Machining device for annular workpiece

Abstract

The utility model provides a machining device for an annular workpiece. The machining device comprises a vacuum suction cup, a first clamping device and a second clamping device, wherein the vacuum suction cup is used for adsorbing a first annular surface of an annular workpiece; the abutting piece is arranged on the vacuum suction cup and used for abutting against the circumferential side surface of the annular workpiece; the pressing plate is arranged above the abutting piece and is used for pressing the second annular surface of the annular workpiece; the second annular surface is opposite to the first annular surface, and the distance between the end, used for pressing, of the pressing plate and the end, used for abutting, of the abutting piece in the radial direction of the vacuum chuck can be adjusted.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a processing device for ring-shaped workpieces. Background Technology

[0002] In semiconductor processing, securing the workpiece is a crucial step, primarily to ensure its stability during machining. However, when machining ring-shaped workpieces, insufficient clamping can lead to edge warping, compromising the workpiece's stability. For example, during cutting and milling operations, warped ring-shaped workpieces are prone to displacement or vibration, affecting machining accuracy and quality.

[0003] Currently, although some commonly used processing devices are applied in the field of semiconductor processing technology, these devices have significant shortcomings in solving the problem of fixing ring-shaped workpieces during processing. Taking common fixed-structure processing devices as an example, they cannot be flexibly adjusted according to the actual specifications and dimensions of the ring-shaped workpiece, which greatly limits the applicability of the processing device. In addition, although some processing devices can fix ring-shaped workpieces of different sizes, the clamping process often requires a long auxiliary time, resulting in low processing efficiency.

[0004] Therefore, providing a processing apparatus for ring-shaped workpieces to effectively improve the processing efficiency and quality of ring-shaped workpieces has become an urgent problem to be solved in the current semiconductor processing technology field. Utility Model Content

[0005] To address the aforementioned technical problems, this utility model aims to provide a processing device for ring-shaped workpieces, which can solve the problem that existing processing devices cannot maintain a good fixed state for ring-shaped workpieces during processing.

[0006] The technical solution of this utility model embodiment is implemented as follows:

[0007] This utility model provides a processing device for a ring-shaped workpiece, the processing device comprising:

[0008] A vacuum suction cup for adsorbing the first annular surface of an annular workpiece thereon;

[0009] An abutment member, disposed on the vacuum suction cup, for abutting against the circumferential side surface of the annular workpiece; and

[0010] A pressure plate is disposed above the abutment member for pressing the second annular surface of the annular workpiece;

[0011] The second annular surface is opposite to the first annular surface, and the distance between the pressing end of the pressure plate and the abutting end of the abutting member in the radial direction of the vacuum suction cup is adjustable.

[0012] Alternatively, in some possible implementations, the pressure plate and the abutment are detachably connected.

[0013] Alternatively, in some possible implementations, the pressure plate and the abutment are connected by bolts.

[0014] Optionally, in some possible embodiments, the processing apparatus further includes a pressure-applying element for applying downward pressure to the pressure plate.

[0015] Optionally, in some possible implementations, the pressure-applying member includes: a rod-shaped portion and a fastening portion threadedly connected to the rod-shaped portion;

[0016] When the rod-shaped part passes through the connection hole opened on the pressure plate and the abutment and connects with the vacuum suction cup, pressure is applied to the pressure plate by rotating the fastening part.

[0017] Optionally, in some possible embodiments, the processing apparatus further includes a height adjusting member disposed below the pressure plate for adjusting the height of the pressure plate.

[0018] Optionally, in some possible implementations, one end of the abutment abuts against the inner circumferential side surface of the annular workpiece.

[0019] Optionally, in some possible implementations, both ends of the abutment abut against the inner circumferential side surface of the annular workpiece.

[0020] Alternatively, in some possible implementations, the abutment is configured to extend or retract along its length.

[0021] Optionally, in some possible implementations, one end of the abutment abuts against the outer circumferential side surface of the annular workpiece.

[0022] Optionally, in some possible implementations, a buffer is sandwiched between the pressure plate and the second annular surface.

