Die and power module

Abstract

The utility model provides a mold and a power module, and relates to the technical field of electronics. The die is used for manufacturing the power module. The power module comprises an insulating substrate and a radiator, a power device is arranged on one side, back on to the radiator, of the insulating substrate, and the insulating substrate is welded with the radiator. The die comprises a plurality of solder resist sheets and a connecting piece, the plurality of solder resist sheets define a containing frame, the plurality of solder resist sheets are located on one side of the connecting piece in the thickness direction of the containing frame, movably penetrate through the connecting piece and make contact with the side, back to the radiator, of the insulating substrate, and the power device is contained in the containing frame. And the plurality of solder masks are used for blocking the soldering flux in the molten state and the solder in the molten state. The soldering flux and the soldering flux in the molten state can be prevented from flowing to the joint surface of the insulating substrate and the power device through the plurality of solder resisting sheets, so that an electrical loop on the joint surface of the insulating substrate and the power device is prevented from being polluted, and the yield of the power module is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronics, in particular to a mold and a power module. BACKGROUND

[0002] In the manufacturing process of the existing power module, flux and solder are filled between the insulating substrate and the heat sink, wherein the side of the insulating substrate opposite to the heat sink is provided with a power device; the flux and the solder are heated to obtain a welding layer, so that the insulating substrate and the heat sink are welded. The welding layer thus obtained has fewer cavities and high quality. However, in the process of heating the flux and the solder, the solder in the molten state can flow to the surface where the power device and the insulating substrate are connected, along with the flux in the molten state, beyond the edge of the insulating substrate, which results in that the connecting position of the power device and the insulating substrate is occupied, the connecting quality of the power device and the insulating substrate is reduced, the insulation withstand voltage performance is reduced and fails, and the yield of the power module thus obtained is low. CONTENT OF THE UTILITY MODEL

[0003] The present application provides a mold and a power module, aiming at solving the problem of low yield of the power module thus obtained.

[0004] In a first aspect, the embodiments of the present application provide a mold for manufacturing a power module. The power module comprises an insulating substrate and a heat sink, the side of the insulating substrate opposite to the heat sink is provided with a power device, and the insulating substrate is welded with the heat sink by heating flux and solder. The mold comprises a plurality of solder resist pieces and a connecting piece, the plurality of solder resist pieces are combined to form a receiving frame, the plurality of solder resist pieces are located on one side of the connecting piece along the thickness direction of the receiving frame and movably arranged in the connecting piece, and each solder resist piece is in contact with the side of the insulating substrate opposite to the heat sink, the power device is received in the receiving frame, and the plurality of solder resist pieces are used for blocking the flux in the molten state and the solder in the molten state.

[0005] The mold provided by the embodiments of the present application is applied to the manufacturing of the power module, in particular the welding of the insulating substrate and the heat sink. The specific welding method is as follows: the flux and the solder are filled between the insulating substrate and the heat sink, wherein the side of the insulating substrate opposite to the heat sink is provided with a power device; the plurality of solder resist pieces of the mold are arranged on the side of the insulating substrate opposite to the heat sink and in contact with the insulating substrate, wherein the power device is surrounded by the plurality of solder resist pieces; and the welding layer is obtained by heating the flux and the solder in a vacuum environment, so that the insulating substrate and the heat sink are welded.

[0006] During the heating process of flux and solder, the molten solder flows along with the molten flux across the edge of the insulating substrate towards the surface where the insulating substrate and power device are joined. This causes short circuits due to solder contamination of the electrical circuits on the surface where the insulating substrate and power device are joined, and the joint position between the power device and the insulating substrate is occupied, leading to deterioration of the joint quality and reduced insulation withstand voltage performance of the power module, resulting in failure. The mold provided in this application uses multiple solder resist sheets to block the molten flux and molten solder during the manufacturing process of the power module. This not only prevents the molten flux and molten solder from flowing to the surface where the insulating substrate and power device are joined, but also prevents solder from splashing onto the surface where the insulating substrate and power device are joined, forming solder beads (e.g., tin beads). This avoids short circuits due to solder contamination of the electrical circuits on the surface where the insulating substrate and power device are joined, and prevents the joint position between the power device and the insulating substrate from being occupied, thus improving the yield of the power module. Moreover, it can prevent solder from splashing onto the surface of the power device facing away from the insulating substrate and forming solder beads. It also prevents solder beads from damaging the power device (such as causing craters) when the power device leads are bonded to the insulating substrate, which is beneficial to the manufacturing of power modules and helps to improve the yield of power modules.

[0007] Furthermore, since the insulating substrate is prone to warping during the heating process of flux and solder, and the degree of warping varies with temperature, the design of multiple blocking components moving through the connector along the thickness direction of the receiving frame ensures that each solder resist can adapt to the degree of warping of the insulating substrate along the thickness direction of the receiving frame. This ensures that each solder resist is always in contact with the insulating substrate, which helps to reduce the gap between each solder resist and the insulating substrate, improves the blocking effect of each solder resist, facilitates the miniaturization design of the insulating substrate, and improves the yield and consistency of the power module.

[0008] In one possible implementation, two adjacent solder resist sheets are in contact.

[0009] The design of two adjacent solder resist tabs in contact is beneficial to improving the blocking effect of multiple solder resist tabs on flux and solder in the molten state, which is conducive to improving the yield and consistency of power modules.

[0010] In one possible implementation, the insulating substrate includes a first metal layer, an insulating layer, and a second metal layer disposed sequentially. The power device is disposed on the side of the first metal layer away from the insulating layer, and the solder mask is located on the side of the insulating layer away from the second metal layer. In the thickness direction of the housing frame, the distance between the surface of the solder mask away from the insulating layer and the insulating layer is greater than the distance between the surface of the power device away from the insulating layer and the insulating layer.

[0011] In the thickness direction of the housing frame, the distance between the surface of the solder mask facing away from the insulating layer and the insulating layer is greater than the distance between the surface of the power device facing away from the insulating layer and the insulating layer. This design helps to improve the blocking effect of the solder mask and prevents the flux and solder in the molten state from passing over the solder mask and sputtering onto the surface of the power device facing away from the insulating substrate and the surface where the insulating substrate and the power device are joined, thus forming solder beads. This helps to improve the yield of the power module.

[0012] In one possible implementation, the solder mask contacts the side of the first metal layer opposite to the insulating layer.

[0013] The design of the solder resist contacting the side of the first metal layer opposite to the insulating layer allows the solder resist to effectively block molten solder and flux. This design also helps to shorten the solder resist's dimensions in the thickness direction of the housing frame, improves its strength, enhances the structural stability and reliability of the mold, and reduces the processing costs of the solder resist, as well as the processing costs of the mold and power module. Furthermore, during the heating process of the flux and solder, the insulating substrate is prone to warping, and collisions may occur between the solder resist and the first metal layer. To avoid damage to the first metal layer due to collisions, the strength of the solder resist must be less than that of the first metal layer. Since the first metal layer has high strength, the strength requirement for the solder resist is lower, which reduces the design complexity and processing costs of the solder resist, and consequently, the processing costs of the power module.

[0014] In one possible implementation, the projection of the solder mask along the thickness direction of the housing frame overlaps with the edge of the projection of the first metal layer along the thickness direction of the housing frame.

[0015] The design of overlapping the edges of the projection of the solder mask along the thickness direction of the housing frame with the projection of the first metal layer along the thickness direction of the housing frame avoids the flux and solder in the molten state from flowing to the surface of the first metal layer facing the power device. This facilitates the arrangement of more electrical circuits on the first metal layer, improves the area utilization of the surface of the first metal layer facing the power device, and is beneficial to the miniaturization design of the power module.

[0016] In one possible implementation, the solder mask contacts the insulating layer, and the first metal layer is housed in a housing frame.

[0017] The design of having the solder mask in contact with the insulating layer and the first metal layer housed within the housing frame avoids the solder mask occupying the surface area of ​​the first metal layer facing the power device, which is beneficial for the miniaturization design of the power module.

[0018] In one possible implementation, the strength of the solder resist is less than the strength of the insulating layer.

