Heat dissipation device, electronic equipment and vehicle

Abstract

The utility model relates to a heat dissipation device, electronic equipment and a vehicle, the heat dissipation device is provided with a first heat absorption end and a first heat release end, the heat dissipation device comprises a heat pipe assembly and a thermoelectric cooler, and the heat pipe assembly is provided with a second heat absorption end and a second heat release end; the thermoelectric cooler has a cold end and a hot end; wherein the second heat absorption end serves as the first heat absorption end and is used for being connected with a heating device in a heat conduction mode, the second heat release end is connected with the cold end in a heat conduction mode, and the hot end serves as the first heat release end and is used for dissipating heat. A fan cooling system or a liquid cooling system is replaced through the heat pipe assembly and the thermoelectric cooler, silent, pollution-free and efficient heat dissipation is achieved, and installation, maintenance, regulation and control are convenient.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a heat dissipation device, an electronic device and a vehicle. BACKGROUND

[0002] With the increasing intelligence of electronic systems (such as automobiles, medical devices and industrial equipment, etc.), the load of electronic devices (such as controllers, actuators, etc.) is increasing, and the power is greatly improved, and the heat generated is also significantly increased. If it cannot be effectively dissipated in time, it may cause the electronic device to overheat locally (at the heat generating device) and even be damaged, thereby affecting the normal operation of the entire system. Therefore, timely and rapid heat dissipation poses new challenges to ensure the reliability and performance of electronic devices.

[0003] However, electronic devices usually use fan cooling or liquid cooling system to achieve their cooling. However, such fan cooling and liquid cooling system have some deficiencies in actual application. The fan cooling method is easy to produce relatively large noise, affecting the user experience. Since it works in an open environment, it is easy to suck in dust, which is not only difficult to clean, but also may reduce the working efficiency of the fan and shorten its service life. The liquid cooling system has high requirements for the sealing of the product, increases the design complexity, and has high requirements for the installation environment, which is not conducive to flexible deployment. In addition, the liquid coolant of the liquid cooling system has the risk of leakage, which may cause environmental pollution or equipment damage. CONTENT OF THE INVENTION

[0004] The present application provides a heat dissipation device, an electronic device and a vehicle, which realizes silent, pollution-free and efficient heat dissipation, and is convenient to install, maintain and control, to at least partially solve the above technical problems.

[0005] In order to achieve the above purpose, according to the first aspect of the present application, a heat dissipation device is provided, the heat dissipation device has a first heat absorbing end and a first heat releasing end, and the heat dissipation device comprises:

[0006] a heat pipe assembly having a second heat absorbing end and a second heat releasing end; and

[0007] a thermoelectric cooler having a cold end and a hot end;

[0008] wherein the second heat absorbing end serves as the first heat absorbing end and is used for heat conduction connection with a heat generating device, the second heat releasing end is in heat conduction connection with the cold end, and the hot end serves as the first heat releasing end and is used for heat dissipation.

[0009] Optionally, the heat pipe assembly extends along a first direction;

[0010] the second heat absorbing end is used for arranging with the heat generating device in a second direction, and the second direction intersects with the first direction;

[0011] The second heat releasing end and the thermoelectric cooler are arranged in the second direction.

[0012] According to a second aspect of the present application, a heat dissipation device is provided, the heat dissipation device having a first heat absorbing end and a first heat releasing end, the heat dissipation device comprising:

[0013] a heat pipe assembly having a second heat absorbing end and a second heat releasing end; and,

[0014] a thermoelectric cooler having a cold end and a hot end;

[0015] The cold end is used as the first heat absorbing end and is used to be in heat conduction connection with a heat generating device, the hot end is in heat conduction connection with the second heat absorbing end, and the second heat releasing end is used as the first heat releasing end and is used to dissipate heat.

[0016] Optionally, the heat pipe assembly comprises:

[0017] a heat pipe having a third heat absorbing end and a third heat releasing end; and,

[0018] a heat conduction block arranged at the third heat absorbing end and / or the third heat releasing end to serve as the second heat absorbing end and / or the second heat releasing end.

