IGBT module structure

Abstract

The utility model discloses an IGBT module structure including an IGBT module, a copper bar assembly and a current sensor, the copper bar assembly is arranged on the IGBT module and is electrically connected with the output end of the IGBT module, the copper bar assembly is provided with a mounting hole, the current sensor is vertically inserted in the mounting hole, and the current sensor is used for detecting the output current of the copper bar assembly. The IGBT module structure provided by the utility model has the advantages of compact structure, good heat dissipation effect and high detection precision of the current sensor.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit technology, and in particular to an IGBT module structure. Background Technology

[0002] IGBTs (Insulated Gate Bipolar Transistors) are important power semiconductor devices that play a crucial role in the field of power electronics. Traditional methods for sensing the output current of IGBT modules typically require integrating a shunt on the double-sided copper-clad ceramic substrate of the IGBT module, which is unsuitable for high-current sensing and results in a relatively large size.

[0003] Chinese patent document CN217563478U discloses a modular IGBT new energy motor controller. In this technical solution, the circuit board, current sensor and copper busbar are stacked in a planar manner. Although this can reduce the size of the device, the copper busbar temperature is high under high power and high current conditions. The planar stacked structure has poor heat dissipation effect, and the excessive temperature will also be conducted to the current sensor, affecting the detection accuracy of the current sensor. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide an IGBT module structure with a compact structure, good heat dissipation effect and high current sensor detection accuracy.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] An IGBT module structure includes an IGBT module, a copper busbar assembly, and a current sensor. The copper busbar assembly is disposed on the IGBT module and electrically connected to the output terminal of the IGBT module. The copper busbar assembly has a mounting hole, and the current sensor is vertically inserted into the mounting hole. The current sensor is used to detect the output current of the copper busbar assembly.

[0007] As a further improvement to the above technical solution:

[0008] A circuit board is vertically mounted on the IGBT module, and the current sensor is located on the circuit board.

[0009] The copper busbar assembly includes an upper connecting part, a middle part, and a lower connecting part connected in sequence. The upper connecting part and the middle part overlap with the IGBT module. The mounting hole is opened on the middle part, and the IGBT module is provided with a mounting groove corresponding to the mounting hole.

[0010] The upper connection part includes multiple terminals that are electrically connected to the output terminal of the IGBT module, and the lower connection part is provided with connection holes.

[0011] The middle part has grooves on both sides of the mounting hole.

[0012] The width of the middle portion is greater than the width of the lower connecting portion and / or the width of the upper connecting portion.

[0013] The middle part is plastic-coated.

[0014] The upper connecting part, the middle part and the lower connecting part are integrally formed.

[0015] The mounting hole can be an oblong hole, a square hole, or a round hole.

[0016] The current sensor is a coreless current sensor.

[0017] Compared with the prior art, the advantages of this utility model are:

[0018] 1. In the IGBT module structure of this utility model, during operation, the current sensor is inserted into the mounting hole, and the copper busbar assembly does not directly contact the current sensor. This reduces the heat conducted from the copper busbar assembly to the current sensor, minimizing the impact on the current sensor's detection accuracy, resulting in high current sensor detection accuracy. By opening mounting holes on the copper busbar assembly, the current sensor is installed using an insertion method, which makes full use of the space of the copper busbar assembly, resulting in a compact structure. Furthermore, the current sensor and the copper busbar assembly form a three-dimensional stacked structure perpendicular to each other, providing good heat dissipation.

[0019] 2. The IGBT module structure of this utility model, by opening grooves on both sides of the mounting hole, can reduce interphase interference, reduce sensitivity, reduce detection error, and improve the detection accuracy of the current sensor.

[0020] 3. The IGBT module structure of this utility model has a locally widened copper busbar assembly, which can improve heat dissipation, reduce the temperature of the copper busbar assembly during operation, especially the temperature of the middle part, and reduce the impact on the current sensor. Attached Figure Description

[0021] Figure 1 This is a structural diagram of the IGBT module of this utility model.

[0022] Figure 2 This is a schematic diagram of the IGBT module structure of this utility model (circuit board and current sensor are not shown).

[0023] Figure 3 This is a top view of the IGBT module structure of this utility model.

[0024] Figure 4 This is a front sectional view of the IGBT module structure of this utility model.