[0019] During the process of heating the flux and the solder, the insulating substrate is easy to be warped by heat, and the solder resist sheet and the insulating layer can collide with each other. The design that the strength of the solder resist sheet is less than the strength of the insulating layer can avoid the damage of the insulating layer (for example, the insulating layer made of ceramic) caused by the collision between the solder resist sheet and the insulating layer, and is beneficial to improve the yield of the power module.

[0020] In a possible implementation, the surface of the solder resist sheet in contact with the insulating layer is provided with a plurality of grooves, and the plurality of grooves are arranged at intervals.

[0021] The design of the plurality of grooves can disperse the stress caused by the collision between the solder resist sheet and the insulating layer, avoid the damage of the insulating layer caused by the collision between the solder resist sheet and the insulating layer, and is beneficial to improve the yield of the power module.

[0022] In a possible implementation, the solder resist sheet comprises a first solder resist sub-sheet and a second solder resist sub-sheet, the first solder resist sub-sheet is in contact with the insulating layer, and the second solder resist sub-sheet is slidably connected to the first solder resist sub-sheet in the thickness direction of the containing frame and movably arranged in the connecting piece.

[0023] The design that the first solder resist sub-sheet is in contact with the insulating layer and the second solder resist sub-sheet is slidably connected to the first solder resist sub-sheet in the thickness direction of the containing frame and movably arranged in the connecting piece can ensure that the stress can be converted into the driving force for the sliding of the second solder resist sub-sheet relative to the first solder resist sub-sheet when the collision between the solder resist sheet and the insulating layer occurs, avoid the damage of the insulating layer caused by the collision between the solder resist sheet and the insulating layer, and is beneficial to improve the yield of the power module.

[0024] In a possible implementation, the solder resist sheet comprises a first matching part, an elastic part and a second matching part arranged in sequence in the thickness direction of the containing frame, the first matching part is in contact with the insulating layer, and the second matching part is movably arranged in the connecting piece.

[0025] The design of the elastic part can ensure that the stress can be buffered by the elastic part when the collision between the solder resist sheet and the insulating layer occurs, avoid the damage of the insulating layer caused by the collision between the solder resist sheet and the insulating layer, and is beneficial to improve the yield of the power module.

[0026] In a possible implementation, the outer side of the solder resist sheet is provided with a first protrusion, the first protrusion is located on the side of the connecting piece facing the insulating substrate, and the projection of the first protrusion in the thickness direction of the containing frame overlaps the projection of the connecting piece in the thickness direction of the containing frame.

[0027] The design that the projection of the first protrusion in the thickness direction of the containing frame overlaps the projection of the connecting piece in the thickness direction of the containing frame can block the connecting piece, avoid the damage of the insulating substrate caused by the collision between the connecting piece and the insulating substrate, and is beneficial to improve the yield of the power module.

[0028] In a possible implementation, the outer side of the solder resist sheet is provided with a second protrusion, the second protrusion is located on the side of the connecting piece away from the insulating substrate, and a projection of the second protrusion along the thickness direction of the receiving frame overlaps a projection of the connecting piece along the thickness direction of the receiving frame.

[0029] The design that the projection of the second protrusion along the thickness direction of the receiving frame overlaps the projection of the connecting piece along the thickness direction of the receiving frame can avoid the solder resist sheet from being separated from the connecting piece during the process that the solder resist sheet moves along the thickness direction of the receiving frame adaptively according to the warping degree of the insulating substrate, and is beneficial to improving the structural reliability of the mold.

[0030] In a possible implementation, the connecting piece is provided with a matching hole, the matching hole penetrates through the connecting piece along the thickness direction of the receiving frame and is arranged opposite to the power device.

[0031] The design of the matching hole ensures that the connecting piece will not collide with the power device during the process that the flux and the solder are heated and the warping degree of the insulating substrate changes with the temperature, not only avoids damage to the power device and is beneficial to improving the yield of the power module, but also avoids the situation that the solder resist sheet cannot be attached to the insulating substrate due to the collision between the connecting piece and the power device, and is beneficial to improving the blocking effect of the solder resist sheet.

[0032] In a possible implementation, the outer side of the solder resist sheet is provided with a blocking film, the blocking film covers at least the surface of the solder resist sheet away from the inside of the receiving frame, and the thickness of the blocking film is smaller than the thickness of the solder resist sheet.

[0033] The design that the blocking film covers at least the surface of the solder resist sheet away from the inside of the receiving frame and the thickness of the blocking film is smaller than the thickness of the solder resist sheet can avoid the reaction between the solder resist sheet and the flux in a molten state and the solder in a molten state, ensure that the solder resist sheet has a good blocking effect, and has a simple structure and is easy to manufacture. In addition, the solder resist sheet has low requirements on the material, which is beneficial to reducing the processing cost of the solder resist sheet.

[0034] In a possible implementation, the solder resist sheet is made of a solder resist material.

[0035] The design that the solder resist sheet is made of a solder resist material can avoid the reaction between the solder resist sheet and the flux in a molten state and the solder in a molten state, ensure that the solder resist sheet has a good blocking effect, and has a simple structure and is easy to manufacture.

[0036] In a second aspect, the embodiments of the present application also provide a power module. The power module is manufactured by the mold of any one of the first aspect, and the power module comprises an insulating substrate and a heat sink, and the side of the insulating substrate away from the heat sink is provided with a power device and is welded with the heat sink. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the drawings needed to be used in the embodiments of the present application or the background art will be described below.

[0038] Figure 1 is a structural schematic diagram of a power module provided by the embodiment of the present application;

[0039] Figure 2 is a structural schematic diagram of a to-be-processed module provided by the embodiment of the present application;

[0040] Figure 3 is a three-dimensional structural schematic diagram of a mold and a to-be-processed module provided by the embodiment of the present application;

[0041] Figure 4 is a three-dimensional structural schematic diagram of a mold and a to-be-processed module provided by the embodiment of the present application; Figure 3

[0042] Figure 5 Figure 3

[0043] Figure 6 Figure 5

[0044] Figure 7 Figure 3

[0045] Figure 8 is a partial structural schematic diagram of a mold and a to-be-processed module provided by the embodiment of the present application;

[0046] Figure 9 is a partial structural schematic diagram of a mold and a to-be-processed module provided by the embodiment of the present application;

[0047] Figure 10 is a partial structural schematic diagram of a mold and a to-be-processed module provided by the embodiment of the present application;

[0048] Figure 11 is a partial structural schematic diagram of a mold and a to-be-processed module provided by the embodiment of the present application;

[0049] Figure 12 is a partial structural schematic diagram of a mold and a to-be-processed module provided by the embodiment of the present application; Figure 11

[0050] Figure 13 is a partial structural schematic diagram of a mold and a to-be-processed module provided by the embodiment of the present application; ​​​​​​​​

[0051] Figure 14 is another structure diagram of a mold and a to-be-processed module cooperating with each other provided by an embodiment of the present application;

[0052] Figure 15 is a structure exploded diagram of the mold and the to-be-processed module shown in Figure 14

[0053] Figure 16 is a partial structure diagram of the mold and the to-be-processed module cooperating with each other from another angle shown in Figure 14

[0054] Figure 17 is a partial structure diagram of the power module manufactured by the mold and the to-be-processed module cooperating with each other shown in Figure 14 DETAILED DESCRIPTION

[0055] An embodiment of the present application provides a mold and a power module. The mold is applied to manufacturing the power module, and is particularly applied to welding of an insulating substrate and a heat sink.

[0056] The embodiments of the present application will be described below with reference to the drawings.

[0057] Please refer to Figure 1 and Figure 2 , Figure 1 is a structure diagram of a power module 100 provided by an embodiment of the present application. Figure 2 is a structure diagram of a to-be-processed module 200 provided by an embodiment of the present application.

[0058] As shown in Figure 1 and Figure 2 , the power module 100 is applied to a power conversion device. The power conversion device converts direct current into alternating current through the power module 100. For example, the power conversion device can be a photovoltaic inverter or other inverters. The photovoltaic inverter converts direct current output by a photovoltaic module into alternating current through the power module 100 to supply a power grid or a load. The power conversion device can also convert alternating current into direct current through the power module 100. For example, the power conversion device can be a rectifier or an energy storage device. The power conversion device converts alternating current output by a power grid or an alternating current power supply into direct current through the power module 100 to supply a load or a battery.

