Ceramic resin binder dicing blade

Abstract

The utility model relates to the technical field of dicing blade equipment, in particular to a ceramic resin binder dicing blade which comprises a blade body and an installation assembly, and the installation assembly comprises a heat dissipation mechanism, an installation ring, an inclined piece, a protruding block, a lower connecting disc, a limiting frame, an upper connecting disc, a limiting piece and a ceramic resin abrasive layer. The protruding block slides into the bottom of the inclined piece, so that the inclined piece can clamp the protruding block, the position of the lower connecting disc is fixed, the limiting piece slides in along the lower connecting disc, and when the limiting piece drives the upper connecting disc to move to the limiting frame close to the lower connecting disc, the limiting piece is not clamped by the lower connecting disc any more and can be clamped in the limiting frame of the lower connecting disc. And the limiting piece is clamped through the limiting frame, so that the position of the upper connecting disc is fixed to the lower connecting disc, and therefore the problem that when the blade body rotates along with the scribing equipment for a long time, the temperature of the blade body rises rapidly, and consequently the blade body is prone to being damaged after being used for a long time is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer dicing blade equipment technical field, concretely relates to a ceramic resin binder wafer dicing blade. BACKGROUND

[0002] The ceramic resin binder wafer dicing blade is made of ceramic material as reinforcing phase and resin material as binder, and is made by specific process to bond together diamond or other abrasive particles to make wafer dicing tool, and the existing ceramic resin wafer dicing tool is prone to falling off after long time use.

[0003] At present, the prior art discloses a ceramic resin binder wafer dicing blade, which is fixed by using two connecting discs, and is installed on the output end of the wafer dicing device, so that the position of the blade body is fixed, and the blade body on the connecting disc is driven to rotate by starting the wafer dicing device, so that the workpiece can be processed, and the use of the staff is facilitated.

[0004] However, by the above-mentioned mode, when the blade body rotates for a long time following the wafer dicing device, the temperature thereof rapidly rises, but the heat dissipation efficiency of the ceramic resin itself is poor, so that the blade body is prone to damage after long time use. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a ceramic resin binder wafer dicing blade, and aims at solving the problem that the blade body of the existing ceramic resin binder wafer dicing blade is prone to damage after long time use due to rapid temperature rise when the blade body rotates for a long time following the wafer dicing device.

[0006] To achieve the above-mentioned purpose, the utility model provides a ceramic resin binder wafer dicing blade, which comprises a blade body and a mounting assembly, the mounting assembly comprises a heat dissipation mechanism, a mounting ring, an inclined piece, a protruding block, a lower connecting disc, a limiting frame, an upper connecting disc, a limiting piece and a ceramic resin abrasive layer;

[0007] The heat dissipation mechanism is arranged on one side of the blade body, the mounting ring is fixedly connected with the heat dissipation mechanism and located at the side of the heat dissipation mechanism, the inclined piece is fixedly connected with the mounting ring and located at the side of the mounting ring, the protruding block is slidably connected with the inclined piece and located on one side of the inclined piece, the lower connecting disc is fixedly connected with the protruding block and located on the top of the protruding block, the limiting frame is fixedly connected with the lower connecting disc and located at the side of the lower connecting disc, the upper connecting disc is slidably connected with the lower connecting disc and located at the side of the lower connecting disc, the limiting piece is rotatably connected with the upper connecting disc and located on one side of the upper connecting disc, and the ceramic resin abrasive layer is fixedly connected with the blade body and located at the side of the blade body.

[0008] The installation assembly further includes a push rod and a spring, the push rod is in sliding connection with the limiting frame and is located at one side of the limiting frame, the spring is fixedly connected with the push rod and the limiting frame and is located at one side of the push rod.

[0009] The heat dissipation mechanism includes heat-conducting fins, a mesh plate and a cooling ring, the heat-conducting fins are fixedly connected with the blade body and are located at one side of the blade body, the mesh plate is fixedly connected with the heat-conducting fins and is located at a side edge of the heat-conducting fins, and the cooling ring is fixedly connected with the heat-conducting fins and the mounting ring and is located at a side edge of the mounting ring.

[0010] The heat dissipation mechanism further includes a water injection channel and a sealing cover, the water injection channel is arranged at the top of the cooling ring, and the sealing cover is in threaded connection with the water injection channel and is located at the top of the water injection channel.

[0011] The cooling ring is provided with an annular groove and a cooling groove, the annular groove is arranged in the cooling ring and is in communication with the water injection channel, and the cooling groove is in communication with the annular groove and is located at a side edge of the cooling ring.