[0019] According to a third aspect of the present application, an electronic device is provided, comprising:

[0020] the heat dissipation device according to any one of the above; and,

[0021] a heat generating device in heat conduction connection with the first heat absorbing end.

[0022] Optionally, the electronic device further comprises a housing, and the heat generating device and the heat dissipation device are arranged in the housing.

[0023] The housing is in heat conduction connection with the first heat releasing end and is capable of dissipating heat.

[0024] Optionally, the electronic device further comprises a heat conduction gel, and the heat conduction gel is arranged between the heat generating device and the first heat absorbing end, and / or the heat conduction gel is arranged between the first heat releasing end and the housing.

[0025] Optionally, the electronic device further comprises a heat dissipation fin arranged outside the housing to dissipate heat.

[0026] Optionally, the housing comprises:

[0027] a first housing in heat conduction connection with the first heat releasing end;

[0028] a second shell, which is separate from the first shell, the heat generating device and the heat dissipating device being arranged between the first shell and the second shell; and

[0029] a connecting piece, which connects the first shell and the second shell and is capable of conducting heat.

[0030] Optionally, the electronic device further comprises a heat dissipation fin, at least one of the outer side of the first shell and the outer side of the second shell being provided with the heat dissipation fin.

[0031] Optionally, the inner side of the shell is provided with a first recess, and the heat pipe assembly is at least partially arranged in the first recess.

[0032] Optionally, the inner side of the shell is provided with a second recess, and the thermoelectric cooler is at least partially arranged in the second recess.

[0033] Optionally, the electronic device further comprises a limiting piece, which is arranged on the side of the thermoelectric cooler away from the bottom wall of the second recess, and the limiting piece is connected with the shell to limit the thermoelectric cooler.

[0034] According to a fourth aspect of the present application, a vehicle is provided, which comprises the electronic device according to any one of the above.

[0035] In the heat dissipation device of the present application, the second heat absorbing end of the heat pipe assembly is in heat-conducting connection with the heat generating device, absorbs the heat generated by the heat generating device, then rapidly transfers the heat to the second heat releasing end of the heat pipe assembly, and then the cold end of the thermoelectric cooler is used for cooling. Finally, the hot end of the thermoelectric cooler serves as the first heat releasing end of the entire heat dissipation device, and the heat is dissipated. Since there is no moving part and no liquid coolant is needed, the heat dissipation device can work without noise, pollution and long service life. No ventilation opening needs to be made on the electronic device, and the closed environment of the electronic device can be realized. It is not easy to accumulate dust, and no additional water pipe or other complex supporting facilities are needed. The installation environment requirement is not high. The heat dissipation device is small in size and light in weight, improves the adaptability, and is convenient to install and maintain. The efficient heat-conducting property of the heat pipe assembly improves the heat dissipation efficiency, and the cooling speed of the thermoelectric cooler can be accurately controlled by adjusting the input voltage. The requirements for working current and voltage are relatively loose, and the practicality is wide. That is, in the heat dissipation device of the present application, the heat pipe assembly and the thermoelectric cooler replace the fan cooling system or the liquid cooling system, realize silent, pollution-free and efficient heat dissipation, and are convenient to install, maintain and control.

[0036] Other features and advantages of the present application will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0038] For a more complete understanding of the present application and its advantages, the following description needs to be taken in conjunction with the drawings, in which the same reference numerals represent the same parts in the following description.

[0039] Figure 1 is a perspective view of an electronic device provided in an exemplary embodiment of the present disclosure;

[0040] Figure 2 is a side view of the electronic device in Figure 1 ;

[0041] Figure 3 is a front view of the electronic device in Figure 1 ;

[0042] Figure 4 is a sectional view at A-A of the electronic device in Figure 3 ;

[0043] Figure 5 is an enlarged view of a partial portion of the electronic device in Figure 4 ;

[0044] Figure 6 is an exploded view of the electronic device in Figure 1 ;

[0045] Figure 7 is a view of a partial component of the electronic device in Figure 6 ;

[0046] Figure 8 is a perspective view of the electronic device in Figure 1 from another angle.

