IGBT (Insulated Gate Bipolar Translator) radiating and cooling device

Abstract

An IGBT heat dissipation cooling device comprises a heat dissipation substrate (10), a fixed plate (20) arranged on the heat dissipation substrate (10) and an IGBT chip (30) arranged on the fixed plate (20), a cavity is arranged in the heat dissipation substrate (10), a water outlet nozzle (13) and a water inlet nozzle (14) which are communicated with the cavity are arranged on the heat dissipation substrate (10), a shunting fin (15) is accommodated in the cavity, and the IGBT chip (30) is arranged on the fixed plate (20). The flow dividing fins (15) comprise a plurality of sawtooth-shaped fins (154), the sawtooth-shaped fins (154) are arranged side by side in the width direction of the cavity, and every two adjacent sawtooth-shaped fins (154) are partially arranged in a staggered mode. According to the utility model, not only is the contact area between the cooling liquid and the shunting fins increased, but also the heat conduction area between the heat dissipation substrate and the IGBT chip is increased, the heat dissipation effect can be effectively improved, and the high-power IGBT heat dissipation structure has strong heat dissipation capability when heat dissipation is carried out on a high-power IGBT.

Description

TECHNICAL FIELD

[0001] The utility model relates to a radiator technical field especially IGBT heat dissipation cooling device. BACKGROUND

[0002] IGBT (English full name: Insulated Gate Bipolar Transistor, insulated gate bipolar transistor), it is a full control type voltage drive type power semiconductor device, and the semiconductor device is by bipolar junction transistor (BJT) and metal-oxide-semiconductor field effect transistor (MOSFET) compound, so as to have the advantages of both, namely input impedance is high, control power is small, easy to drive, switching frequency is high, on-current is big and on-loss is small etc.

[0003] The utility model discloses a kind of IGBT heat dissipation bottom plate, the IGBT heat dissipation bottom plate includes heat dissipation substrate and multiple heat dissipation groups, multiple the heat dissipation groups are arranged at the end face of one end of the heat dissipation substrate, the heat dissipation group includes two complementary shapes heat dissipation columns, two The heat dissipation column is spaced and oppositely arranged between the heat dissipation column.The IGBT heat dissipation bottom plate although increases the heat dissipation area of heat dissipation column and cooling liquid contact, improves heat dissipation effect, but heat dissipation area increases limitedly, when high-power IGBT is heat dissipated, still insufficient, and heat dissipation capacity needs to be improved.

[0004] Therefore, prior art needs to be improved and improved. UTILITY MODEL CONTENTS

[0005] In view of the deficiencies in the prior art, the purpose of the utility model is to provide an IGBT heat dissipation cooling device with large heat dissipation area and strong heat dissipation capacity.

[0006] The utility model is to achieve the above-mentioned purposes through the following technical means:

[0007] An IGBT heat dissipation cooling device, comprising a heat dissipation substrate, a fixing plate arranged on the heat dissipation substrate, and an IGBT chip arranged on the fixing plate, a cavity is arranged in the heat dissipation substrate, a water outlet nozzle and a water inlet nozzle are arranged on the heat dissipation substrate and communicate with the cavity, a flow dividing fin is arranged in the cavity, the flow dividing fin comprises a plurality of sawtooth fins, the plurality of sawtooth fins are arranged side by side along the width direction of the cavity, and adjacent two sawtooth fins are partially staggered.

[0008] As a further scheme of the utility model, the heat dissipation base plate includes a bottom plate and a base plate arranged on the bottom plate, the bottom plate has a lower groove, the base plate has an upper groove corresponding to the lower groove, the lower groove includes a first lower groove, a second lower groove and a third lower groove, and the depth of the second lower groove is deeper than the depths of the first lower groove and the third lower groove.

[0009] As a further scheme of the utility model, the heat dissipation base plate includes a bottom plate and a base plate arranged on the bottom plate, the bottom plate has a lower groove, the base plate has an upper groove corresponding to the lower groove, the lower groove includes a first lower groove, a second lower groove and a third lower groove, and the depth of the second lower groove is deeper than the depths of the first lower groove and the third lower groove.

[0010] As a further scheme of the utility model, the first lower groove is provided with a positioning boss, the first shunt fin is provided with a lower positioning hole, and the positioning boss is inserted into the lower positioning hole.

[0011] As a further scheme of the utility model, the upper groove includes a first upper groove, a second upper groove and a third upper groove, and the depth of the second upper groove is deeper than the depths of the first upper groove and the third upper groove.

[0012] As a further scheme of the utility model, the shape of the fixing plate is matched with the shape of the upper groove, and the fixing plate is installed in the upper groove.

[0013] As a further scheme of the utility model, the edges of the fixing plate are uniformly provided with a plurality of nut columns, the edges of the IGBT chip are uniformly provided with a plurality of mounting holes, a plurality of screws are threadedly connected with corresponding plurality of nut columns through a plurality of mounting holes, and the IGBT chip and the fixing plate are fixed together.