[0023] Optionally, in some possible implementations, the material hardness of the abutment is less than that of the annular workpiece.

[0024] This invention provides a processing apparatus for a ring-shaped workpiece. First, a vacuum suction cup is used to adhere and fix the ring-shaped workpiece. Then, an abutment member abuts against the circumferential side surface of the ring-shaped workpiece, preventing radial movement of the workpiece through this abutment action. Further, a pressure plate applies downward pressure to clamp the ring-shaped workpiece and the abutment member respectively, ensuring the ring-shaped workpiece remains stably fixed during processing. Moreover, the distance between the pressing end of the pressure plate and the abutment end of the abutment member in the radial direction of the vacuum suction cup is adjustable, ensuring the processing apparatus can accommodate ring-shaped workpieces of different sizes and that their edges are adequately fixed. This not only improves the fixing stability of the ring-shaped workpiece but also enhances the applicability and flexibility of the processing apparatus. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of a ring-shaped workpiece provided by this utility model.

[0026] Figure 2 This is a schematic diagram of the structure of a processing device for a ring-shaped workpiece provided by the present invention.

[0027] Figure 3 This is a schematic diagram of another processing device for ring-shaped workpieces provided by this utility model.

[0028] Figure 4 This is a schematic diagram of a connection method between the pressure plate and the abutment member provided by this utility model.

[0029] Figure 5 This is a schematic diagram of a specific structure of the pressure-applying component provided by this utility model.

[0030] Figure 6 This is a schematic diagram of another processing device for ring-shaped workpieces provided by this utility model.

[0031] Figure 7 This is a schematic diagram of a structure in which a buffer element is sandwiched between a pressure plate and a ring-shaped workpiece, as provided by this utility model. Detailed Implementation

[0032] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0033] Unless otherwise defined, the technical terms used in this invention should be understood in the ordinary sense known to those skilled in the art. Terms such as "upper" and "lower" in this invention are used only to indicate relative positional relationships.

[0034] It should be noted that, for clarity, not all features of a particular embodiment are described or shown in the specification and drawings. Furthermore, to avoid unnecessary details obscuring the technical solution of interest to this utility model, only the device structure and parts closely related to the technical solution of this utility model are described and shown in the specification and drawings, while other details that are not closely related to the technical content of this utility model and are known to those skilled in the art are omitted.

[0035] It should be noted that, as Figure 1 As shown, in one embodiment of the present invention, the annular workpiece 1 includes a first annular surface 11, a second annular surface 12 opposite to the first annular surface 11, an inner circumferential side surface 13, and an outer circumferential side surface 14 opposite to the inner circumferential side surface 13.

[0036] See Figure 2 This invention illustrates a processing apparatus 2 for a ring-shaped workpiece 1, comprising: a vacuum suction cup 10, an abutment member 20 disposed on the vacuum suction cup 10, and a pressure plate 30 disposed above the abutment member 20. Specifically, the vacuum suction cup 10 is used to adsorb the first annular surface 11 of the ring-shaped workpiece 1. The abutment member 20 is used to abut against the circumferential side surface of the ring-shaped workpiece 1. The pressure plate 30 is used to press the second annular surface 12 of the ring-shaped workpiece 1.

[0037] In some examples, the annular workpiece 1 can be a annular silicon carbide product, or it can be an annular product of other semiconductor materials. In this invention, the material of the annular product is not specifically limited.

[0038] In some examples, the circumferential side surface of the annular workpiece 1 in this invention includes the aforementioned inner circumferential side surface 13 and outer circumferential side surface 14. Based on this, in this invention, as... Figure 2 and Figure 3 As shown, the abutment 20 can be arranged along the inner circumference and / or outer circumference of the annular workpiece 1.

[0039] It should be noted that the inner circumferential direction of the annular workpiece 1 refers to the tangent direction along the inner circumference of the annular workpiece 1, that is, the circumferential direction around the edge of the inner circle. The outer circumferential direction of the annular workpiece 1 refers to the tangent direction along the outer circumference of the annular workpiece 1, that is, the circumferential direction around the edge of the outer circle.

