Liquid cooling case and liquid cooling host

Abstract

The embodiment of the utility model discloses a liquid cooling cabinet and a liquid cooling host, the liquid cooling cabinet comprises a liquid cooling frame, a liquid pump, a heat exchange cold discharge assembly, a heat conduction boss and a floating liquid cooling module, the liquid cooling frame is internally provided with a liquid cooling flow channel, and the liquid pump, the heat exchange cold discharge assembly and the heat conduction boss are all installed on the liquid cooling frame. The floating liquid cooling module is installed on the liquid cooling frame in a floating mode through a plurality of floating assemblies, a cooling flow channel in the floating liquid cooling module communicates with a liquid cooling flow channel, and an inner cavity of the heat exchange cold discharge assembly, the liquid pump and the liquid cooling flow channel are sequentially connected to form a closed circulating flow channel. The liquid cooling case can complete heat dissipation without being additionally connected with an external cooling system, good contact with heating sources of different heights is kept by adding the heat conduction boss and the floating liquid cooling module, the problem that the heat dissipation efficiency is reduced due to poor contact of the heating sources is solved, the temperature of the heating sources is reduced, and the service life of the heating sources is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation equipment technical field, concretely relates to a liquid cooling machine case and liquid cooling host computer. BACKGROUND

[0002] With the development of electronic equipment towards high performance, high integration and high density, its power consumption is rising, and the heat dissipation problem caused thereby becomes particularly prominent. Among many cooling schemes, the liquid cooling mode exhibits obvious advantages compared with the traditional air cooling mode due to its excellent cooling effect and good noise control performance. The basic principle of liquid cooling is to circulate the cooling liquid in the closed loop system, thereby effectively conducting the heat generated by the electronic equipment to the surrounding environment.

[0003] The existing case type liquid cooling product adopts the liquid cooling plate with built-in flow channel to directly contact with the heat source for heat dissipation, and the structural member can also be used as the case shell. Although this mode can solve the heat dissipation problem of multiple heat sources to a certain extent, due to the lack of independent cooling and heat exchange system, it still needs to be connected with the external cooling system to complete the heat dissipation task. When processing chip heat sources with different height tolerances, the heat dissipation efficiency may be reduced due to poor contact. SUMMARY

[0004] Therefore, the utility model embodiment provides a liquid cooling machine case and liquid cooling host computer, which can ensure good contact with heat sources of different heights, improve the problem of heat dissipation efficiency reduction caused by poor contact of heat sources, reduce the temperature of heat sources, and prolong the service life of heat sources.

[0005] In a first aspect, the utility model embodiment provides a liquid cooling machine case, which comprises:

[0006] A liquid cooling frame, the shell of the liquid cooling frame is internally provided with a liquid cooling flow channel;

[0007] A liquid pump and a heat exchange cold row assembly are both installed on the liquid cooling frame, the inner cavity of the heat exchange cold row assembly, the liquid pump and the liquid cooling flow channel are sequentially connected to form a closed circulation flow channel;

[0008] At least one heat conduction boss is arranged on the liquid cooling frame, and part of the liquid cooling flow channel is located below the heat conduction boss;

[0009] A floating liquid cooling module is floatingly installed on the liquid cooling frame through a plurality of floating assemblies, the floating liquid cooling module has a cooling flow channel, and the cooling flow channel is in communication with the liquid cooling flow channel.

[0010] Optionally, the floating assembly comprises a floating block guide column, a floating elastic element and a floating block limiting connector, the floating block guide column is fixedly connected with the liquid cooling frame and the floating block limiting connector at both ends respectively, and a plurality of floating elastic elements are connected between the floating liquid cooling module and the liquid cooling frame respectively.

[0011] The floating liquid cooling module is provided with a plurality of first through holes, and a plurality of floating block guide columns pass through the plurality of first through holes respectively, and the floating liquid cooling module slides along the floating block guide column between the floating block limiting connector and the liquid cooling frame.

[0012] Optionally, the floating liquid cooling module comprises:

[0013] A floating block cover plate comprises a plurality of first through holes and a cooling cavity with a top opening, the plurality of first through holes are located outside the cooling cavity, and the bottom of the cooling cavity is provided with a liquid supply port and a liquid return port.

[0014] A floating water cooling head is located on the side of the floating block cover plate away from the liquid cooling frame, the floating water cooling head covers the top opening of the cooling cavity and is connected with the floating block cover plate.

[0015] Optionally, the floating liquid cooling module further comprises:

[0016] A water baffle is arranged in the cooling cavity, a flow guide groove is formed between the water baffle and the floating water cooling head, a first recess and a second recess are respectively recessed on the upper and lower sides of the water baffle, and a avoiding groove is respectively recessed on the front and rear sides of the water baffle, the first recess, the flow guide groove, the avoiding groove and the second recess are sequentially communicated to form the cooling flow channel, a liquid inlet hole communicating with the liquid supply port is arranged in the first recess, and the second recess communicates with the liquid return port.

[0017] A first sealing ring is sealingly connected between the top opening of the cooling cavity and the floating water cooling head.

[0018] Optionally, the floating elastic element is sleeved on the outside of the floating block guide column.

