Blowing temperature control device and chip testing machine
By employing an air-blowing temperature control device in a three-temperature sorter, and utilizing a combination of downblowing and sideblowing channels, efficient temperature control of the chips is achieved, solving the problem of low temperature control efficiency in existing technologies and improving chip testing efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-07
- Publication Date
- 2026-03-20
AI Technical Summary
Existing three-temperature sorting machines use a Pogo pin to contact chip pins for heat transfer and temperature control, which is inefficient, especially for SOT packaged chips where heat transfer efficiency is insufficient, resulting in inadequate temperature control capabilities.
A blowing temperature control device is adopted, which sets up a downward blowing channel and a side blowing channel through the support base on the substrate and the blowing element. The airflow simultaneously conducts heat through the test probe and directly contacts the chip surface to transfer heat, increasing the heat exchange path.
It improves temperature control and heat exchange efficiency, shortens temperature control time, and enhances chip testing efficiency.
Smart Images
Figure CN224019849U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor testing, in particular to a blowing temperature control device and a chip testing machine. BACKGROUND
[0002] A three-temperature sorting machine is a device capable of testing and sorting chips at different temperatures. A three-temperature sorting machine currently available on the market controls the temperature of a chip by high-temperature or low-temperature airflow. It includes a SOCKET (test seat) for carrying a chip during testing. By passing high-temperature or low-temperature gas into the blowing channel in the SOCKET, the high-temperature or low-temperature gas is in contact with the chip pins through the Pogo pin structure to exchange heat, so as to control the temperature of the chip to meet the test temperature requirement.
[0003] However, the heat exchange path of the Pogo pin and the chip pin contact heat transfer control mode in the prior art is single and the heat transfer efficiency is low, resulting in long temperature control time and low temperature control efficiency. Especially for SOT packaged chips, which have non-insertion pins, the heat conduction efficiency is low due to the special packaging and pin structure of such chips, which makes the temperature control capacity of the device insufficient for such chips.
[0004] Therefore, it is necessary to provide a new technical scheme to overcome the shortcomings of the prior art. CONTENT OF THE INVENTION
[0005] Therefore, the present application provides a blowing temperature control device and a chip testing machine, which can improve the heat exchange efficiency, shorten the temperature control time, and improve the chip testing efficiency.
[0006] To this end, the present application adopts the following technical scheme: a blowing temperature control device for controlling the temperature of a chip for testing, comprising:
[0007] a substrate;
[0008] a support seat provided on the substrate, the support seat being provided with a test probe, the support seat being provided with a chip placement area for supporting a chip and a heat conduction channel inside the support seat, the test probe being connected to the chip placement area and extending into the heat conduction channel;
[0009] a blowing element provided on the substrate, the blowing element being located above the support seat, the blowing element having a through hole in communication with the chip placement area, the blowing element being provided with a downward blowing channel, a side blowing channel and an exhaust channel inside the blowing element;
[0010] The lower blowing channel and the exhaust channel are communicated with two ends of the heat conduction channel to provide air flow to contact and transfer heat to the test probe, and the side blowing channel is communicated with the inner wall of the through hole to blow air to the chip in the chip placement area.
[0011] In some embodiments, the side blowing channel comprises a gas guide section and a gas outlet section arranged in intersection, and the gas outlet section is arranged in downward inclination in the flow direction of the air flow.
[0012] In some embodiments, the side blowing channel comprises at least two side blowing channels, and the at least two side blowing channels blow air to the chip placement area from the inner walls of the opposite sides of the through hole.
[0013] In some embodiments, the air blowing element has an air inlet, and the at least two side blowing channels and the lower blowing channel are communicated to the same air inlet.
[0014] In some embodiments, the chip placement area comprises a main body placement part for placing the main body of the chip and a pin placement part for placing the pins of the chip, and the pin placement part is located on both sides of the main body placement part.
[0015] In some embodiments, the line connecting the two sides where the gas outlet of the side blowing channel is located is perpendicular to the line connecting the two sides where the pin placement part is located.
[0016] In some embodiments, the main body placement part and / or the pin placement part is a boss.
