Full-sealed crystallizer copper pipe flow plating equipment

Abstract

The utility model relates to a fully-sealed crystallizer copper pipe flow plating device, which is characterized in that a liquid return box body mechanism and a liquid inlet sealing base are fully sealed, and only the bottom of the liquid return box body mechanism is reserved to be in butt joint with an anode main body and the upper end of a workpiece copper pipe for supporting and sealing with the anode main body and the workpiece copper pipe; the liquid inlet pipe is made of a conductive material and is designed on the liquid inlet sealing base, the liquid inlet sealing base adopts the copper pipe bottom sealing disc and the station bottom plate for supporting and sealing the bottoms of the anode main body and the workpiece copper pipe respectively, and the liquid inlet pipe is mounted on the station bottom plate, so that the anode main body is electrified from the lower end; and meanwhile, the sealing performance of the lower end is also achieved, the situation that in the prior art, a supporting groove mode is adopted for the lower end is avoided, and the plating solution is thoroughly prevented from making contact with the outside world.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating equipment technical field, concretely relates to a full sealing crystallizer copper pipe flow plating equipment. BACKGROUND

[0002] The traditional electroplating mode of continuous casting crystallizer copper pipe adopts groove type electroplating (immersion type electroplating), and the R&D team breaks the traditional electroplating mode, adopts the mode of sealed flow plating, and proposes a tubular crystallizer fluid type electroplating equipment with the publication number CN222476801U, but the design defect in the conductive structure is found in the application of the equipment, and the specific embodiment is that the anode wiring mechanism is connected with the anode main body located in the liquid return tank body, and the anode is connected in the upper wiring conductive mode, and the specific structure is referred to the patent specification part. Since the anode screw rod moves back and forth horizontally in the water return tank body, the sealing property of the liquid return tank body and the anode clamping device is poor, and after being used for a period of time, the liquid return tank body and the anode clamping device are sealed and liquid seepage or even liquid leakage occurs. CONTENT OF THE UTILITY MODEL

[0003] In view of the above problems, the utility model provides a full sealing crystallizer copper pipe flow plating equipment, adopts the mode of wiring conductive at the bottom of the anode main body, and avoids the problem of poor sealing property caused by movable wiring.

[0004] In order to achieve the above purpose, the following technical scheme is adopted: a full sealing crystallizer copper pipe flow plating equipment, comprising a support frame main body, a pressing mechanism, a liquid return tank body mechanism, an anode main body, a liquid inlet sealing base and a cathode wiring mechanism,

[0005] The liquid inlet sealing base comprises a copper pipe bottom sealing disc, a work station bottom plate and a base support plate,

[0006] The work station bottom plate is provided with a conductive liquid inlet pipe, the upper end of the conductive liquid inlet pipe is provided with a conductive plate, the bottom of the anode main body is assembled on the conductive plate, a plurality of through holes are arranged on the conductive plate in the circumferential direction, the position of the through hole is between the edge of the conductive plate and the anode main body, the work station bottom plate is arranged on the base support plate, and the liquid inlet pipe section of the conductive liquid inlet pipe is located below the base support plate,

[0007] The copper pipe bottom sealing disc is provided with a first liquid inlet, and the surface of the first liquid inlet is provided with a first sealing groove for arranging the lower end of the workpiece copper pipe, the copper pipe bottom sealing disc is installed on the work station bottom plate, and the conductive liquid inlet pipe and the first liquid inlet are concentric,

[0008] The liquid return tank mechanism comprises a tank main body, an upper sealing plate and a lower sealing plate, the tank main body is a sealed tank with an open bottom, the tank main body is provided with a liquid return pipe, the bottom of the tank main body is installed on the upper sealing plate, the upper sealing plate is installed on the lower sealing plate, wherein the upper sealing plate is provided with a butt joint adapted to the upper end of the anode main body, the lower sealing plate is provided with a second liquid passage, the outer edge of the lower surface of the second liquid passage is provided with a second sealing groove for accommodating the upper end of the workpiece copper pipe, the butt joint is concentric with the second liquid passage,

[0009] The liquid return tank mechanism is installed on the pressing mechanism, the pressing mechanism is installed on the support frame main body, the maximum stroke of the pressing mechanism makes the second sealing groove of the lower sealing plate sealingly butt joint with the upper end surface of the workpiece copper pipe, and ensures that the upper end of the anode main body is embedded in the butt joint of the upper sealing plate,

[0010] The cathode wiring mechanism is used for connecting with the outer wall of the workpiece copper pipe.