[0019] Optionally, the liquid cooling case further comprises a back plate, and the back plate is connected on the side of the floating liquid cooling module away from the liquid cooling frame through a plurality of locking assemblies.

[0020] Optionally, the floating liquid cooling module is provided with a plurality of second through holes, and the back plate is provided with a plurality of third through holes.

[0021] The locking assembly comprises a locking guide column, a locking elastic element and a locking connector, one end of the locking guide column is fixedly connected with the liquid cooling frame, the other end of the locking guide column passes through the corresponding second through hole, the locking connector passes through the corresponding third through hole and is fixedly connected with the other end of the locking guide column, the locking elastic element is connected between the floating liquid cooling module and the liquid cooling frame, and the floating liquid cooling module slides along the locking guide column between the back plate and the liquid cooling frame.

[0022] Optionally, the liquid cooling flow channel comprises a first flow channel and a second flow channel, two ends of the first flow channel are respectively provided with a first liquid inlet and a first liquid outlet, and two ends of the second flow channel are respectively provided with a second liquid inlet and a second liquid outlet.

[0023] The liquid inlet of the cooling cavity is communicated with the first liquid outlet of the first flow channel through a liquid supply plug, the liquid return port of the cooling cavity is communicated with the second liquid inlet of the second flow channel through a liquid return plug, and at least one second sealing ring is arranged on the liquid supply plug and the liquid return plug respectively.

[0024] Optionally, the heat exchange cold row assembly comprises a fan and a heat exchange cold row, and the fan is arranged on the heat exchange cold row.

[0025] The water inlet of the heat exchange cold row is communicated with the second liquid outlet of the second flow channel through a first fluid connecting seat, the water outlet of the heat exchange cold row is communicated with the water inlet of the liquid pump through a second fluid connecting seat, and the water outlet of the liquid pump is communicated with the first liquid inlet of the first flow channel through a third fluid connecting seat.

[0026] In a second aspect, the utility model embodiment provides a liquid cooling host computer, the liquid cooling host computer comprises:

[0027] The liquid cooling machine case as described in the first aspect;

[0028] A PCB assembly is connected to the side of the floating liquid cooling module away from the liquid cooling frame, the PCB assembly comprises a PCB and a plurality of heat sources, and the plurality of heat sources are arranged on the side of the PCB facing the floating liquid cooling module.

[0029] Among them, the plurality of heat sources are respectively abutted with the floating liquid cooling module and the heat conduction boss through the heat conduction layer.

[0030] This utility model provides a liquid-cooled chassis and a liquid-cooled main unit. The liquid-cooled chassis includes a liquid-cooled frame with internal liquid-cooled channels, a liquid pump, a heat exchange radiator assembly, a heat-conducting boss, and a floating liquid-cooled module. The liquid pump, heat exchange radiator assembly, and heat-conducting boss are all mounted on the liquid-cooled frame. The floating liquid-cooled module is floatingly mounted on the liquid-cooled frame through multiple floating components. The cooling channels within the floating liquid-cooled module are connected to the liquid-cooled channels, and the inner cavity of the heat exchange radiator assembly, the liquid pump, and the liquid-cooled channels are sequentially connected end-to-end to form a closed circulation channel. This liquid-cooled chassis can achieve heat dissipation without the need for an external cooling system. By adding heat-conducting bosses and a floating liquid-cooled module, good contact is maintained with heat sources at different heights, improving the problem of reduced heat dissipation efficiency due to poor heat source contact, reducing the temperature of the heat source, and extending the service life of the heat source. Attached Figure Description

[0031] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:

[0032] Figure 1 This is a schematic diagram of the structure of the liquid-cooled chassis according to an embodiment of the present invention;

[0033] Figure 2 This is a partial structural diagram of the liquid-cooled chassis according to an embodiment of the present invention;

[0034] Figure 3 This is an exploded view of the liquid-cooled chassis according to an embodiment of the present invention;

[0035] Figure 4 This is a cross-sectional view of the liquid-cooled frame according to an embodiment of the present invention;

[0036] Figure 5 This is an exploded view of part A of the liquid-cooled chassis according to an embodiment of the present invention;

[0037] Figure 6 This is a partial sectional view of the liquid-cooled chassis according to an embodiment of the present invention;

[0038] Figure 7 This is a cross-sectional view of the floating liquid cooling module according to an embodiment of the present invention;

[0039] Figure 8 This is a schematic diagram of the structure of the water-blocking plate according to an embodiment of the present utility model;

[0040] Figure 9 This is a schematic diagram of the structure of the floating water cooling head according to an embodiment of the present invention;

[0041] Figure 10 This is a schematic diagram of the structure of the floating block cover plate according to an embodiment of the present utility model.