[0017] In some embodiments, the substrate has opposite top and bottom surfaces, the air blowing element is mounted on the top surface of the substrate, the supporting seat is mounted on the bottom surface of the substrate, the substrate has a through hole penetrating the top and bottom surfaces, and the air blowing element is provided with an air inlet column and an air outlet column communicated with the heat conduction channel through the through hole.
[0018] In some embodiments, the top surface of the substrate is provided with a receiving groove, the air blowing element is mounted in the receiving groove, and the receiving groove comprises an exhaust avoiding groove corresponding to the outlet of the exhaust channel.
[0019] The application also adopts the following technical scheme: a chip testing machine comprising a test pressure head device and an air blowing temperature control device as described above, the test pressure head device comprising a pickup head, the pickup head picks up the chip to be tested in the chip placement area, and the pickup head is arranged such that the pins of the chip and at least part of the side surface of the main body of the chip are exposed outside the pickup head.
[0020] The air blowing temperature control device comprises a base plate, a supporting seat and an air blowing element. The supporting seat is provided with a heat conduction channel through which air flows to transfer heat to the test probe in the supporting seat. The air blowing element comprises a lower blowing channel for delivering air to the heat conduction channel and a side blowing channel for directly blowing air to the chip placement area, so that the air flow can realize heat conduction through the test probe and direct contact with the surface of the chip placed in the chip placement area. The heat exchange path between the air flow and the chip is increased, the temperature control and heat exchange efficiency during chip testing is improved, the heating or cooling time is shortened, and the chip testing efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0022] Figure 1 It is a perspective assembly view of an embodiment of the air blowing temperature control device and the test head device of the present application.
[0023] Figure 2 It is an exploded perspective view of an embodiment of the air blowing temperature control device and the test head device of the present application.
[0024] Figure 3 It is a perspective view of the air blowing element in an embodiment of the air blowing temperature control device of the present application.
[0025] Figure 4 It is a perspective view of the air blowing element in another view in an embodiment of the air blowing temperature control device of the present application.
[0026] Figure 5 It is a partial sectional view of an embodiment of the air blowing temperature control device of the present application.
[0027] Figure 6 It is another sectional view of an embodiment of the air blowing temperature control device of the present application.
[0028] Figure 7 It is still another sectional view of an embodiment of the air blowing temperature control device of the present application.
[0029] Figure 8 It is a perspective view of the supporting seat and the chip in an embodiment of the air blowing temperature control device of the present application.
[0030] Figure 9 It is a perspective assembly view of an embodiment of the air blowing temperature control device of the present application.
[0031] Figure 10 It is a sectional view of an embodiment of the air blowing temperature control device and the test head device of the present application.
[0032] The elements are as follows: 1, substrate; 11, accommodating groove; 111, exhaust avoiding groove; 112, opening; 113, perforation; 2, air inlet block; 3, air blowing element; 301, lower blowing channel; 302, side blowing channel; 3021, air guiding section; 3022, air outlet section; 303, exhaust channel; 31, through hole; 32, air inlet; 33, side air outlet; 34, exhaust outlet; 351, air inlet column; 352, air outlet column; 4, supporting seat; 401, heat conducting channel; 41, chip placement area; 411, main body placement part; 412, pin placement part; 42, test probe; 5, test pressure head device; 51, pick-up head; 511, limiting shielding part; 6, chip; 61, main body part; 62, pin. DETAILED DESCRIPTION
[0033] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application can be practiced without using some or all of these specific details. In other instances, well-known process steps have not been described in detail in order to avoid obscuring the present application.
[0034] It should be noted that when an element is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements can also be present. In addition, the term "connected" can refer to physical or logical connections, and can also mean that two elements are capable of being connected together. The term "vertical", "horizontal", "up", "down", "left", "right", and the like as used in the description of the present application are only for the purpose of illustration and are not intended to limit the present application.
[0035] In addition, the terms "first", "second", etc. are used herein only to describe various elements, and are not intended to imply relative importance or a number of the indicated elements. Thus, a feature with a "first" and "second" designation can include at least one of the features, explicitly or implicitly. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.