[0040] In this invention, a vacuum suction cup 10 is used to fix and adsorb the annular workpiece 1. Since the vacuum suction cup 10 utilizes the vacuum principle to achieve damage-free fixation of the annular workpiece 1, it effectively avoids mechanical damage and contamination to the first annular surface 11 of the annular workpiece 1. In specific implementation, when the vacuum pump in the vacuum suction cup 10 is activated, a powerful suction force rapidly removes the gas between the vacuum suction cup 10 and the annular workpiece 1 through the gas channel on the vacuum suction cup 10. This process creates a vacuum region below the annular workpiece 1, with a pressure much lower than the external atmospheric pressure. Under the action of the external atmospheric pressure, the annular workpiece 1 is pressed against the surface of the vacuum suction cup 10, thereby achieving fixation of the annular workpiece 1.

[0041] In this utility model, the vacuum suction cup 10 only needs to be able to adsorb the annular workpiece 1 in the specific implementation process, and its specific type is not specifically limited.

[0042] When machining the annular workpiece 1, due to its high material hardness, relying solely on the vacuum suction cup 10 for adsorption and fixation may not effectively prevent displacement of the annular workpiece 1 during machining. To solve this problem, this invention adds an abutment member 20 to the circumferential side surface of the annular workpiece 1. This abutment member 20 can apply tension along the radial direction of the annular workpiece 1. Through this tension, the movement of the annular workpiece 1 in its radial direction is effectively restricted, thereby ensuring stability during machining.

[0043] In this invention, a pressure plate 30 is further added. This pressure plate 30 is positioned above the annular workpiece 1 and is used to press the second annular surface 12 of the annular workpiece 1, thereby clamping the annular workpiece 1. In this configuration, not only can the stability of the annular workpiece 1 during processing be effectively improved, ensuring it remains fixed under high-precision processing conditions, but the reliability of the entire processing device 2 can also be further enhanced, meeting the needs of various processing scenarios.

[0044] Furthermore, in this invention, when the pressure plate 30 presses against the second annular surface 12 of the annular workpiece 1, the pressure plate 30 applies a certain pressure to the abutment member 20 located below it. This pressure keeps the abutment member 20 stable and allows it to tightly abut against the circumferential side surface of the annular workpiece 1, thereby effectively preventing the annular workpiece 1 from moving in its radial direction. In this way, this invention solves the problem that when the abutment member 20 abuts against the circumferential side surface of the annular workpiece 1, the annular workpiece 1 may move due to the movement of the abutment member 20 itself, thus improving the stability of the annular workpiece 1 during processing.

[0045] Furthermore, such as Figure 4As shown, in this invention, the distance between the pressing end 31 of the pressure plate 30 and the abutting end 21 of the abutting member 20 in the radial direction of the vacuum suction cup 10 is adjustable. In practice, when the dimensions of the annular workpiece 1 change, especially when the annular width of the annular workpiece 1 changes, the contact area between the pressure plate 30 and the second annular surface 12 may decrease, resulting in insufficient edge fixation of the annular workpiece 1. It is understandable that if the edge of the annular workpiece 1 is not sufficiently fixed, it is prone to warping during processing. This warping phenomenon causes a change in the vacuum level of the vacuum area below the annular workpiece 1, thereby reducing the suction force of the vacuum suction cup 10 on the annular workpiece 1, thus affecting the overall fixing effect of the annular workpiece 1, and even ultimately affecting processing accuracy and quality. Therefore, in practice, for example, when the annular width of the annular workpiece 1 increases, adjusting the position of the pressure plate 30 along the radial direction of the annular workpiece 1 can increase the contact area between the pressure plate 30 and the second annular surface 12 of the annular workpiece 1, thereby effectively preventing edge warping. In other words, by making the distance between the pressing end 31 of the pressure plate 30 and the abutting end 21 of the abutting member 20 in the radial direction of the vacuum suction cup 10 adjustable, the pressure plate 30 can better match the size of the annular workpiece 1, thereby maintaining the stability of the vacuum area below the annular workpiece 1, ensuring the adsorption force of the vacuum suction cup 10 on the annular workpiece 1, and ultimately improving the fixation stability of the annular workpiece 1 during the processing.