[0047] Explanation of reference numerals:

[0048] 1000, electronic device; 100, heat dissipation device; 101, first heat absorbing end; 102, first heat releasing end; 10, heat pipe assembly; 11, second heat absorbing end; 12, second heat releasing end; 13, heat pipe; 131, third heat absorbing end; 132, third heat releasing end; 14, heat conduction block; 20, thermoelectric cooler; 21, cold end; 22, hot end; 200, heat generating component; 300, shell; 310, first shell; 320, second shell; 330, first groove; 340, second groove; 400, heat conduction gel; 500, connecting piece; 600, heat dissipation fin; 700, limiting piece; 800, fastener; 900, mainboard. DETAILED DESCRIPTION

[0049] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person skilled in the art without creative labor are within the protection scope of the present application.

[0050] The present application provides a heat dissipation device, Figures 1 to 8 The structure schematic diagram of the electronic device provided by the present application is shown.

[0051] Please refer to Figures 1 to 4 The electronic device 1000 includes a heat dissipation device 100 and a heat generating component 200, see Figure 5 The heat dissipation device 100 has a first heat absorbing end 101 and a first heat releasing end 102, and the heat dissipation device 100 has a clear first heat absorbing end 101 and a first heat releasing end 102, which ensures an efficient heat transfer path from the heat generating component 200 to the external environment.

[0052] The heat dissipation device 100 includes a heat pipe assembly 10 and a thermoelectric cooler 20, and the heat pipe assembly 10 has a second heat absorbing end 11 and a second heat releasing end 12, wherein the second heat absorbing end 11 is in heat conduction connection with the heat generating component 200 as the first heat absorbing end 101. The efficient heat conduction characteristics of the heat pipe assembly 10 enable the heat to be quickly transferred from the heat generating component 200 to the second heat releasing end 12 of the heat pipe assembly 10, which can quickly transfer the heat in a short time and reduce the risk of local overheating. The heat pipe assembly 10 has no mechanical moving parts, which reduces the possibility of wear and failure and prolongs the service life.

[0053] The thermoelectric cooler 20 has a cold end 21 and a hot end 22, the second heat-absorbing end 12 of the heat pipe assembly 10 is in heat-conducting connection with the cold end 21 of the thermoelectric cooler 20, and the hot end 22 of the thermoelectric cooler 20 serves as the first heat-dissipating end 102 for final heat dissipation. The thermoelectric cooler 20 can precisely control the cooling rate by adjusting the input voltage, thereby enhancing the flexibility and adaptability of the heat dissipation device 100. The thermoelectric cooler 20 almost has no noise when working, thereby providing a quiet working environment.

[0054] In the technical solution of the present application, the second heat-absorbing end 11 of the heat pipe assembly 10 is in heat-conducting connection with the heat-generating device 200 to absorb the heat generated by the heat-generating device 200, then rapidly transfer the heat to the second heat-dissipating end 12 of the heat pipe assembly 10, and then cool down through the cold end 21 of the thermoelectric cooler 20. Finally, the hot end 22 of the thermoelectric cooler 20 serves as the first heat-dissipating end 102 of the entire heat dissipation device 100 to dissipate the heat. Since there is no moving part and no liquid coolant is needed, the heat dissipation device 100 can work without noise, pollution, and long service life, without the need to open a ventilation opening on the electronic equipment 1000, so that the closed environment of the electronic equipment 1000 can be realized, dust accumulation is not easy, no additional water pipes or other complex supporting facilities are needed, the installation environment requirement is not high, the heat dissipation device 100 is small in size and light in weight, the adaptability is improved, and the installation and maintenance are facilitated. The high-efficiency heat-conducting property of the heat pipe assembly 10 improves the heat dissipation efficiency, the cooling speed of the thermoelectric cooler 20 is fast, the cooling rate of the thermoelectric cooler 20 can be precisely controlled by adjusting the input voltage, the requirements for working current and voltage are relatively loose, and the practicality is wide. That is, in the technical solution of the present application, the heat pipe assembly 10 and the thermoelectric cooler 20 replace the fan cooling system or the liquid cooling system to realize silent, pollution-free, and efficient heat dissipation, and facilitate installation, maintenance, and control.

