Surface-mounted terminal and magnetic device
By designing a surface-mount terminal with a thickness smaller than that of traditional side electrodes, the problem of difficult AOI inspection caused by solder overflow was solved, enabling reliable judgment of soldering quality and improving inspection efficiency and effectiveness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2026-03-20
AI Technical Summary
In existing surface mount magnetic devices, the solder on the surface mount device (SMT) is difficult to overflow during vertical AOI inspection, which makes inspection difficult and affects the judgment of soldering quality.
Design a surface mount terminal, including a body and a surface mount part. The thickness of the body and the surface mount part is less than the maximum thickness of a conventional side electrode, and a small outer radius is formed at the connection to ensure that the solder is exposed in the vertical direction, which is convenient for AOI inspection.
By addressing the solder overflow issue, the reliability of vertical AOI inspection and the ability to determine solder quality have been improved, ensuring effective monitoring of solder quality.
Smart Images

Figure CN224021089U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of magnetic devices, in particular to a patch terminal and a magnetic device. BACKGROUND
[0002] With the rapid development of technology, especially the emergence of multifunctional devices, the demand for passive devices is increasing, and as one of the passive components, magnetic devices have been widely used. For patch magnetic devices, at least including a magnet, a winding and a terminal (also known as "external terminal" or "external electrode"), the terminal mainly undertakes two functions, one is as a wiring part or side electrode, electrically connected with the lead of the winding, and the other is as a patch electrode, electrically connected with a circuit board (such as a PCB, i.e. Printed Circuit Board) by SMT (Surface Mounted Technology).
[0003] Based on SMT, high-quality solder joints are the guarantee of the performance and reliability of electronic products. At present, vertical AOI (Automated Optical Inspection) technology is commonly used to check whether the solder joints have defects, the principle of which is to use optical technology to obtain the image of the detection position and analyze it when observing vertically downward along the line of sight direction parallel to the side of the magnetic device. However, the current patch electrode is usually directly bent from a conductor with uniform thickness (also known as "thick conductor"), and the thick conductor will also form a side electrode exposed on the side of the magnetic device after bending. The bottom surface of the patch electrode performing SMT forms an outer fillet with the side of the side electrode. At this point, after the magnetic device is electrically connected with the circuit board, most of the solder tin (which can be referred to as "SMT solder tin") of the patch electrode and the circuit board is located at the bottom of the magnetic device and the outer fillet, which is difficult to overflow, and is eventually blocked by the magnetic device, thereby making it difficult to collect the required SMT solder tin image when using vertical AOI technology, which is not conducive to vertical AOI detection and judgment. CONTENT OF THE UTILITY MODEL
[0004] In view of this, the present application provides a patch terminal and a magnetic device, which can improve the problem that SMT solder tin is not conducive to vertical AOI detection and judgment.
[0005] The patch terminal provided by the present application is used for a magnetic device, comprising:
[0006] A main body part at least used for being exposed and fitted to the side of the magnetic device, the main body part comprising a first part and a second part, the thickness of the second part being smaller than the thickness of the first part;
[0007] The patch part is connected perpendicularly to the second part and is used to expose and adhere to the bottom of the magnetic device, and the thickness of the patch part is less than or equal to the thickness of the second part.
[0008] Optionally, at least one of the following is met:
[0009] The thickness of the patch part is E11, and E11≤0.2mm is met;
[0010] The thickness of the second part is E12, and E12≤0.2mm is met;
[0011] The length of the second part along the extension direction of the main body part is F1, and F1≥0.1mm is met;
[0012] The connection between the patch part and the second part is rounded, and the outer radius of the rounded corner is R1, and R1≤0.5mm is met.
[0013] Optionally, the patch terminal further comprises a wiring part connected to the first part of the main body part, which is used to extend into the magnetic device and be electrically connected to the winding of the magnetic device.
[0014] Optionally, a soldering layer is arranged on the outer surface of the patch part and the second part.
[0015] The application provides a magnetic device, which comprises a magnet, a winding and any one of the patch terminals, the winding is arranged in the magnet, the main body part of the patch terminal is exposed and adhered to the side of the magnetic device, and the patch part of the patch terminal is exposed and adhered to the bottom of the magnetic device.
[0016] Optionally, the lead end of the winding is located in the magnet, and the patch terminal further comprises a wiring part connected to the first part of the main body part, which extends into the magnet and is electrically connected to the lead end of the winding.