[0011] Further, a sealing ring is arranged between the conductive liquid inlet pipe and the work station bottom plate, an insulating spacer sleeve is arranged outside the pipe wall of the conductive liquid inlet pipe in contact with the base support plate, a flange joint is installed at the lower end of the conductive liquid inlet pipe, an anode wiring copper plate is arranged on the outer wall of the liquid inlet pipe section of the conductive liquid inlet pipe, the anode wiring copper plate is fixed by a group of thin nuts, and a butterfly spring is arranged between the end surface of the insulating spacer sleeve and the thin nuts.

[0012] Further, the material of the conductive liquid inlet pipe and the conductive plate is metal titanium, the conductive plate is installed on the upper end surface of the conductive liquid inlet pipe through titanium bolts, a positioning column for positioning the anode main body is arranged at the center of the conductive plate, and the material of the positioning column is metal titanium.

[0013] Further, a sealing ring is arranged between the copper pipe bottom sealing disc and the work station bottom plate.

[0014] Further, the base support plate is installed on a group of support square steels, and the liquid inlet pipe section of the conductive liquid inlet pipe is located between the two support square steels.

[0015] Further, the upper liquid inlet sealing base further comprises a group of disc pressing rods, two disc pressing rods are arranged on the copper pipe bottom sealing disc and connected with the base support plate through a screw rod to fix the copper pipe bottom sealing disc and the work station bottom plate.

[0016] Further, the cathode wiring mechanism comprises a wiring support frame, a first push rod cylinder and a cathode wiring copper plate, the first push rod cylinder is installed on the wiring support frame, the cathode wiring copper plate is installed on the telescopic rod of the first push rod cylinder, and the maximum stroke of the first push rod cylinder ensures that the cathode wiring copper plate is in contact with the outer wall of the workpiece copper pipe.

[0017] Further, the flow plating equipment further comprises a pressure head docking mechanism, the pressure head docking mechanism comprising a set of support sleeves, a telescopic arm and a second push rod cylinder, the set of support sleeves being fixedly installed on the support frame body, the telescopic arm being installed in the support sleeve, one end of the telescopic arm being connected with the pressing mechanism, the other end of the telescopic arm being provided with a fixed baffle, and the second push rod cylinder being arranged transversely, wherein the cylinder body tail end is connected with the support sleeve through a hinge structure, and the cylinder rod end is connected with the fixed baffle through a traction connecting rod, so as to ensure that the telescopic arm moves transversely when the second push rod cylinder acts.

[0018] The utility model has the advantages that: the utility model discloses a conductive wiring structure of the flow plating equipment, which is characterized by a liquid inlet sealing base, a copper pipe bottom sealing disc and a work station bottom plate, and the copper pipe bottom sealing disc and the work station bottom plate are used for supporting and sealing the bottom of the anode main body and the copper pipe of the workpiece respectively, and a pipe interface for conducting electricity and feeding plating liquid is arranged on the work station bottom plate, so that the anode main body is connected to electricity from the lower end, the phenomenon of liquid leakage and seepage caused by the existing structure of connecting to electricity from the upper end is avoided, the sealing property of the lower end is realized, the support groove form of the lower end in the prior art is avoided, and the plating liquid is prevented from contacting the outside world. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structural schematic view of the utility model;

[0020] Figure 2 It is a structural schematic view of the utility model; Figure 1 It is a schematic view of A-A direction;