[0059] ​​​The power module 100 comprises an insulating substrate 10 and a heat sink 20. In the Z-axis direction, the heat sink 20 is located on one side of the insulating substrate 10, and the power device 30 is arranged on the side of the insulating substrate 10 away from the heat sink 20 and is welded to the heat sink 20. The insulating substrate 10 and the heat sink 20 form a welding layer 40 therebetween, the welding layer 40 is fixedly stacked between the insulating substrate 10 and the heat sink 20, and the insulating substrate 10 and the heat sink 20 are welded through the welding layer 40. The power device 30 is fixedly connected to the insulating substrate 10 by means including but not limited to welding, sintering or pressure bonding. The power device 30 is a device for power conversion, for example, the power device 30 can be a chip, a diode or a triode, etc. For example, the number of power devices 30 is 1. In other embodiments, it can also be 2, 3 or more.

[0060] For ease of description, the three directions perpendicular to each other are defined as a first direction (i.e. the Z-axis direction shown in the figure), a second direction (i.e. the X-axis direction shown in the figure) and a third direction (i.e. the Y-axis direction shown in the figure) in the embodiments of the present application. In the embodiments, the thickness direction of the insulating substrate 10 is parallel to the Z-axis direction, the width direction of the insulating substrate 10 is parallel to the X-axis direction, and the length direction of the insulating substrate 10 is parallel to the Y-axis direction. In other embodiments, the width direction of the insulating substrate 10 can also be parallel to the Y-axis direction, and the length direction of the insulating substrate 10 is parallel to the X-axis direction.

[0061] The welding layer 40 is prepared by heating the flux 51 and the solder 52. Specifically, in step S10, the flux 51 and the solder 52 are filled between the insulating substrate 10 and the heat sink 20 to form a to-be-welded layer 50, so as to obtain a to-be-processed module 200. In the to-be-processed module 200, in the thickness direction (i.e. the Z-axis direction) of the insulating substrate 10, the heat sink 20 is located on one side of the insulating substrate 10, the power device 30 is arranged on the side of the insulating substrate 10 away from the heat sink 20, and the insulating substrate 10 and the heat sink 20 are filled with the flux 51 and the solder 52 to form the to-be-welded layer 50, and the to-be-welded layer 50 is fixedly stacked between the insulating substrate 10 and the heat sink 20. The solder 52 is stacked between the heat sink 20 and the insulating substrate 10, and the flux 51 is arranged between the solder 52 and the heat sink 20 and / or the insulating substrate 10, and the flux 51 and the solder 52 are stacked. In the embodiments, the flux 51 comprises a first flux and a second flux, the first flux is stacked between the solder 52 and the heat sink 20, and the second flux is stacked between the solder 52 and the insulating substrate 10. In other embodiments, the first flux or the second flux can be omitted.

[0062] Step S20, heating the soldering layer 40 by heating the soldering layer 50 (i.e. the flux 51 and the solder 52) in a vacuum environment, so that the insulating substrate 10 and the heat sink 20 are soldered; and then pressurizing the power device 30 so that the power device 30 is wire-bonded to the insulating substrate 10, to obtain the power module 100.

[0063] After the flux 51 and the solder 52 are heated, most of the flux 51 volatilizes or is discharged to the surroundings of the soldering layer 40. The soldering layer 40 obtained after the flux 51 and the solder 52 are vacuum-reflowed has fewer cavities, which is conducive to the heat of the power device 30 being transferred to the heat sink 20 through the insulating substrate 10 and the soldering layer 40, so that the heat dissipation of the power device 30 is realized, the working temperature of the power device 30 is ensured to be below the set working temperature, and the use safety of the power device 30 is improved. The flux 51 can be an organic flux, an inorganic flux (mainly containing inorganic acid and inorganic salt), an active flux (mainly containing organic acid), or a resin flux (mainly containing rosin), etc. The solder 52 can be made of metal materials such as tin, lead, silver, or copper, etc.

[0064] In the existing process of manufacturing the power module, in the process of heating the flux and the solder filled between the insulating substrate and the heat sink, the solder in a molten state flows to the surface where the insulating substrate and the power device are bonded, along with the flux in a molten state, beyond the edge of the insulating substrate, which causes the electric circuit on the surface where the insulating substrate and the power device are bonded to be contaminated by the solder and broken, the bonding position of the power device and the insulating substrate is occupied, resulting in the degradation of the bonding quality, the insulation withstand voltage performance of the power module is reduced and the power module fails, and the yield of the power module is low.

[0065] To solve the above problems, the embodiment of the present application provides a mold 300 for manufacturing the power module 100, so that in the process of heating the flux 51 and the solder 52, the solder in a molten state and the flux in a molten state do not flow to the surface where the insulating substrate 10 and the power device 30 are bonded, beyond the edge of the insulating substrate 10, which is conducive to improving the yield of the power module 100.

[0066] Please refer to Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 , and combine Figure 1 , Figure 3 is a schematic diagram of the three-dimensional structure of the mold 300 and the module 200 to be processed. Figure 4 is Figure 3 the exploded schematic diagram of the mold 300 and the module 200 to be processed. Figure 5 is Figure 3 the structural schematic diagram of the mold 300 and the module 200 to be processed along the A-A line. Figure 6 is Figure 5 is an enlarged view of the mold 300 and the VI part of the to-be-processed module 200. Figure 7 is Figure 3 is a structural schematic view of the mold 300 and the to-be-processed module 200 from another angle.

[0067] As shown in Figure 1 and Figure 3 , the mold 300 is used for manufacturing the power module 100. The power module 100 is manufactured by the mold 300. Specifically, the mold 300 is arranged on the to-be-processed module 200, and then the to-be-welded layer 50 (i.e., the flux 51 and the solder 52) of the to-be-processed module 200 is heated in a vacuum environment to obtain the welding layer 40, so that the insulating substrate 10 and the heat sink 20 are welded; then the mold 300 is removed, and the power device 30 is pressed to make the lead of the power device 30 be bonded to the insulating substrate 10 to manufacture the power module 100. Next, the cooperation relationship between the mold 300 and the to-be-processed module 200 is specifically described.

[0068] As shown in Figure 3 , Figure 4 and Figure 5 , the mold 300 includes a plurality of solder resist sheets 60 and a connecting piece 70. The plurality of solder resist sheets 60 enclose a receiving frame 80, and the plurality of solder resist sheets 60 are located on one side of the connecting piece 70 along the thickness direction of the receiving frame 80 and movably penetrate the connecting piece 70. The thickness direction of the receiving frame 80 is parallel to the Z-axis direction. In the Z-axis direction, the plurality of solder resist sheets 60 contact the side of the insulating substrate 10 away from the heat sink 20. The power device 30 is received in the receiving frame 80. The connecting piece 70 abuts against the side of the heat sink 20 facing the insulating substrate 10. Specifically, the connecting piece 70 includes a first part 71 and a second part 72. In the Z-axis direction, the first part 71 is located on the side of the insulating substrate 10 away from the heat sink 20, and the second part 72 is fixedly connected to the side of the first part 71 facing the heat sink 20 and abuts against the heat sink 20. The first part 71 is provided with a plurality of through holes 711, each of which penetrates the first part 71 along the Z-axis direction, and the plurality of solder resist sheets 60 are movably penetrated in the plurality of through holes 711 along the Z-axis direction one by one. The number of the second part 72 can be 1, and the second part 72 surrounds the insulating substrate 10. The number of the second part 72 can also be 2, 3 or more. The plurality of second parts 72 are arranged at intervals. The thickness d1 of the first part 71 can be 0.3-10 mm. In other embodiments, the thickness d1 of the first part 71 can also be less than 0.3 mm or greater than 10 mm. In other embodiments, the side of the connecting piece 70 facing the insulating substrate 10 can also not abut against the heat sink 20, and the connecting piece 70 can also abut against the load-bearing surface of the heat sink 20 (such as a board surface, a table surface, a mesa surface or a ground surface) and the like.