[0017] The application provides a magnetic device, which comprises a magnet, a winding and a patch terminal, the winding is arranged in the magnet, and the winding is wound by a strip-shaped patch conductor;
[0018] The patch terminal comprises:
[0019] The main body part is exposed and adhered to the side of the magnet, the end of the strip-shaped patch conductor of the winding extends out of the magnet and is adhered to the side of the magnet, and is electrically connected to the main body part;
[0020] The patch portion is connected perpendicularly to the main body portion and is exposed and attached to the bottom of the magnet. The thickness of the patch portion and the thickness of the main body portion are both less than the thickness of the strip-shaped conductor on the side of the magnet.
[0021] Optionally, at least one of the following is satisfied:
[0022] The thickness of the patch portion is E2, and E2≤0.2mm is satisfied.
[0023] The thickness of the main body portion is E3, and E3≤0.2mm is satisfied.
[0024] The length of the main body portion in the extension direction of the main body portion is F2, and F2≥0.1mm is satisfied.
[0025] The connection between the patch portion and the main body portion is rounded, and the outer radius of the rounding is R2, and R2≤0.5mm is satisfied.
[0026] Optionally, the thickness of the patch portion is equal to the thickness of the main body portion.
[0027] Optionally, a soldering aid layer is arranged on the outer surface of the patch portion and the main body portion.
[0028] As described above, in the patch terminal and the magnetic device of the present application, the patch portion of the patch terminal corresponds to the patch electrode of the traditional magnetic device, and the main body portion corresponds to the side electrode of the traditional magnetic device. The thickness of the part of the patch electrode and the side electrode connected to the patch electrode is less than the maximum thickness of the side electrode. Therefore, the rounding at the connection between the patch electrode and the side electrode has a small outer radius of the rounding. The space formed by the terminal and the circuit board at this position is small. In the vertical direction, the SMT soldering tin for electrically connecting the patch electrode and the circuit board can be exposed to the side electrode, which is conducive to vertical AOI detection and judgment. BRIEF DESCRIPTION OF DRAWINGS
[0029] Figure 1 and Figure 2 are structural schematic diagrams of two perspectives of the magnetic device of the first embodiment of the present application;
[0030] Figure 3 is an exploded schematic diagram of the magnetic device shown in Figure 1
[0031] Figure 4 is a sectional view schematic diagram of the magnetic device shown in Figure 1
[0032] Figure 5 is a structural schematic diagram of the magnetic device and the circuit board after assembly shown in Figure 1
[0033] Figure 6 is a perspective view of the terminal and winding in electrical connection shown in FIG. 1; Figure 1 is a perspective view of the terminal and winding in electrical connection shown in FIG. 1;
[0034] Figure 7 is a side view of the terminal and winding in electrical connection shown in FIG. 1; Figure 6 is a side view of the terminal and winding in electrical connection shown in FIG. 1;
[0035] Figure 8 and Figure 9 are structural schematic diagrams of two perspectives of the magnetic device of the second embodiment of the present application;
[0036] Figure 10 is an exploded schematic diagram of the magnetic device shown in FIG. 2; Figure 8 is an exploded schematic diagram of the magnetic device shown in FIG. 2;
[0037] Figure 11 is a sectional schematic diagram of the magnetic device shown in FIG. 2 along the direction of A-A'; Figure 8 is a sectional schematic diagram of the magnetic device shown in FIG. 2 along the direction of A-A';
[0038] Figure 12 is a structural schematic diagram of the magnetic device assembled with the circuit board shown in FIG. 2; Figure 8 is a structural schematic diagram of the magnetic device assembled with the circuit board shown in FIG. 2;
[0039] Figure 13 is a perspective view of the terminal and winding in electrical connection shown in FIG. 3; Figure 8 is a perspective view of the terminal and winding in electrical connection shown in FIG. 3;
[0040] Figure 14 is a side view of the terminal and winding in electrical connection shown in FIG. 3. Figure 13 is a side view of the terminal and winding in electrical connection shown in FIG. 3.