[0025] Figure 5 This is a top view of one embodiment of the copper busbar assembly in the IGBT module structure of this utility model.

[0026] Figure 6 This is a top view of one embodiment of the copper busbar assembly in the IGBT module structure of this utility model.

[0027] Figure 7 This is a top view of one embodiment of the copper busbar assembly in the IGBT module structure of this utility model.

[0028] Figure 8 This is a top view of one embodiment of the copper busbar assembly in the IGBT module structure of this utility model.

[0029] Legend: 1. IGBT module; 11. Mounting slot; 2. Copper busbar assembly; 21. Mounting hole; 211. Stepped platform; 22. Upper connection part; 221. Terminal post; 23. Middle part; 231. Groove; 24. Lower connection part; 241. Connection hole; 3. Current sensor; 4. Circuit board. Detailed Implementation

[0030] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "assembly," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] like Figures 1 to 8 As shown, the IGBT module structure of this embodiment includes an IGBT module 1, a copper busbar assembly 2, and a current sensor 3. The copper busbar assembly 2 is disposed on the IGBT module 1 and electrically connected to the output terminal of the IGBT module 1. The copper busbar assembly 2 has a mounting hole 21, and the current sensor 3 is vertically inserted into the mounting hole 21. The current sensor 3 is used to detect the output current of the copper busbar assembly 2.

[0035] In this embodiment of the IGBT module structure, during operation, the current sensor 3 is inserted into the mounting hole 21, and the copper busbar assembly 2 does not directly contact the current sensor 3. This reduces the heat conducted from the copper busbar assembly 2 to the current sensor 3, minimizing the impact on the detection accuracy of the current sensor 3, resulting in high detection accuracy. By opening the mounting hole 21 on the copper busbar assembly 2, the current sensor 3 is installed using an insertion method, which makes full use of the space of the copper busbar assembly 2, resulting in a compact structure. Furthermore, the current sensor 3 and the copper busbar assembly 2 form a three-dimensional stacked structure perpendicular to each other, providing good heat dissipation.

[0036] In this embodiment, the IGBT module 1 has three output terminals, and correspondingly, the copper busbar assembly 2 and the current sensor 3 are also provided in three sets.

[0037] Furthermore, such as Figure 1 As shown, in this embodiment, a circuit board 4 is vertically mounted on the IGBT module 1, and the current sensor 3 is disposed on the circuit board 4. The vertical mounting of the circuit board 4 on the IGBT module 1 provides support for the current sensor 3 and also reduces the contact area between the circuit board 4 and the IGBT module 1 and the copper busbar assembly 2, resulting in better heat dissipation. Preferably, in this embodiment, the circuit board 4 is an integrated circuit board, requiring no complex soldering process and facilitating fabrication.

[0038] Furthermore, such as Figure 2 , Figure 3 and Figure 5As shown, in this embodiment, the copper busbar assembly 2 includes an upper connecting portion 22, a middle portion 23, and a lower connecting portion 24 connected in sequence. The upper connecting portion 22 and the middle portion 23 overlap with the IGBT module 1. A mounting hole 21 is formed on the middle portion 23. The IGBT module 1 is provided with a mounting groove 11 corresponding to the mounting hole 21. The upper connecting portion 22 and the middle portion 23 of the copper busbar assembly 2 overlap with the IGBT module 1, and the lower connecting portion 24 extends out of the IGBT module 1, facilitating connection with external devices. The IGBT module 1 is provided with a mounting groove 11 corresponding to the mounting hole 21, allowing the current sensor 3 to be inserted into the mounting groove 11 and the mounting hole 21, avoiding interference with the IGBT module 1.

[0039] Preferably, such as Figure 2 and Figure 4 As shown, in this embodiment, the mounting groove 11 is provided with a stepped platform 211 for positioning the circuit board 4. The circuit board 4 is vertically inserted into the mounting groove 11 and positioned by the stepped platform 211. Then, glue is applied to fix the circuit board 4 to prevent the current sensor 3 from shaking.

[0040] Furthermore, such as Figures 5 to 8 As shown, in this embodiment, the upper connection part 22 includes multiple terminals 221 electrically connected to the output terminal of the IGBT module 1, and the lower connection part 24 is provided with a connection hole 241. The terminals 221 are connected to the output terminal of the IGBT module 1, and the connection hole 241 is connected to an external device, resulting in a simple structure.