[0012] The ceramic resin binder slicing cutter of the utility model, when being installed, firstly fixes the ceramic resin abrasive layer at both sides of the blade body, and fixes the heat dissipation mechanism at a side edge of the blade body close to the ceramic resin abrasive layer, so that the position of the mounting ring is fixed, at this time, the lug can be slid into the inclined plate bottom, so that the inclined plate can be clamped on the lug, the position of the lower connecting disc is fixed accordingly, at this time, the upper connecting disc can be rotated on the lower connecting disc, and the limiting piece can be slid along the lower connecting disc, at this time, the limiting piece rotates on the upper connecting disc, and can be slid into the lower connecting disc, when the limiting piece drives the upper connecting disc to move close to the limiting frame of the lower connecting disc, the limiting piece is no longer clamped on the lower connecting disc, so that the limiting piece rotates on the upper connecting disc and can be clamped in the limiting frame of the lower connecting disc, and the limiting piece is clamped by the limiting frame, so that the position of the upper connecting disc is fixed on the lower connecting disc, at this time, the upper connecting disc can be installed to the output end of the grinding wheel polishing machine, and subsequent use is facilitated, the positions of the upper connecting disc and the lower connecting disc are fixed by using two clamping structures, so that the problem that the temperature of the blade body of the existing ceramic resin binder slicing cutter rapidly rises when the blade body rotates for a long time along with the slicing equipment, the heat dissipation efficiency of the ceramic resin is poor, and the blade body is prone to damage after long-time use is solved. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced.

[0014] Figure 1 is the overall structure schematic diagram of the ceramic resin binder dicing blade of the utility model.

[0015] Figure 2 is another angle structure schematic diagram of the overall structure of the ceramic resin binder dicing blade of the utility model.

[0016] Figure 3 is the front view of the overall structure of the ceramic resin binder dicing blade of the utility model.

[0017] Figure 4 is the sectional view of the overall structure of the ceramic resin binder dicing blade of the utility model.

[0018] 101-blade body, 102-mounting assembly, 103-heat dissipation mechanism, 104-mounting ring, 105-inclined sheet, 106-bump, 107-lower connecting disc, 108-limiting frame, 109-upper connecting disc, 110-limiting sheet, 111-ceramic resin abrasive layer, 112-push rod, 113-spring, 114-heat conduction fin, 115-mesh plate, 116-cooling ring, 117-water injection channel, 118-sealing cover, 119-annular groove, 120-cooling ring. DETAILED DESCRIPTION

[0019] Please refer to Figures 1-4 , Figure 1 is the overall structure schematic diagram of the ceramic resin binder dicing blade of the utility model, Figure 2 is another angle structure schematic diagram of the overall structure of the ceramic resin binder dicing blade of the utility model, Figure 3 is the front view of the overall structure of the ceramic resin binder dicing blade of the utility model, Figure 4 is the sectional view of the overall structure of the ceramic resin binder dicing blade of the utility model.

[0020] The utility model discloses a ceramic resin binder dicing blade, including blade body 101 and installation component 102, installation component 102 includes heat abstractor 103, mounting ring 104, inclined sheet 105, boss 106, lower connecting disc 107, spacing frame 108, upper connecting disc 109, spacing sheet 110, ceramic resin abrasive layer 111, push rod 112 and spring 113, heat abstractor 103 includes heat conduction fin 114, mesh plate 115, cooling ring 116, water injection channel 117 and sealing cover 118, cooling ring 116 is provided with annular groove 119 and cooling groove 120, and the foregoing scheme has solved the existing small diameter resin cutting grinding wheel to use two bolts and fixes the upper connecting disc 109, lower connecting disc 107 and connecting ring fixed position one whole, makes the grinding wheel in the long time use to bolt wear seriously, makes the fastening of bolt reduce, and the problem of easy to fall off is solved.

[0021] For this specific implementation, the workpiece can be polished by the operation of the blade body 101.

