Material box body of semiconductor structure and material box of semiconductor structure
By designing a removable partition structure in the material box, the problem that the material box can only hold wafers of specific sizes is solved, enabling adaptive accommodation of wafers of different thicknesses and reducing the risk of wafer damage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2026-03-13
AI Technical Summary
Existing hoppers can only hold wafers of specific sizes, resulting in poor applicability.
A semiconductor-structured cassette housing is designed, comprising a frame and a detachable partition structure. The frame has a slot for mounting the partition, and the partition is partially exposed in the slot and limited within the receiving cavity. The partition can be disassembled and its position adjusted as needed to accommodate wafers of different thicknesses.
The versatility of the hopper has been improved, enabling it to accommodate wafers of different thicknesses and reducing damage to the wafers during the transfer process.
Smart Images
Figure CN223993878U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, and in particular to a semiconductor-structured cassette and a semiconductor-structured cassette. Background Technology
[0002] In the semiconductor industry, wafer cassettes are often used to hold wafers, such as for transferring wafers between different processes. This reduces the chance of wafers cracking or breaking during the transfer process.
[0003] Existing wafer bins can only hold wafers of specific sizes, resulting in poor applicability. Utility Model Content
[0004] This application provides a semiconductor-structured material box body and a semiconductor-structured material box.
[0005] A first aspect of this application provides a semiconductor-structured cartridge housing. The semiconductor-structured cartridge housing includes:
[0006] A frame body has a receiving cavity for placing a semiconductor structure and an opening communicating with the receiving cavity, the opening being used for the semiconductor structure to enter and exit the receiving cavity; the frame body includes a first sidewall and a second sidewall located on opposite sides of the receiving cavity; the frame body is provided with multiple sets of slots, each set of slots including a first slot provided on the first sidewall and a second slot provided on the second sidewall, wherein in the same set of slots, the first slot is opposite to one of the second slots;
[0007] Multiple partition structures; each partition structure is installed in a set of slots, with a portion of the partition structure exposed above its corresponding slot and the exposed portion located within the receiving cavity; two adjacent partition structures are used to limit the semiconductor structure located between them; at least a portion of the partition structures are detachably installed in the frame body.
[0008] In one embodiment, all of the partition structures are detachably mounted on the frame.
[0009] In one embodiment, when the partition structure is detachably installed on the frame, the partition structure includes a first partition and a second partition; the first partition includes a first main body portion, which is installed in the first slot; the second partition includes a second main body portion, which is installed in the second slot; the first main body portion partially exposes the first slot and the exposed portion is located within the receiving cavity, and the second main body portion partially exposes the second slot and the exposed portion is located within the receiving cavity.
[0010] In one embodiment, the first partition further includes a first hook connected to the first main body portion, the first hook being engaged with the end of the first sidewall near the opening; and / or, the second partition further includes a second hook connected to the second main body portion, the second hook being engaged with the end of the second sidewall near the opening.
[0011] In one embodiment, the frame body further includes a plurality of first limiting grooves located on the side of the receiving cavity away from the opening; the first partition further includes a first limiting plate connected to the end of the first main body away from the opening, the first limiting plate being mounted in the first limiting groove; and / or,
[0012] The frame body is also provided with a plurality of second limiting grooves located at the end of the receiving cavity away from the opening; the second partition also includes a second limiting plate connected to the end of the second main body away from the opening, and the second limiting plate is installed in the second limiting groove.
[0013] In one embodiment, the partition structure detachably installed on the frame body includes a first type of partition structure, wherein the first partition and the second partition of the first type of partition structure are separate structures.
[0014] In one embodiment, the first partition of the first type of partition structure has the same structure as the second partition.
[0015] In one embodiment, the partition structure detachably installed on the frame body includes a second type of partition structure, wherein the first partition and the second partition of the second type of partition structure are an integral structure.
[0016] In one embodiment, the second type of partition structure further includes a support plate located between the first partition and the second partition, the support plate being situated within the receiving cavity; and / or,
[0017] The frame body is also provided with a plurality of first limiting grooves and a plurality of second limiting grooves located on the side of the receiving cavity away from the opening; the second type of partition structure also includes a limiting plate, the limiting plate being connected to the end of the first main body away from the opening and the end of the second main body away from the opening respectively, one end of the limiting plate being installed in the first limiting groove and the other end being installed in the second limiting groove.