[0046] The processing apparatus 2 provided by this invention first uses a vacuum suction cup 10 to adsorb and fix the annular workpiece 1. Then, an abutment member 20 abuts against the circumferential side surface of the annular workpiece 1, preventing the annular workpiece 1 from moving radially. Further, a downward pressure is applied by a pressure plate 30 to press the annular workpiece 1 and the abutment member 20 together, ensuring the annular workpiece 1 remains stably fixed during processing. Moreover, the distance between the pressing end 31 of the pressure plate 30 and the abutment end 21 of the abutment member 20 in the radial direction of the vacuum suction cup 10 is adjustable, ensuring that the processing apparatus 2 can adapt to annular workpieces 1 of different sizes and that their edges are adequately fixed. This not only improves the fixing stability of the annular workpiece 1 but also enhances the applicability and flexibility of the processing apparatus 2.

[0047] for Figure 2 In some possible implementations of the technical solution shown, the pressure plate 30 and the abutment member 20 are detachably connected.

[0048] To ensure that the distance between the pressing end 31 of the pressure plate 30 and the abutting end 21 of the abutting member 20 is adjustable, the pressure plate 30 and the abutting member 20 are connected in a detachable manner during implementation. This detachable connection method may specifically include bolt connection, snap-fit ​​connection, pin connection, etc.

[0049] Optionally, in some examples, such as Figure 4 As shown, the pressure plate 30 and the abutment 20 are connected by bolts 41. Specifically, both the pressure plate 30 and the abutment 20 are provided with threaded holes 42. The bolts 41 pass through the threaded holes 42 provided in the pressure plate 30 and the abutment 20 to connect the pressure plate 30 and the abutment 20.

[0050] It should be noted that the number of bolts 41 can be determined according to the actual situation. In this utility model, no specific limitation is made in this regard.

[0051] In some examples, the threaded hole 42 can be an elongated hole. Both the pressure plate 30 and the abutment 20 have elongated holes. This allows the pressure plate 30 and the abutment 20 to be adjusted within a certain range. Even after the position of the pressure plate 30 is moved, the bolt 41 can still pass through the threaded hole 42 to connect the pressure plate 30 and the abutment 20. Specifically, for example, when changing the contact area between the pressure plate 30 and the second annular surface 12 by moving the position of the pressure plate 30, the elongated hole allows the processing device 2 to adapt to annular workpieces 1 of different sizes.

[0052] Furthermore, by connecting the pressure plate 30 and the abutment 20 with bolts 41, the pressure plate 30 can be moved flexibly without removing the bolts 41, thereby enabling quick adjustment and assembly.

[0053] for Figure 2 The technical solution shown, in some possible implementations, such as Figure 2 As shown, the processing device 2 also includes a pressure-applying member 40, which is used to apply downward pressure to the pressure plate 30.

[0054] In this invention, the downward pressure applied to the pressure plate 30 by the pressure applying member 40 ensures a tighter contact between the pressure plate 30 and the second annular surface 12 of the annular workpiece 1, thereby effectively pressing the annular workpiece 1. Furthermore, the pressure applied by the pressure applying member 40 can be transmitted to the abutment member 20 through the pressure plate 30, ensuring that the abutment member 20 maintains tight contact with the circumferential side surface of the annular workpiece 1, effectively preventing the annular workpiece 1 from moving in the radial direction.

[0055] In some examples of the above implementation methods, such as Figure 5As shown, the pressure-applying member 40 includes: a rod-shaped portion 51 and a fastening portion 52 threadedly connected to the rod-shaped portion 51;

[0056] When the rod-shaped part 51 passes through the connection hole 53 opened on the pressure plate 30 and the abutment 20 and is connected to the vacuum suction cup 10, pressure is applied to the pressure plate 30 by rotating the fastening part 52.

