.
[0029] Furthermore, a substrate 18 is provided between the LED chip 11 and the bracket 10, and the LED chip 11 is connected to the bracket 10 through the substrate 18.
[0030] Furthermore, an arc-shaped glue-receiving groove 19 is provided on the top of the injection molded part 12, the glue-receiving groove 19 is arranged around the groove 13, and the lens 15 is disposed in the glue-receiving groove 19.
[0031] Understandably, by providing the adhesive reservoir 19, the mold for the lens 15 can be placed in the adhesive reservoir 19, thereby increasing the stability and convenience of manufacturing the lens 15.
[0032] Furthermore, an insulating groove 20 is provided at the center of the bottom of the bracket 10.
[0033] Understandably, the insulating groove is provided to prevent the bottom electrodes of the LED chip 11 from short-circuiting in parallel.
[0034] Furthermore, a pin 21 is provided at the bottom of the bracket 10, and a waterproof line structure 22 is provided inside the pin 21.
[0035] It is understood that by setting the pin 21, this utility model can connect the LED chip 11 to an external circuit through the pin.
[0036] Furthermore, a Mark point 23 is also provided on the top of the bracket 10.
[0037] Furthermore, the sidewall inclination angle of the groove 13 is 60°.
[0038] Understandably, by tilting the sidewalls of the groove 13 and forming a funnel-shaped opening at the top of the groove 13, the light-emitting angle of the LED chip is increased. By providing a metal-stamped, integrally formed bracket 10, by providing an integrally formed injection-molded part 12 around the LED chip at the top of the bracket 10, and by providing an integrally formed plastic layer 14 within the groove 13, the bonding strength between the bracket 10 and the injection-molded part 12, and between the injection-molded part 12 and the plastic layer 14, can be increased, thus enhancing the bond strength between the injection-molded part 12 and the bracket 10. The injection molded part 12 and the plastic layer 14 are more tightly bonded, which can increase the airtightness of this utility model. By setting the integrally formed plastic layer 14 in the groove 13, the white glue application process can be reduced, and the white glue 1 can be avoided from blocking the edge of the chip and affecting the light output efficiency and brightness. It can also be avoided that the light output surface of the white glue 1 is not smooth enough, which affects the light refraction. It can also improve production efficiency. Moreover, not using white glue 1 can also avoid the white glue layer from delaminating and turning black due to long-term use of the lamp beads, and avoid the lamp bead brightness being too low or the lamp dying.
[0039] In summary, the flip-chip high-efficiency LED bead in the above embodiments of this utility model increases the light-emitting angle of the LED chip by setting the sidewall of the groove to be inclined and forming a funnel-shaped opening at the top of the groove; by setting a metal stamping integrally formed bracket, by setting an integrally formed injection molded part around the LED chip on the top of the bracket, and by setting an integrally formed plastic layer in the groove, the bonding between the bracket and the injection molded part and the injection molded part and the plastic layer can be increased, making the injection molded part and the bracket and the injection molded part and the plastic layer more tightly bonded, thereby increasing the airtightness of this utility model; by setting an integrally formed plastic layer in the groove, the encapsulation white glue application process can be reduced, avoiding the white glue from obscuring the edges of the chip and affecting the light emission efficiency and brightness, and also avoiding the light refraction affected by the insufficient smoothness of the white glue light emission surface, and improving production efficiency. Moreover, not using white glue can also avoid the white glue layer from delaminating and turning black due to long-term use of the LED bead, and avoid low brightness or dead LEDs.
[0040] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0041] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. An inverted high light efficiency lamp bead, characterized in that, The bracket is integrally formed by hardware stamping, an LED chip is arranged at the top center of the bracket, and an integrally formed injection molding part is arranged around the LED chip at the top of the bracket, the injection molding part and the bracket form a groove, the side wall of the groove is arranged in an inclined manner, the top of the groove forms a horn-shaped opening, the LED chip is arranged at the center of the bottom of the groove, an integrally formed plastic layer is arranged in the groove, the plastic layer wraps the LED chip, and the thickness of the plastic layer is between the height of the top of the injection molding part and the height of the top of the LED chip, a lens is arranged at the top of the injection molding part, and a fluorescent powder layer is arranged between the lens and the plastic layer.
2. The inverted high light efficiency lamp bead according to claim 1, characterized in that, A Zener structure is further arranged at the top of the bracket, the Zener structure is arranged at one side of the LED chip and is wrapped by the plastic layer.
3. The inverted high light efficiency lamp bead according to claim 1, characterized in that, A substrate is arranged between the LED chip and the bracket, and the LED chip is connected to the bracket through the substrate.
4. The inverted high light efficiency lamp bead according to claim 1, characterized in that, A glue accommodating groove in a circular arc shape is formed at the top of the injection molding part, the glue accommodating groove is arranged around the groove, and the lens is arranged in the glue accommodating groove.
5. The inverted high light efficiency lamp bead according to claim 1, characterized in that, An insulating groove is arranged at the center of the bottom of the bracket.
6. The inverted high light efficiency lamp bead according to claim 1, characterized in that, A pin is arranged at the bottom of the bracket, and a waterproof wire structure is arranged in the pin.
7. The inverted high light efficiency lamp bead according to claim 1, characterized in that, A Mark point is further arranged at the top of the bracket.
8. The inverted high light efficiency lamp bead according to claim 1, characterized in that, The inclination angle of the side wall of the groove is 60°.