High-temperature chip test data acquisition device

Abstract

The utility model provides a high-temperature chip test data acquisition device, which relates to the technical field of chip data acquisition devices and comprises an acquisition device main body, a heater fixedly mounted at the bottom of the inner wall of the acquisition device main body, and a chip placement plate fixedly mounted on the inner surface wall of the acquisition device main body. Two moving grooves are formed in the inner surface wall of the collecting device main body, positive and negative motors are fixedly mounted at the bottoms of the inner walls of the two moving grooves, and threaded rods are fixedly mounted at the tops of the two positive and negative motors. According to the static electricity collecting device, the two positive and negative motors are started through the controller, and under the action of the two moving grooves, the two moving blocks are driven to move in the two threaded rods and the two moving grooves, so that the two connecting blocks and the two static electricity eliminating rods are driven to move up and down in the collecting device main body, and static electricity in the collecting device main body is neutralized; therefore, the accuracy of the acquisition device for subsequently acquiring the test data of the high-temperature chip is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip data acquisition device technical field especially relates to a high temperature chip test data acquisition device. BACKGROUND

[0002] High temperature chip refers to the integrated circuit (IC) that can work normally and stably in high temperature environment, and such chips usually adopt special materials and design to adapt to the needs of high temperature, high pressure or harsh environment (such as aerospace, automobile, industrial control, etc.), and its high temperature chip test data acquisition device is a kind of equipment for testing and data collection to the performance of electronic chip in high temperature environment, and such device is usually used in semiconductor industry, material science and electronic engineering field to ensure the reliability and stability of chip under extreme temperature conditions.

[0003] In prior art, high temperature chip test data acquisition device in use, due to the internal components of the equipment work in high temperature environment, and the flow of electronic current can produce static electricity phenomenon, thereby reducing the accuracy of the subsequent acquisition device to high temperature chip test data acquisition. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the problem that the internal components of the equipment work in high temperature environment, and the flow of electronic current can produce static electricity phenomenon in prior art, and provides a kind of high temperature chip test data acquisition device.

[0005] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme: a kind of high temperature chip test data acquisition device, including acquisition device main part, the inner wall bottom of acquisition device main part is fixedly installed with heater, the inner surface wall of acquisition device main part is fixedly installed with chip placement plate, two movement grooves are set in the inner surface wall of acquisition device main part, the inner wall bottom of two movement grooves is fixedly installed with positive and negative motor, the top of two positive and negative motors is fixedly installed with threaded rod, the outer surface wall of two threaded rods is fixedly connected with moving block, and two moving blocks are L-shaped, the top of two moving blocks is placed with connecting block, and the outer wall side of two connecting blocks is fixedly installed with static electricity elimination stick.

[0006] Preferably, the top of the chip placement plate is fixedly installed with a temperature sensor, and the inner surface wall of the acquisition device main body is fixedly installed with a layer plate.

[0007] Preferably, the top of the layer plate is fixedly installed with a current sensor, and the top of the layer plate is fixedly installed with a voltage sensor.

[0008] Preferably, the outer wall side of the acquisition device main body is fixedly installed with a controller, and the top of the two moving blocks is fixedly installed with two positioning columns.

[0009] Preferably, the top of each of the two moving blocks is provided with a through hole.

[0010] Preferably, the top of each of the two connecting blocks is provided with two positioning holes, and the outer wall of each of the four positioning columns is movably inserted into the interior of each of the four positioning holes.

[0011] Preferably, the bottom of each of the two connecting blocks is provided with a fixing hole, the inner wall of each of the two fixing holes is threadedly connected with a bolt, and the outer wall of each of the two bolts is movably inserted into the interior of each of the two through holes.

[0012] Compared with the prior art, the high temperature chip test data acquisition device has the advantages and positive effects that,

[0013] 1. In the high temperature chip test data acquisition device, the two positive and negative motors are started by the controller, and under the action of the two moving grooves, the two moving blocks are moved in the two threaded rods and the two moving grooves, so as to drive the two connecting blocks and the two static elimination rods to move up and down in the main body of the acquisition device, and neutralize the static electricity in the main body of the acquisition device, thereby improving the accuracy of subsequent test data acquisition of the acquisition device on the high temperature chip.