[0018] A second aspect of this application provides a semiconductor structure cassette, the semiconductor structure cassette including a cassette cover and the aforementioned semiconductor structure cassette body.
[0019] The main technical effects achieved by the embodiments of this application are:
[0020] The semiconductor structure cassette and semiconductor structure cassette provided in this application embodiment have a partition structure installed in the slot of the frame body. After the partition structure is partially exposed in the slot and the exposed part is located in the receiving cavity, the exposed part of the adjacent partition structure can limit the semiconductor structure placed between them. Since at least part of the partition structure is detachably installed in the frame body, the installation position of the partition structure can be determined according to the thickness of the semiconductor structure that the cassette body needs to accommodate. Therefore, the semiconductor structure cassette body provided in this application embodiment can be used to accommodate semiconductor structures of different thicknesses. The cassette body is applicable to wafers of different thicknesses, improving the applicability of the cassette body. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the frame structure of the material box body provided in an exemplary embodiment of this application;
[0022] Figure 2 This is a schematic diagram of a partition structure for a material box body provided in an exemplary embodiment of this application;
[0023] Figure 3 This is a schematic diagram of another partition structure for the material box body provided in an exemplary embodiment of this application;
[0024] Figure 4 This is a schematic diagram of the structure of the material box body provided in an exemplary embodiment of this application. Specific Implementation
[0025] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0026] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0027] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."
[0028] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0029] This application provides a semiconductor structure cassette, used for holding semiconductor structures.
[0030] like Figures 1 to 4 As shown, the semiconductor structure housing includes a frame body 10 and multiple partition structures 20. The frame body 10 has a receiving cavity 101 for placing the semiconductor structure; the frame body 10 includes a first sidewall 11 and a second sidewall 12 located on opposite sides of the receiving cavity 101; the frame body 10 is provided with multiple sets of slots, each set of slots including a first slot 111 located on the first sidewall 11 and a second slot 121 located on the second sidewall 12, with the first slot 111 and a second slot 121 opposite each other in the same set of slots. Each partition structure 20 is installed within a set of slots, with a portion of the partition structure 20 exposed above its corresponding slot, and the exposed portion of the partition structure 20 is located within the receiving cavity 101; adjacent partition structures 20 limit the semiconductor structure located between them. At least a portion of the partition structures 20 are detachably installed on the frame body 10.
[0031] The semiconductor structure cassette provided in this application embodiment has a partition structure 20 installed in the slot of the frame body 10. After the partition structure 20 is partially exposed in the slot and the exposed part is located in the receiving cavity 101, the exposed part of the adjacent partition structure 20 can limit the semiconductor structure placed between them. Since at least part of the partition structure 20 is detachably installed in the frame body 10, the installation position of the partition structure 20 can be determined according to the thickness of the semiconductor structure to be accommodated by the cassette body. Therefore, the semiconductor structure cassette body provided in this application embodiment can be used to accommodate semiconductor structures of different thicknesses. The cassette body is applicable to wafers of different thicknesses, improving the applicability of the cassette body.
[0032] In one embodiment, such as Figure 1 and Figure 4As shown, the frame body 10 also includes opposing third sidewalls 13 and fourth sidewalls 14, and the first sidewall 11, second sidewall 12, third sidewall 13, and fourth sidewall 14 enclose a receiving cavity 101. The height direction of the cartridge body 10 is perpendicular to the direction from the first sidewall 11 to the second sidewall 12 and the direction from the third sidewall 13 to the fourth sidewall 14. The frame body 10 is provided with an opening 102 for the semiconductor structure to enter and exit the receiving cavity 101, and the opening 102 is located at one end of the frame body 10. The semiconductor structure can enter the receiving cavity 101 through the opening 102 along the height direction of the cartridge body 10, and can also exit the receiving cavity 101 through the opening 102 along the height direction of the cartridge body 10.
[0033] In one embodiment, the semiconductor structure housed in the semiconductor structure's housing is a circular plate-like structure, such as a wafer. Parts of the first sidewall 11 and the second sidewall 12 are arc-shaped, which allows for a larger contact area between the semiconductor structure and the first sidewall 11 and the second sidewall 12, thus providing better containment of the semiconductor structure.