[0055] In some embodiments, the heat pipe assembly 10 extends in a first direction; the second heat absorbing end 11 is arranged in a second direction with the heat generating device 200, the second direction intersects the first direction; the second heat releasing end 12 is arranged in the second direction with the thermoelectric cooler 20. In these embodiments, the heat dissipating device 100 can conduct heat in the first direction, so that heat is conducted from a high temperature area (an area where the heat generating device 200 is located) to a low temperature area (an area away from the heat generating device 200), achieving rapid heat dissipation. In addition, the second heat absorbing end 11 is arranged in the second direction with the heat generating device 200, and the second heat releasing end 12 is arranged in the second direction with the thermoelectric cooler 20, that is, at one end in the first direction, the heat pipe assembly 10 is stacked with the heat generating device 200, and at the other end in the first direction, the heat pipe assembly 10 is stacked with the thermoelectric cooler 20, avoiding the stacking of the heat generating device 200, the heat pipe assembly 10 and the thermoelectric cooler 20 in the second direction, achieving a relatively compact layout in the second direction, while not affecting the heat dissipation effect, reducing the size of the electronic device 1000 in the second direction.

[0056] According to a second aspect of the present application, a heat dissipation device 100 is provided, the heat dissipation device 100 has a first heat absorbing end 101 and a first heat releasing end 102, the heat dissipation device 100 comprises a heat pipe assembly 10 and a thermoelectric cooler 20, the heat pipe assembly 10 has a second heat absorbing end 11 and a second heat releasing end 12; the thermoelectric cooler 20 has a cold end 21 and a hot end 22; the cold end 21 is used as the first heat absorbing end 101 and is used to be in heat conduction connection with a heat generating device 200, the hot end 22 is in heat conduction connection with the second heat absorbing end 11, the second heat releasing end 12 is used as the first heat releasing end 102 and is used to dissipate heat. In these embodiments, the cold end 21 of the thermoelectric cooler 20 is in heat conduction connection with the heat generating device 200, the heat generating device 200 is cooled, and heat is transferred to the hot end 22 of the thermoelectric cooler 20 and then to the second heat absorbing end 11 of the heat pipe assembly 10, the heat pipe assembly 10 rapidly transfers heat, finally, the second heat releasing end 12 of the heat pipe assembly 10 is used as the first heat releasing end 102 of the entire heat dissipation device 100, and heat is dissipated. Since there is no moving part and no liquid coolant is needed, the heat dissipation device 100 can work without noise, pollution, and long service life, without the need to open a vent on the electronic equipment 1000, and the closed environment of the electronic equipment 1000 can be achieved, which is not easy to accumulate dust, does not need to be connected to a water pipe or other complex supporting facilities, and has low requirements for the installation environment. The heat dissipation device 100 is small in size and light in weight, improves adaptability, and is convenient to install and maintain. The high-efficiency heat conduction characteristics of the heat pipe assembly 10 improve the heat dissipation efficiency, the cooling speed of the thermoelectric cooler 20 is fast, the cooling rate of the thermoelectric cooler 20 can be accurately controlled by adjusting the input voltage, the requirements for working current and voltage are relatively loose, and the practicality is wide. That is, in these embodiments, the heat pipe assembly 10 and the thermoelectric cooler 20 replace the fan cooling system or the liquid cooling system to achieve silent, pollution-free, and efficient heat dissipation, and are convenient to install, maintain, and control. Specifically, the thermoelectric cooler 20 and the second heat absorbing end 11 are arranged in a second direction with the heat generating device 200, and the thermoelectric cooler 20 is arranged between the heat generating device 200 and the second heat absorbing end 11. The heat pipe assembly 10 extends along a first direction, and the first direction intersects the second direction. In this way, the heat generating device can conduct heat in the first direction, so that heat is conducted from a high-temperature area (an area where the heat generating device 200 is located) to a low-temperature area (an area away from the heat generating device 200), and rapid heat dissipation is achieved.

