Packaging chip polishing device

Abstract

A packaged chip polishing device comprises a suction mechanism arranged at the moving end of a linear mechanism and provided with a chip suction cup movably arranged in the vertical direction; the polishing mechanism is located below the stroke track of the suction mechanism and comprises a polishing plate and a swing assembly, a carborundum layer is arranged on the top face of the polishing plate, and the swing assembly is used for driving the polishing plate to swing in the horizontal direction. Wherein the swinging assembly comprises a base, and a straddle frame, a motor and an X-direction horizontal guide rail which are arranged on the base; the motor is vertically arranged on the base and located below the straddle frame, and an output shaft of the motor vertically penetrates through the straddle frame and is coaxially connected with the round rotating disc located on the top face of the straddle frame. A rotating column is eccentrically arranged on the circular turntable, and a rotating block is rotationally matched with the rotating column; a first sliding block is arranged on the X-direction horizontal guide rail in a sliding fit mode and provided with a Y-direction horizontal guide rail, and a second sliding block is arranged on the Y-direction horizontal guide rail in a sliding fit mode. The polishing plate is connected with the rotating block and the second sliding block. The device is applied before a screeding process, and the back colloid of the packaged chip is polished and removed in batches.

Description

Technical Field

[0001] This application belongs to the field of semiconductor packaging technology, specifically relating to a chip polishing apparatus. Background Technology

[0002] For some semiconductor packaged chips with heat sinks, the heat sink is exposed on the back after packaging to improve heat dissipation in downstream applications. During the packaging process, after the chip's internal components are bonded and wire-bonded, it undergoes molding. Inevitably, some adhesive overflow occurs after molding, meaning the adhesive spreads to cover at least part of the heat sink. If not removed, this will affect the chip's heat dissipation during application. Therefore, how to efficiently and effectively remove excess adhesive becomes a problem that needs to be solved. Utility Model Content

[0003] To address the shortcomings of the aforementioned prior art, this application provides a chip polishing apparatus, applied before the punching process in the packaging process, to achieve batch and efficient polishing removal of adhesive overflowing onto the surface of the heat sink.

[0004] To achieve the above objectives, the present invention employs the following technology:

[0005] A chip polishing apparatus, comprising:

[0006] A linear mechanism, horizontally mounted on a column;

[0007] A suction mechanism, located at the moving end of the linear mechanism, has a chip suction cup that moves vertically to suction the packaged chip frame; and

[0008] The polishing mechanism, located below the travel trajectory of the suction mechanism, includes a polishing plate and a swinging component. The top surface of the polishing plate has a diamond abrasive layer, and the swinging component is used to drive the polishing plate to swing in the horizontal direction. The specific swinging range is such that the polishing area of ​​the polishing plate can effectively cover the packaged chip frame picked up by the suction mechanism.

[0009] The swing assembly includes a base and a crossbeam mounted on the base, a motor, and an X-axis horizontal guide rail. The motor is vertically mounted on the base and located below the crossbeam. Its output shaft passes vertically through the crossbeam and is coaxially connected to a turntable located on the top surface of the crossbeam. A rotating column is eccentrically mounted on the turntable, and a rotating block is rotatably fitted on it. A first slider is slidably fitted on the X-axis horizontal guide rail. A Y-axis horizontal guide rail is mounted on the first slider, and a second slider is slidably fitted on the Y-axis horizontal guide rail. A grinding plate connects the rotating block and the second slider.

[0010] The beneficial effects of this utility model are as follows:

[0011] The device can suck multiple packaging chip frame top layers by the suction mechanism, then transfer and load to the polishing under the action of the linear mechanism, polish the back of the adsorbed frame packaging chip by the swinging polishing plate, and remove the overflow glue; the polishing plate top surface adopts the diamond sand layer, which can effectively ensure the polishing effect and shorten the polishing time, and the swinging movement of the polishing plate limited in X direction and Y direction can better complete the efficient polishing of the back of multiple frames adsorbed on the chip suction disc. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a device perspective view of the embodiment of the present application.

[0013] Figure 2 is a device side view of the embodiment of the present application.