[0034] In one embodiment, the distance between any two adjacent first slots 111 on the first sidewall 11 is the same, and the distance between any two adjacent first slots 111 is approximately 6.2 mm to 6.5 mm; the distance between any two adjacent second slots 121 on the second sidewall 12 is the same, and is also the same as the distance between any two adjacent first slots 111. The distance between any two adjacent first slots 111 is greater than the thickness of conventionally thinner wafers on the market. Thus, when each of the two adjacent first slots 111 is provided with a partition structure 20, the gap between the two partition structures 20 can accommodate a thinner wafer; when there is a gap of one or more first slots 111 between the two first slots 111 on which the two adjacent partition structures 20 are installed, the gap between the two adjacent partition structures 20 can accommodate a thicker wafer.
[0035] In one embodiment, the width of the first card slot 111 and the width of the second card slot 121 are approximately 0.9 mm to 1.1 mm.
[0036] In one embodiment, all of the partition structures 20 are detachably mounted on the frame body 10. This arrangement allows the mounting positions of all required partition structures 20 to be determined based on the thickness of the semiconductor structure to be accommodated, thereby enabling the cartridge body to accommodate more semiconductor structures.
[0037] In one embodiment, the first slot 111 is formed by a recess in the inner surface of the first sidewall 11, and the first slot 111 does not penetrate the first sidewall 11; the second slot 121 is formed by a recess in the inner surface of the second sidewall 12, and the second slot 121 does not penetrate the second sidewall 12.
[0038] In one embodiment, the width of the portion of the partition structure 20 exposed above its corresponding slot ranges from 2mm to 4mm. This allows the exposed portion of the partition structure 20 to provide better containment for the semiconductor structure.
[0039] In one embodiment, such as Figure 2 and Figure 3 As shown, when the partition structure 20 is detachably installed on the frame, the partition structure 20 includes a first partition 21 and a second partition 22. The first partition 21 includes a first main body portion 211, which is installed in the first slot 111. The second partition 22 includes a second main body portion 221, which is installed in the second slot 121. The first main body portion 211 is partially exposed outside the first slot 111, and the exposed portion is located within the receiving cavity 101. The second main body portion 221 is partially exposed outside the second slot 121, and the exposed portion is located within the receiving cavity 101. With this configuration, both adjacent first main body portions 211 and both adjacent second main body portions 221 can limit the semiconductor structure placed between the two partition structures 20, resulting in a better limiting effect on the semiconductor structure.
[0040] In one embodiment, such as Figures 2 to 4 As shown, the first partition 21 further includes a first hook 212 connected to the end of the first main body 211 near the opening 102. The first hook 212 is engaged with the end of the first sidewall 11 near the opening 102. This arrangement allows the end of the first partition 21 near the opening 102 to be more firmly fixed to the frame 10, helping to prevent the first partition 21 from moving relative to the frame 10 or from detaching from the frame 10, thus affecting the limiting effect of the partition structure 20 on the semiconductor structure.
[0041] In one embodiment, such as Figures 2 to 4 As shown, the second partition 22 further includes a second hook 222 connected to the end of the second main body 221 near the opening 102. The second hook 222 is engaged with the end of the second sidewall 12 near the opening 102. This arrangement allows the end of the second partition 22 near the opening 102 to be more securely fixed to the frame 10, helping to prevent the second partition 22 from moving relative to the frame 10 or from detaching from the frame 10, thus affecting the limiting effect of the partition structure 20 on the semiconductor structure.
[0042] In one embodiment, such as Figure 4As shown, the frame body 10 also has a plurality of first limiting grooves 15 and a plurality of second limiting grooves (not shown) located on the side of the receiving cavity 101 away from the opening 102. Specifically, the frame body 10 also has a through hole located on the side of the receiving cavity 101 away from the opening 102, and the first limiting grooves and second limiting grooves are disposed on the side of the through hole. In some embodiments, each first limiting groove 15 communicates with a first slot 111, and each second limiting groove communicates with a second slot 121.