[0041] first direction x, second direction y, third direction;
[0042] magnetic device 100, magnet 1, winding 2, patch terminal / terminal 3, lead 20; main body part 31, patch part 32, wiring part 33, first part 311, second part 312, solder 340, strip-shaped patch conductor 21, circuit board 200. DETAILED DESCRIPTION
[0043] To solve the above technical problems existing in the prior art, the patch terminal (referred to as "terminal" for short) of the present application comprises a main body part and a patch part, the patch part corresponds to the patch electrode of the traditional magnetic device, and the main body part corresponds to the side electrode of the traditional magnetic device. The thickness of the patch electrode and the part of the side electrode connected to the patch electrode is less than the maximum thickness of the side electrode. In this way, the fillet at the connection between the patch electrode and the side electrode has a smaller outer fillet radius, and the SMT solder for electrically connecting the patch electrode and the circuit board can be exposed to the outside of the side electrode in the vertical direction, which is beneficial to vertical AOI detection and judgment.
[0044] The specific forms of the shape, number, size, and other parameters of any one of the patch terminal, the main body part, the patch part, the magnetic device, the magnet, the winding, and the circuit board can be determined according to the actual needs, and the present application is not limited in this regard.
[0045] To make the objectives, technical solutions, and advantages of the present application clearer, the technical solutions of the present application will be described clearly below in conjunction with specific embodiments and corresponding drawings. Obviously, the following described embodiments are only some of the embodiments of the present application, rather than all the embodiments. In the case of no conflict, each of the following embodiments and technical features can be combined with each other, and also belong to the technical solutions of the present application.
[0046] In the description of the embodiments of the present application, the orientations or positional relationships indicated by the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “upper”, “lower”, “front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise”, and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the technical solutions of the corresponding embodiments, and do not indicate or imply that the devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and cannot be understood as a limitation of the present application.
[0047] First Embodiment
[0048] Referring to Figures 1 to 7 , a patch terminal (which can be simply referred to as “terminal” or “external terminal”) 3 of an example of the present application is shown, and a single terminal 3 includes a main body part 31, a patch part 32, and a wiring part 33, and the patch part 32 and the wiring part 33 can be vertically arranged at the upper and lower ends of the main body part 31. The terminal 3 is suitable for a magnetic device 100 as shown in Figure 1 and Figure 2 , and is used at least for electrical connection with a circuit board 200. The structure and assembly design of the terminal 3 will be described below in conjunction with the magnetic device 100.
[0049] The patch part 32 is arranged at the first end (i.e., the lower end or the bottom end) of the main body part 31 and is perpendicular to the extension direction (i.e., the second direction y) of the main body part 31. The patch part 32 can be exposed and attached to the bottom of the magnetic device 100. The magnetic device 100 of the present embodiment is equivalent to a patch magnetic device 100, and the patch part 32 can be regarded as part of the patch electrode or patch pin of the magnetic device 100 to be electrically connected to the circuit board 200 in a patch welding manner (e.g., SMT welding).
[0050] The wiring part 33 is arranged at the second end of the main body part 31, i.e., the upper end or the top end.
[0051] The main body 31 is at least exposed on the side of the magnetic device 100. The main body 31 can be a sheet structure, such as a conductive sheet, and includes a first part 311 and a second part 312. Therefore, the first part 311 and the second part 312 are also sheet structures such as conductive sheets, and their thicknesses are the same as the thickness of the conductive sheet. The thickness of the second part 312 is less than the thickness of the first part 311.
[0052] The patch portion 32 is vertically connected to the second portion 312 of the main body portion 31, and is exposed and attached to the bottom of the magnetic device 100. The thickness of the patch portion 32 is equal to the thickness of the second portion 312. In other examples, the thickness of the patch portion 32 may be less than the thickness of the second portion 312.
[0053] The magnetic device 100 includes a magnet 1, a winding 2, and a plurality of the aforementioned terminals 3. The number of terminals 3 provided in this application can be determined according to the type of the magnetic device 100; for example... Figure 3 , Figure 4 , Figure 6 and Figure 7 The magnetic device 100 shown may be provided with two terminals 3.
[0054] For ease of description and understanding, combined with Figures 1 to 7 In the orientation shown, the width direction of the magnetic device 100 is referred to as the first direction x, the height direction as the second direction y, and the thickness direction as the third direction z. The first direction x, the second direction y, and the third direction z are all perpendicular to each other and can be regarded as the three coordinate axes of a three-dimensional rectangular coordinate system. It should be understood that the term "perpendicular" throughout this application does not require that the angle between the two directions must be 90°, but allows for deviations of, for example, ±10°. That is, "perpendicular" can be understood as the angle between any two directions being 80° to 100°. Similarly, the term "parallel" throughout this application does not require that the angle between the two directions be 0° or 180°, but allows for deviations of, for example, ±10°. That is, "parallel" can be understood as the angle between any two directions being 0° to 10° or 170° to 190°.