[0014] Figure 3 is a perspective view of the swinging assembly of the embodiment of the present application.

[0015] Figure 4 is a device perspective view when the chip suction disc moves above the polishing disc. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the embodiments of the present application will be described in detail below with reference to the drawings, but the embodiments described in the present application are part of the embodiments of the present application, not all the embodiments.

[0017] The embodiment of the present application provides a packaging chip polishing device, as shown in the figure, which comprises a polishing mechanism 1, a suction mechanism 2, a linear mechanism 3 and the like. Figures 1-4 The present example can realize batch operation, and the specific batch operation means that the packaging chip frame after plastic packaging but before cutting the rib is processed, and multiple pairs of arrayed packaging chip frames can be processed in batches.

[0018] Specifically, the linear mechanism 3 is horizontally installed on a column, in order to adapt to the front and rear processes, the column can be driven to rotate, so as to rotate and switch between different process positions. Optionally, the linear mechanism 3 adopts a linear motor.

[0019] The suction mechanism 2 is located at the moving end of the linear mechanism 3, facilitating movement along the stroke direction of the linear mechanism 3. The suction mechanism 2 has a chip suction cup 20 that moves vertically and is used to suction the packaged chip frame. Specifically, the chip suction cup 20 has an airflow channel inside and is connected to an air pump through a hose for suction under the action of the air pump. In this example, the bottom surface of the chip suction cup 20 is set as the suction surface. This surface array has multiple recessed limiting areas to limit the packaged chip frame to be suctioned. The limiting area array has suction holes connected to the airflow channel for suctioning the packaged chip frame. Specifically, during suction, the front side of the packaged chip frame is suctioned, while the back side is the side that needs to be polished.

[0020] The polishing mechanism 1 is located below the travel trajectory of the suction mechanism 2, and includes a polishing plate 10 and a swinging component. The top surface of the polishing plate 10 has a diamond layer, which is used as a polishing surface to achieve an effective and fast polishing and adhesive removal effect. The swinging component is used to drive the polishing plate 10 to swing in the horizontal direction. The specific swing range is such that the polishing area of ​​the polishing plate 10 can effectively cover the packaged chip frame picked up by the suction mechanism.

[0021] The linear mechanism 3 transfers the suction mechanism 2, which picks up the packaged chip frame, to above the polishing mechanism 1, as shown. Figure 1 The image shows the location of the newly acquired packaged chip frame, such as... Figure 4 The diagram shows the position of the suction mechanism 2 when it moves above the polishing plate 10; then the chip suction cup 20 is moved vertically, and the packaged chip frame that has been suctioned is lowered to be in contact with the surface of the polishing plate 10. The polishing plate 10 is driven to swing by the swing component, thereby polishing the back of the packaged chip frame that has been suctioned and quickly removing the adhesive.

[0022] As a specific alternative to the swing assembly, the swing assembly includes a base 11 and a frame 12 disposed on the base 11, a motor 13, and an X-axis horizontal guide rail 17. The motor 13 is vertically disposed on the base 11 and located below the frame 12, with its output shaft vertically passing through the frame 12 and coaxially connected to a rotary disk 14 located on the top surface of the frame 12. A rotating column 15 is eccentrically disposed on the rotary disk 14, and a rotating block 16 is rotatably fitted on it. A first slider is slidably fitted on the X-axis horizontal guide rail 17, and a Y-axis horizontal guide rail 18 is mounted on the first slider. A second slider 19 is slidably fitted on the Y-axis horizontal guide rail 18. A grinding plate 10 connects the rotating block 16 and the second slider 19. To improve stability during operation, there is a pair of X-axis horizontal guide rails 17, each of which is correspondingly provided with a first slider, a Y-axis horizontal guide rail 18, and a second slider 19. Here, X and Y refer to two vertical directions within the horizontal direction.

[0023] In use, the circular turntable 14 is driven to rotate by the motor 13. Since the rotating block 16 is connected to the rotating column 15, the polishing plate 10 connected to the rotating block 16 performs eccentric swing with the circular turntable 14. During the swing, the polishing plate 10 is constrained by the X-direction horizontal guide rail 17 and the Y-direction horizontal guide rail 18, so that the swing process can maintain its posture, ensuring that the polishing is orderly performed.