[0021] Figure 3 It is a structural schematic view of the utility model; Figure 2 It is an enlarged view of the lower structure;

[0022] Figure 4 It is a schematic view of the copper pipe bottom sealing disc; Figure 2

[0023] Figure 5 It is a schematic view of the conductive liquid feeding pipe;

[0024] Figure 6 It is a top view of the conductive plate;

[0025] Figure 7 It is a structural schematic view of the utility model; Figure 2 It is a structural schematic view of the pressing mechanism and the liquid return tank body mechanism;

[0026] Figure 8 It is a structural schematic view of the liquid return tank body mechanism;

[0027] Figure 9 It is a structural schematic view of the pressure head docking mechanism

[0028] Figure 10 It is a schematic view of the anode main body.

[0029] ​As shown in the figure: 1. Support frame main body; 2. Pressing mechanism; 3. Return tank mechanism; 4. Anode main body; 5. Liquid inlet sealing base; 6. Cathode wiring mechanism; 7. Press head docking mechanism; 8. Conductive liquid inlet pipe; 9. Support square steel; 10. Chassis clamping rod; 11. Screw; 20. Third push rod cylinder; 21. Cylinder support seat; 22. Box connecting frame; 30. Box main body; 31. Upper sealing plate; 32. Lower sealing plate; 33. Return pipe; 50. Copper pipe bottom sealing plate; 51. Station base plate; 52. Base support plate; 60. Wiring support. Support frame; 61. First push rod cylinder; 62. Cathode wiring copper plate; 70. Support sleeve; 71. Telescopic arm; 72. Second push rod cylinder; 73. Fixed baffle; 74. Traction connecting rod; 80. Conductive plate; 81. Flange joint; 82. Insulating sleeve; 83. Anode wiring copper plate; 84. Thin nut; 85. Butterfly spring; 310. Connecting interface; 320. Second liquid inlet; 321. Second sealing groove; 500. First liquid inlet; 501. First sealing groove; 800. Positioning post; 801. Through hole; 900. Workpiece copper tube. Detailed Implementation

[0030] Example 1

[0031] The following description, in conjunction with the accompanying drawings, further illustrates the points, such as... Figures 1-2 The copper tube plating equipment shown includes a fully sealed crystallizer, comprising a support frame body 1, a pressing mechanism 2, a return tank mechanism 3, an anode body 4, a liquid inlet sealing base 5, a cathode wiring mechanism 6, and a pressure head docking mechanism 7.

[0032] like Figures 7-8 As shown, the return tank mechanism 3 includes a tank body 30, an upper sealing plate 31, and a lower sealing plate 32. The tank body 30 is a titanium-made sealed tank with an open bottom surface. A return pipe 33 is provided on the tank body 30. The upper sealing plate 31 is provided with a mating interface 310 adapted to the upper end of the anode body. The lower sealing plate 32 is provided with a second liquid inlet 320. A second sealing groove 321 is provided on the outer edge of the lower surface of the second liquid inlet 320 for placing the upper end of the workpiece copper tube 900. The mating interface 310 is concentric with the second liquid inlet 320. A sealing ring is provided on the second sealing groove 321. The bottom surface of the tank body 30 is mounted on the upper sealing plate 31, and the upper sealing plate 31 is mounted on the lower sealing plate 32. Both the upper sealing plate 31 and the lower sealing plate 32 are made of PVC material, and a sealing ring is provided between them.

[0033] The pressing mechanism 2 is implemented by a cylinder pressing structure. The pressing mechanism 2 includes a set of third push rod cylinders 20, cylinder support seat 21 and box connecting frame 22. The third push rod cylinder 20 is installed on the cylinder support seat 21, and the cylinder rod of the third push rod cylinder 20 is connected to the box connecting frame 22 through the cylinder floating joint.