[0036] In the present application, unless otherwise explicitly specified and limited, the first feature is "on", "under" the second feature, which can be that the first feature is in direct contact with the second feature, or the first feature is indirectly in contact with the second feature through an intermediate medium. Moreover, the first feature is "above", "over" and "on" the second feature, which can be that the first feature is directly above or obliquely above the second feature, or only means that the first feature is higher than the second feature in horizontal height. The first feature is "under", "below" and "under" the second feature, which can be that the first feature is directly below or obliquely below the second feature, or only means that the first feature is lower than the second feature in horizontal height.
[0037] Unless otherwise defined, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the specification of the present application includes any and all combinations of one or more related listed items.
[0038] Please refer to Figures 1 to 8 As shown in the drawings, the present application provides a blowing temperature control device for temperature control test of a chip 6. The blowing temperature control device comprises a substrate 1, a supporting seat 4 arranged on the substrate 1, and a blowing element 3 arranged on the substrate 1. The supporting seat 4 is provided with a test probe 42, a chip placement area 41 for supporting the chip 6, and a heat conduction channel 401 arranged in the inside thereof. The test probe 42 is connected to the chip placement area 41 and extends into the heat conduction channel 401. The blowing element 3 is located above the supporting seat 4. The blowing element 3 has a through hole 31 communicating with the chip placement area 41. The inside of the blowing element 3 is provided with a downward blowing channel 301, a side blowing channel 302, and an exhaust channel 303. The downward blowing channel 301 and the exhaust channel 303 are communicated with both ends of the heat conduction channel 401 to provide airflow in contact with the test probe 42 for heat conduction. The side blowing channel 302 is communicated to the inner wall of the through hole 31 to blow air to the chip 6 in the chip placement area 41 for heat conduction.
[0039] In the blowing temperature control device provided by the present application, the downward blowing channel 301 of the blowing element 3 delivers airflow to the heat conduction channel in the inside of the supporting seat 4 for heat conduction through the test probe 42. The side blowing channel 302 of the blowing element 3 directly blows air to the chip placed in the chip placement area 41 for heat conduction, thereby increasing the heat exchange path of the airflow and the chip, strengthening the temperature control heat exchange efficiency during chip test, shortening the heating or cooling time, and improving the chip test efficiency.
[0040] Please refer to Figure 1 and Figure 2As shown, in the present embodiment, multiple blowing elements 3 and supporting seats 4 can be placed on the substrate 1 simultaneously, the multiple blowing elements 3 are arranged in an array on the substrate 1, and the multiple supporting seats 4 are arranged one-to-one with the multiple blowing elements 3. During the testing process, multiple chips 6 can be sucked by the multiple testing head devices 5 for synchronous testing, thereby improving the testing efficiency. In the present embodiment, eight blowing elements 3 are assembled on the substrate 1, and the eight blowing elements are arranged in two rows and four columns. The blowing temperature control device further comprises air inlet blocks 2 assembled on the substrate 1, each air inlet block 2 is connected with multiple blowing elements 3 to simultaneously supply air to the multiple blowing elements 3. In the present embodiment, there are two air inlet blocks 2, and one air inlet block 2 supplies air to four blowing elements 3 in the same row.
[0041] The substrate 1 is plate-shaped and has opposite top and bottom surfaces, the blowing elements 3 are mounted on the top surface of the substrate 1, and the supporting seats 4 are mounted on the bottom surface of the substrate 1. The substrate 1 has openings 112 and through holes 113 penetrating through the top and bottom surfaces. The openings 112 are used to expose the supporting seats 4 mounted on the bottom surface of the substrate 1, so that the testing head devices 5 take and place the chips on the supporting seats 4 above the substrate 1. The through holes 113 are two and are located on opposite sides of the openings 112, and the two through holes 113 are respectively used for the air inlet column 351 and the air outlet column 352 arranged on the blowing element 3 to pass through, so that the air inlet column 351 and the air outlet column 352 are in communication with the heat conduction channel 401 in the supporting seat 4. The top surface of the substrate 1 is provided with a receiving groove 11, the blowing element 3 is mounted in the receiving groove 11, and the receiving groove 11 comprises an exhaust avoiding groove 111 arranged corresponding to the outlet of the exhaust channel 303. In the present embodiment, the receiving groove 11 is substantially rectangular, and the exhaust avoiding groove 111 is arranged at two corners of the rectangle.