[0042] Reference signs:

[0043] 1-liquid cooling frame; 11-liquid cooling flow channel; 111-first flow channel; 1111-first liquid inlet; 1112-first liquid outlet; 112-second flow channel; 1121-second liquid inlet; 1122-second liquid outlet; 2-liquid pump; 3-heat exchange cooling row assembly; 31-fan; 32-heat exchange cooling row; 4-heat conduction boss; 5-floating liquid cooling module; 51-cooling flow channel; 511-liquid supply port; 512-liquid return port; 52-first through hole; 53-floating block cover plate; 531-cooling cavity; 54-floating water cooling head; 55-waterproof plate; 551-flow guide groove; 552-first groove; 553-second groove; 554-avoidance groove; 555-liquid inlet hole; 56-first sealing ring; 57-second through hole; 6-floating assembly; 61-floating block guide column; 62-floating elastic element; 63-floating block limiting connecting piece; 7-back plate; 71-third through hole; 8-locking assembly; 81-locking guide column; 82-locking elastic element; 83-locking connecting piece; 9-liquid supply plug; 10-liquid return plug; 20-second sealing ring; 301-first fluid connecting seat; 302-second fluid connecting seat; 303-third fluid connecting seat; 40-PCB board assembly; 401-PCB board; 402-heating source; 50-heat conduction layer; h-up and down direction; w-front and back direction. DETAILED DESCRIPTION

[0044] The present application is described in detail below based on examples, but the present application is not limited to only these examples. In the following detailed description of the present application, some specific details are described in detail. The present application can also be fully understood without the description of these details. In order not to obscure the essence of the present application, well-known methods, processes, procedures, elements and circuits are not described in detail.

[0045] In addition, those of ordinary skill in the art will understand that the drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0046] Unless otherwise clearly indicated and limited, the terms "mount", "connect", "connection", "fixed", and the like, should be interpreted broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0047] Unless the context clearly requires otherwise, throughout the application, the general term "comprise", "comprising" or "comprises" is to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is to say, in the sense of "including, but not limited to".

[0048] In the description of the present application, it should be understood that the terms "first", "second" and the like are used only for descriptive purposes and are not to be construed as indicating or implying relative importance. In addition, in the description of the present application, the meaning of "multiple" is two or more, unless otherwise stated.

[0049] Referring to Figure 1 and Figure 3 , the liquid cooling machine case includes a liquid cooling frame 1, a liquid pump 2, a heat exchange cold row assembly 3, a heat conduction boss 4, and a floating liquid cooling module 5. The liquid pump 2, the heat exchange cold row assembly 3, the heat conduction boss 4, and the floating liquid cooling module 5 are all arranged on the liquid cooling frame 1 to form an integrated liquid cooling machine case. The integrated liquid cooling machine case is compact in design and can provide efficient cooling and heat dissipation performance without increasing the size of the case, thereby improving the service life of the heat source.

[0050] Referring to Figure 3 , the liquid cooling frame 1 is the overall frame of the integrated liquid cooling machine case, and one side of the liquid cooling frame 1 is provided with a mounting cavity, and the heat exchange cold row assembly 3 is arranged in the mounting cavity. Referring to Figure 4 , the shell of the liquid cooling frame 1 is internally provided with a liquid cooling flow channel 11. Referring to Figure 1 , the liquid pump 2 is located on one side of the heat exchange cold row assembly 3. The liquid pump 2, the inner cavity of the heat exchange cold row assembly 3, and the liquid cooling flow channel 11 are sequentially connected in series to form a closed circulation flow channel, thereby achieving heat dissipation and cooling of the heat source 402 in the integrated liquid cooling machine case. Sequentially connected in series means that the inlet and outlet of the liquid pump 2 are connected in series with the inner cavity of the heat exchange cold row assembly 3 and the liquid cooling flow channel 11, and the three form a closed circulation liquid cooling flow channel.

[0051] Among them, the heat exchange cold row assembly 3 is integrated in the interior of the liquid cooling frame 1, and the combination of air cooling and liquid cooling is used to realize efficient heat dissipation and high integration of the case, solving the problems of the traditional liquid cooling machine case, such as the need to be equipped with a liquid cooling source, resulting in a large volume and heavy weight of the overall liquid cooling system, and limited use occasions.

[0052] In this embodiment, the heat exchange cold row assembly 3 has a separate space and does not directly contact with the ambient air, and this structure greatly improves the three-proofing performance and electromagnetic shielding performance of the integrated liquid cooling machine case. In addition, the heat exchange cold row assembly 3 is easy to disassemble and replace.

[0053] In this embodiment, the heat exchange cold row assembly 3 is located on the left side of the liquid cooling frame 1, referring to Figure 1 . Referring to Figure 3The heat exchange cold row assembly 3 comprises a fan 31 and a heat exchange cold row 32. The heat exchange cold row 32 is arranged in the mounting cavity of the liquid cooling frame 1 and detachably connected with the liquid cooling frame 1. A plurality of fans 31 are arranged below the heat exchange cold row 32. The fan 31 is used for cooling the cooling liquid in the heat exchange cold row 32. In order to increase the heat dissipation area, fins for heat dissipation are arranged in the heat exchange cold row 32, and the fins are uniformly distributed in the heat exchange cold row 32.