[0024] The suction mechanism 2 comprises a vertical cylinder 21 and the chip suction disc 20 installed on the moving end of the linear mechanism 3. The output end of the vertical cylinder 21 is vertically arranged at the bottom and connected to the top of the chip suction disc 20. The bottom surface of the chip suction disc 20 is concave and provided with a plurality of limiting areas for limiting the frame of the packaged chip. The limiting areas are provided with suction holes connected to the airflow channel inside the chip suction disc 20. The airflow channel of the chip suction disc 20 is connected to the air pump through a hose.

[0025] The top of the chip suction disc 20 is connected to a plurality of vertical guide rods 22. The vertical guide rods 22 pass through a fixed plate 25. The fixed plate 25 is installed on the shell of the vertical cylinder 21. The top end of the vertical guide rod 22 is provided with a limiting block 23. The spring 24 is sleeved on the vertical guide rod 22 between the limiting block 23 and the fixed plate 25. Thus, the spring 24 is compressed when the chip suction disc 20 is lowered to provide a buffering force.

[0026] The above only describes the preferred embodiments of the present application and is not used to limit the present application. Obviously, those skilled in the art can make various modifications and changes to the present application without departing from the spirit and scope of the present application.

Claims

1. A chip polishing apparatus, characterized in that, include: A linear mechanism (3) is horizontally mounted on a column; The suction mechanism (2), located at the moving end of the linear mechanism (3), has a chip suction cup (20) that moves vertically to pick up the packaged chip frame; and The polishing mechanism (1) is located below the stroke trajectory of the suction mechanism (2) and includes a polishing plate (10) and a swing assembly. The swing assembly is used to drive the polishing plate (10) to swing in the horizontal direction. The swing assembly includes a base (11) and a strut (12) provided on the base (11), a motor (13), and an X-axis horizontal guide rail (17). The motor (13) is vertically mounted on the base (11) and located below the span frame (12). Its output shaft passes vertically through the span frame (12) and is coaxially connected to the circular turntable (14) located on the top surface of the span frame (12). A rotating column (15) is eccentrically arranged on the turntable (14), and a rotating block (16) is rotatably fitted on it. A first slider is slidably fitted on the X-direction horizontal guide rail (17), and a Y-direction horizontal guide rail (18) is mounted on the first slider. A second slider (19) is slidably fitted on the Y-direction horizontal guide rail (18). The grinding plate (10) is connected to the rotating block (16) and the second slider (19).

2. The chip polishing apparatus according to claim 1, characterized in that, The top surface of the grinding plate (10) has a diamond layer.

3. The chip polishing apparatus according to claim 1, characterized in that, There is a pair of X-direction horizontal guide rails (17), and each X-direction horizontal guide rail (17) is provided with a first slider, a Y-direction horizontal guide rail (18), and a second slider (19).

4. The chip polishing apparatus according to claim 1, characterized in that, The suction mechanism (2) includes a vertical cylinder (21) installed on the moving end of the linear mechanism (3) and the chip suction cup (20). The output end of the vertical cylinder (21) is set vertically downward and connected to the top of the chip suction cup (20). The bottom surface of the chip suction cup (20) is recessed and has multiple limiting areas for limiting the encapsulation of the chip frame. The limiting areas are provided with suction holes that connect to the internal airflow channels of the chip suction cup (20). The airflow channels of the chip suction cup (20) are connected to the air pump through a hose.

5. The chip polishing apparatus according to claim 2, characterized in that, The chip suction cup (20) is connected to a number of vertical guide rods (22) at the top. The vertical guide rods (22) pass through the fixing plate (25) and the fixing plate (25) is installed on the housing of the vertical cylinder (21). The top of the vertical guide rod (22) has a limiting block (23) and a spring (24) is sleeved on the vertical guide rod (22) between the limiting block (23) and the fixing plate (25).

6. The chip polishing apparatus according to claim 1, characterized in that, The linear mechanism (3) uses a linear electric bar.

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