[0042] Please refer to Figures 3 to 5 As shown, the blowing element 3 has a through hole 31 penetrating through the top and bottom surfaces, and when the blowing element 3 is assembled in the receiving groove 11 on the substrate 1, the through hole 31 is in communication with the opening 112 of the substrate 1. The blowing element 3 is internally provided with a lower blowing channel 301, a side blowing channel 302, and an exhaust channel 303. The top surface of the blowing element 3 is provided with an air inlet 32 in communication with the lower blowing channel 301 and the side blowing channel 302. The outlet of the side blowing channel 302, i.e., the side air outlet 33 is arranged on the opposite inner wall surfaces of the through hole 31. The bottom surface of the blowing element 3 is provided with an air inlet column 351 and an air outlet column 352, both of which are hollow columns. The upper end of the air inlet column 351 is in communication with the lower blowing channel 301, and the lower end is used to abut and communicate with one end of the heat conduction channel 401 in the supporting seat 4; the upper end of the air outlet column 352 is in communication with the exhaust channel 303, and the lower end is used to abut and communicate with the other end of the heat conduction channel 401 in the supporting seat 4. The outlet of the exhaust channel 303, i.e., the exhaust port 34 is arranged on the side surface of the blowing element 3, corresponding to the exhaust avoiding groove 111 on the substrate 1.
[0043] Referring to Figure 5 and Figure 6 Further, the side blowing passages 302 are at least two, and the at least two side blowing passages 302 blow air to the chip placement area 41 from the inner walls of the through holes 31 on opposite sides of the chip placement area 41. Each side blowing passage 302 includes an air guiding section 3021 and an air outlet section 3022 arranged in intersection, and the air outlet section 3022 is arranged in downward inclination in the flow direction of the air flow. Since the side air outlet 33 is arranged in the inner wall of the through hole 31 of the air blowing element 3, which is located obliquely above the chip 6, the air flow can be directly blown to the surface of the chip 6 by arranging the air outlet section 3022 in inclination, so that the heat exchange can be enhanced. In the embodiment, the at least two side blowing passages 302 are communicated to the same air inlet 32 with the lower blowing passage 301, and the air flow delivered from the air inlet block 2 is divided into three streams after entering the air blowing element 3 from the air inlet 32, and then blown to the lower blowing passage 301 and the two side blowing passages 302 respectively. By arranging multiple passages to connect to the same air inlet 32, the number of air inlets 32 can be reduced, and the workload of sealing connection during assembly can be reduced.
[0044] Referring to Figures 6 to 8 The supporting seat 4 is generally square, and the middle part of the supporting seat 4 is provided with a chip placement area 41. In the embodiment, the chip placement area 41 is a groove, and when the supporting seat 4 is assembled to the bottom surface of the base plate 1, the chip placement area 41 is exposed in the opening 112 of the base plate 1 and the through hole 31 of the air blowing element 3. Among them, the through hole 31, the opening 112 and the chip placement area 41 jointly constitute a test area, and the pickup head 51 of the test pressure head device 5 can extend into the test area to pick and place the chip 6.
[0045] In the embodiment, the chip 6 is a patch chip, which includes a main body part 61 and pins 62 extending from both sides of the main body part 61. The chip placement area 41 includes a main body placement part 411 for placing the main body part 61 of the chip 6 and pin placement parts 412 for placing the pins 62 of the chip 6, and the pin placement parts 412 are located on both sides of the main body placement part 411. In the embodiment, the main body placement part 411 and the pin placement parts 412 are both bosses. The main body placement part 411 supports the main body part 61 and prevents the main body part 61 from being suspended so that the deformation of the pins 62 is caused when the chip 6 is pressed. The pin placement parts 412 support the pins 62, and the pin placement parts 412 are provided with through holes for the test probes 42 to pass through and contact the pins 62. The upper ends of the test probes 42 contact the pins 62, and the lower ends of the test probes 42 extend through the heat-conducting channel 401 and are connected to the circuit board. The airflow flowing through the heat-conducting channel 401 can contact and transfer heat to the part of the test probes 42 exposed in the heat-conducting channel 401 and then to the pins 62 of the chip 6 through the test probes 42. In the embodiment, the pins 62 of the chip 6 include two pins on one side and one pin on the other side; of course, in other embodiments, the distribution and number of the pins of the chip 6 are not limited to this. In addition, it should be noted that the air blowing temperature control device provided by the present application not only has a good temperature control effect on patch packaging such as SOT (Small Outline Transistor) packaging, but also has a temperature control effect on DIP (Dual In-line Package) packaging and other types of packaging chips.