[0054] Generally, a plurality of heat sources 402 are arranged on the PCB 401, including chips with small heat dissipation power and chips with large heat dissipation power. In this embodiment, the chips with small heat dissipation power are conducted and dissipated by increasing the heat conduction boss 4 on the liquid cooling frame 1; the chips with large heat dissipation power are conducted and dissipated by arranging the floating liquid cooling module 5 on the liquid cooling frame 1. When the PCB 401 is mounted on the liquid cooling frame 1, the heat conduction boss 4 and the floating liquid cooling module 5 can improve the problem of poor contact between the heat source 402 (i.e. the chip) and the liquid cooling frame 1, reduce the thermal resistance, improve the heat dissipation performance of the heat source 402, reduce the temperature of the heat source 402, and prolong the service life of the heat source 402.

[0055] Specifically, the number of the heat conduction boss 4 is consistent with the number of the chips with small heat dissipation power, and the top surface shape of the heat conduction boss 4 is consistent with the shape of the chip with small heat dissipation power, so as to increase the heat dissipation area. The heat conduction boss 4 is arranged on the liquid cooling frame 1, and the heat conduction boss 4 is located above the liquid cooling flow channel 11, that is, part of the liquid cooling flow channel 11 is located below the heat conduction boss 4. When the cooling liquid flows through the liquid cooling flow channel 11 below the heat conduction boss 4, the heat source 402 transmits heat to the cooling liquid in the liquid cooling flow channel 11 below through the heat conduction boss 4, so that the cooling liquid takes away the heat to achieve heat dissipation and cooling. The heat conduction boss 4 is made of heat conduction material to increase the heat conduction and dissipation performance. The height of the heat conduction boss 4 is associated with the heat source 402 to ensure that the heat source 402 and the heat conduction boss 4 are in good contact when the PCB 401 is mounted on the liquid cooling frame 1. A heat conduction layer 50 is arranged between the heat conduction boss 4 and the heat source 402 to further increase the heat conduction capacity.

[0056] The floating liquid cooling module 5 has a cooling flow channel 51. Referring to Figure 2 and Figure 6, the floating liquid cooling module 5 is floatingly installed on the liquid cooling frame 1 through a plurality of floating assemblies 6, and the cooling flow channel 51 is in communication with the liquid cooling flow channel 11. The floating liquid cooling module 5 is located below the PCB board assembly 40 and used to abut against the heat source 402 on the PCB board 401, and the cooling liquid carries away the heat on the floating liquid cooling module 5 when passing through the cooling flow channel 51, so that the heat source 402 is cooled. The floating liquid cooling module 5 can float according to the height difference of the heat source 402 (i.e. the chip), so that the floating liquid cooling module 5 can keep good contact with the chips of different heights, thereby reducing the thermal resistance and improving the heat dissipation performance.

[0057] In the embodiment, the floating liquid cooling module 5 is floatingly installed on the liquid cooling frame 1 through four floating assemblies 6, and the four floating assemblies 6 are symmetrically located on the four edges of the floating liquid cooling module 5, so as to improve the stability of the floating of the floating liquid cooling module 5 and ensure good contact between the floating liquid cooling module 5 and the heat source 402, thereby improving the contact area and the heat dissipation performance.

[0058] Referring to Figure 2 and Figure 5 , the floating assembly 6 comprises a floating block guide column 61, a floating elastic element 62 and a floating block limiting connecting piece 63. The floating liquid cooling module 5 is provided with a plurality of first through holes 52. One end of the floating block guide column 61 is fixedly connected with the liquid cooling frame 1, and the other end of the floating block guide column 61 is connected with the floating block limiting connecting piece 63 after penetrating through the first through hole 52, so that the floating liquid cooling module 5 is slidingly connected between the liquid cooling frame 1 and the floating block limiting connecting piece 63. That is, the floating liquid cooling module 5 slides between the floating block limiting connecting piece 63 and the liquid cooling frame 1 along the floating block guide column 61. The plurality of floating elastic elements 62 are connected between the floating liquid cooling module 5 and the liquid cooling frame 1.

[0059] Since the distance between the PCB board 401 and the liquid cooling frame 1 is relatively fixed after the PCB board assembly 40 is installed with the liquid cooling frame 1, the heat source 402 is located between the PCB board 401 and the floating liquid cooling module 5. When the heat source 402 contacts the top surface of the floating liquid cooling module 5, the heat source 402 can push the floating liquid cooling module 5 to slide downward along the floating block guide column 61, so as to facilitate the installation of the heat source 402 of different heights and avoid the damage of the heat source 402 due to extrusion. The plurality of floating elastic elements 62 apply an upward pushing force to the floating liquid cooling module 5, so as to push the floating liquid cooling module 5 to keep good contact with the heat source 402 at all times, thereby improving the heat dissipation performance and reducing the temperature of the heat source 402.

[0060] The floating block guide column 61 can pass through the counterbore in sliding. The top of the floating block guide column 61 can be provided with a threaded hole, and the floating block limiting connector 63 can be a screw that is connected to the top of the floating block guide column 61 in cooperation with the threaded hole. The first through hole 52 can be a counterbore, and the diameter of the nut of the screw is greater than the diameter of the counterbore, so as to realize the connection of the floating liquid cooling module 5 and the liquid cooling frame 1 and the limitation of the sliding range. The floating elastic element 62 is a spring and can be sleeved outside the floating block guide column 61 to avoid disengagement.