[0057] In some embodiments, see Figure 5 、 Figure 6 and Figure 7In some embodiments, the heat pipe assembly 10 includes a heat pipe 13 having a third heat absorbing end 131 and a third heat releasing end 132, and a heat conducting block 14 arranged at the third heat absorbing end 131 and / or the third heat releasing end 132 to serve as the second heat absorbing end 11 and / or the second heat releasing end 12. In these embodiments, the heat conducting block 14 arranged at the third heat absorbing end 131 and / or the third heat releasing end 132 of the heat pipe 13 to serve as the second heat absorbing end 11 or the second heat releasing end 12 can increase the contact area with the adjacent components and improve the heat conduction efficiency. For example, when the heat conducting block 14 serves as the second heat absorbing end 11 and contacts the heat generating device 200, the larger contact area can allow the heat to be more efficiently conducted from the heat generating device 200 to the heat pipe assembly 10. In particular, the heat conducting block 14 is a copper block.

[0058] The present application does not limit the specific type of the heat pipe 13. In some embodiments, the heat pipe 13 includes a pipe body and a capillary structure (also referred to as a wick) arranged in the pipe body, which can allow the working medium in the pipe body to return from the heat releasing end (condensation zone) to the heat absorbing end (evaporation zone) of the heat pipe. This can ensure the continuous and effective operation of the heat pipe and achieve efficient heat transfer. The heat pipe 13 with the capillary structure has strong heat transfer performance, is not dependent on gravity, is suitable for various postures, has good stability and reliability, and ensures the efficient heat transfer efficiency for a long time.

[0059] According to a third aspect of the present application, an electronic device 1000 is provided, which includes the heat dissipation device 100 and a heat generating device 200. The heat dissipation device 100 has the structure as described above, and the heat generating device 200 is in heat conductive connection with the first heat absorbing end 101. Since the electronic device 1000 adopts all the technical solutions of all the embodiments described above, it has at least the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0060] The present application does not limit the specific type of the electronic device 1000, which can be an actuator or a charging management system, etc. In particular, see Figure 4 and Figure 6 The electronic device 1000 is a controller, which includes a mainboard 900, and the heat generating device 200 is arranged on the mainboard 900. The heat generating device 200 can be a MOSFET, an IGBT, etc., which is not limited by the present application.

[0061] In some embodiments, the electronic device 1000 further includes a housing 300, within which the heat-generating device 200 and the heat dissipation device 100 are disposed. The housing 300 is thermally connected to the first heat-dissipating end 102 and is capable of heat dissipation. In these embodiments, the housing 300 protects the heat-generating device 200 and the heat dissipation device 100. The housing 300 is thermally connected to the first heat-dissipating end 102 and is capable of heat dissipation. Heat can be further transferred to the housing 300 through the thermal connection. As a large heat dissipation surface, the housing 300 can dissipate heat into the surrounding environment, increasing the overall heat dissipation area of ​​the electronic device 1000 and thus improving heat dissipation efficiency. Specifically, the housing 300 is made of aluminum or an aluminum alloy to achieve heat dissipation.