[0055] Magnet 1 can be a rectangular magnetic component made of a soft magnetic material conventional in the art. The surface of magnet 1 may or may not have an insulating layer. The magnet 1 illustrated in this application is merely an example; other examples may also have other shapes.
[0056] Winding 2 is a wound structure, the shape of which and the specific number of turns can be determined according to the actual scenario. For example, winding 2 can be made of, for example... Figure 3 , Figure 4 , Figure 6 and Figure 7The shown lead wire (e.g. enameled wire) is wound, of course the winding 2 can also be formed by winding a strip-shaped (or long strip-shaped sheet-shaped) conductor (hereinafter referred to as "strip-shaped sheet conductor 21") shown in Figure 10 , Figure 11 , Figure 13 and Figure 14 around the axis, but the conductor applicable to the present embodiment is different from the strip-shaped sheet conductor 21 shown in Figure 10 , and specifically can be different in structure at the end portion and extending out of the magnet 1, the conductor can include a body and an insulating layer covering the outer surface of the body, and the body is an electrically conductive member. For ease of description, the winding 2 formed by the lead wire is taken as an example for illustration and description in the present embodiment.
[0057] Each end of the lead wire 20 can extend out of the magnet 1 and be electrically connected to the corresponding terminal 3, for example, welding can be used to achieve the electrical connection. In the examples of Figure 3 , Figure 6 and Figure 7 , the winding 2 is provided with two ends of the lead wire 20, and the magnetic device 100 is provided with two terminals 3, which are symmetrically arranged along the first direction x, and the shapes of the two terminals 3 can be the same as shown in the figure, or different.
[0058] The two ends of the lead wire 20 of the winding 2 coil can be located on the same side of the winding 2, for example, the upper side along the second direction y in the figure, and the wiring portion 33 of the two terminals 3 is completely arranged inside the magnet 1 and located adjacent to the upper side of the magnet 1, the wiring portion 33 of each terminal 3 is connected to the first portion 311 of the corresponding body portion 31, and is electrically connected to the corresponding end of the lead wire 20 of the winding 2 inside the magnet 1.
[0059] Based on the above, the patch portion 32 of the present example patch terminal 3 corresponds to the patch electrode of the conventional magnetic device, and the main body portion 31 corresponds to the side electrode of the conventional magnetic device. The thickness of the part (i.e., the second portion 312) of the patch electrode and the side electrode that is connected to the patch electrode is smaller than the maximum thickness (i.e., the thickness of the first portion 311) of the side electrode. This can make the fillet at the connection between the patch electrode and the side electrode have a smaller outer fillet radius. The space formed by the terminal 3 and the circuit board 200 at this location is small. Therefore, when the patch portion 32 and the circuit board 200 are welded to perform SMT mounting, the solder 340 used for welding can overflow and adhere to the outer surface of the second portion 312 of the side electrode. Therefore, the solder 340 after final solidification can protrude from the second portion 312 of each terminal 3. When the AOI technology is used, the AOI device can collect an image of the solder 340 along the direction of gravity (i.e., the opposite direction of the second direction y), which is beneficial for vertical AOI detection and judgment to determine whether the welding quality is qualified, and finally realizes effective monitoring of the SMT quality.
[0060] In an example, a soldering layer (not shown in the figure) can be arranged on the outer surface of the patch portion 32 (i.e., the surface away from the bottom of the magnet 1) and the outer surface of the second portion 312 of the main body portion 31 (i.e., the surface away from the side of the magnet 1), which is beneficial for welding with the circuit board 200. The soldering layer is a structure layer containing at least one of tin, nickel, silver, and gold.