[0069] The solder mask 60 and the power device 30 can be spaced apart or in contact. For example, the receiving frame 80 is a rectangular frame. In other embodiments, the receiving frame 80 is a circular frame, a triangular frame, or other irregularly shaped frame. The number of solder mask sheets 60 can be two, three, or more; for example, two solder mask sheets 60 can be C-shaped, and the two C-shaped solder mask sheets 60 are arranged opposite each other to enclose and form the receiving frame 80. The thickness d0 of the solder mask sheet 60 can be 0.05-5 mm (milliliters). In other embodiments, the thickness d0 of the solder mask sheet 60 can also be less than 0.05 mm or greater than 5 mm.

[0070] Multiple solder resist sheets 60 are used to block flux 51 and solder 52. Specifically, the multiple solder resist sheets 60 can prevent the flux 51 and solder 52 in the molten state from flowing to the surface 101 where the insulating substrate 10 and the power device 30 are bonded; wherein, the surface 101 where the insulating substrate 10 and the power device 30 are bonded is surrounded by multiple solder resist sheets 60. An electrical circuit is provided on the surface 101 where the insulating substrate 10 and the power device 30 are bonded.

[0071] The mold 300 provided in this embodiment is applied to the power module 100 (e.g. Figure 1 The manufacturing process (shown) specifically involves welding the insulating substrate 10 to the heat sink 20. The specific welding method is as follows: flux 51 and solder 52 are filled between the insulating substrate 10 and the heat sink 20. A power device 30 is provided on the side of the insulating substrate 10 facing away from the heat sink 20. Multiple solder resist sheets 60 of the mold 300 are placed on the side of the insulating substrate 10 facing away from the heat sink 20 and in contact with the insulating substrate 10. The power device 30 is surrounded by the multiple solder resist sheets 60. A welding layer 40 is obtained by heating the flux 51 and solder 52 in a vacuum environment, thereby welding the insulating substrate 10 to the heat sink 20.

[0072] During the heating process of flux 51 and solder 52, the molten solder 52 will flow over the edge of the insulating substrate 10 and toward the surface 101 where the insulating substrate 10 and the power device 30 are joined, along with the molten flux 51. This causes the electrical circuit on the surface 101 where the insulating substrate 10 and the power device 30 are joined to be contaminated by the solder 52 and short-circuited. The joint position between the power device 30 and the insulating substrate 10 is occupied, resulting in deterioration of the joint quality. The insulation withstand voltage performance of the power module 100 is reduced and it fails. The mold 300 provided in this application embodiment blocks the flux 51 and solder 52 in the molten state during the manufacturing process of the power module 100 by using multiple solder resist sheets 60. This not only prevents the flux 51 and solder 52 in the molten state from flowing to the surface 101 where the insulating substrate 10 and the power device 30 are joined, but also prevents the solder 52 from splashing onto the surface 101 where the insulating substrate 10 and the power device 30 are joined to form solder beads (e.g., tin beads). This prevents the electrical circuit on the surface 101 where the insulating substrate 10 and the power device 30 are joined from being contaminated by the solder 52 and short-circuiting, and prevents the joining position between the power device 30 and the insulating substrate 10 from being occupied, which is beneficial to improving the yield of the power module 100. Moreover, it can prevent solder 52 from splashing onto the surface of the power device 30 facing away from the insulating substrate 10 and forming solder beads. It can also prevent solder beads from damaging the power device 30 when the power device 30 leads are bonded to the insulating substrate 10 (e.g., forming craters in the power device 30). This is beneficial for the manufacturing of the power module 100 and can help improve the yield of the power module 100.

[0073] Furthermore, since the insulating substrate 10 is prone to warping when heated during the heating process of flux 51 and solder 52, and the degree of warping varies with temperature, the design of multiple solder resist tabs 60 being movably inserted into the connector 70 along the thickness direction (i.e., the Z-axis direction) of the receiving frame 80 ensures that each solder resist tab 60 can adaptively move along the thickness direction of the receiving frame 80 according to the degree of warping of the insulating substrate 10, ensuring that each solder resist tab 60 is always in contact with the insulating substrate 10. This helps to reduce the gap between each solder resist tab 60 and the insulating substrate 10, improves the blocking effect of each solder resist tab 60, facilitates the miniaturization design of the insulating substrate 10, and improves the yield and consistency of the power module 100.

[0074] like Figure 4 , Figure 5 and Figure 6 As shown, in some embodiments, the insulating substrate 10 includes a first metal layer 11, an insulating layer 12, and a second metal layer 13 sequentially disposed. The power device 30 is disposed on the side of the first metal layer 11 facing away from the insulating layer 12. The second metal layer 13 is connected to the heat sink 20 via a solder layer 40 (e.g., ...). Figure 1The first metal layer 11, the insulating layer 12 and the second metal layer 13 are fixed and stacked in sequence in the Z-axis direction. For example, the insulating layer 12 is made of ceramic, but is not limited to ceramic, and the first metal layer 11 and the second metal layer 13 are made of copper, aluminum or copper alloy, but are not limited to copper, aluminum or copper alloy. The power device 30 is fixedly connected to the side of the first metal layer 11 away from the insulating layer 12, and the power device 30 can be located at the edge of the first metal layer 11 or can not be located at the edge of the first metal layer 11. The solder layer 50 is fixed and stacked between the second metal layer 13 and the heat sink 20. The solder 52 is stacked between the second metal layer 13 and the heat sink 20, the flux 51 is stacked between the second metal layer 13 and the solder 52, and is stacked between the solder 52 and the heat sink 20.

[0075] The solder resist sheet 60 is located on the side of the insulating layer 12 away from the second metal layer 13. In the Z-axis direction (i.e. the thickness direction of the containing frame 80), the distance d2 between the surface of the solder resist sheet 60 away from the insulating layer 12 and the insulating layer 12 is greater than the distance d3 between the surface of the power device 30 away from the insulating layer 12 and the insulating layer 12.

[0076] In the Z-axis direction (i.e. the thickness direction of the containing frame 80), the distance d2 between the surface of the solder resist sheet 60 away from the insulating layer 12 and the insulating layer 12 is greater than the distance d3 between the surface of the power device 30 away from the insulating layer 12 and the insulating layer 12. This design is beneficial to improve the blocking effect of the solder resist sheet 60, to prevent the flux 51 in a molten state and the solder 52 in a molten state from splashing onto the surface of the power device 30 away from the insulating substrate 10 and the surface 101 of the insulating substrate 10 and the power device 30, and to form solder beads, which is beneficial to improve the yield of the power module 100 (such as Figure 1 as shown).

[0077] In the embodiments shown in Figure 4 , Figure 5 and Figure 6 , the solder resist sheet 60 contacts the side of the first metal layer 11 away from the insulating layer 12. The surface 101 of the insulating substrate 10 and the power device 30 is part of the surface of the first metal layer 11 away from the insulating layer 12. The design that the solder resist sheet 60 contacts the side of the first metal layer 11 away from the insulating layer 12 is based on the realization that the solder resist sheet 60 can effectively block the flux 51 in a molten state and the solder 52 in a molten state in the solder layer 50. This design is beneficial to shorten the size of the solder resist sheet 60 in the Z-axis direction (i.e. the thickness direction of the containing frame 80), to improve the strength of the solder resist sheet 60, to improve the structural stability and reliability of the mold 300, to reduce the processing cost of the solder resist sheet 60, to reduce the mold 300 and the power module 100 (such as Figure 1In addition, during the heating of the flux 51 and the solder 52, the insulating substrate 10 is prone to warping, and the solder resist 60 can collide with the first metal layer 11. In order to avoid damage to the first metal layer 11 caused by the collision between the solder resist 60 and the first metal layer 11, the strength of the solder resist 60 is required to be less than that of the first metal layer 11. Since the first metal layer 11 has a large strength, the strength of the solder resist 60 is low, which is beneficial to reduce the design difficulty and processing cost of the solder resist 60, and is beneficial to reduce the processing cost of the power module 100.