[0022] The heat dissipation mechanism 103 is arranged on one side of the blade body 101, the mounting ring 104 is fixedly connected with the heat dissipation mechanism 103 and located on the side of the heat dissipation mechanism 103, the inclined piece 105 is fixedly connected with the mounting ring 104 and located on the side of the mounting ring 104, the protruding block 106 is slidingly connected with the inclined piece 105 and located on one side of the inclined piece 105, the lower connecting disc 107 is fixedly connected with the protruding block 106 and located on the top of the protruding block 106, the limiting frame 108 is fixedly connected with the lower connecting disc 107 and located on the side of the lower connecting disc 107, the upper connecting disc 109 is slidingly connected with the lower connecting disc 107 and located on the side of the lower connecting disc 107, the limiting piece 110 is rotationally connected with the upper connecting disc 109 and located on one side of the upper connecting disc 109, and the ceramic resin abrasive layer 111 is fixedly connected with the blade body 101 and located on the side of the blade body 101. During installation, first, the ceramic resin abrasive layer 111 is fixed on both sides of the blade body 101, and the heat dissipation mechanism 103 is fixed on the side of the blade body 101 close to the ceramic resin abrasive layer 111, so that the position of the mounting ring 104 is fixed. At this time, the protruding block 106 can be slid into the bottom of the inclined piece 105, so that the inclined piece 105 can block the protruding block 106, and the position of the lower connecting disc 107 is fixed. At this time, the upper connecting disc 109 can rotate the lower connecting disc 107, and the limiting piece 110 can be slid along the lower connecting disc 107. At this time, the limiting piece 110 rotates on the upper connecting disc 109 and can be slid into the lower connecting disc 107. When the limiting piece 110 drives the upper connecting disc 109 to move to the limiting frame 108 close to the lower connecting disc 107, the limiting piece 110 is no longer blocked by the lower connecting disc 107, so that the limiting piece 110 rotates on the upper connecting disc 109 and can be blocked in the limiting frame 108 of the lower connecting disc 107. Then, the limiting piece 110 is blocked by the limiting frame 108, so that the position of the upper connecting disc 109 is fixed on the lower connecting disc 107. At this time, the upper connecting disc 109 can be installed to the output end of the grinding machine, which is convenient for subsequent use. The positions of the upper connecting disc 109 and the lower connecting disc 107 are fixed by using two clamping structures, so as to solve the problem that the temperature of the existing ceramic resin binder blade body 101 rapidly rises when it rotates for a long time, the heat dissipation efficiency of the ceramic resin itself is poor, and the blade body is easily damaged after long-term use.

[0023] Secondly, the push rod 112 is in sliding connection with the limiting frame 108 and is located at one side of the limiting frame 108, the spring 113 is in fixed connection with the push rod 112 and the limiting frame 108 and is located at one side of the push rod 112, when the upper connecting disc 109 needs to be taken out, the push rod 112 can be pushed to compress the spring 113, so that the push rod 112 can move in the limiting frame 108, and the limiting sheet 110 is pushed out of the limiting frame 108, thereby facilitating the staff to take out the upper connecting disc 109 from the lower connecting disc 107.

[0024] Thirdly, the heat-conducting fin 114 is in fixed connection with the blade body 101 and is located at one side of the blade body 101, the mesh plate 115 is in fixed connection with the heat-conducting fin 114 and is located at the side of the heat-conducting fin 114, and the cooling ring 116 is in fixed connection with the heat-conducting fin 114 and the mounting ring 104 and is located at the side of the mounting ring 104, when the blade body 101 operates, the ceramic resin abrasive layer 111 rotates at a high speed to polish the workpiece, the temperature of the ceramic resin abrasive layer 111 rises to transfer heat to the heat-conducting fin 114, and the heat-conducting fin 114 transfers part of the heat to the cooling water in the cooling ring 116, and the heat of the cooling water is dissipated through the outer wall of the cooling ring 116 in contact with the external air, so that the blade body 101 and the ceramic resin abrasive layer 111 can be effectively cooled, and the blade body 101 is less likely to burst during long-time use.

[0025] In addition, the water injection channel 117 is arranged at the top of the cooling ring 116, the sealing cover 118 is in threaded connection with the water injection channel 117 and is located at the top of the water injection channel 117, the cooling ring 116 is opened by left-rotating the sealing cover 118, and then external cooling water can be poured into the cooling ring 116, thereby facilitating subsequent use.

[0026] Meanwhile, the annular groove 119 is arranged in the cooling ring 116 and is in communication with the water injection channel 117, the cooling groove 120 is in communication with the annular groove 119 and is located at the side of the cooling ring 116, the cooling water enters the annular groove 119 along the water injection channel 117 and enters the cooling groove 120 through the annular groove 119, so that the cooling water in the cooling groove 120 can cool multiple positions of the heat-conducting fin 114.