[0034] likeFigure 10 As shown, the anode body 4 is a contoured anode used in existing technologies;

[0035] like Figures 3-5 As shown, the liquid inlet sealing base 5 includes a copper tube bottom sealing plate 50, a workstation base plate 51 and a base support plate 52. The copper tube bottom sealing plate 50 is provided with a first liquid inlet 500, and the outer edge of the surface of the first liquid inlet 500 is provided with a first sealing groove 501 for placing the lower end of the workpiece copper tube 900. The copper tube bottom sealing plate 50 and the workstation base plate 51 are made of PVC material.

[0036] The workstation base plate 51 is provided with a mounting groove adapted for installing the conductive liquid inlet pipe 8. The conductive liquid inlet pipe 8 is installed on the workstation base plate 51, and the two are sealed by a sealing ring.

[0037] The conductive inlet pipe 8 is made of titanium. A conductive plate 80, also made of titanium, is installed at the upper end of the conductive inlet pipe 8. The conductive plate 80 is mounted on the upper end face of the conductive inlet pipe 8 with titanium bolts. A positioning post 800, also made of titanium, is provided at the center of the conductive plate 80 for positioning the anode body 4. Several through holes 801 are provided along the circumference of the conductive plate 80. The through holes 801 are located between the edge of the conductive plate 80 and the anode body 4. A flange joint 81 is installed at the lower end of the conductive inlet pipe 8.

[0038] The bottom sealing plate 50 of the copper tube is installed on the workstation base plate 51 to ensure that the conductive liquid inlet pipe 8 is concentric with the first liquid inlet 500. A sealing ring is provided between the bottom sealing plate 50 of the copper tube and the workstation base plate 51. The workstation base plate 51 is set on the base support plate 52. The liquid inlet section of the conductive liquid inlet pipe 8 is located below the base support plate 52. An insulating sleeve 82 is provided on the outside of the pipe wall where the conductive liquid inlet pipe 8 contacts the base support plate 52. An anode wiring copper plate 83 is provided on the outer wall of the liquid inlet section of the conductive liquid inlet pipe 8. The anode wiring copper plate 83 is fixed by a set of thin nuts 84. A butterfly spring 85 is provided between the end face of the insulating sleeve 82 and the thin nut 83.

[0039] The cathode connection mechanism 6 includes a connection support frame 60, a first push rod cylinder 61, and a cathode connection copper plate 62. The first push rod cylinder 61 is mounted on the connection support frame 60, and the cathode connection copper plate 62 is mounted on the telescopic rod of the first push rod cylinder 61.

[0040] like Figure 9As shown, the pressure head docking mechanism 7 includes a set of support sleeves 70, a telescopic arm 71, and a second push rod cylinder 72. The set of support sleeves 70 is fixedly installed on the support frame body 1, the telescopic arm 71 is installed in the support sleeve 70, one end of the telescopic arm 71 is used to connect the pressing mechanism 2, the other end is provided with a fixed baffle 73, and the second push rod cylinder 72 is arranged transversely, wherein the cylinder body end is connected with the support sleeve 70 through a hinge structure, and the cylinder rod end is connected with the fixed baffle 73 through a traction connecting rod 74, so as to ensure that the telescopic arm 71 moves transversely when the second push rod cylinder 72 acts;

[0041] The embodiment is assembled: the assembly position of the liquid inlet sealing base 5 is determined, the base support plate 52 is installed on a set of support square steels 9, the liquid inlet pipe section of the conductive liquid inlet pipe 8 is located between two support square steels 9, a set of bottom disc pressing rods 10 is arranged on the copper pipe bottom sealing disc 50, the bottom disc pressing rods 10 are connected with the base support plate 52 through screw rods 11, the copper pipe bottom sealing disc 50 and the work position bottom plate 51 are fixed, the anode body 4 is assembled, the anode body 4 at the bottom is positioned and assembled on the conductive plate 80 through the positioning column 800, the workpiece copper pipe 900 is assembled, the lower end of the workpiece copper pipe 900 is assembled on the first sealing groove 501 on the edge of the first liquid passage 500 of the copper pipe bottom sealing disc 500 through a sealing washer,