[0078] In some embodiments, the projection of the solder resist 60 along the Z-axis direction (i.e., the thickness direction of the containing frame 80) overlaps with the edge of the projection of the first metal layer 11 along the Z-axis direction (i.e., the thickness direction of the containing frame 80). The design that the projection of the solder resist 60 along the Z-axis direction (i.e., the thickness direction of the containing frame 80) overlaps with the edge of the projection of the first metal layer 11 along the Z-axis direction (i.e., the thickness direction of the containing frame 80) avoids the molten flux 51 and the molten solder 52 flowing to the surface of the first metal layer 11 facing the power device 30, which is beneficial to arrange more electrical circuits on the first metal layer 11, improve the area utilization of the surface of the first metal layer 11 facing the power device 30, and facilitate the miniaturization design of the power module 100 (such as Figure 1 In other embodiments, the projection of the solder resist 60 along the Z-axis direction can also not overlap with the edge of the projection of the first metal layer 11 along the Z-axis direction, for example, the edge of the projection of the first metal layer 11 along the Z-axis direction is located outside the projection of the solder resist 60 along the Z-axis direction.

[0079] In some embodiments, the outer side of the solder resist 60 is provided with a first protrusion 61, and the first protrusion 61 is located on the side of the connecting piece 70 facing the insulating substrate 10. The projection of the first protrusion 61 along the Z-axis direction (i.e., the thickness direction of the containing frame 80) overlaps with the projection of the connecting piece 70 along the Z-axis direction (i.e., the thickness direction of the containing frame 80). Specifically, the projection of the first protrusion 61 along the Z-axis direction overlaps with the projection of the first part 71 along the Z-axis direction. The design that the projection of the first protrusion 61 along the Z-axis direction (i.e., the thickness direction of the containing frame 80) overlaps with the projection of the connecting piece 70 along the Z-axis direction (i.e., the thickness direction of the containing frame 80) can block the connecting piece 70, avoiding damage to the insulating substrate 10 caused by the collision between the connecting piece 70 and the insulating substrate 10, and is beneficial to improve the yield of the power module 100 (such as Figure 1

[0080] In Figure 4 , Figure 5 and Figure 6 ​In the illustrated embodiment, the solder resist sheet 60 is provided with the first protrusion 61 on both sides of the solder resist sheet 60 in the length direction of the solder resist sheet 60, and the first protrusion 61 is arranged on one side of the solder resist sheet 60 in the length direction of the solder resist sheet 60. In other embodiments, the first protrusion 61 can also be arranged around the outside of the solder resist sheet 60 in the Z-axis direction. The first protrusion 61 can also be arranged on one side of the solder resist sheet 60 in the thickness direction of the solder resist sheet 60. The first protrusion 61 is in contact with the insulating substrate 10. The design in which the first protrusion 61 is in contact with the insulating substrate 10 is advantageous for improving the blocking effect of the solder resist sheet 60 on the flux 51 in a molten state and the solder 52 in a molten state, and is advantageous for improving the yield and consistency of the power module 100 (as shown in Figure 1 In other embodiments, the first protrusion 61 can also not be in contact with the insulating substrate 10.

[0081] In some embodiments, two adjacent solder resist sheets 60 are in contact. Specifically, in the embodiments shown in Figure 4 , Figure 5 and Figure 6 , the first protrusion 61 of one of the two adjacent solder resist sheets 60 is in contact with the first protrusion 61 of the other solder resist sheet 60. The design in which the two adjacent solder resist sheets 60 are in contact is advantageous for improving the blocking effect of the plurality of solder resist sheets 60 on the flux 51 in a molten state and the solder 52 in a molten state, and is advantageous for improving the yield and consistency of the power module 100 (as shown in Figure 1 In other embodiments, the two adjacent solder resist sheets 60 can also be arranged at intervals.

[0082] As shown in Figure 3 , Figure 6 and Figure 7 , in some embodiments, the solder resist sheet 60 is provided with a second protrusion 62 on the outside of the solder resist sheet 60, the second protrusion 62 is located on the side of the connecting piece 70 away from the insulating substrate 10, and the projection of the second protrusion 62 in the Z-axis direction (i.e., the thickness direction of the containing frame 80) overlaps the projection of the connecting piece 70 in the Z-axis direction (i.e., the thickness direction of the containing frame 80). Specifically, the projection of the second protrusion 62 in the Z-axis direction overlaps the projection of the first part 71 in the Z-axis direction. The design in which the projection of the second protrusion 62 in the Z-axis direction (i.e., the thickness direction of the containing frame 80) overlaps the projection of the connecting piece 70 in the Z-axis direction (i.e., the thickness direction of the containing frame 80) can avoid the solder resist sheet 60 and the connecting piece 70 being separated during the process in which the solder resist sheet 60 moves along the Z-axis direction (i.e., the thickness direction of the containing frame 80) adaptively according to the degree of warping of the insulating substrate 10, and is advantageous for improving the structural reliability of the mold 300.

[0083] In Figure 3 , Figure 6 and Figure 7In the shown embodiment, the solder resist sheet 60 is provided with the second protrusions 62 on both sides in the thickness direction of the solder resist sheet 60, and the second protrusions 62 are arranged on one side of the solder resist sheet 60 in the thickness direction of the solder resist sheet 60. In the thickness direction of the solder resist sheet 60, the second protrusions 62 arranged on one side of the solder resist sheet 60 in the thickness direction of the solder resist sheet 60 are arranged in a staggered manner with the second protrusions 62 arranged on the other side of the solder resist sheet 60 in the thickness direction of the solder resist sheet 60. In this way, the blocking effect of the second protrusions 62 on the connecting piece 70 is improved, and the structural reliability of the mold 300 is improved. In other embodiments, the second protrusions 62 can also be arranged around the outside of the solder resist sheet 60 in the Z-axis direction. The second protrusions 62 can also be arranged on one side of the solder resist sheet 60 in the length direction of the solder resist sheet 60.

[0084] As shown in Figure 3 , Figure 5 and Figure 7 , in some embodiments, the connecting piece 70 is provided with a matching hole 73, and the matching hole 73 penetrates the connecting piece 70 in the Z-axis direction (i.e., the thickness direction of the receiving frame 80) and is arranged opposite the power device 30. Specifically, the matching hole 73 penetrates the first part 71 in the Z-axis direction. The projection of the matching hole 73 in the Z-axis direction covers the projection of the power device 30 in the Z-axis direction. The design of the matching hole 73 ensures that the connecting piece 70 does not collide with the power device 30 during the process of heating the flux 51 and the solder 52 and the change of the warping degree of the insulating substrate 10 with the change of temperature, not only avoids damage to the power device 30, but also improves the yield of the power module 100; and can avoid the situation that the solder resist sheet 60 cannot be attached to the insulating substrate 10 due to the collision between the connecting piece 70 and the power device 30, and improves the blocking effect of the solder resist sheet 60.

[0085] In some embodiments, the solder resist sheet 60 is made of a solder resist material. The solder resist material can be a metal or an alloy having a solder resist effect, such as chromium, aluminum, nickel, titanium, etc., as well as stainless steel, aluminum alloy, titanium alloy, die steel, etc.; it can also be a copper alloy treated with solder resist, etc.; it can also be an inorganic or organic material, etc. For example, the solder resist material can be polyurethane, polyimine, phenolic resin, plastic, oxide (such as aluminum oxide, zirconium oxide, or ceramic), etc. The design of the solder resist sheet 60 made of a solder resist material can avoid the reaction between the solder resist sheet 60 and the flux 51 in a molten state and the solder 52 in a molten state, and ensure that the solder resist sheet 60 has a good blocking effect; and the structure is simple and easy to manufacture.

[0086] Please refer to Figure 8 , and in combination with Figure 6 , Figure 8 is another partial structure schematic view of the mold 300 and the to-be-processed module 200 provided by the embodiments of the present application.

[0087] As Figure 6 and Figure 8 shown, Figure 8 The embodiment shown in Figure 6 The structure of the embodiment shown in Figure 8 The outer side of the solder resist sheet 60 is provided with a solder resist film 63, which covers at least the surface of the solder resist sheet 60 facing away from the interior of the receiving frame 80, and the thickness of the solder resist film 63 is less than the thickness d0 of the solder resist sheet 60. The solder resist film 63 is made of solder resist material. Specifically, the solder resist film 63 completely covers the solder resist sheet 60. The solder resist material can refer to the related description of the embodiment shown in Figure 6 The embodiment shown in Figure 6 The solder resist sheet 60 is made of metal material such as stainless steel, aluminum alloy, titanium alloy, nickel alloy, or pure metal (such as nickel, titanium, or aluminum). The solder resist film 63 is an oxidation film with solder resist property formed by oxidation of the metal material. In some other embodiments, the solder resist film 63 can also be a nitriding film with solder resist property, and the solder resist film 63 can only cover the surface of the solder resist sheet 60 facing away from the power device 30.