[0061] In addition, the thickness of the second portion 312 and the thickness of the patch portion 32 are small, which facilitates the bending formation of the second portion 312 relative to the patch portion 32. Further, a gap is formed between the connection of the two portions and the first portion 311. In other examples of the present application, the magnet 1 of the magnetic device 100 can extend into the gap (not shown in the example) and be stably connected to the gap, which is beneficial for the stable assembly of the terminal 3 and the magnet 1 at the bottom of the magnetic device 100. Figures 1 to 7
[0062] In an example, the terminal 3 satisfies at least one of the following conditions:
[0063] The thickness of the patch portion 32 is E11, which satisfies E11≤0.2mm;
[0064] The thickness of the second portion 312 of the main body portion 31 is E12, which satisfies E12≤0.2mm;
[0065] The length (which can also be referred to as "height") of the second portion 312 of the main body portion 31 along the extension direction of the main body portion 31, i.e., along the second direction y, is F1, which satisfies F1≥0.1mm;
[0066] The connection between the patch portion 32 and the second portion 312 of the main body portion 31 is rounded, and the outer rounding radius of the rounded corner is R1, which satisfies R1≤0.5 mm.
[0067] Based on the above corresponding threshold range, the terminal 3 in this example can be beneficial for vertical AOI detection and assembly with the magnet 1, and can also ensure that the terminal 3 has high structural strength, at least at the connection between the patch portion 32 and the second portion 312 of the main body portion 31.
[0068] The embodiments of the present application also provide a magnetic device, which includes a magnet, a winding, and a patch terminal. The winding is arranged in the magnet. The patch terminal includes a main body portion and a patch portion. The main body portion is exposed and attached to the side of the magnet. The patch portion is exposed and attached to the bottom of the magnet. The structural design between these structural elements and the cooperation relationship therebetween can be referred to the corresponding embodiments described above. That is, the magnetic device can include the patch terminal 3 of any of the above examples to realize the magnetic device 100 of the corresponding examples, and thus has the beneficial effects of the patch terminal 3 of the corresponding examples.
[0069] Second embodiment
[0070] The same reference numerals are used to identify the same structural elements in the present application. Based on the description of the above embodiments, the cooperation relationship between the structural elements in the present embodiment can be understood in combination with the above embodiments. Figures 8 to 14 As shown in the drawings, in the magnetic device 100 of the present embodiment, the structure and cooperation relationship of the winding 2 and the patch terminal 3 are different from the above.
[0071] The winding 2 is wound by a strip-shaped conductor 21. Both ends of the strip-shaped conductor 21 extend out of the magnet 1 and are attached to the corresponding side of the magnet 1, so as to be electrically connected to the main body portion 31 on the corresponding side of the magnet 1. As shown in the drawings, Figure 11 、 Figure 13 and Figure 14 As shown in the drawings, along the second direction y, one end of the strip-shaped conductor 21 is located on the upper side of the winding 2, and the other end is located on the lower side of the winding 2. The main body portion 31 of the present embodiment assumes the role of the wiring portion 33 of the first embodiment described above, and each terminal 3 does not need to extend into the magnet 1. In addition, the thickness of the patch portion 32 and the thickness of the main body portion 31 are both less than the thickness of the strip-shaped conductor 21 on the side of the magnet 1. Optionally, the thickness of the patch portion 32 and the thickness of the main body portion 31 can be equal, and the terminal 3 can be directly bent from a strip-shaped conductive sheet with uniform thickness.
[0072] In the magnetic device 100 of the present embodiment, the patch portion 32 corresponds to the patch electrode of a conventional magnetic device, and the main body portion 31 corresponds to the side electrode of a conventional magnetic device. The thickness of the patch electrode and the portion of the side electrode (i.e. the main body portion 31) connected to the patch electrode are both less than the maximum thickness of the side electrode (i.e. the thickness of the strip-shaped patch conductor 21), so that the fillet at the connection between the patch electrode and the side electrode has a small fillet radius, and the space formed by the terminal 3 and the circuit board 200 is small. Therefore, when the patch portion 32 is soldered to the circuit board 200 to perform SMT mounting, the solder 340 after solidification will be exposed on the main body portion 31 of each terminal 3, which is conducive to vertical AOI detection and judgment to determine whether the soldering quality is qualified, and finally realizes effective monitoring of the SMT quality.