[0062] In some embodiments, see Figure 5 , Figure 6 and Figure 7 The electronic device 1000 also includes a thermally conductive gel 400, which is disposed between the heating element 200 and the first heat-absorbing end 101; and / or, the thermally conductive gel 400 is disposed between the first heat-releasing end 102 and the housing 300. In these embodiments, the thermally conductive gel 400 is a thermally conductive material with a certain degree of viscosity and flexibility. Between the heating element 200 and the first heat-absorbing end 101, it can make the two fit better. For the heating element 200 and the first heat-absorbing end 101, whose surfaces may be uneven, the thermally conductive gel 400 can conform to their shape to ensure the maximum contact area between the two, thereby improving the uniformity of heat conduction. The thermally conductive gel 400 can also play a similar role between the first heat-releasing end 102 and the housing 300. The use of the thermally conductive gel 400 avoids local overheating due to poor contact, ensures stable heat transfer throughout the heat dissipation path, helps maintain the stability of the internal temperature of the electronic device 1000, and reduces equipment performance fluctuations or malfunctions caused by unstable heat dissipation. In addition, it is understandable that during the operation of electronic device 1000, heat-generating device 200, heat dissipation device 100 and housing 300 may undergo thermal expansion due to temperature changes. The flexibility of thermal conductive gel 400 can adapt to this thermal expansion difference to a certain extent. It can buffer the stress generated between components due to thermal expansion, prevent the connection between components from becoming loose or damaged, thereby ensuring that heat dissipation device 100 can work normally under different working conditions and improving the stability of heat dissipation.

[0063] In some embodiments, see Figure 1 and Figure 2 The electronic device 1000 also includes heat dissipation fins 600, which are disposed on the outer side of the housing 300 for heat dissipation. In these embodiments, the heat dissipation fins 600 can significantly increase the heat dissipation area of ​​the electronic device 1000, thereby improving heat dissipation efficiency.

[0064] The application does not limit the manufacturing method of the shell 300 and the heat dissipation fin 600. In some examples, the shell 300 and the heat dissipation fin 600 are integrally formed, including but not limited to pressure casting, forging, extrusion, etc. This integrally formed method simplifies the manufacturing process, reduces assembly steps, and can ensure the structural strength and stability, avoiding the problem of thermal resistance or material mismatch caused by the connection method (such as welding), thereby ensuring efficient heat dissipation. In other examples, the shell 300 and the heat dissipation fin 600 are separately provided and then connected, including but not limited to welding, screw / bolt fixing, interference fit, etc. Separate settings give more design flexibility, allowing different types of optimal materials to be used to manufacture the shell 300 and the heat dissipation fin 600 to meet specific functional requirements, such as using materials with better thermal conductivity to make the heat dissipation fin 600, thereby further enhancing the heat dissipation effect.

[0065] In some embodiments, see Figure 6 and Figure 7 , the shell 300 includes a first shell 310, a second shell 320, and a connecting piece 500, the first shell 310 is in thermal contact with the first heat dissipation end 102; the second shell 320 is separately provided from the first shell 310, and the heat generating device 200 and the heat dissipation device 100 are arranged between the first shell 310 and the second shell 320; the connecting piece 500 connects the first shell 310 and the second shell 320 and can conduct heat. In these embodiments, during the production and assembly of the electronic device 1000, the first shell 310 and the second shell 320 can be machined and manufactured separately, and then assembled through the connecting piece 500, facilitating production operations, and the connecting piece 500 can conduct heat, so that part of the heat conducted from the first heat dissipation end 102 is directly dissipated through the first shell 310, and the other part is conducted to the second shell 320 through the connecting piece 500 and then dissipated, the second shell 320 can play a protective and auxiliary heat dissipation role, forming a multi-path heat dissipation mode, which can dissipate heat more quickly and reduce the temperature inside the electronic device 1000. Specifically, the connecting piece 500 is a metal screw or a metal bolt, etc., realizing the structural connection and heat conduction of the first shell 310 and the second shell 320.

[0066] In some embodiments, the electronic device 1000 further includes a heat dissipation fin 600, at least one of the outer side of the first shell 310 and the outer side of the second shell 320 is provided with the heat dissipation fin 600. In these embodiments, according to different use scenarios and heat dissipation requirements of the electronic device 1000, the heat dissipation fin 600 is flexibly selected to be arranged on the outer side of the first shell 310 or the second shell 320 or both, specifically, see Figure 1 、 Figure 2 and Figure 8The heat dissipation fins 600 can be arranged on the outer side of the first shell 310 and the second shell 320 at the same time to maximize the heat dissipation efficiency, or the heat dissipation fins 600 can be arranged on one of the first shell 310 and the second shell 320 to reduce the production cost and the weight of the equipment while meeting the heat dissipation requirement.