[0042] The pressing mechanism 2 is assembled on the pressure head docking mechanism 7, and the liquid return tank mechanism 3 is assembled on the pressing mechanism 2. Specifically, the cylinder support seat 21 of the pressing mechanism 2 is connected with the telescopic arm 71 of the pressure head docking mechanism 7, the tank body 30 of the liquid return tank mechanism 3 is connected with the tank connecting frame 22 of the pressing mechanism 2, the maximum stroke of the telescopic arm 71 ensures that the pressing mechanism 2 drives the tank body 30 to move to the lower pressing position directly above the anode body 4, the maximum stroke of the third push rod cylinder 20 of the pressing mechanism 2 makes the second sealing groove 321 of the lower sealing plate 32 sealingly dock with the upper end surface of the workpiece copper pipe 900, and ensures that the upper end of the anode body 4 is embedded in the docking port 310 of the upper sealing plate 31, the cathode wiring mechanism 6 is assembled, the wiring support frame 60 is arranged, the assembly position of the wiring support frame 60 is determined, and the maximum stroke of the first push rod cylinder 61 ensures that the cathode wiring copper plate 62 contacts the outer wall of the workpiece copper pipe 900.

[0043] In working, the conductive liquid inlet pipe 8 and the liquid return pipe 33 are connected with a liquid storage tank, and through a connecting circulating pump, the plating solution enters from the conductive liquid inlet pipe 8, fills the plating solution cavity formed by the first liquid outlet 500, the through hole 801 on the conductive plate 80, the anode main body 4 and the inner wall of the copper pipe 900 of the workpiece, then enters the tank main body 30 through the second liquid outlet 320, and the plating solution returns to the liquid storage tank connected outside through the liquid return pipe 33, thereby forming a circulating plating solution loop. The anode connecting copper plate 83 and the cathode connecting copper plate 62 are connected with a power supply, thereby forming a complete current loop, so that the plating solution is fluid electroplated on the anode main body 4 and the copper pipe 900 of the workpiece, and is rapidly deposited under the action of a strong electric field.

[0044] The utility model is not limited to the embodiment, and any equivalent concept or change within the technical range disclosed in the utility model is included in the protection scope of the utility model.

Claims

1. A fully sealed crystallizer copper tube plating apparatus, comprising a support frame body (1), a pressing mechanism (2), a return tank mechanism (3), an anode body (4), a liquid inlet sealing base (5), and a cathode wiring mechanism (6), characterized in that, The liquid inlet sealing base (5) includes a copper pipe bottom sealing disc (50), a workstation base plate (51), and a base support plate (52). A conductive liquid inlet pipe (8) is provided on the base plate (51). A conductive plate (80) is installed at the upper end of the conductive liquid inlet pipe (8). The bottom of the anode body (4) is assembled on the conductive plate (80). Several through holes (801) are provided on the conductive plate (80) along the circumferential direction. The through holes (801) are located between the edge of the conductive plate (80) and the anode body (4). The base plate (51) is set on the base support plate (52). The liquid inlet pipe section of the conductive liquid inlet pipe (8) is located below the base support plate (52). The bottom sealing plate (50) of the copper tube is provided with a first liquid inlet (500), and the outer edge of the surface of the first liquid inlet (500) is provided with a first sealing groove (501) for placing the lower end of the workpiece copper tube (900). The bottom sealing plate (50) of the copper tube is installed on the station base plate (51) to ensure that the conductive liquid inlet pipe (8) is concentric with the first liquid inlet (500). The return tank mechanism (3) includes a main body (30), an upper sealing plate (31), and a lower sealing plate (32). The main body (30) is a sealed tank with an open bottom surface. A return pipe (33) is provided on the main body (30). The bottom surface of the main body (30) is mounted on the upper sealing plate (31), and the upper sealing plate (31) is mounted on the lower sealing plate (32). The upper sealing plate (31) is provided with a mating interface (310) adapted to the upper end of the anode body (4). The lower sealing plate (32) is provided with a second liquid inlet (320). The lower surface of the second liquid inlet (320) has a second sealing groove (321) on its outer edge for placing the upper end of the workpiece copper tube (900). The mating interface (310) and the second liquid inlet (320) are concentric. The return tank mechanism (3) is installed on the pressing mechanism (2), which is installed on the support frame body (1). The pressing mechanism (2) descends to its maximum stroke so that the second sealing groove (321) of the lower sealing plate (32) is sealed and connected with the upper end face of the workpiece copper tube (900), and ensures that the upper end of the anode body (4) is embedded in the interface (310) of the upper sealing plate (31). The cathode wiring mechanism (6) is used to connect with the outer wall of the workpiece copper tube (900).

