Fixed-point tin melting mounting device

Abstract

The utility model relates to the technical field of SMT (Surface Mount Technology) mounting, in particular to a fixed-point tin melting mounting device, which comprises an equipment bracket, a mounting plate fixedly connected to the front side of the upper end of the equipment bracket, a hydraulic cylinder fixedly mounted at the front end of the mounting plate, and a heating fan fixedly mounted in the middle of the upper end of the equipment bracket, the lower end of a telescopic rod in the hydraulic cylinder is fixedly connected with a tin melting assembly. The tin melting assembly comprises a lifting frame, a flow dividing pipe, a first connecting hose, an adjusting valve, an air inlet hose, a fixing frame, a second connecting hose, a guide rod, a mounting base, a fourth connector, a heating head and a locking screw. In the using process, according to tin points on the surfaces of different circuit boards, the installation base slides front and back and rotates left and right on the surfaces of the guide rods, the position and angle of the heating head are adjusted, the heating head can be suitable for the circuit boards of different models and different tin point positions, and the adaptability and using convenience of the heating head are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to SMT mounting technical field, concretely relates to a fixed point tin melting mounting device. BACKGROUND

[0002] SMT (Surface Mount Technology) is the most popular technology and process in electronic assembly industry, electronic circuit surface assembly technology is called surface mounting or surface mounting technology, it is a kind of short pin or short lead surface assembly component (abbreviation SMC / SMD, Chinese called sheet component) is installed on the surface of printed circuit board (PCB) or the surface of other substrate, through reflow soldering or dip soldering etc. Circuit connection technology is welded and assembled.

[0003] Among the announcement number CN117177473B discloses a kind of cover type zoning fixed point tin melting device before component mounting, circuit board moves to the positive below of hot trapezoidal table, tin paste on the circuit board that needs to mount surface-mounted electronic component is heated, it is convenient to temporarily fix electronic component when mounting surface-mounted electronic component, and hot trapezoidal table is moved to reduce wind heat after preheating is completed.

[0004] But in actual use process, since the shape specification of different circuit boards is different, the surface component mounting position is also different, and the position of the heat conduction through hole in the device is fixed, only can realize heating to one kind of circuit board, and the adaptability is poor.

[0005] Therefore, it is necessary to invent a kind of fixed point tin melting mounting device to solve the above problems. UTILITY MODEL CONTENTS

[0006] The utility model aims at providing a kind of fixed point tin melting mounting device, to solve the problem that the position of the heat conduction through hole in the device is fixed in the technology, only can realize heating to one kind of circuit board, and the adaptability is poor.

[0007] In order to realize the above-mentioned purpose, the utility model provides the following technical scheme: a kind of fixed point tin melting mounting device, including equipment support, the upper end front side of the equipment support is fixedly connected with mounting plate, the front end of the mounting plate is fixedly installed with hydraulic cylinder, the upper end middle part of the equipment support is fixedly installed with heating fan, the lower end of the telescopic rod in the hydraulic cylinder is fixedly connected with tin melting assembly, tin melting assembly includes lifting frame, shunt pipe, first connecting hose, regulating valve, air inlet hose, fixing frame, second connecting hose, guide rod, mounting seat, fourth connecting head, heating head, locking screw.

[0008] By adopting the technical scheme, the hydraulic cylinder is used to drive the tin melting assembly to ascend and descend, the height of the tin melting assembly is adjusted, and the heating fan is used to blow hot air, the hot air is blown out by the multiple groups of heating heads, tin melting is performed at fixed points, the mounting seat can be slid on the surface of the guide rod and rotated left and right according to the position of the tin point on the surface of the circuit board, the position and angle of the heating head are adjusted, the heating head can be applied to circuit boards of different models and different tin point positions, and the adaptability and use convenience are improved.

[0009] Optionally, the lifting frame is fixedly connected with the lower end of the telescopic rod in the hydraulic cylinder, and the left and right ends of the lifting frame are fixedly connected with the shunt pipes.

[0010] Optionally, the rear ends of the two groups of shunt pipes are fixedly connected with second connecting heads, the upper end of the air inlet hose is fixedly connected with the second connecting heads, and the upper end of the air inlet hose is fixedly connected with the air outlet of the heating fan.