[0014] As a further scheme of the utility model, the fixing plate is provided with a plurality of positioning columns, and the IGBT chip is provided with upper positioning holes corresponding to the plurality of positioning columns.

[0015] As a further scheme of the utility model, the fixing plate includes a first fixing plate, a second fixing plate and a third fixing plate, the first fixing plate and the third fixing plate are oppositely provided with two positioning columns at the middle part along the length direction, and the second fixing plate is oppositely provided with two positioning columns at the middle part along the width direction.

[0016] Compared with the prior art, the utility model has the beneficial effects that:

[0017] Due to the adoption of the above structure design, namely, the split-flow fins are arranged in the cavity of the heat dissipation base plate, the split-flow fins comprise a plurality of sawtooth fins, the plurality of sawtooth fins are arranged side by side along the width direction of the cavity, and adjacent two sawtooth fins are partially staggered, which not only increases the contact area of the cooling liquid and the split-flow fins, but also increases the heat conduction area of the heat dissipation base plate and the IGBT chip, so that the heat dissipation effect can be effectively improved, and the heat dissipation capacity is relatively strong when the high-power IGBT is cooled. BRIEF DESCRIPTION OF DRAWINGS

[0018] ATTACHMENT Figure 1 It is a structural schematic diagram of the embodiment of the utility model;

[0019] ATTACHMENT Figure 2 It is an exploded structural schematic diagram of the embodiment of the utility model.

[0020] The numbers in the figure are respectively:

[0021] 10-heat dissipation base plate, 20-fixed plate, 30-IGBT chip, 40-screw;

[0022] 11-bottom plate, 12-base plate, 13-water inlet nozzle, 14-water outlet nozzle, 15-split-flow fin;

[0023] 111-first lower groove, 112-second lower groove, 113-third lower groove;

[0024] 151-first split-flow fin, 152-second split-flow fin, 153-third split-flow fin, 154-sawtooth fin;

[0025] 1111-positioning boss;

[0026] 1511-lower positioning hole;

[0027] 121-first upper groove, 122-second upper groove, 123-third upper groove;

[0028] 21-first fixed plate, 22-second fixed plate, 23-third fixed plate, 24-nut column, 25-positioning column;

[0029] 31-mounting hole, 32-upper positioning hole. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical scheme and advantages of the utility model clearer and more apparent, the utility model will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model, that is, the described embodiments are only a part of the embodiments of the utility model, but not all the embodiments. The components of the utility model embodiments generally described and shown in the drawings can be arranged and designed in various different configurations.

[0031] Therefore, the detailed description of the embodiments of the utility model provided in the drawings below is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0032] It should be noted that the relational terms such as "first" and "second" and the like are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0033] The features and performances of the utility model will be further described in detail below in combination with the embodiments. Embodiments

[0034] As Figure 1 and Figure 2The application discloses an IGBT heat dissipation cooling device, which comprises a heat dissipation base plate 10, a fixed plate 20 arranged on the heat dissipation base plate 10 and an IGBT chip 30 arranged on the fixed plate 20. The heat dissipation base plate 10 comprises a bottom plate 11 and a base plate 12 arranged on the bottom plate 11. The bottom plate 11 is provided with a lower groove, and the base plate 12 is provided with an upper groove corresponding to the lower groove. The lower groove comprises a first lower groove 111, a second lower groove 112 and a third lower groove 113. The depth of the second lower groove 112 is deeper than the depths of the first lower groove 111 and the third lower groove 113. A cavity is arranged in the heat dissipation base plate 10. The base plate 12 is provided with a water outlet nozzle 14 and a water inlet nozzle 15 which are connected with the cavity. A flow distribution fin is arranged in the cavity. The flow distribution fin comprises a first flow distribution fin 151 arranged in the first lower groove, a second flow distribution fin 152 arranged in the second lower groove and a third flow distribution fin 153 arranged in the third lower groove. The flow distribution fin comprises a plurality of sawtooth fins 154. The sawtooth fins 154 are arranged in parallel along the width direction of the cavity. Adjacent two sawtooth fins 154 are partially staggered. The flow distribution fin formed by the partially staggered sawtooth fins can continuously distribute the cooling liquid entering the cavity, so that the cooling liquid can contact two surfaces of the side walls of the sawtooth fins, greatly increasing the contact area of the cooling liquid and the sawtooth fins. Meanwhile, the surfaces of the top walls of the sawtooth fins are used for heat dissipation of the IGBT chip, greatly increasing the heat conduction area of the IGBT chip, and effectively improving the heat dissipation effect, especially the heat dissipation capacity for high-power IGBT.

[0035] Specifically, the bottom of the first lower groove 111 is provided with a positioning boss 1111, the first flow distribution fin 151 is provided with a lower positioning hole 1511, and the positioning boss 1111 is inserted into the lower positioning hole 1511. Through cooperation of the positioning boss 1111 and the lower positioning hole 1511, the first flow distribution fin 151 and the first lower groove 111 are accurately positioned.