[0057] It should be noted that both the pressure plate 30 and the abutment member 20 are provided with connection holes 53, and the positions of the connection holes 53 on the two are corresponding to each other, so as to ensure that the rod-shaped part 51 can pass through smoothly and achieve the connection between the two.

[0058] In some examples, such as Figure 5 As shown, the connecting hole 53 can be an elongated hole so that when the pressure plate 30 is adjusted, the rod-shaped part 51 can move within a certain range in the connecting hole 53, thereby better adapting to ring workpieces 1 of different sizes and ensuring that the pressure plate 30 and the second ring surface 12 and the abutment 20 and the circumferential side surface of the ring workpiece 1 maintain close contact.

[0059] By configuring the pressure-applying component 40 to include a rod-shaped portion 51 and a fastening portion 52, and having the rod-shaped portion 51 pass through the connection hole 53 on the pressure plate 30 and the abutment 20 and connect to the vacuum suction cup 10, when the fastening portion 52 is rotated to apply downward pressure, this pressure can be transmitted to the pressure plate 30, thereby pressing the annular workpiece 1 and the abutment 20 respectively. This design of the pressure-applying component 40 allows for precise control of the pressure applied to the pressure plate 30, enabling flexible adjustment of the pressure according to the specific material and processing requirements of the annular workpiece 1, ensuring the best fixing effect.

[0060] for Figure 2 The technical solution shown is as follows: Figure 2 As shown, the processing device 2 also includes a height adjustment member 50, which is disposed below the pressure plate 30 for adjusting the height of the pressure plate 30.

[0061] The height of the pressure plate 30 can be precisely adjusted using the height adjustment component 50, ensuring that its lower surface is flush with the second annular surface 12. This guarantees complete contact between the pressure plate 30 and the annular workpiece 1, preventing uneven localized stress caused by height mismatch. Specifically, adjusting the height of the pressure plate 30 prevents the annular workpiece 1 from warping at the edges during processing due to uneven stress, thereby reducing processing errors and improving processing accuracy. Furthermore, the height adjustment component 50 allows the pressure plate 30 to adapt to annular workpieces 1 of varying heights, enhancing the flexibility and applicability of the processing device 2.

[0062] Furthermore, when pressure is applied to the pressure plate 30 using the pressure-applying component 40, the height adjustment component 50 and the annular workpiece 1 together generate a reaction force on the pressure plate 30. This balanced distribution of reaction force not only further ensures the stability of the pressure plate 30 but also effectively prevents deformation or damage to the pressure plate 30 due to excessive local stress. In this way, the pressure plate 30 can evenly transmit pressure to the second annular surface 12 and the abutment component 20 of the annular workpiece 1, thereby achieving stable fixation of the annular workpiece 1.

[0063] for Figure 2 The technical solution shown, in some possible implementations, such as Figure 2 As shown, one end of the abutment 20 abuts against the inner circumferential side surface 13 of the annular workpiece 10.

[0064] By abutting one end of the abutment 20 against the inner circumferential side surface 13 of the annular workpiece 1, tension can be directly applied in the radial direction of the annular workpiece 1, effectively preventing the annular workpiece 1 from moving in its radial direction during processing, thereby significantly enhancing the radial stability of the annular workpiece 1. This is particularly important for high-precision machining, as radial movement can lead to machining errors.

[0065] Of course, in order to provide greater tension in the radial direction of the annular workpiece 1, thereby effectively preventing displacement of the annular workpiece 1 during processing and ensuring its stability during processing, in some possible embodiments, such as Figure 6 As shown, both ends of the abutment 20 abut against the inner circumferential side surface 13 of the annular workpiece 1.

[0066] In some examples of the above-described embodiments, the abutment 20 is configured to be able to extend and retract along its length.

[0067] This design allows the abutment 20 to adapt to annular workpieces 1 with different inner diameters. Specifically, the length of the abutment 20 can be adjusted according to the specific dimensions of the annular workpiece 1, thereby more evenly distributing the tension between it and the inner circumferential side surface 13 of the annular workpiece 1. This not only helps reduce stress concentration but also reduces the risk of damage to the annular workpiece 1 due to excessive local pressure during processing.