[0061] With reference to Figure 2 , Figure 3 and Figure 5 , the PCB assembly 40 is located above the heat-conducting boss 4 and the floating liquid cooling module 5, and the PCB assembly 40 is connected to the liquid cooling frame 1 through a plurality of locking assemblies 8, so that a plurality of heat sources 402 on the PCB assembly 40 can be in abutment with the heat-conducting boss 4 and the floating liquid cooling module 5 for conduction heat dissipation.

[0062] With reference to Figure 5 , the locking assembly 8 includes a locking guide column 81 and a locking connector 83. One end of the locking guide column 81 is fixedly connected to the liquid cooling frame 1, and the other end of the locking guide column 81 extends upward. After the PCB assembly 40 is placed above the heat-conducting boss 4 and the floating liquid cooling module 5, the locking connector 83 is fixedly connected to the other end of the locking guide column 81 through the mounting hole of the PCB 401. The locking connector 83 and the locking guide column 81 can be in threaded connection, and the pressure between the PCB assembly 40 and the heat-conducting boss 4 and the floating liquid cooling module 5 can be adjusted by adjusting the height of the threaded connection, so as to avoid damage to the heat sources 402.

[0063] In this embodiment, the integrated liquid cooling case further includes a back plate 7. With reference to Figure 1 and Figure 2 , the back plate 7 is located outside the PCB 401, and the locking connector 83 can pass through the back plate 7 and the PCB 401 and be fixedly connected to the locking guide column 81. The back plate 7 can provide a certain thickness for the installation of the locking connector 83, so as to avoid damage to the PCB 401 caused by direct contact between the locking connector 83 and the PCB 401. At the same time, the back plate 7 provides additional support for the PCB 401, increases the rigidity and stability of the overall structure, and makes it easier to fix the PCB 401 to the liquid cooling frame 1.

[0064] In a preferred embodiment, the floating liquid cooling module 5 is provided with a plurality of second through holes 57, and the back plate 7 is provided with a plurality of third through holes 71. With reference to Figure 5. One end of the locking guide column 81 is fixedly connected with the liquid cooling frame 1, the other end of the locking guide column 81 passes through the corresponding second through hole 57, the locking connecting piece 83 passes through the corresponding third through hole 71 and the PCB board 401 and is fixedly connected with the other end of the locking guide column 81, thereby connecting the floating liquid cooling module 5 between the PCB board 401 and the liquid cooling frame 1. Wherein, the floating liquid cooling module 5 can also slide along the locking guide column 81 between the PCB board 401 and the liquid cooling frame 1. That is, the floating block guide column 61 and the locking guide column 81 can provide guidance for the floating of the floating liquid cooling module 5. Wherein, when the PCB board 401 is connected with the liquid cooling frame 1 through the locking assembly 8, the heat source 402 abuts against the floating liquid cooling module 5 and pushes the floating liquid cooling module 5 to slide downward, which realizes good contact between the heat source 402 and the floating liquid cooling module 5 and avoids damage to the heat source 402 caused by extrusion. In order to avoid damage to the heat source 402 caused by excessive pressure, the depth of the connection between the locking connecting piece 83 and the locking guide column 81 can be adjusted to adjust the pressure.

[0065] Further, the locking assembly 8 further comprises a locking elastic element 82, which is connected between the floating liquid cooling module 5 and the liquid cooling frame 1. Figure 2 、 Figure 5 When the floating liquid cooling module 5 slides along the locking guide column 81 and the floating block guide column 61 between the PCB board 401 and the liquid cooling frame 1, the locking elastic element 82 and the floating elastic element 62 can simultaneously apply an upward thrust to the floating liquid cooling module 5 to push the floating liquid cooling module 5 to always maintain good contact with the heat source 402, thereby improving the heat dissipation performance and reducing the temperature of the heat source 402.

[0066] Wherein, the top of the locking guide column 81 can be provided with a threaded hole, and the locking connecting piece 83 can be a screw which is connected with the top of the locking guide column 81 in cooperation with the threaded hole after passing through the third through hole 71. The third through hole 71 is provided as a countersunk hole, and the diameter of the nut of the screw is greater than the diameter of the countersunk hole, so as to realize the connection of the PCB board 401 and the back plate 7. The locking elastic element 82 is a spring which can be sleeved outside the locking guide column 81, and the connection is simple and avoids disconnection.

[0067] Referring to Figure 6 and Figure 7 , the liquid cooling frame 1 is internally provided with a liquid cooling flow channel 11, and the floating liquid cooling module 5 has a cooling flow channel 51, and when the floating liquid cooling module 5 is floatingly installed on the liquid cooling frame 1, the cooling flow channel 51 is in communication with the liquid cooling flow channel 11. The cooling liquid flows into the cooling flow channel 51 from the liquid cooling flow channel 11 and then flows into the liquid cooling flow channel 11 again, so that the cooling liquid carries away the heat of the heat source 402 above the floating liquid cooling module 5 in the flowing process, thereby realizing heat dissipation and cooling of the heat source 402.