[0046] Please refer to Figure 5 、 Figure 9 and Figure 10 In the embodiment, the line L1 on both sides of the air outlet of the side blowing channel 302 is perpendicular to the line L2 on both sides of the pin placement part 412. In other words, the side on which the air outlet of the side blowing channel 302 is located is perpendicular to the side on which the pin placement part 412 is located. For example, the view angle shown in Figure 5 The side on which the air outlet of the side blowing channel 302 is located is the left and right side in the view shown in Figure 5 , and the side on which the pin placement part 412 is located is the upper and lower side in the view shown in Figure 5 . Please refer to Figure 10 In the embodiment, when the pickup head 51 of the test pressure head device 5 picks up the chip 6, the limiting and shielding part 511 is formed on both sides of the pickup head 51 where the pins 62 are located, so as to ensure accurate and reliable pickup of the chip 6; by arranging the air outlet of the side blowing channel 302 on the side perpendicular to the side on which the pins 62 are located, the limiting and shielding part 511 on the pickup head 51 is avoided, so that the airflow can contact the surface of the chip 6 which is not shielded, and the airflow flows as shown in Figure 10As shown by the arrows, such arrangement helps to strengthen heat exchange and improve temperature control effect.
[0047] Please refer to Figures 5 to 7 As shown, when the air blowing temperature control device provided by the present application is used to blow air to control the temperature of the chip 6, the airflow delivered by the air inlet block 2 enters the air blowing element 3 from the air inlet 32 of the air blowing element 3 and is divided into three streams, which are blown into the lower blowing channel 301 and the two side blowing channels 302, respectively. The airflow in the lower blowing channel 301 enters the heat conduction channel 401 through the air inlet column 351, the airflow in the heat conduction channel 401 conducts heat to the test probe 42, and the airflow flows to the exhaust channel 303 through the air outlet column 352 and is discharged from the air outlet 34. The airflow in the side blowing channel 302 enters the air outlet section 3022 after passing through the air guide section 3021, and is discharged obliquely downward in the air outlet section 3022 to blow against the chip 6 in the test area to directly contact and conduct heat to the exposed part of the chip 6, and then escapes from above the test area.
[0048] The present application also provides a chip testing machine, which comprises a test pressure head device 5 and the air blowing temperature control device as above. The test pressure head device 5 comprises a pickup head 51, which picks up the chip 6 to be tested and mounted on the chip placement area 41. The pickup head 51 is arranged such that the pins 62 of the chip 6 and at least part of the side surface of the main body part 61 of the chip 6 are exposed outside the pickup head 51, so that the air blown by the side blowing channel 302 can directly contact the pins 62 of the chip 6 and the part of the side surface of the main body part of the chip 6, thereby improving the heat transfer and temperature control effect. It can be understood that the chip testing machine, as a set of equipment that can realize the complete operation process of feeding, testing and collecting, also comprises feeding conveying devices, discharging conveying devices and other components. The chip testing machine provided by the present application also comprises other components which can be implemented according to the prior art, and will not be described here.
[0049] As can be known from the above description of the specific embodiments, the air blowing temperature control device provided by the present application comprises a substrate 1, a supporting seat 4 and an air blowing element 3, the supporting seat 4 is provided with a heat conduction channel 401 through which the airflow can flow to conduct heat to the test probe 42 inside, and the air blowing element 3 comprises a lower blowing channel 301 for delivering airflow to the heat conduction channel 401 and a side blowing channel 302 for directly blowing air to the chip placement area 41, so that the airflow can simultaneously realize heat conduction through the test probe 42 and direct contact with the surface of the chip 6 placed in the chip placement area 41 to conduct heat, thereby increasing the heat exchange path of the airflow and the chip 6, strengthening the temperature control and heat exchange efficiency during the test of the chip 6, shortening the heating or cooling time, and improving the test efficiency of the chip 6.