[0011] By adopting the technical scheme, the hot air blown by the heating fan is transported to the two shunt pipes through the air inlet hose.

[0012] Optionally, the surface of the shunt pipe is fixedly connected with multiple groups of first connecting heads, the lower end of each group of first connecting heads is fixedly connected with a first connecting hose, and the inside of each group of first connecting heads is provided with an adjusting valve.

[0013] By adopting the technical scheme, the connecting position of the first connecting hose and the first connecting head can be sealed through the adjusting valve, and the exhaust of the heating head is controlled.

[0014] Optionally, the lower surface of the lifting frame is fixedly connected with multiple groups of fixing rods, and the lower end of the fixing rod is fixedly connected with the fixing frame.

[0015] Optionally, the left and right sides of the upper surface of the fixing frame are fixedly connected with multiple groups of third connecting heads, the lower end of the first connecting hose is fixedly connected with the third connecting head, and the lower end of each group of third connecting heads is fixedly connected with a second connecting hose.

[0016] By adopting the technical scheme, the hot air in the shunt pipe is sent into the inside of the second connecting hose through the first connecting hose and the third connecting head.

[0017] Optionally, the front and rear sides of the lower surface of the fixing frame are fixedly connected with two groups of connecting plates, the two ends of the guide rod are fixedly connected with the front and rear two groups of connecting plates, the surface of the guide rod is slidably connected with multiple groups of mounting seats, and the lower surface of the mounting seat is threadedly connected with the locking screw.

[0018] By adopting the above technical solution, the mounting base can slide back and forth on the surface of the guide rod, and can also rotate left and right. Furthermore, by tightening the locking screws, the position and angle of the mounting base can be locked and fixed.

[0019] Optionally, the fourth connector is fixedly connected to the side of the mounting base, the lower end of the second connecting hose is fixedly connected to the upper end of the fourth connector, and the heating head is fixedly connected to the lower end of the fourth connector.

[0020] By adopting the above technical solution, the hot air inside the second connecting hose enters the interior of the heating head through the fourth connector, and the heating head sprays out the hot air to melt the solder points on the surface of the circuit board.

[0021] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0022] 1. This utility model adjusts the position and angle of the heating head by sliding the mounting base back and forth and rotating it left and right on the surface of the guide rod, thereby enabling it to melt solder points at different locations. It is applicable to circuit boards of different models and with different solder point positions, improving the adaptability and ease of use of the equipment.

[0023] 2. This utility model utilizes a regulating valve to open and close the connection between the first connecting hose and the first connector, which further facilitates the control of the exhaust air of the heating head and can control the air volume of the heating head, avoiding excessive melting of the solder joints. At the same time, it ensures that the lower end of the heating head is precisely aligned with the solder joint position, improving melting accuracy. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0025] Figure 2 This is a schematic diagram of the tin melting component structure of this utility model;

[0026] Figure 3 This is a schematic diagram of the lifting frame structure of this utility model;

[0027] Figure 4 This is a schematic diagram of the fixing frame structure of this utility model;

[0028] Figure 5 This is a schematic diagram of the guide rod structure of this utility model.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Equipment bracket; 11. Mounting plate; 12. Heating fan; 13. Hydraulic cylinder; 2. Lifting frame; 21. Diverter pipe; 22. First connector; 23. First connecting hose; 24. Regulating valve; 25. Second connector; 26. Air inlet hose; 27. Fixing rod; 3. Fixing frame; 31. Third connector; 32. Second connecting hose; 33. Connecting plate; 34. Guide rod; 35. Mounting base; 36. Fourth connector; 37. Heating head; 38. Locking screw. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0032] This utility model provides, for example Figures 1 to 3 The device shown includes a fixed-point solder melting and mounting device, comprising an equipment bracket 1, a mounting plate 11 fixedly connected to the upper front side of the equipment bracket 1, a hydraulic cylinder 13 fixedly mounted at the front end of the mounting plate 11, a heating fan 12 fixedly mounted at the upper middle part of the equipment bracket 1, and a solder melting assembly fixedly connected to the lower end of the telescopic rod in the hydraulic cylinder 13. The solder melting assembly includes a lifting frame 2, a diverter pipe 21, a first connecting hose 23, a regulating valve 24, an air inlet hose 26, a fixing frame 3, a second connecting hose 32, a guide rod 34, a mounting base 35, a fourth connector 36, a heating head 37, and a locking screw 38. The lifting frame 2 is fixedly connected to the lower end of the telescopic rod in the hydraulic cylinder 13, and multiple sets of fixing rods 27 are fixedly connected to the lower surface of the lifting frame 2. The lower ends of the fixing rods 27 are fixedly connected to the fixing frame 3.