[0068] Referring toFigure 4 The liquid cooling flow channel 11 includes a first flow channel 111 and a second flow channel 112. The first flow channel 111 is provided with a first liquid inlet 1111 and a first liquid outlet 1112 at two ends thereof respectively. The second flow channel 112 is provided with a second liquid inlet 1121 and a second liquid outlet 1122 at two ends thereof respectively. The first flow channel 111 and the second flow channel 112 can be arranged according to the position of the heat source 402. The first liquid inlet 1111, the first liquid outlet 1112, the second liquid inlet 1121 and the second liquid outlet 1122 extend vertically to the upper surface of the liquid cooling frame 1, so as to be communicated with the liquid pump 2, the cooling flow channel 51 of the floating liquid cooling module 5 and the inner cavity of the heat exchange cold row assembly 3. The cooling flow channel 51 is provided with a liquid supply port 511 and a liquid return port 512.

[0069] The water inlet of the heat exchange cold row 32 is communicated with the second liquid outlet 1122 of the second flow channel 112 through the first fluid connection seat 301. The water outlet of the heat exchange cold row 32 is communicated with the water inlet of the liquid pump 2 through the second fluid connection seat 302. The water outlet of the liquid pump 2 is communicated with the first liquid inlet 1111 of the first flow channel 111 through the third fluid connection seat 303.

[0070] When the floating liquid cooling module 5 is floatingly installed on the liquid cooling frame 1, the liquid supply port 511 of the cooling flow channel 51 is communicated with the first liquid outlet 1112 of the first flow channel 111 through the liquid supply plug 9. The liquid return port 512 of the cooling flow channel 51 is communicated with the second liquid inlet 1121 of the second flow channel 112 through the liquid return plug 10. Thus, the first flow channel 111 is communicated with the second flow channel 112 through the cooling flow channel 51, so as to realize the flow of the cooling liquid in the floating liquid cooling module 5. The liquid pump 2 delivers the cooled cooling liquid to the first flow channel 111, and then the cooling liquid flows into the cooling flow channel 51. The warmed cooling liquid flows into the second flow channel 112 and the heat exchange cold row 32 for cooling, so that the cooling liquid carries away the heat of the heat source 402 above the floating liquid cooling module 5 in the flow process, and realizes the heat dissipation and cooling of the heat source 402. In addition, the cooling liquid carries away the heat of other heat sources 402 in the flow process in the first flow channel 111 and the second flow channel 112 through the heat conduction boss 4 for cooling.

[0071] Referring to Figure 5 , Figure 6 and Figure 7 , the floating liquid cooling module 5 includes a floating block cover plate 53 and a floating water cooling head 54. The floating block cover plate 53 includes a cooling cavity 531 with a top opening, a plurality of first through holes 52 and a plurality of second through holes 57. The plurality of first through holes 52 and the plurality of second through holes 57 are located on the outside of the cooling cavity 531. The plurality of first through holes 52 and the plurality of second through holes 57 are respectively used for cooperating with the plurality of floating assemblies 6 and the plurality of locking assemblies 8.

[0072] The bottom of the cooling cavity 531 is provided with a liquid supply port 511 and a liquid return port 512 to communicate with the first flow channel 111 and the second flow channel 112. The liquid supply port 511 is connected with a liquid supply plug 9, and the liquid return port 512 is connected with a liquid return plug 10. Referring to Figure 10 The floating block cover plate 53 is inserted into the first liquid outlet 1112 and the second liquid inlet 1121 through the liquid supply plug 9 and the liquid return plug 10, respectively, so that the cooling cavity 531 is in communication with the first flow channel 111 and the second flow channel 112. When the floating liquid cooling module 5 floats up and down as a whole, the floating block cover plate 53 with the liquid supply plug 9 and the liquid return plug 10 can slide up and down in the first liquid outlet 1112 and the second liquid inlet 1121, respectively.

[0073] Further, at least one second sealing ring 20 is arranged on the liquid supply plug 9 and the liquid return plug 10, respectively. The second sealing ring 20 can seal the connection between the cooling cavity 531 and the liquid cooling flow channel 11, prevent liquid leakage, and ensure the reliability of the overall heat dissipation system.

[0074] Referring to Figure 2 and Figure 5 The floating water cooling head 54 is located on the side of the floating block cover plate 53 away from the liquid cooling frame 1. The floating water cooling head 54 covers the top opening of the cooling cavity 531 and is connected with the floating block cover plate 53, thereby forming a sealed cooling cavity 531 to prevent the cooling liquid from overflowing from the cooling cavity 531 and causing damage to the chips and the like in the liquid cooling frame 1. Alternatively, the floating water cooling head 54 and the floating block cover plate 53 can be detachably connected by screws for later maintenance.

[0075] Further, the floating water cooling head 54 can be made of a heat-conducting material. The floating water cooling head 54 is used to contact and abut the heat source 402 through the heat-conducting layer 50. The heat source 402 transmits heat to the cooling liquid in the cooling cavity 531 through the floating water cooling head 54, and the cooling liquid is taken away by flowing, thereby achieving heat dissipation and cooling of the heat source 402.