[0088] The design that the solder resist film 63 covers at least the surface of the solder resist sheet 60 facing away from the interior of the receiving frame 80 and the thickness of the solder resist film 63 is less than the thickness d0 of the solder resist sheet 60 can avoid the reaction between the solder resist sheet 60 and the flux 51 in molten state and the solder 52 in molten state, and ensure that the solder resist sheet 60 has good blocking effect. Moreover, the structure is simple and convenient to manufacture. In addition, the requirement for the material of the solder resist sheet 60 is low, which is conducive to reducing the processing cost of the solder resist sheet 60.

[0089] Please refer to Figure 9 , and combine Figure 1 , Figure 6 and Figure 8 , Figure 9 is another partial structure schematic diagram of the mold 300 cooperating with the module to be processed 200 provided by the embodiment of the application.

[0090] As Figure 6 and Figure 9 shown, Figure 9 The embodiment shown in Figure 6 The structure of the embodiment shown in Figure 9 The structure of the embodiment shown inIn the illustrated embodiment, the solder mask 60 contacts the insulating layer 12, and the first metal layer 11 is housed in the housing frame 80. The first metal layer 11 and the housing frame 80 are spaced apart. The first protrusion 61 contacts the insulating layer 12, and the surface 101 where the insulating substrate 10 and the power device 30 are bonded is the entire surface of the first metal layer 11 facing the power device 30. In some other embodiments, the first metal layer 11 may also contact the housing frame 80. The design of the solder mask 60 contacting the insulating layer 12 and the first metal layer 11 being housed in the housing frame 80 avoids the solder mask 60 occupying the area of ​​the surface of the first metal layer 11 facing the power device 30, which is beneficial for improving the utilization rate of the insulating substrate 10's footprint and for the power module 100 (e.g., Figure 1 The miniaturized design is shown in the figure.

[0091] Furthermore, the strength of the solder resist 60 is less than the strength of the insulating layer 12. During the heating process of the flux 51 and solder 52, the insulating substrate 10 is prone to warping due to heat, and the solder resist 60 may collide with the insulating layer 12. The design that the strength of the solder resist 60 is less than the strength of the insulating layer 12 avoids damage to the insulating layer 12 due to collision between the solder resist 60 and the insulating layer 12, which is beneficial to improving the power module 100 (e.g., Figure 1 The yield rate (as shown in the figure). Figure 9 In the embodiment shown, a solder resist film 63 is provided on the outer side of the solder resist sheet 60. The solder resist film 63 can be referred to as Figure 8 The relevant descriptions of the illustrated embodiments will not be repeated. The insulating layer 12 is made of ceramic. The solder resist 60 is made of aluminum. Aluminum has a plastic deformation strength of 20 MPa and is made of soft metals such as aluminum alloys. The strength of aluminum is less than that of ceramic. The solder resist film 63 is an alumina film formed by the oxidation of aluminum. In some other embodiments, the solder resist 60 may also be made of aluminum alloys or other soft metals. In other embodiments, the solder resist 60 may not have a solder resist film 63, and the solder resist 60 may be made of solder resist materials such as plastic, whose strength is less than that of ceramics. It should be noted that the strength of feature A refers to the strength of the material of feature A. Strength refers to the material's ability to resist permanent deformation and fracture, that is, the stress required for the material to break.

[0092] Understandable. Figure 9 The design of the solder mask 60 contacting the insulating layer 12 in the illustrated embodiment, and the design that the strength of the solder mask 60 is less than the strength of the insulating layer 12, can be applied to... Figures 1-8 In any of the embodiments shown.

[0093] Please see Figure 10 , combined Figure 1 and Figure 6 , Figure 10 This is a partial structural diagram of another mold 300 and the module to be processed 200 provided in the embodiments of this application.

[0094] As Figure 6 and Figure 10 shown, Figure 10 the embodiment shown is similar to the structure of the embodiment shown in Figure 6 , the difference between the two is that the cooperation relationship between the solder resist sheet 60 and the insulating substrate 10 is different, and the structure of the solder resist sheet 60 is different. In the embodiment shown in Figure 10 , the solder resist sheet 60 is in contact with the insulating layer 12, and the first metal layer 11 is accommodated in the accommodation frame 80. Among them, the first protrusion 61 is in contact with the insulating layer 12, and the surface of the solder resist sheet 60 in contact with the insulating layer 12 is provided with a plurality of grooves 64, and the plurality of grooves 64 are arranged at intervals. Specifically, in the length direction of the solder resist sheet 60, the plurality of grooves 64 are arranged at intervals in sequence. The design of the plurality of grooves 64 can disperse the stress of the collision between the solder resist sheet 60 and the insulating layer 12, avoid damaging the insulating layer 12 due to the collision between the solder resist sheet 60 and the insulating layer 12, and be beneficial to improve the yield of the power module 100 (as shown in Figure 1 ). In other embodiments, the plurality of grooves 64 can also be arranged at intervals in sequence along the thickness direction of the solder resist sheet 60.

[0095] It can be understood that Figure 10 the design that the solder resist sheet 60 is in contact with the insulating layer 12 in the embodiment shown and the design that the surface of the solder resist sheet 60 in contact with the insulating layer 12 is provided with a plurality of grooves 64 can be applied to Figures 1-9 any embodiment shown.

[0096] Please refer to Figure 11 and Figure 12 , and combine Figure 1 and Figure 6 , Figure 11 is another part structure schematic diagram of the mold 300 and the to-be-processed module 200 provided by the embodiment of the application. Figure 12 is Figure 11 the part structure schematic diagram of the mold 300 and the to-be-processed module 200 along the B-B line.

[0097] As Figure 6 , Figure 11 and Figure 12 shown, Figure 11 and Figure 12 the embodiment shown is similar to the structure of the embodiment shown in Figure 6 , the difference between the two is that the cooperation relationship between the solder resist sheet 60 and the insulating substrate 10 is different, and the structure of the solder resist sheet 60 is different. In the embodiment shown in Figure 11 and Figure 12 , the solder resist sheet 60 is in contact with the insulating layer 12, and the first metal layer 11 is accommodated in the accommodation frame 80.

[0098] The solder resist sheet 60 comprises a first solder resist sub-sheet 65 and a second solder resist sub-sheet 66. The first solder resist sub-sheet 65 is in contact with the insulating layer 12. The second solder resist sub-sheet 66 is slidably connected to the first solder resist sub-sheet 65 along the Z-axis direction (i.e. the thickness direction of the receiving frame 80) and movably penetrates the connecting member 70 along the Z-axis direction. The first solder resist sub-sheet 65 is in contact with the insulating layer 12. The second solder resist sub-sheet 66 is slidably connected to the first solder resist sub-sheet 65 along the Z-axis direction (i.e. the thickness direction of the receiving frame 80) and movably penetrates the connecting member 70 along the Z-axis direction. When the solder resist sheet 60 collides with the insulating layer 12, the stress can be converted into the driving force for the sliding of the second solder resist sub-sheet 66 relative to the first solder resist sub-sheet 65, thereby avoiding the damage of the insulating layer 12 caused by the collision between the solder resist sheet 60 and the insulating layer 12. This is conducive to improving the yield of the power module 100 (as shown in Figure 1

[0099] In the embodiments shown in Figure 11 Figure 12 In the embodiments shown in Figure 6 The first solder resist sub-sheet 65 is in contact with the second solder resist sub-sheet 66 and is arranged in a stacked manner along the thickness direction of the solder resist sheet 60 and is located on the side of the second solder resist sub-sheet 66 away from the power device 30. The first solder resist sub-sheet 65 is provided with a mounting hole 651 penetrating the first solder resist sub-sheet 65 along the thickness direction of the solder resist sheet 60, and the mounting hole 651 is arranged along the Z-axis direction. The solder resist sheet 60 further comprises a sliding member 67 fixedly penetrating the second solder resist sub-sheet 66 along the thickness direction of the solder resist sheet 60, penetrating the mounting hole 651 and slidably connected to the mounting hole 651 along the Z-axis direction. In other embodiments, the first solder resist sub-sheet 65 can not be in contact with the second solder resist sub-sheet 66, and the first solder resist sub-sheet 65 can be located on the side of the second solder resist sub-sheet 66 facing the power device 30. The connection relationship between the second solder resist sub-sheet 66 and the connecting member 70 can refer to the embodiments shown in

[0100] In the embodiments shown in Figure 11 Figure 12 ​​​In the shown embodiment, the first protrusion 61 is arranged outside the first solder resist sub-piece 65 and contacts the insulating layer 12; the second protrusion 62 is arranged outside the second solder resist sub-piece 66 and is located on the side of the connecting piece 70 facing away from the insulating substrate 10. For details, please refer to Figure 6 In the shown embodiment, no further description is given.