[0068] In practice, the dimensions of the annular workpiece 1 are uncertain; its inner and outer diameters may vary depending on the specific application scenario. To effectively fix the annular workpiece 1 with its smaller inner diameter, for... Figure 2 The technical solution shown, in some possible implementations, such as Figure 3 As shown, one end of the abutment 20 abuts against the outer circumferential side surface 14 of the annular workpiece 1.

[0069] for Figure 2The technical solution shown, in some possible implementations, such as Figure 7 As shown, a buffer 60 is sandwiched between the pressure plate 30 and the second annular surface 12.

[0070] In this configuration, the buffer 60 reduces direct friction and impact between the pressure plate 30 and the annular workpiece 1, thereby reducing wear on the second annular surface 12 of the annular workpiece 1. Furthermore, the buffer 60 effectively absorbs the impact force generated by the pressure plate 30 during the clamping process, mitigating direct impact on the annular workpiece 1 and preventing damage to the second annular surface 12 of the annular workpiece 1 caused by impact.

[0071] In some possible implementations, the material hardness of the abutment 20 is less than that of the annular workpiece 1.

[0072] This is because when the material of the abutment 20 has a lower hardness, it can reduce scratches or damage to the circumferential side surface of the annular workpiece 1 when it abuts against it. This is especially suitable for annular workpieces 1 made of high-hardness materials, such as annular workpieces made of silicon carbide. By selecting a material with lower hardness, the abutment 20 can effectively protect the integrity of the surface of the annular workpiece 1 and avoid surface damage caused by the abutment 20 being too hard.

[0073] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A processing apparatus for a ring-shaped workpiece, characterized in that, The processing apparatus includes: A vacuum suction cup for adsorbing the first annular surface of an annular workpiece thereon; An abutment member, disposed on the vacuum suction cup, for abutting against the circumferential side surface of the annular workpiece; and A pressure plate is disposed above the abutment member for pressing the second annular surface of the annular workpiece; The second annular surface is opposite to the first annular surface, and the distance between the pressing end of the pressure plate and the abutting end of the abutting member in the radial direction of the vacuum suction cup is adjustable.

2. The processing apparatus for a ring-shaped workpiece according to claim 1, characterized in that, The pressure plate and the abutment are detachably connected.

3. The processing apparatus for a ring-shaped workpiece according to claim 2, characterized in that, The pressure plate and the abutment are connected by bolts.

4. The processing apparatus for a ring-shaped workpiece according to claim 1, characterized in that, The processing apparatus further includes a pressure-applying component, which is used to apply downward pressure to the pressure plate.

5. The processing apparatus for a ring-shaped workpiece according to claim 4, characterized in that, The pressure-applying component includes: a rod-shaped portion and a fastening portion threadedly connected to the rod-shaped portion; When the rod-shaped part passes through the connection hole opened on the pressure plate and the abutment and connects with the vacuum suction cup, pressure is applied to the pressure plate by rotating the fastening part.

6. The processing apparatus for a ring-shaped workpiece according to any one of claims 1 to 5, characterized in that, The processing device further includes a height adjusting component, which is disposed below the pressure plate to adjust the height of the pressure plate.

7. The processing apparatus for a ring-shaped workpiece according to claim 1, characterized in that, One end of the abutment abuts against the inner circumferential side surface of the annular workpiece.

8. The processing apparatus for a ring-shaped workpiece according to claim 1, characterized in that, Both ends of the abutting member abut against the inner circumferential side surface of the annular workpiece.

9. The processing apparatus for a ring-shaped workpiece according to claim 8, characterized in that, The abutment is configured to extend and retract along its length.

10. The processing apparatus for a ring-shaped workpiece according to claim 1, characterized in that, One end of the abutment abuts against the outer circumferential side surface of the annular workpiece.

11. The processing apparatus for a ring-shaped workpiece according to claim 1, characterized in that, A buffer is sandwiched between the pressure plate and the second annular surface.

12. The processing apparatus for a ring-shaped workpiece according to claim 1, characterized in that, The material hardness of the abutment is less than that of the annular workpiece.

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