[0041] Furthermore, in this embodiment, the middle portion 23 is provided with grooves 231 on both sides of the mounting hole 21. By opening grooves 231 on both sides of the mounting hole 21, the side slotting can reduce interphase interference, reduce sensitivity, reduce detection error, and improve the detection accuracy of the current sensor 3.

[0042] Furthermore, in this embodiment, the width of the middle portion 23 is greater than the width of the lower connecting portion 24 and the width of the upper connecting portion 22. This localized widening of the copper busbar assembly 2 improves heat dissipation, reduces the temperature of the copper busbar assembly 2 during operation, particularly the temperature of the middle portion 23, and minimizes the impact on the current sensor 3.

[0043] Furthermore, in this embodiment, the middle portion 23 is plastic-coated. Since the current sensor 3 is inserted into the mounting hole 21 of the middle portion 23, plastic coating the middle portion 23 improves the insulation between the current sensor 3 and the copper busbar assembly 2. Preferably, in this embodiment, the current sensor 3 is fixed in the mounting hole 21 by applying adhesive, which provides good vibration resistance.

[0044] Furthermore, in this embodiment, the upper connecting part 22, the middle part 23 and the lower connecting part 24 are integrally formed, which has a simple structure and reliable connection.

[0045] Furthermore, in this embodiment, the mounting hole 21 is an oblong hole. In other embodiments, the mounting hole 21 can also be a square hole or a circular hole. Different shapes of holes can be set according to different current sensors 3 to be compatible with current sensors 3 of different ranges.

[0046] Furthermore, in this embodiment, the current sensor 3 is a coreless current sensor 3. The coreless current sensor 3 is small in size and has a more compact structure.

[0047] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make many possible variations and modifications to the technical solution of the present utility model using the methods and techniques disclosed above, or modify it into equivalent embodiments with equivalent changes, without departing from the spirit and technical solution of the present utility model. Therefore, any simple modifications, equivalent substitutions, equivalent changes and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the content of the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. An IGBT module structure, characterized by: The application relates to an IGBT module (1), a copper bar assembly (2) and a current sensor (3), the copper bar assembly (2) is arranged on the IGBT module (1) and is electrically connected with the output end of the IGBT module (1), a mounting hole (21) is formed in the copper bar assembly (2), the current sensor (3) is vertically inserted into the mounting hole (21), and the current sensor (3) is used for detecting the output current of the copper bar assembly (2).

2. The IGBT module structure according to claim 1, characterized in that: The IGBT module (1) is vertically provided with a circuit board (4), and the current sensor (3) is arranged on the circuit board (4).

3. The IGBT module structure of claim 1, wherein: The copper bar assembly (2) comprises a upper connecting part (22), an intermediate part (23) and a lower connecting part (24) which are sequentially connected, the upper connecting part (22) and the intermediate part (23) overlap the IGBT module (1), the mounting hole (21) is formed in the intermediate part (23), and the IGBT module (1) is provided with a mounting groove (11) corresponding to the mounting hole (21).

4. The IGBT module structure of claim 3, wherein: The upper connecting part (22) comprises a plurality of connecting columns (221) which are electrically connected with the output end of the IGBT module (1), and the lower connecting part (24) is provided with a connecting hole (241).

5. The IGBT module structure of claim 3, wherein: The intermediate part (23) is provided with a groove (231) on both sides of the mounting hole (21).

6. The IGBT module structure of claim 3, wherein: The width of the intermediate part (23) is greater than the width of the lower connecting part (24) and / or the width of the upper connecting part (22).

7. The IGBT module structure of claim 3, wherein: The intermediate part (23) is plastic-coated.

8. The IGBT module structure of claim 3, wherein: The upper connecting part (22), the intermediate part (23) and the lower connecting part (24) are integrally formed.

9. The IGBT module structure according to any one of claims 1 to 8, characterized in that: The mounting hole (21) is a waist-shaped hole, a square hole or a circular hole.

10. The IGBT module structure according to any one of claims 1 to 8, characterized in that: The current sensor (3) is a coreless current sensor (3).

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