[0101] It can be understood that Figure 11 and Figure 12 In the shown embodiment, the design that the solder resist piece 60 contacts the insulating layer 12 and the design that the first solder resist sub-piece 65 and the second solder resist sub-piece 66 are connected in the Z-axis direction can be applied to Figures 1-10 any of the shown embodiments.

[0102] Please refer to Figure 13 in combination with Figure 1 and Figure 6 , Figure 13 is another partial structure schematic diagram of a mold 300 cooperating with a module to be processed 200 provided by the embodiment of the present application.

[0103] As Figure 6 and Figure 13 shown, Figure 13 The shown embodiment is similar to the structure of the embodiment shown in Figure 6 The difference between the two is that the cooperation relationship between the solder resist piece 60 and the insulating substrate 10 is different, and the structure of the solder resist piece 60 is different. In Figure 13 the shown embodiment, the solder resist piece 60 contacts the insulating layer 12, and the first metal layer 11 is accommodated in the accommodation frame 80.

[0104] The solder resist piece 60 includes a first cooperation part 68, an elastic part 69 and a second cooperation part 69a arranged in sequence in the Z-axis direction (i.e. the thickness direction of the accommodation frame 80), and the first cooperation part 68 contacts the insulating layer 12. The second cooperation part 69a is movably arranged in the connecting piece 70 in the Z-axis direction. The elastic part 69 is fixedly connected between the first cooperation part 68 and the second cooperation part 69a. In Figure 13 the shown embodiment, the elastic part 69 is an S-shaped elastic piece. In the Z-axis direction, the elastic part 69 is located on the side of the power device 30 facing away from the insulating substrate 10. The connection between the second cooperation part 69a and the connecting piece 70 can refer to the related description of the embodiment shown in Figure 6 No further description is given. The design of the elastic part 69 ensures that when the solder resist piece 60 collides with the insulating layer 12, the stress can be buffered by the elastic part 69, avoiding damage to the insulating layer due to the collision between the solder resist piece 60 and the insulating layer 12, which is conducive to improving the yield of the power module 100 (such as Figure 1 shown). In other embodiments, the elastic part 69 can also be an arc-shaped elastic piece or a spring or other elastic component.

[0105] In Figure 13 In the embodiment shown in FIG. 6, the first protrusion 61 is arranged outside the first matching portion 68 and contacts the insulating layer 12; the second protrusion 62 is arranged outside the second matching portion 69a and on the side of the connecting piece 70 away from the insulating substrate 10. For details, refer to the embodiment shown in FIG. 5, which will not be repeated here. Figure 6 In the embodiment shown in FIG. 6, the first protrusion 61 is arranged outside the first matching portion 68 and contacts the insulating layer 12; the second protrusion 62 is arranged outside the second matching portion 69a and on the side of the connecting piece 70 away from the insulating substrate 10. For details, refer to the embodiment shown in FIG. 5, which will not be repeated here.

[0106] It can be understood that Figure 13 In the embodiment shown in FIG. 6, the design that the solder resist sheet 60 contacts the insulating layer 12 and the design that the solder resist sheet 60 includes the first matching portion 68, the elastic portion 69, and the second matching portion 69a can be applied to any of the embodiments shown in FIGS. 1-5. Figures 1-12 In the embodiment shown in FIG. 6, the design that the solder resist sheet 60 contacts the insulating layer 12 and the design that the solder resist sheet 60 includes the first matching portion 68, the elastic portion 69, and the second matching portion 69a can be applied to any of the embodiments shown in FIGS. 1-5.

[0107] Please refer to Figure 14 , Figure 15 , Figure 16 and Figure 17 , and combine Figure 1 and Figure 5 , Figure 14 is another structure diagram of the mold 300 cooperating with the module to be processed 200 provided by the embodiment of the present application. Figure 15 is a structure exploded diagram of the mold 300 and the module to be processed 200 shown in FIG. 8. Figure 14 is a structure exploded diagram of the mold 300 and the module to be processed 200 shown in FIG. 8. Figure 16 is a structure exploded diagram of the mold 300 and the module to be processed 200 shown in FIG. 8. Figure 14 is a structure exploded diagram of the mold 300 and the module to be processed 200 shown in FIG. 8. Figure 17 is a structure exploded diagram of the mold 300 and the module to be processed 200 shown in FIG. 8. Figure 14 is a structure exploded diagram of the mold 300 and the module to be processed 200 shown in FIG. 8.

[0108] As shown in Figure 5 , Figure 14 and Figure 15 , the embodiments shown in FIGS. 9-12 and the embodiment shown in FIG. 6 have similar structures, and the difference between the two is that the structure of the module to be processed 200 is different, and the number of the module to be processed 200 cooperating with the mold 300 is different; correspondingly, the structure of the mold 300 is different, and the structure of the power module 100 (as shown in FIGS. 9-12) is different. Figure 14 Figure 15 As shown in Figure 5 , the embodiments shown in FIGS. 9-12 and the embodiment shown in FIG. 6 have similar structures, and the difference between the two is that the structure of the module to be processed 200 is different, and the number of the module to be processed 200 cooperating with the mold 300 is different; correspondingly, the structure of the mold 300 is different, and the structure of the power module 100 (as shown in FIGS. 9-12) is different. Figure 1 Figure 17

[0109] In Figure 14 and Figure 15 ​​​In the embodiment shown, in the processing module 200, the number of insulating substrates 10 and the number of power devices 30 are both plural. In the Z-axis direction, the plurality of insulating substrates 10 are arranged on one side of the heat sink 20, and the plurality of insulating substrates 10 are arranged at intervals. In the X-axis direction, the plurality of insulating substrates 10 are arranged at intervals in sequence. The welding layer 50 is formed between each insulating substrate 10 and the heat sink 20. The number of welding layers 50 can be one, and the welding layer 50 is fixedly stacked with the heat sink 20 and each insulating substrate 10. The number of welding layers 50 can also be plural, and each welding layer 50 is fixedly stacked with the heat sink 20 and one insulating substrate 10. In the Z-axis direction, at least one power device 30 is arranged on the side of each insulating substrate 10 away from the heat sink 20.

[0110] For example, the number of insulating substrates 10 is two, and the two insulating substrates 10 are a first insulating substrate 10a and a second insulating substrate 10b. Two power devices 30 are arranged on the side of each insulating substrate 10 away from the heat sink 20. In other embodiments, the number of insulating substrates 10 can be three, four, or more. One, three, four, or more power devices 30 can be arranged on the side of the insulating substrate 10 away from the heat sink 20.

[0111] In the embodiment shown, Figure 14 and Figure 15 The number of processing modules 200 cooperating with the mold 300 is plural, and the plurality of processing modules 200 are arranged at intervals. Specifically, in the X-axis direction, the plurality of processing modules 200 are arranged at intervals in sequence. For example, the number of processing modules 200 is two. The two processing modules 200 are a first processing module 200a and a second processing module 200b. In other embodiments, the number of processing modules 200 can be three, four, or more.