[0073] The magnetic device 100 of the present embodiment also has other differences in structure from the magnetic device 100 of the first embodiment described above, for example, the lengths of the main body portions 31 of the terminals 3 are different. The specific value ranges of the thicknesses, lengths and fillet radii of the main body portions 31 and the patch portions 32 of the terminals 3 can be different from or the same as those described above. That is, the terminals 3 of the present embodiment can satisfy at least one of the following conditions:
[0074] The thickness of the patch portion 32 is E2, and E2≤0.2mm is satisfied;
[0075] The thickness of the main body portion 31 is E3, and E3≤0.2mm is satisfied;
[0076] The length (which can also be referred to as "height") of the entire main body portion 31 along the extension direction of the main body portion 31, i.e. along the second direction y, is F2, and F2≥0.1mm is satisfied;
[0077] The connection between the patch portion 32 and the main body portion 31 is a fillet, and the fillet radius of the fillet is R2, and R2≤0.5mm is satisfied.
[0078] In addition, in an example, a soldering layer can be provided on the outer surface of the patch portion 32 and the entire main body portion 31, which is conducive to soldering to the circuit board 200.
[0079] The above only describes some embodiments of the present application, and does not limit the patent scope of the present application. For those skilled in the art, any equivalent structural transformation made by using the content of the present specification and drawings is also included in the patent protection scope of the present application.
[0080] Although the terms "first", "second", etc. are used herein to describe various information, the information should not be limited to these terms. These terms are only used to distinguish one category of information from another category of information. In addition, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "or" and "and / or" are to be construed as inclusive and meant to mean either one or any combination. Only when components, functions, steps, or operations are inherently mutually exclusive are they represented with "only one of" language.
Claims
1. A surface mount terminal for use in magnetic devices, characterized in that, include: The main body portion is at least exposed on the side of the magnetic device, the main body portion comprising a first portion and a second portion, wherein the thickness of the second portion is less than the thickness of the first portion; The patch portion, which is perpendicularly connected to the second part, is exposed and attached to the bottom of the magnetic device. The thickness of the patch portion is less than or equal to the thickness of the second part.
2. The surface mount terminal according to claim 1, characterized in that, At least one of the following must be met: The thickness of the patch portion is E11, which satisfies E11≤0.2mm; The thickness of the second part is E12, which satisfies E12≤0.2mm; Along the extending direction of the main body, the length of the second part is F1, which satisfies F1≥0.1mm; The connection between the patch portion and the second portion is rounded, and the outer radius of the rounded corner is R1, which satisfies R1≤0.5mm.
3. The surface mount terminal according to claim 1, characterized in that, The surface mount terminal also includes a wiring portion connected to a first part of the main body, for extending into the interior of the magnetic device and electrically connecting to the windings of the magnetic device.
4. The surface mount terminal according to any one of claims 1 to 3, characterized in that, A soldering flux layer is provided on the outer surface of the patch portion and the second portion.
5. A magnetic device, characterized in that, The device includes a magnet, a winding, and a surface mount terminal as described in any one of claims 1 to 4, wherein the winding is disposed within the magnet, the main body of the surface mount terminal is exposed and attached to the side of the magnet, and the surface mount portion of the surface mount terminal is exposed and attached to the bottom of the magnet.
6. The magnetic device according to claim 5, characterized in that, The lead end of the winding is located inside the magnet; the patch terminal also includes a wiring portion connected to the first part of the main body, the wiring portion extending into the magnet and electrically connected to the lead end of the winding.
7. A magnetic device, characterized in that, It includes a magnet, a winding, and a surface-mount terminal, wherein the winding is disposed within the magnet and is formed by winding a strip-shaped sheet conductor; The surface mount terminal includes: The main body is exposed and attached to the side of the magnet. The end of the strip-shaped conductor of the winding extends outside the magnet and is attached to the side of the magnet, and is electrically connected to the main body. The patch portion is perpendicularly connected to the main body portion and exposed and attached to the bottom of the magnet. The thickness of the patch portion and the thickness of the main body portion are both less than the thickness of the strip-shaped conductor on the side of the magnet.
8. The magnetic device according to claim 7, characterized in that, The thickness of the patch portion is equal to that of the main body portion.
9. The magnetic device according to claim 7, characterized in that, At least one of the following must be met: The thickness of the patch portion is E2, which satisfies E2≤0.2mm; The thickness of the main body is E3, which satisfies E3≤0.2mm; Along the extending direction of the main body, the length of the main body is F2, which satisfies F2≥0.1mm; The connection between the patch portion and the main body portion is rounded, and the outer radius of the rounded corner is R2, which satisfies R2≤0.5mm.
10. The magnetic device according to any one of claims 7 to 9, characterized in that, A soldering flux layer is provided on the outer surface of the patch portion and the main body portion.