[0050] The technical features of the above embodiments can be combined in any way, and in order to make the description concise, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.
[0051] The above-described embodiments are merely illustrative of several embodiments of the present application, which are described in more detail and in a more specific and detailed manner, but should not be construed as limiting the scope of the patent application. It should be noted that, for those of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.
Claims
1. A blowing temperature control device for temperature control testing of a chip (6), characterized in that, The air blowing temperature control device includes: base(1); A support (4) is provided on the substrate (1), and a test probe (42) is provided in the support (4). The support (4) has a chip placement area (41) for supporting the chip (6) and a heat conduction channel (401) provided therein. The test probe (42) is connected to the chip placement area (41) and extends into the heat conduction channel (401). An air blowing element (3) is provided on the substrate (1), the air blowing element (3) is located above the support (4), the air blowing element (3) has a through hole (31) communicating with the chip placement area (41), and the air blowing element (3) is provided with a down blowing channel (301), a side blowing channel (302) and an exhaust channel (303) inside; The downblowing channel (301) and the exhaust channel (303) are connected to both ends of the heat conduction channel (401) to provide airflow to contact the test probe (42) for heat transfer. The sideblowing channel (302) is connected to the inner wall of the through hole (31) to blow air to the chip (6) in the chip placement area (41) for heat transfer.
2. The air blowing temperature control device according to claim 1, characterized in that, The side-blowing channel (302) includes an intersecting air guide section (3021) and an air outlet section (3022), wherein the air outlet section (3022) is inclined downward in the direction of airflow.
3. The air blowing temperature control device according to claim 1 or 2, characterized in that, There are at least two side-blowing channels (302), and at least two side-blowing channels (302) blow air onto the chip placement area (41) from the inner walls on both sides opposite to the through hole (31).
4. The air blowing temperature control device according to claim 3, characterized in that, The blowing element (3) has an air inlet (32), and at least two of the side blowing channels (302) are connected to the same air inlet (32) along with the down blowing channel (301).
5. The air blowing temperature control device according to claim 3, characterized in that, The chip placement area (41) includes a main body placement area (411) for placing the main body (61) of the chip (6) and a pin placement area (412) for placing the pins (62) of the chip (6), and the pin placement area (412) is located on both sides of the main body placement area (411).
6. The air blowing temperature control device as described in claim 5, characterized in that, The line connecting the two sides of the air outlet of the side blowing channel (302) is perpendicular to the line connecting the two sides of the pin placement part (412).
7. The air blowing temperature control device as described in claim 5, characterized in that, The main body placement portion (411) and / or the pin placement portion (412) are bosses.
8. The air blowing temperature control device according to claim 1, characterized in that, The substrate (1) has a top surface and a bottom surface opposite to each other. The air blowing element (3) is mounted on the top surface of the substrate (1), and the support (4) is mounted on the bottom surface of the substrate (1). The substrate (1) has a through hole that penetrates the top surface and the bottom surface. The air blowing element (3) is provided with an air inlet column (351) and an air outlet column (352) that pass through the through hole and communicate with the heat conduction channel (401).
9. The air blowing temperature control device according to claim 5, characterized in that, The top surface of the substrate (1) is provided with a receiving groove (11), and the blowing element (3) is installed in the receiving groove (11). The receiving groove (11) includes an exhaust clearance groove (111) provided corresponding to the outlet of the exhaust channel (303).
10. A chip testing machine, characterized in that, The device includes a test head assembly (5) and a blowing temperature control device as described in any one of claims 1 to 9. The test head assembly (5) includes a pickup head (51) that picks up the chip (6) and presses it into the chip placement area (41) for testing. The pickup head (51) is configured such that at least a portion of the pins (62) of the chip (6) and the sides of the main body (61) of the chip (6) are exposed.