[0043] Furthermore, such as Figure 2 and Figure 3 As shown, the first partition 21 further includes a first limiting plate 213 connected to the end of the first main body 211 away from the opening 102, and the first limiting plate 213 is installed in the first limiting groove 15. This configuration, with the first limiting plate 213 cooperating with the first limiting groove 15, allows the end of the first partition 21 away from the opening 102 to be more firmly fixed to the first sidewall 11, further preventing the first partition 21 from moving relative to the frame 10 or from detaching from the frame 10, thus affecting the limiting effect of the partition structure 20 on the semiconductor structure.
[0044] Furthermore, such as Figure 2 and Figure 3 As shown, the second partition 22 further includes a second limiting plate 223 connected to the end of the second main body 221 away from the opening 102, and the second limiting plate 223 is installed in the second limiting groove. With this configuration, the second limiting plate 223 cooperates with the second limiting groove, allowing the end of the second partition 22 away from the opening 102 to be more firmly fixed to the second side wall 12. This further prevents the second partition 22 from moving relative to the frame 10 or from detaching from the frame 10, thus affecting the limiting effect of the partition structure 20 on the semiconductor structure.
[0045] In one embodiment, such as Figure 2 As shown, the partition structure 20, which is detachably installed on the frame 10, includes a first type of partition structure 201, wherein the first partition 21 and the second partition 22 of the first type of partition structure 201 are separate structures. This configuration allows the first partition 21 and the second partition 22 to be installed and removed individually, reducing the difficulty of installing and removing the first type of partition structure 201 on the frame 10 and making it easier to operate.
[0046] Furthermore, such as Figure 2 As shown, the first partition 21 and the second partition 22 of the first type of partition structure 201 have the same structure. With this configuration, when the first type of partition structure 201 is installed on the frame 10, the first partition 21 and the second partition 22 do not need to be distinguished, which can further reduce the installation difficulty.
[0047] In one embodiment, such as Figure 3 As shown, the partition structure 20 detachably installed on the frame body 10 includes a second type of partition structure 202, wherein the first partition 21 and the second partition 22 of the second type of partition structure 202 are an integral structure.
[0048] Furthermore, such as Figure 3 As shown, the second type of partition structure 202 also includes a support plate 23 located between the first partition 21 and the second partition 22, the support plate 23 being located within the receiving cavity 101. When the height direction of the material box body is parallel to the horizontal direction, the portion of the first main body 211 exposed to the slot, the portion of the second main body 221 exposed to the slot, and the support plate 23 can all support the semiconductor structure, which helps to prevent deformation of the semiconductor structure. In some embodiments, the length of the support plate 23 is approximately 100 mm, thus providing better support for the semiconductor structure.
[0049] In one embodiment, such as Figure 3 As shown, the second type of partition structure 202 also includes a limiting plate 24. The limiting plate 24 is connected to the end of the first main body 211 away from the opening 102 and the end of the second main body 221 away from the opening 102, respectively. One end of the limiting plate 24 is installed in the first limiting groove 13, and the other end is installed in the second limiting groove 14. The cooperation between the limiting plate 24 and the first limiting groove 13 and the second limiting groove 14 makes the second type of partition structure 202 more firmly installed on the frame 10, and the larger width of the limiting plate 24 enhances the strength of the second type of partition structure 202. In this embodiment, the limiting plate 24 is also the integrally formed first limiting plate 213 and second limiting plate 223.
[0050] In one embodiment, such as Figure 3 As shown, the support plate 23 is connected to the limiting plate 24, and the width of the end of the support plate 23 connected to the limiting plate 24 is greater than the width of the end of the support plate 23 away from the limiting plate 24. This arrangement can further improve the strength of the second type of partition structure 202.
[0051] In one embodiment, when the semiconductor structure has a small thickness, such as less than 200 μm, it is more prone to deformation. A second type of separator structure 202 can be used to limit its movement. Thus, when the height direction of the cartridge body is parallel to the horizontal direction, the support plate 23 can support the semiconductor structure and prevent deformation. When the semiconductor structure has a large thickness, such as greater than 200 μm, it is less prone to deformation. A first type of separator 201 or a second type of separator 202 can be used to limit its movement.
[0052] In one embodiment, such as Figure 4 As shown, the frame body 10 can simultaneously mount a first type of partition 201 and a second type of partition 202. Thus, the cartridge body can accommodate two or more semiconductor structures of different thicknesses. In other embodiments, the frame body 10 may only mount the first type of partition 201, or the frame body 10 may only mount the second type of partition 202.