[0036] Specifically, the upper groove comprises a first upper groove 121, a second upper groove 122 and a third upper groove 123. The depth of the second upper groove 122 is deeper than the depths of the first upper groove 121 and the third upper groove 123. The shape of the fixed plate 20 is matched with the shape of the upper groove, and the fixed plate 20 is arranged in the upper groove.

[0037] Specifically, the fixing plate 20 is provided with a plurality of positioning columns 25, the fixing plate 20 comprises a first fixing plate 21, a second fixing plate 22 and a third fixing plate 23, the first fixing plate 21 and the third fixing plate 23 are oppositely provided with two positioning columns 25 at the middle part in the length direction, the second fixing plate 22 is oppositely provided with two positioning columns 25 at the middle part in the width direction, the IGBT chip 30 is provided with upper positioning holes 32 corresponding to the plurality of positioning columns 25, the positioning columns 25 on the fixing plate 20 are matched with the upper positioning holes 32 on the IGBT chip 30, so that the accurate positioning and assembly of the IGBT chip and the fixing plate are facilitated. The edges of the fixing plate 20 are uniformly provided with a plurality of nut columns 24, the edges of the IGBT chip 30 are uniformly provided with a plurality of mounting holes 31, a plurality of screws 40 are threadedly connected with the corresponding plurality of nut columns 24 through the plurality of mounting holes 31, so that the IGBT chip 30 and the fixing plate 20 are fixed together.

[0038] In conclusion, the utility model discloses the structure design above, solve the deficiency in the prior art, with rational structure, good heat dissipation effect, strong heat dissipation capacity and so on.

[0039] The above is only the preferred embodiment of the utility model, and does not limit the utility model, and the patent protection scope of the utility model is accurate with the claim, and the equivalent structural change of the content of the specification and the drawings of the utility model should be included in the protection scope of the utility model.

Claims

1. An IGBT heat dissipation and cooling device, comprising a heat dissipation substrate (10), a fixing plate (20) disposed on the heat dissipation substrate (10), and an IGBT chip (30) disposed on the fixing plate (20), wherein a cavity is disposed within the heat dissipation substrate (10), and a water outlet (13) and a water inlet (14) communicating with the cavity are disposed on the heat dissipation substrate (10), characterized in that: The cavity contains a flow divider fin (15), which includes a plurality of serrated fins (154). The plurality of serrated fins (154) are arranged side by side along the width direction of the cavity, and adjacent serrated fins (154) are partially staggered.

2. The IGBT heat dissipation and cooling device according to claim 1, characterized in that: The heat dissipation substrate (10) includes a base plate (11) and a substrate (12) disposed on the base plate (11). The base plate (11) has a lower groove, and the substrate (12) has an upper groove corresponding to the lower groove. The lower groove includes a first lower groove (111), a second lower groove (112), and a third lower groove (113). The depth of the second lower groove (112) is deeper than the depth of the first lower groove (111) and the third lower groove (113).

3. The IGBT heat dissipation and cooling device according to claim 2, characterized in that: The flow divider fin (15) includes a first flow divider fin (151) located in the first lower groove (111), a second flow divider fin (152) located in the second lower groove (112), and a third flow divider fin (153) located in the third lower groove (113).

4. The IGBT heat dissipation and cooling device according to claim 3, characterized in that: A positioning boss (1111) is provided at the bottom of the first lower groove (111), and a lower positioning hole (1511) is provided on the first diverter fin (151). The positioning boss (1111) is inserted into the lower positioning hole (1511).

5. The IGBT heat dissipation and cooling device according to claim 4, characterized in that: The upper groove includes a first upper groove (121), a second upper groove (122) and a third upper groove (123), wherein the depth of the second upper groove (122) is greater than the depth of the first upper groove (121) and the third upper groove (123).

6. The IGBT heat dissipation and cooling device according to claim 5, characterized in that: The shape of the fixing plate (20) is adapted to the shape of the upper groove, and the fixing plate (20) is installed in the upper groove.

7. The IGBT heat dissipation and cooling device according to claim 6, characterized in that: The fixing plate (20) has a number of nut posts (24) evenly distributed along its edge, and the IGBT chip (30) has a number of mounting holes (31) evenly distributed along its edge. A number of screws (40) pass through the mounting holes (31) and are threadedly connected to the corresponding number of nut posts (24) to fix the IGBT chip (30) and the fixing plate (20) together.

8. The IGBT heat dissipation and cooling device according to claim 7, characterized in that: The fixing plate (20) is provided with a plurality of positioning posts (25), and the IGBT chip (30) is provided with upper positioning holes (32) that correspond to and cooperate with the plurality of positioning posts (25).

9. The IGBT heat dissipation and cooling device according to claim 8, characterized in that: The fixing plate (20) includes a first fixing plate (21), a second fixing plate (22) and a third fixing plate (23). The first fixing plate (21) and the third fixing plate (23) are provided with two positioning posts (25) opposite each other at the middle of the length direction, and the second fixing plate (22) is provided with two positioning posts (25) opposite each other at the middle of the width direction.

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