[0067] In some embodiments, referring to Figure 7 , the inner side of the shell 300 is provided with a first recess 330, and the heat pipe assembly 10 is arranged at least partially in the first recess 330. In these embodiments, the heat pipe assembly 10 is arranged at least partially in the first recess 330 to position the heat pipe assembly 10, and the heat pipe assembly 10 is stable in position to avoid loosening or disconnection between the heat pipe assembly 10 and other components, thereby ensuring that the heat dissipation device 100 can work normally in various use environments and continuously and effectively dissipate heat for the electronic device 1000. In addition, arranging the heat pipe assembly 10 in the first recess 330 on the inner side of the shell 300 can effectively utilize the space inside the shell 300, avoid occupying too much space due to random placement of the heat pipe assembly 10, make the internal layout of the electronic device 1000 more compact and reasonable, and facilitate the layout and installation of other components, thereby improving the utilization rate of the internal space of the electronic device 1000. Specifically, the heat pipe assembly 10 can also be welded to the shell 300.

[0068] In some embodiments, referring to Figure 7 , the inner side of the shell 300 is provided with a second recess 340, and the thermoelectric cooler 20 is arranged at least partially in the second recess 340. In these embodiments, the thermoelectric cooler 20 is arranged at least partially in the second recess 340 to position the thermoelectric cooler 20, and the thermoelectric cooler 20 is stable in position to avoid loosening or disconnection between the thermoelectric cooler 20 and other components, thereby ensuring that the heat dissipation device 100 can work normally in various use environments and continuously and effectively dissipate heat for the electronic device 1000. In addition, arranging the thermoelectric cooler 20 in the second recess 340 on the inner side of the shell 300 can effectively utilize the space inside the shell 300, avoid occupying too much space due to random placement of the thermoelectric cooler 20, make the internal layout of the electronic device 1000 more compact and reasonable, and facilitate the layout and installation of other components, thereby improving the utilization rate of the internal space of the electronic device 1000.

[0069] In some embodiments, referring to Figure 5 and Figure 7The electronic device 1000 further comprises a limiting member 700, which is arranged on the side of the thermoelectric cooler 20 away from the bottom wall of the second recess 340, and is connected with the shell 300 to limit the thermoelectric cooler 20 and expose part of the thermoelectric cooler 20. In these embodiments, the limiting member 700 is arranged on one side of the thermoelectric cooler 20 and connected with the shell 300 to limit the movement of the thermoelectric cooler 20, so as to ensure that the thermoelectric cooler 20 and the related components maintain a correct contact relationship and ensure the effectiveness of heat transfer. The exposed part of the thermoelectric cooler 20 is to meet the heat exchange requirement, for example, the thermoelectric cooler 20 exposes the cold end 21, which is in thermal conductive connection with the second heat releasing end 12 of the heat pipe assembly 10; or the thermoelectric cooler 20 exposes the cold end 21 and the hot end 22, the cold end 21 is in thermal conductive connection with the heat generating device 200 as the first heat absorbing end 101, and the hot end 22 is in thermal conductive connection with the second heat absorbing end 11 of the heat pipe assembly 10. Specifically, the limiting member 700 is installed on the shell 300 by means of fasteners 800 (such as screws).

[0070] According to a fourth aspect of the present application, a vehicle is provided, which comprises the electronic device 1000, and the structure of the electronic device 1000 is as described above. Since the vehicle adopts all the technical solutions of the above-mentioned embodiments, it has at least the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described here.

[0071] The vehicle can be a fuel automobile, a plug-in hybrid electric vehicle or a new energy vehicle, and the present disclosure does not make specific limitation thereon.