[0014] 2. In the high temperature chip test data acquisition device, the two connecting blocks are placed on the corresponding positions of the two moving blocks by the action of the four positioning columns and the four positioning holes, and the two through holes and the two fixing holes are corresponded, and then the two bolts pass through the two through holes and are threadedly connected in the interior of the two fixing holes, so that the two static elimination rods and the two connecting blocks are installed on the two moving blocks, and the two static elimination rods and the two connecting blocks are convenient to disassemble, replace or maintain, and the static effect is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A perspective view of the high temperature chip test data acquisition device is provided for the utility model;

[0016] Figure 2 A front view of the high temperature chip test data acquisition device is provided for the utility model;

[0017] Figure 3 A partially exploded view of the high temperature chip test data acquisition device is provided for the utility model;

[0018] Figure 4 A partial bottom view of the high temperature chip test data acquisition device is provided for the utility model.

[0019] LEGEND:

[0020] 1. Main body of the data acquisition device; 2. Heater; 3. Chip placement board; 4. Moving slot; 5. Forward and reverse motor; 6. Threaded rod; 7. Moving block; 8. Connecting block; 9. Static eliminator; 10. Temperature sensor; 11. Sheet; 12. Current sensor; 13. Voltage sensor; 14. Controller; 15. Positioning post; 16. Through hole; 17. Positioning hole; 18. Fixing hole; 19. Bolt. Detailed Implementation

[0021] To better understand the above-mentioned objectives, features and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0022] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0023] Example 1: As Figures 1-4 As shown, this utility model provides a high-temperature chip testing data acquisition device, including an acquisition device body 1. A heater 2 is fixedly installed on the bottom of the inner wall of the acquisition device body 1. A chip placement plate 3 is fixedly installed on the inner surface wall of the acquisition device body 1. Two moving grooves 4 are opened on the inner surface wall of the acquisition device body 1. A forward and reverse motor 5 is fixedly installed on the bottom of the inner wall of each of the two moving grooves 4. A threaded rod 6 is fixedly installed on the top of each of the two forward and reverse motors 5. Moving blocks 7 are threadedly connected to the outer surface walls of each of the two threaded rods 6. Both moving blocks 7 are L-shaped. A connecting block 8 is placed on the top of each of the two moving blocks 7. An electrostatic eliminator 9 is fixedly installed on one side of the outer wall of each of the two connecting blocks 8.

[0024] The overall effect of Embodiment 1 is as follows: the chip to be tested is placed on the chip placement board 3. The controller 14 is electrically connected to the heater 2, two forward and reverse motors 5, temperature sensor 10, current sensor 12, and voltage sensor 13. The controller 14 starts the heater 2 to heat the internal components. Under the action of the temperature sensor 10, and through the voltage sensor 13 and current sensor 12 to reflect the data changes of the chip at high temperature, the test data is collected. During this process, static electricity is generated, which causes the controller 14 to start the two forward and reverse motors 5. Since the two moving blocks 7 are movably embedded in the two moving slots 4, the two moving blocks 7 move back and forth stably on the two threaded rods 6, thereby driving the two connecting blocks 8 and the two static elimination rods 9 to move up and down, and neutralizing the static electricity generated in the main body 1 of the acquisition device, thereby improving the accuracy of the subsequent acquisition of high-temperature chip test data by the acquisition device.

[0025] Embodiment 2: As shown in Figures 2-4 The top of the chip placement plate 3 is fixedly provided with a temperature sensor 10, the inner wall of the acquisition device body 1 is fixedly provided with a layer plate 11, the top of the layer plate 11 is fixedly provided with a current sensor 12, the top of the layer plate 11 is fixedly provided with a voltage sensor 13, one side of the outer wall of the acquisition device body 1 is fixedly provided with a controller 14, the top of each of the two moving blocks 7 is fixedly provided with two positioning columns 15, the top of each of the two moving blocks 7 is provided with a through hole 16, the top of each of the two connecting blocks 8 is provided with two positioning holes 17, the outer wall of each of the four positioning columns 15 is movably inserted into the inside of each of the four positioning holes 17, the bottom of each of the two connecting blocks 8 is provided with a fixed hole 18, the inner wall of each of the two fixed holes 18 is threadedly connected with a bolt 19, and the outer wall of each of the two bolts 19 is movably inserted into the inside of each of the two through holes 16.