[0076] Referring to Figures 5-7 The floating liquid cooling module 5 further includes a water isolation plate 55 and a first sealing ring 56. The water isolation plate 55 is arranged in the cooling cavity 531, and the water isolation plate 55 is used to divide the cooling cavity 531 to form a cooling flow channel 51, so that the cooling liquid has a clear flow direction, thereby improving the heat dissipation performance.

[0077] Specifically, the water isolation plate 55 is recessed to form a first recess 552 and a second recess 553 on both sides of the up-down direction h, respectively, and is recessed to form an avoidance groove 554 on both sides of the front-back direction w, respectively. The avoidance groove 554 is in communication with the second recess 553 on both sides of the up-down direction h, respectively, and the groove bottom surface of the avoidance groove 554 is connected with the upper surface of the water isolation plate 55. Referring to Figure 5 and Figure 8When the water baffle 55 is placed in the cooling cavity 531, a flow guide groove 551 is formed between the upper side of the water baffle 55 and the inner side of the floating water cooling head 54, the first groove 552, the flow guide groove 551, the avoidance groove 554 and the second groove 553 are sequentially communicated to form the cooling flow channel 51, the first groove 552 is provided with a liquid inlet hole 555 communicated with the liquid supply port 511, and the second groove 553 is communicated with the liquid return port 512. The cooling liquid in the first flow channel 111 enters the first groove 552 through the liquid supply port 511 and the liquid inlet hole 555, and then sequentially flows through the flow guide groove 551, the avoidance groove 554 and the second groove 553, and finally flows into the second flow channel 112 from the liquid return port 512. The cooling flow channel 51 arranged above increases the flow length and flow area of the cooling liquid in the floating liquid cooling module 5, which can accelerate the heat dissipation of the heat source 402.

[0078] Further, referring to Figure 6 and Figure 9 , the inner side of the floating water cooling head 54 is provided with a plurality of parallel arranged heat dissipation fins, which can increase the heat dissipation area. At the same time, the gap between the heat dissipation fins is used for the cooling liquid to enter the second groove 553 after passing through.

[0079] The first sealing ring 56 is sealingly connected between the top opening of the cooling cavity 531 and the floating water cooling head 54, which can prevent the cooling liquid from overflowing into the case. Referring to Figure 5 , the middle part of the first sealing ring 56 can abut against the floating water cooling head 54 and the water baffle 55 to prevent the water baffle 55 from shaking in the cooling cavity 531. At the same time, the middle part of the first sealing ring 56 is provided with three through grooves, which are respectively communicated with the first groove 552 and the two avoidance grooves 554. The middle part of the first sealing ring 56 abuts against the heat dissipation fins, and the two form the flow guide groove 551. The embodiment also provides an integrated liquid cooling host computer, which comprises the integrated liquid cooling case and the PCB board assembly 40 of the above embodiment. The PCB board assembly 40 is connected to the side of the floating liquid cooling module 5 and the heat conduction boss 4 away from the liquid cooling frame 1. The PCB board assembly 40 comprises a PCB board 401 and a plurality of heat sources 402, and the plurality of heat sources 402 are arranged on the side of the PCB board 401 facing the floating liquid cooling module 5. When the PCB board assembly 40 is connected to the liquid cooling frame 1, the plurality of heat sources 402 abut against the floating liquid cooling module 5 and the heat conduction boss 4 through the heat conduction layer 50, so that the integrated liquid cooling case can conduct heat dissipation. The connection mode of the PCB board assembly 40 and the liquid cooling frame 1 can refer to the related description in the above embodiment. Since the area of the PCB board 401 is large, a plurality of supporting columns can be further arranged on the liquid cooling frame 1 to improve the rigidity and stability of the PCB board 401.

[0080] The integrated liquid cooling machine box and the integrated liquid cooling main machine of the embodiment can complete heat dissipation without connecting an external cooling system, and good contact with heat sources of different heights is maintained by increasing the heat conduction boss and the floating liquid cooling module, so that the problem of poor contact of the heat source and the decrease of the heat dissipation efficiency is improved, the temperature of the heat source is reduced, and the service life of the heat source is improved.

[0081] The above merely provides the preferred embodiments of the present application, but is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A liquid-cooled chassis, characterized in that, The liquid-cooled chassis includes: Liquid-cooled frame (1), wherein a liquid-cooled flow channel (11) is provided inside the shell of the liquid-cooled frame (1); The liquid pump (2) and the heat exchanger assembly (3) are both installed on the liquid cooling frame (1). The inner cavity of the heat exchanger assembly (3), the liquid pump (2) and the liquid cooling channel (11) are connected in sequence to form a closed circulation channel. At least one heat-conducting boss (4) is disposed on the liquid cooling frame (1), and part of the liquid cooling channel (11) is located below the heat-conducting boss (4); The floating liquid cooling module (5) is floatingly mounted on the liquid cooling frame (1) by multiple floating components (6). The floating liquid cooling module (5) has a cooling channel (51) which is connected to the liquid cooling channel (11).