[0072] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0073] In the above-mentioned embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0074] The embodiments, implementation manners and related technical features of the present application can be combined or replaced with each other without conflict.

[0075] The above are only the preferred embodiments of the present application, and do not limit the present application in any form, but any simple modification, equivalent change and modification made to the above embodiments without departing from the technical solution of the present application and according to the technical essence of the present application are still within the scope of the technical solution of the present application.

Claims

1. A heat dissipation device, characterized in that, The heat dissipation device has a first heat absorption end and a first heat dissipation end, the heat dissipation device comprising: A heat pipe assembly having a second heat-absorbing end and a second heat-releasing end; and, Thermoelectric cooler, having a cold end and a hot end; Wherein, the second heat-absorbing end serves as the first heat-absorbing end and is used for thermally conductive connection with the heating device; the second heat-releasing end is thermally conductively connected with the cold end; and the hot end serves as the first heat-releasing end and is used for heat dissipation.

2. The heat dissipation device according to claim 1, characterized in that, The heat pipe assembly extends along a first direction; The second heat-absorbing end is arranged with the heating device in a second direction, which intersects with the first direction; The second heat-dissipating end and the thermoelectric cooler are arranged in the second direction.

3. A heat dissipation device, characterized in that, The heat dissipation device has a first heat absorption end and a first heat dissipation end, the heat dissipation device comprising: A heat pipe assembly having a second heat-absorbing end and a second heat-releasing end; and, Thermoelectric cooler, having a cold end and a hot end; The cold end serves as the first heat-absorbing end and is used for thermally conductive connection with the heat-generating device. The hot end is thermally connected to the second heat-absorbing end, and the second heat-releasing end serves as the first heat-releasing end and is used for heat dissipation.

4. The heat dissipation device according to any one of claims 1 to 3, characterized in that, The heat pipe assembly includes: A heat pipe having a third heat-absorbing end and a third heat-releasing end; and, A heat-conducting block is disposed at the third heat-absorbing end and / or the third heat-releasing end to serve as the second heat-absorbing end and / or the second heat-releasing end.

5. An electronic device, characterized in that, include: The heat dissipation device as described in any one of claims 1 to 4; as well as, The heating element is thermally connected to the first heat-absorbing end.

6. The electronic device according to claim 5, characterized in that, The electronic device also includes a housing, and the heat-generating device and the heat dissipation device are both disposed within the housing; The shell is thermally connected to the first heat-dissipating end and is capable of dissipating heat.

7. The electronic device according to claim 6, characterized in that, The electronic device further includes a thermally conductive gel, which is disposed between the heating element and the first heat-absorbing end; and / or, the thermally conductive gel is disposed between the first heat-releasing end and the housing.

8. The electronic device according to claim 6, characterized in that, The electronic device also includes heat dissipation fins, which are disposed on the outside of the housing for heat dissipation.

9. The electronic device according to claim 6, characterized in that, The housing includes: The first housing is thermally connected to the first heat-dissipating end; The second housing is separately disposed from the first housing, and the heating element and the heat dissipation device are disposed between the first housing and the second housing; and... A connector that connects the first housing and the second housing and is capable of conducting heat.

10. The electronic device according to claim 9, characterized in that, The electronic device further includes heat dissipation fins, and at least one of the outer side of the first housing and the outer side of the second housing is provided with the heat dissipation fins.

11. The electronic device according to claim 6, characterized in that, The inner side of the housing is provided with a first groove, and the heat pipe assembly is at least partially disposed in the first groove.

12. The electronic device according to claim 6, characterized in that, The inner side of the housing is provided with a second groove, and the thermoelectric cooler is at least partially disposed in the second groove.

13. The electronic device according to claim 12, characterized in that, The electronic device further includes a limiting member disposed on the side of the thermoelectric cooler away from the bottom wall of the second groove, and the limiting member is connected to the housing to limit the thermoelectric cooler.

14. A vehicle, characterized in that, Includes the electronic device as described in any one of claims 5 to 13.

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