[0033] During use, when the circuit board reaches the lower side of the device, the hydraulic cylinder 13 and the heating fan 12 are activated. The hydraulic cylinder 13 pushes the solder melting component downward, bringing the heating head 37 closer to the circuit board surface. At the same time, the hot air blown by the heating fan 12 passes through the air inlet hose 26, the first connecting hose 23, and the second connecting hose 32 in sequence, and finally exits from the heating head 37, melting the solder points on the circuit board surface at a specific point. In addition, since multiple sets of circuit board surfaces need to be heated continuously during use, the heating fan 12 is always running, and the heating head 37 continuously blows hot air. After heating is completed, the hydraulic cylinder 13 lifts the solder melting component upward, moving the heating head 37 away from the circuit board, thereby reducing its heating capacity and preventing it from heating other solder points on the circuit board surface.

[0034] See Figures 2 to 5Both ends of the lifting frame 2 are fixedly connected to a diversion pipe 21. The rear ends of the two diversion pipes 21 are fixedly connected to a second connector 25. The upper end of the air inlet hose 26 is fixedly connected to the second connector 25. The upper end of the air inlet hose 26 is fixedly connected to the air outlet of the heating fan 12. Multiple sets of first connectors 22 are fixedly connected to the surface of the diversion pipe 21. The lower ends of the multiple sets of first connectors 22 are fixedly connected to a first connecting hose 23. The interior of each set of first connectors 22 is equipped with a regulating valve 24. Multiple sets of third connectors 31 are fixedly connected to the left and right sides of the upper surface of the fixed frame 3. The lower ends of the first connecting hoses 23 are fixedly connected to the third connectors 3. The third connector 31 is fixedly connected to the lower end of each of the multiple sets of third connectors 31. The lower ends of each set of third connectors 31 are fixedly connected to the second connecting hose 32. The front and rear sides of the lower surface of the fixing frame 3 are fixedly connected to two sets of connecting plates 33. The two ends of the guide rod 34 are fixedly connected to the front and rear sets of connecting plates 33 respectively. Multiple sets of mounting seats 35 are slidably connected to the surface of the guide rod 34. The locking screw 38 is threadedly connected to the lower surface of the mounting seat 35. The fourth connector 36 is fixedly connected to the side of the mounting seat 35. The lower end of the second connecting hose 32 is fixedly connected to the upper end of the fourth connector 36. The heating head 37 is fixedly connected to the lower end of the fourth connector 36.

[0035] Specifically, before use, adjust the angle and position of the heating head 37 according to the location of the solder joint. At the same time, close the regulating valve 24 corresponding to the mounting position of the surface-mount components on the circuit board that do not need to be heated, open the regulating valve 24 corresponding to the mounting position of the surface-mount components on the circuit board that need to be heated, and adjust the exhaust volume of the heating head 37 according to the size of the solder joint.

[0036] Next, during the melting of the solder joints on the circuit board surface, the hydraulic cylinder 13 pushes the lifting frame 2 and the fixing frame 3 downwards, so that the heating head 37 is precisely aligned with the upper side of the solder joint. At this time, the hot air discharged by the heating fan 12 is transmitted to the two-way diversion pipes 21 through the air inlet hose 26. Then, the hot air inside the diversion pipe 21 is sent into the first connecting hose 23 through the second connector 25, then into the second connecting hose 32 through the third connector 31, and then into the heating head 37 through the fourth connector 36. The heating head 37 then precisely blows the hot air onto the solder joint, precisely melting the solder joint.