2. The liquid-cooled chassis according to claim 1, characterized in that, The floating component (6) includes a floating block guide post (61), a floating elastic element (62), and a floating block limiting connector (63). The two ends of the floating block guide post (61) are fixedly connected to the liquid cooling frame (1) and the floating block limiting connector (63), respectively. A plurality of the floating elastic elements (62) are respectively connected between the floating liquid cooling module (5) and the liquid cooling frame (1). The floating liquid cooling module (5) is provided with a plurality of first through holes (52), and a plurality of floating block guide posts (61) pass through the plurality of first through holes (52) respectively. The floating liquid cooling module (5) slides along the floating block guide posts (61) between the floating block limiting connector (63) and the liquid cooling frame (1).

3. The liquid-cooled chassis according to claim 2, characterized in that, The floating liquid cooling module (5) includes: The floating block cover plate (53) includes a plurality of first through holes (52) and a cooling cavity (531) with a top opening. The plurality of first through holes (52) are located on the outside of the cooling cavity (531). The bottom of the cooling cavity (531) is provided with a liquid supply port (511) and a liquid return port (512). A floating water cooling head (54) is located on the side of the floating block cover plate (53) away from the liquid cooling frame (1). The floating water cooling head (54) covers the top opening of the cooling cavity (531) and is connected to the floating block cover plate (53).

4. The liquid-cooled chassis according to claim 3, characterized in that, The floating liquid cooling module (5) also includes: A baffle plate (55) is disposed in the cooling chamber (531). A guide groove (551) is formed between the baffle plate (55) and the floating water cooling head (54). A first groove (552) and a second groove (553) are respectively recessed on both sides of the baffle plate (55) in the vertical direction (h). A relief groove (554) is respectively recessed on both sides of the baffle plate (55) in the front-back direction (w). The first groove (552), the guide groove (551), the relief groove (554) and the second groove (553) are sequentially connected to form the cooling channel (51). The first groove (552) is provided with an inlet hole (555) that communicates with the liquid supply port (511). The second groove (553) communicates with the liquid return port (512). A first sealing ring (56) is sealed between the top opening of the cooling chamber (531) and the floating water cooling head (54).

5. The liquid-cooled chassis according to claim 2, characterized in that, The floating elastic element (62) is sleeved on the outside of the floating block guide post (61).

6. The liquid-cooled chassis according to claim 1, characterized in that, The liquid cooling chassis also includes a back plate (7), which is connected to the side of the floating liquid cooling module (5) away from the liquid cooling frame (1) by a plurality of locking components (8).

7. The liquid-cooled chassis according to claim 6, characterized in that, The floating liquid cooling module (5) is provided with multiple second through holes (57), and the back plate (7) is provided with multiple third through holes (71); The locking assembly (8) includes a locking guide post (81), a locking elastic element (82), and a locking connector (83). One end of the locking guide post (81) is fixedly connected to the liquid cooling frame (1), and the other end of the locking guide post (81) passes through the corresponding second through hole (57). The locking connector (83) passes through the corresponding third through hole (71) and is fixedly connected to the other end of the locking guide post (81). The locking elastic element (82) is connected between the floating liquid cooling module (5) and the liquid cooling frame (1). The floating liquid cooling module (5) slides along the locking guide post (81) between the back plate (7) and the liquid cooling frame (1).

8. The liquid-cooled chassis according to claim 3, characterized in that, The liquid cooling channel (11) includes a first channel (111) and a second channel (112). The first channel (111) has a first liquid inlet (1111) and a first liquid outlet (1112) at its two ends, and the second channel (112) has a second liquid inlet (1121) and a second liquid outlet (1122) at its two ends. The liquid supply port (511) of the cooling chamber (531) is connected to the first liquid outlet (1112) of the first flow channel (111) through the liquid supply plug (9), and the liquid return port (512) of the cooling chamber (531) is connected to the second liquid inlet (1121) of the second flow channel (112) through the liquid return plug (10). At least one second sealing ring (20) is provided on the liquid supply plug (9) and the liquid return plug (10).

9. The liquid-cooled chassis according to claim 8, characterized in that, The heat exchange radiator assembly (3) includes a fan (31) and a heat exchange radiator (32), wherein the fan (31) is mounted on the heat exchange radiator (32); The inlet of the heat exchange radiator (32) is connected to the second outlet (1122) of the second flow channel (112) through the first fluid connector (301), the outlet of the heat exchange radiator (32) is connected to the inlet of the liquid pump (2) through the second fluid connector (302), and the outlet of the liquid pump (2) is connected to the first inlet (1111) of the first flow channel (111) through the third fluid connector (303).

10. A liquid-cooled main unit, characterized in that, The liquid-cooled host includes: Liquid-cooled chassis as described in any one of claims 1-9; The PCB board assembly (40) is connected to the side of the floating liquid cooling module (5) away from the liquid cooling frame (1). The PCB board assembly (40) includes a PCB board (401) and a plurality of heat sources (402). The plurality of heat sources (402) are respectively disposed on the side of the PCB board (401) facing the floating liquid cooling module (5). Among them, multiple heat sources (402) abut against the floating liquid cooling module (5) and the heat-conducting boss (4) respectively through the heat-conducting layer (50).

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