[0027] The utility model discloses a ceramic resin bond dicing blade, when installing, first ceramic resin abrasive layer 111 is fixed in the both sides of blade body 101, and cooling ring 116 is installed in proper order to the side of cooling ring 116, can install ring 104 to the side of cooling ring 116 at this time, can slide into the inclined sheet 105 bottom of boss 106, can be stuck in the inclined sheet 105 of boss 106, the position of lower connecting disc 107 is fixed in proper order at this time, can rotate lower connecting disc 107 to upper connecting disc 109, and slide into along lower connecting disc 107 of limiting sheet 110 at this time, the limiting sheet 110 rotates on upper connecting disc 109, and can slide into lower connecting disc 107, when the limiting sheet 110 moves to the limiting frame 108 of lower connecting disc 107 close to the limiting sheet 110, the limiting sheet 110 is no longer stuck in lower connecting disc 107, makes the limiting sheet 110 rotate on upper connecting disc 109, can be stuck in the limiting frame 108 of lower connecting disc 107, and the limiting sheet 110 is stuck through limiting frame 108, makes the position of upper connecting disc 109 fixed on lower connecting disc 107 at this time, can install upper connecting disc 109 to the output end of grinding machine, and the subsequent use is convenient, the position of upper connecting disc 109 and lower connecting disc 107 is fixed through the use of two clamping structures, when needing to take out upper connecting disc 109, can push push rod 112, and the spring 113 is compressed, makes push rod 112 can move in limiting frame 108, pushes out limiting sheet 110 in limiting frame 108, and the subsequent use is convenient, and when the blade body 101 is running, drives ceramic resin abrasive layer 111 high -speed rotation, and the temperature of ceramic resin abrasive layer 111 rises, can transfer heat to heat conduction fin 114, and heat is discharged through mesh plate 115 through heat conduction fin 114, simultaneously, heat conduction fin 114 transfers part heat to cooling water in cooling ring 116, and the heat of cooling water is emitted again through the outer wall of cooling ring 116 and external air contact, can effectively cool the blade body 101 and ceramic resin abrasive layer 111, makes the blade body 101 not prone to burst in long -term use, thereby solving the problem that the temperature of the blade body 101 of the existing ceramic resin bond dicing blade is rapidly increased when following the dicing equipment long -time rotation, but the heat dissipation efficiency of ceramic resin is poor, leading to the blade body to be damaged after long -time use.

[0028] The above disclosure only shows one or more preferred embodiments of the present application, and cannot limit the scope of the present application. Those skilled in the art can understand that the implementation of all or part of the above-mentioned embodiments, and the equivalent changes made according to the claims of the present application, still belong to the scope covered by the present application.

Claims

1. A ceramic resin-bonded dicing blade, comprising a blade body, characterized in that, It also includes installation components; The mounting assembly includes a heat dissipation mechanism, a mounting ring, a wedge, a protrusion, a lower connecting plate, a limiting frame, an upper connecting plate, a limiting piece, and a ceramic resin abrasive layer; The heat dissipation mechanism is disposed on one side of the blade body. The mounting ring is fixedly connected to the heat dissipation mechanism and located on the side of the heat dissipation mechanism. The inclined plate is fixedly connected to the mounting ring and located on the side of the mounting ring. The protrusion is slidably connected to the inclined plate and located on one side of the inclined plate. The lower connecting plate is fixedly connected to the protrusion and located on the top of the protrusion. The limiting frame is fixedly connected to the lower connecting plate and located on the side of the lower connecting plate. The upper connecting plate is slidably connected to the lower connecting plate and located on the side of the lower connecting plate. The limiting piece is rotatably connected to the upper connecting plate and located on one side of the upper connecting plate. The ceramic resin abrasive layer is fixedly connected to the blade body and located on the side of the blade body.

2. The ceramic resin binder dicing blade as described in claim 1, characterized in that, The mounting assembly also includes a push rod and a spring. The push rod is slidably connected to the limiting frame and located on one side of the limiting frame. The spring is fixedly connected to the push rod and the limiting frame, and is located on one side of the push rod.

3. The ceramic resin binder dicing blade as described in claim 2, characterized in that, The heat dissipation mechanism includes heat-conducting fins, a mesh plate, and a cooling ring. The heat-conducting fins are fixedly connected to the blade body and located on one side of the blade body. The mesh plate is fixedly connected to the heat-conducting fins and located on the side of the heat-conducting fins. The cooling ring is fixedly connected to the heat-conducting fins and to the mounting ring, and located on the side of the mounting ring.

4. The ceramic resin binder dicing blade as described in claim 3, characterized in that, The heat dissipation mechanism also includes a water injection channel and a sealing cap. The water injection channel is located at the top of the cooling ring, and the sealing cap is threadedly connected to the water injection channel and located at the top of the water injection channel.

5. The ceramic resin binder dicing blade as described in claim 4, characterized in that, The cooling ring is provided with an annular groove and a cooling groove. The annular groove is located inside the cooling ring and is connected to the water injection channel. The cooling groove is connected to the annular groove and is located on the side of the cooling ring.

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