[0037] In addition, during the adjustment of the position of the heating head 37, firstly, turn the locking screw 38 counterclockwise to loosen the gap between the mounting base 35 and the guide rod 34. Then, slide the mounting base 35 back and forth on the surface of the guide rod 34 to adjust the position of the heating head 37. At the same time, rotate the mounting base 35 to adjust the left and right angle of the heating head 37. After the position is adjusted, turn the locking screw 38 clockwise so that the inner end of the locking screw 38 abuts against the surface of the guide rod 34 to lock and fix the mounting base 35, thereby fixing the heating head 37. This allows for precise melting of solder points at different locations, improving the adaptability of the equipment.

[0038] The working principle of this utility model is as follows: the hydraulic cylinder 13 drives the solder melting component to rise and fall, and the height of the solder melting component is adjusted. The hot air blown out by the heating fan 12 is sprayed out at fixed points through multiple heating heads 37 to perform fixed-point solder melting. During use, according to the position of the solder point on the circuit board surface, the mounting base 35 slides back and forth on the surface of the guide rod 34 and rotates left and right to adjust the position and angle of the heating head 37, so that it can be used for circuit boards of different models and different solder point positions, improving its adaptability and ease of use.

[0039] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A fixed-point solder placement device, comprising an equipment bracket (1), characterized in that: The upper front side of the equipment bracket (1) is fixedly connected to the mounting plate (11), the front end of the mounting plate (11) is fixedly installed with a hydraulic cylinder (13), the upper middle part of the equipment bracket (1) is fixedly installed with a heating fan (12), the lower end of the telescopic rod in the hydraulic cylinder (13) is fixedly connected with a solder melting assembly, the solder melting assembly includes a lifting frame (2), a diverter pipe (21), a first connecting hose (23), a regulating valve (24), an air inlet hose (26), a fixing frame (3), a second connecting hose (32), a guide rod (34), a mounting base (35), a fourth connector (36), a heating head (37), and a locking screw (38).

2. The fixed-point solder placement device according to claim 1, characterized in that: The lower end of the telescopic rod in the hydraulic cylinder (13) is fixedly connected to the lifting frame (2), and the left and right ends of the lifting frame (2) are fixedly connected to the diversion pipe (21).

3. The fixed-point solder placement device according to claim 2, characterized in that: The rear ends of the two sets of diversion pipes (21) are fixedly connected to a second connector (25), the upper end of the air inlet hose (26) is fixedly connected to the second connector (25), and the upper end of the air inlet hose (26) is fixedly connected to the air outlet of the heating fan (12).

4. The fixed-point solder placement device according to claim 1, characterized in that: The surface of the diversion pipe (21) is fixedly connected to multiple sets of first connectors (22), the lower ends of the multiple sets of first connectors (22) are fixedly connected to first connecting hoses (23), and the interior of the multiple sets of first connectors (22) is equipped with regulating valves (24).

5. The fixed-point solder placement device according to claim 1, characterized in that: The lower surface of the lifting frame (2) is fixedly connected to multiple sets of fixing rods (27), and the lower end of the fixing rods (27) is fixedly connected to the fixing frame (3).

6. The fixed-point solder placement device according to claim 5, characterized in that: Multiple sets of third connectors (31) are fixedly connected to the left and right sides of the upper surface of the fixed frame (3). The lower end of the first connecting hose (23) is fixedly connected to the third connector (31), and the lower ends of the multiple sets of third connectors (31) are fixedly connected to the second connecting hose (32).

7. The fixed-point solder placement device according to claim 6, characterized in that: Two sets of connecting plates (33) are fixedly connected to the front and rear sides of the lower surface of the fixed frame (3). The two ends of the guide rod (34) are fixedly connected to the front and rear sets of connecting plates (33) respectively. Multiple sets of mounting seats (35) are slidably connected to the surface of the guide rod (34). The locking screw (38) is threadedly connected to the lower surface of the mounting seat (35).

8. The fixed-point solder placement device according to claim 7, characterized in that: The fourth connector (36) is fixedly connected to the side of the mounting base (35), the lower end of the second connecting hose (32) is fixedly connected to the upper end of the fourth connector (36), and the heating head (37) is fixedly connected to the lower end of the fourth connector (36).

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