2. The fully sealed crystallizer copper tube plating equipment according to claim 1, characterized in that, A sealing ring is provided between the conductive liquid inlet pipe (8) and the workstation base plate (51). An insulating sleeve (82) is provided on the outside of the pipe wall where the conductive liquid inlet pipe (8) contacts the base support plate (52). A flange joint (81) is installed at the lower end of the conductive liquid inlet pipe (8). An anode wiring copper plate (83) is provided on the outer wall of the liquid inlet section of the conductive liquid inlet pipe (8). The anode wiring copper plate (83) is fixed by a set of thin nuts (84). A butterfly spring (85) is provided between the end face of the insulating sleeve (82) and the thin nut (84).

3. The fully sealed crystallizer copper tube plating equipment according to claim 2, characterized in that, The conductive liquid inlet pipe (8) and the conductive plate (80) are both made of titanium. The conductive plate (80) is installed on the upper end face of the conductive liquid inlet pipe (8) by titanium bolts. The conductive plate (80) has a positioning post (800) at the center for positioning the anode body (4). The positioning post (800) is made of titanium.

4. The fully sealed crystallizer copper tube plating equipment according to claim 3, characterized in that, A sealing ring is provided between the bottom sealing disc (50) of the copper tube and the workstation base plate (51).

5. The fully sealed crystallizer copper tube plating equipment according to claim 4, characterized in that, The base support plate (52) is installed on a set of support square steel (9), and the liquid inlet section of the conductive liquid inlet pipe (8) is located between two support square steel (9).

6. The fully sealed crystallizer copper tube plating equipment according to claim 5, characterized in that, The liquid inlet sealing base (5) also includes a set of chassis clamping rods (10). The two chassis clamping rods (10) are placed on the bottom sealing plate (50) of the copper tube and connected to the base support plate (52) by screws to fix the bottom sealing plate (50) of the copper tube and the station base plate (51).

7. The fully sealed crystallizer copper tube plating equipment according to claim 5, characterized in that, The cathode wiring mechanism (6) includes a wiring support frame (60), a first push rod cylinder (61), and a cathode wiring copper plate (62). The first push rod cylinder (61) is mounted on the wiring support frame (60), and the cathode wiring copper plate (62) is mounted on the telescopic rod of the first push rod cylinder (61). The maximum stroke of the first push rod cylinder (61) ensures that the cathode wiring copper plate (62) contacts the outer wall of the workpiece copper tube (900).

8. The fully sealed crystallizer copper tube plating equipment according to any one of claims 1-7, characterized in that, It also includes a pressure head docking mechanism (7), which includes a set of support sleeves (70), a telescopic arm (71) and a second push rod cylinder (72). The set of support sleeves (70) is fixedly installed on the support frame body (1), and the telescopic arm (71) is installed inside the support sleeves (70). One end of the telescopic arm (71) is connected to the pressing mechanism (2), and the other end is provided with a fixed baffle (73). The second push rod cylinder (72) is arranged laterally, wherein the end of the cylinder body is connected to the support sleeve (70) through a hinge structure, and the cylinder rod end is connected to the fixed baffle (73) through a traction connecting rod (74) to ensure that when the second push rod cylinder (72) is activated, it drives the telescopic arm (71) to move laterally.

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