[0053] This application also provides a semiconductor structure cassette, which includes a lid and a cassette body as described in any of the above embodiments. The lid is detachably fitted onto the opening of the cassette body. After the semiconductor structure enters the cassette body, the lid covers the opening of the cassette body, protecting the semiconductor structure; when it is necessary to remove the semiconductor structure from the cassette body, the lid is removed from the opening of the cassette body.
[0054] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.
Claims
1. A cassette body of a semiconductor structure, characterized by, The cartridge body of the semiconductor structure comprises: a frame body having a containing cavity for placing semiconductor structures and an opening communicating with the containing cavity, the opening being used for semiconductor structures to enter and move out of the containing cavity; the frame body comprises a first side wall and a second side wall located at opposite sides of the containing cavity; the frame body is provided with a plurality of groups of clamping grooves, each group of clamping grooves comprising a first clamping groove provided on the first side wall and a second clamping groove provided on the second side wall, and the first clamping groove and the second clamping groove in the same group are opposite to each other; a plurality of partition structures; each partition structure is installed in a group of clamping grooves, and the partition structure partially exposes its corresponding clamping groove and the exposed part is located in the containing cavity; two adjacent partition structures are used for limiting semiconductor structures located therebetween; at least part of the partition structures are detachably installed on the frame body.
2. The cartridge case of a semiconductor structure according to claim 1, wherein All the partition structures are detachably installed on the frame body.
3. The cartridge body of a semiconductor structure according to claim 1, wherein, When the partition structures are detachably installed on the frame body, the partition structures comprise a first partition and a second partition; the first partition comprises a first main body part, and the first main body part is installed in the first clamping groove; the second partition comprises a second main body part, and the second main body part is installed in the second clamping groove; the first main body part partially exposes the first clamping groove and the exposed part is located in the containing cavity, and the second main body part partially exposes the second clamping groove and the exposed part is located in the containing cavity.
4. The cartridge case of a semiconductor structure according to claim 3, wherein, The first partition further comprises a first clamping hook connected with the first main body part, and the first clamping hook is clamped on the end of the first side wall close to the opening; and / or, the second partition further comprises a second clamping hook connected with the second main body part, and the second clamping hook is clamped on the end of the second side wall close to the opening.
5. The cartridge case of a semiconductor structure according to claim 3, wherein, The frame body is further provided with a plurality of first limiting grooves located on the side of the containing cavity away from the opening; the first partition further comprises a first limiting plate connected with the end of the first main body part away from the opening, and the first limiting plate is installed in the first limiting groove; and / or, The frame body is further provided with a plurality of second limiting grooves located on the side of the containing cavity away from the opening; the second partition further comprises a second limiting plate connected with the end of the second main body part away from the opening, and the second limiting plate is installed in the second limiting groove.
6. The cartridge body of a semiconductor structure according to claim 3, wherein, The partition structures detachably installed on the frame body comprise first-type partition structures, and the first partition and the second partition of the first-type partition structures are in split structure.
7. The cartridge body of a semiconductor structure according to claim 6, wherein, The first partition and the second partition of the first-type partition structures are of the same structure.
8. The cartridge body of a semiconductor structure according to claim 3, wherein, The partition structures detachably installed on the frame body comprise second-type partition structures, and the first partition and the second partition of the second-type partition structures are in integral structure.
9. The cartridge body of a semiconductor structure according to claim 8, wherein, The second-type partition structure further comprises a support plate located between the first partition and the second partition, and the support plate is located in the containing cavity; and / or, The support plate of the second-type partition structure is detachably installed on the frame body. The frame body is further provided with a plurality of first limiting grooves and a plurality of second limiting grooves on the side of the accommodating cavity away from the opening; the second type of partition plate structure further comprises a limiting plate connected with the end of the first main body part away from the opening and the end of the second main body part away from the opening respectively, one end of the limiting plate being installed in the first limiting groove and the other end being installed in the second limiting groove.
10. A magazine of semiconductor structures, characterized by, The magazine of the semiconductor structure comprises a magazine cover and the magazine of the semiconductor structure of any one of claims 1 to 9.