[0026] The effect of the whole embodiment 2 is that since the two moving blocks 7 are L-shaped and each is provided with two positioning columns 15, and then the two connecting blocks 8 are placed on the corresponding positions of the two moving blocks 7 quickly and accurately through the action that the top of each of the two connecting blocks 8 is provided with two positioning holes 17, and the through hole 16 provided on each of the two moving blocks 7 corresponds to the fixed hole 18 provided on each of the two connecting blocks 8, then the two bolts 19 pass through the two through holes 16 and are threadedly connected in the inside of the two fixed holes 18 under the action of the two bolts 19, that is, the two static elimination rods 9 and the two connecting blocks 8 are installed on the two moving blocks 7, and the disassembly and assembly process is simple, which is convenient for subsequent disassembly, replacement or maintenance, so as to improve the static effect of the two static elimination rods 9 and further improve the accuracy of the subsequent high-temperature chip test data collection of the acquisition device.

[0027] Working principle: First, the chip to be tested is placed on the chip placement board 3, and the current sensor 12 and voltage sensor 13 are both connected to the chip. Then, the heater 2 is started by the controller 14. Under the action of the temperature sensor 10, the current sensor 12 and voltage sensor 13 reflect the data changes of the chip at high temperature and collect the test data. Next, the controller 14 starts two forward and reverse motors 5, which drive the two threaded rods 6 to rotate inside the main body 1 of the acquisition device, and cause the two moving blocks 7 to reciprocate on the two moving slots 4 and the two threaded rods 6. Since the two connecting blocks 8 are fitted onto the four positioning posts 1 through the four positioning holes 17, 5. Then, under the action of two bolts 19, it passes through two through holes 16 and is threaded into two fixing holes 18. Then, the two static elimination rods 9 and the two connecting blocks 8 are installed on the two moving blocks 7. Thus, by moving the two moving blocks 7 up and down, the two static elimination rods 9 can be moved up and down, so as to more fully neutralize the static electricity generated in the main body 1 of the acquisition device, thereby improving the accuracy of the acquisition device in subsequent high-temperature chip test data acquisition. Moreover, the static elimination rods 9 and connecting blocks 8 are easy to disassemble and assemble, which facilitates subsequent disassembly, maintenance or replacement, further improving the accuracy of the acquisition device in subsequent high-temperature chip test data acquisition.

[0028] The above are merely preferred embodiments of this utility model and are not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the technical solution of this utility model shall still fall within the protection scope of this utility model.

Claims

1. A high-temperature chip test data acquisition device, comprising a main body (1) of the acquisition device, characterized in that: A heater (2) is fixedly installed on the bottom of the inner wall of the main body (1) of the acquisition device. A chip placement plate (3) is fixedly installed on the inner surface of the main body (1) of the acquisition device. Two moving slots (4) are opened on the inner surface of the main body (1) of the acquisition device. A forward and reverse motor (5) is fixedly installed on the bottom of the inner wall of each of the two moving slots (4). A threaded rod (6) is fixedly installed on the top of each of the two forward and reverse motors (5). A moving block (7) is threadedly connected to the outer surface of each of the two threaded rods (6). Both moving blocks (7) are L-shaped. A connecting block (8) is placed on the top of each of the two moving blocks (7). An electrostatic eliminator (9) is fixedly installed on one side of the outer wall of each of the two connecting blocks (8).

2. The high-temperature chip test data acquisition device according to claim 1, characterized in that: A temperature sensor (10) is fixedly installed on the top of the chip placement board (3), and a shelf (11) is fixedly installed on the inner wall of the main body (1) of the acquisition device.

3. The high-temperature chip test data acquisition device according to claim 2, characterized in that: A current sensor (12) is fixedly installed on the top of the shelf (11), and a voltage sensor (13) is fixedly installed on the top of the shelf (11).

4. The high-temperature chip test data acquisition device according to claim 3, characterized in that: A controller (14) is fixedly installed on one side of the outer wall of the main body (1) of the acquisition device, and two positioning columns (15) are fixedly installed on the top of each of the two moving blocks (7).

5. The high-temperature chip test data acquisition device according to claim 4, characterized in that: Both of the movable blocks (7) have through holes (16) on their tops.

6. The high-temperature chip test data acquisition device according to claim 5, characterized in that: Two positioning holes (17) are opened on the top of each of the two connecting blocks (8), and the outer walls of the four positioning posts (15) are movably inserted into the four positioning holes (17).

7. The high-temperature chip test data acquisition device according to claim 6, characterized in that: The bottom of each of the two connecting blocks (8) is provided with a fixing hole (18), and the inner surface of each of the two fixing holes (18) is threaded with a bolt (19), and the outer surface of each bolt (19) is movably inserted into the inside of the two through holes (16).

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