[0112] As shown in Figure 14 , Figure 15 and Figure 16 In the embodiment shown, Figure 14 , Figure 15 and Figure 16In the illustrated embodiment, the number of receiving frames 80 is multiple, and the multiple receiving frames 80 are sequentially and spacedly arranged along the X-axis direction. Each receiving frame 80 is in contact with an insulating substrate 10 and receives a power device 30 arranged on the insulating substrate 10 in contact with the receiving frame 80. Specifically, the multiple receiving frames 80 include a first receiving frame 80a, a second receiving frame 80b, a third receiving frame 80c, and a fourth receiving frame 80d. The first receiving frame 80a is in contact with the first insulating substrate 10a of the first to-be-processed module 200a and receives each power device 30 arranged on the first insulating substrate 10a of the first to-be-processed module 200a. The second receiving frame 80b is in contact with the second insulating substrate 10b of the first to-be-processed module 200a and receives each power device 30 arranged on the second insulating substrate 10b of the first to-be-processed module 200a. The third receiving frame 80c is in contact with the first insulating substrate 10a of the second to-be-processed module 200b and receives each power device 30 arranged on the first insulating substrate 10a of the second to-be-processed module 200b. The fourth receiving frame 80d is in contact with the second insulating substrate 10b of the second to-be-processed module 200b and receives each power device 30 arranged on the second insulating substrate 10b of the second to-be-processed module 200b.

[0113] The connecting piece 70 is in abutment with the side of the heat sink 20 of the first to-be-processed module 200a facing the insulating substrate 10 of the first to-be-processed module 200a and is in abutment with the side of the heat sink 20 of the second to-be-processed module 200b facing the insulating substrate 10 of the second to-be-processed module 200b. Specifically, the connecting piece 70 includes a first portion 71 and a second portion 72. In each to-be-processed module 200, the first portion 71 is located on the side of each insulating substrate 10 facing away from the heat sink 20, and the second portion 72 is fixedly connected to the side of the first portion 71 facing the heat sink 20. Among them, the number of second portions 72 is 2, and the two second portions 72 are in abutment with the heat sink 20 of the first to-be-processed module 200a and the heat sink 20 of the second to-be-processed module 200b, respectively. In some other embodiments, the number of second portions 72 can also be 1, 3, 4, or more.

[0114] In Figure 14 , Figure 15 and Figure 16In the shown embodiment, the number of the matching holes 73 is multiple, each of the matching holes 73 penetrates the first part 71 (i.e. the connecting piece 70) along the Z-axis direction, and each of the matching holes 73 is arranged opposite to each of the power devices 30 arranged on one of the insulating substrates 10. Specifically, the projection of each of the matching holes 73 along the Z-axis direction overlaps the projection of each of the power devices 30 arranged on one of the insulating substrates 10 along the Z-axis direction. In the shown embodiment, the number of the matching holes 73 is four, and the four matching holes 73 correspond to the four insulating substrates 10 respectively. In the corresponding matching hole 73 and the insulating substrate 10, the matching hole 73 is arranged opposite to each of the power devices 30 arranged on the insulating substrate 10.

[0115] It can be understood that the welding between the heat sink 20 and the multiple insulating substrates 10 can be realized by one mold 300, which is beneficial to improve the utilization rate of the board area of each of the insulating substrates 10, beneficial to the miniaturization of each of the insulating substrates 10, beneficial to improve the utilization rate of the mold 300, and beneficial to reduce the processing cost.

[0116] As shown in Figure 14 , Figure 15 and Figure 17 , the mold 300 can be applied to the synchronous manufacturing of the multiple power modules 100. Figure 14 and Figure 15 , the mold 300 and the multiple to-be-processed modules 200 can be used to synchronously manufacture the multiple power modules 100. Specifically, after the mold 300 and the multiple to-be-processed modules 200 are assembled, each of the to-be-welded layers 50 (i.e. the flux 51 and the solder 52) can be synchronously heated in a vacuum environment, which is beneficial to improve the processing efficiency and consistency of the power modules 100. In the shown embodiment, each of the power modules 100 includes the multiple insulating substrates 10 and the heat sink 20, and the multiple insulating substrates 10 are located on one side of the heat sink 20 in the thickness direction (i.e. the Z-axis direction) of the insulating substrates 10. Each of the insulating substrates 10 is provided with at least one power device 30 on the side away from the heat sink 20, and each of the insulating substrates 10 is welded with the heat sink 20 to form the welding layer 40.

[0117] It can be understood that the design of the multiple insulating substrates 10 and the multiple power devices 30 in the to-be-processed module 200 and the design of the multiple to-be-processed modules 200 cooperating with the mold 300 in the shown embodiment of Figure 14 and Figure 15 can be applied to any of the shown embodiments. Figures 1-13 ​

Claims

1. A mold for manufacturing a power module, the power module comprising an insulating substrate and a heat sink, wherein a power device is disposed on the side of the insulating substrate facing away from the heat sink, and the insulating substrate is welded to the heat sink, characterized in that, The mold includes multiple solder resist sheets and connectors. The multiple solder resist sheets are arranged to form a receiving frame. The multiple solder resist sheets are located on one side of the connector along the thickness direction of the receiving frame and are movably inserted in the connector. They are all in contact with the side of the insulating substrate facing away from the heat sink. The power device is housed in the receiving frame. The multiple solder resist sheets are used to block flux and solder.

2. The mold according to claim 1, characterized in that, The two adjacent solder resist sheets are in contact.

3. The mold according to claim 1 or 2, characterized in that, The insulating substrate includes a first metal layer, an insulating layer, and a second metal layer disposed sequentially. The power device is disposed on the side of the first metal layer away from the insulating layer. The solder mask is located on the side of the insulating layer away from the second metal layer. In the thickness direction of the housing frame, the distance between the surface of the solder mask away from the insulating layer and the insulating layer is greater than the distance between the surface of the power device away from the insulating layer and the insulating layer.

4. The mold according to claim 3, characterized in that, The solder resist sheet contacts the side of the first metal layer opposite to the insulating layer.

5. The mold according to claim 4, characterized in that, The projection of the solder mask along the thickness direction of the housing frame overlaps with the edge of the projection of the first metal layer along the thickness direction of the housing frame.

6. The mold according to claim 3, characterized in that, The solder resist sheet is in contact with the insulating layer, and the first metal layer is housed in the housing frame.

7. The mold according to claim 6, characterized in that, The strength of the solder resist is less than the strength of the insulating layer.

8. The mold according to claim 6, characterized in that, The surface of the solder resist sheet that contacts the insulating layer has multiple grooves, and the multiple grooves are spaced apart from each other.

9. The mold according to claim 6, characterized in that, The solder resist sheet includes a first solder resist sub-sheet and a second solder resist sub-sheet. The first solder resist sub-sheet is in contact with the insulating layer, and the second solder resist sub-sheet is slidably connected to the first solder resist sub-sheet along the thickness direction of the receiving frame and is movably inserted into the connector.

10. The mold according to claim 6, characterized in that, The solder resist sheet includes a first mating part, an elastic part, and a second mating part arranged sequentially in the thickness direction of the receiving frame. The first mating part is in contact with the insulating layer, and the second mating part is movably inserted into the connector.

11. The mold according to claim 1, characterized in that, The solder resist sheet has a first protrusion on its outer side. The first protrusion is located on the side of the connector facing the insulating substrate. The projection of the first protrusion along the thickness direction of the receiving frame overlaps with the projection of the connector along the thickness direction of the receiving frame.

12. The mold according to claim 1, characterized in that, The solder resist sheet has a second protrusion on its outer side. The second protrusion is located on the side of the connector facing away from the insulating substrate. The projection of the second protrusion along the thickness direction of the receiving frame overlaps with the projection of the connector along the thickness direction of the receiving frame.

13. The mold according to claim 1, characterized in that, The connector is provided with a mating hole, which extends through the connector along the thickness direction of the receiving frame and is positioned opposite to the power device.

14. The mold according to claim 1, characterized in that, The solder resist sheet has a solder resist film on its outer side, the solder resist film at least covers the surface of the solder resist sheet facing away from the inside of the receiving frame, and the thickness of the solder resist film is less than the thickness of the solder resist sheet; And / or, the solder resist sheet is made of solder resist material.

15. A power module, characterized in that, The power module is manufactured using the mold described in any one of claims 1 to 14. The power module includes an insulating substrate and a heat sink. A power device is provided on the side of the insulating substrate facing away from the heat sink and is welded to the heat sink.

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