Perovskite Inline type vacuum coating equipment

Abstract

The utility model relates to perovskite Inline type vacuum coating equipment which comprises an evaporation cavity, an evaporation source arranged at the center of the lower part of the evaporation cavity, a moving mechanism arranged at the upper part of the evaporation cavity, a carrier plate driven by the moving mechanism to move, and a vacuum pump arranged outside the evaporation cavity, the evaporation cavity is divided into an upper cavity and a lower cavity with the conveying face of the carrier plate as an interface, the vacuum pump is connected to the outer portion of the evaporation cavity through the mounting flange, a cavity is formed in the mounting flange, the upper portion of the cavity is directly communicated with the lower cavity, the side of the cavity is communicated with the side wall of the upper cavity through an upper air suction pipe, and the side of the cavity is further communicated with the side wall of the lower cavity through a lower air suction pipe. The three air suction positions of the upper cavity and the lower cavity are independent, so that the upper cavity does not need to suck air through the lower cavity, but directly obtains suction force from the upper air suction pipe, all spaces of the evaporation cavity can be rapidly pumped to be in a vacuum state, no large pressure difference exists between the upper cavity and the lower cavity, large fluctuation of the plating rate is avoided, and the evaporation efficiency is improved. And the film coating is stable and good in repeatability.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of evaporation technology, especially to a perovskite Inline type vacuum coating equipment. BACKGROUND

[0002] Vacuum coating refers to the formation of gaseous particles by traditional deposition materials under vacuum conditions by means of current heating, electron beam bombardment, etc. The gaseous particles are deposited onto the substrate by straight-line motion with little collision under high vacuum conditions. When the number of particles exceeds a certain critical value, it becomes a stable nucleus, and then continues to absorb and diffuse particles to gradually grow. Finally, through the contact and merging of adjacent stable nuclei, a continuous thin film is formed. The perovskite mass production vacuum coating field usually adopts Inline (linear) equipment structure, such as vertical or horizontal Inline PVD equipment for nickel oxide, horizontal Inline evaporation equipment for C60& lithium fluoride, etc.

[0003] In order to improve material utilization, the distance between the carrier plates is usually reduced when using Inline equipment structure. The entry of the carrier plates in succession will cause the cavity to be divided into two parts with poor flowability, the lower part of the cavity can maintain a relatively optimal level of vacuum due to the connection of the vacuum pump, while the upper part has poor evacuation ability and high vacuum degree, forming a pressure difference between the upper and lower parts, which will cause the deposition rate to fluctuate, seriously affecting the stability of the deposition rate and the repeatability of the coating.

[0004] Chinese patent CN203668497U discloses an evaporation coating machine for amorphous selenium thin film, which is provided with a molecular pump below the temperature control area on both sides of the coating chamber, and the molecular pump is connected with the coating chamber through a high-vacuum isolation valve. Here, the communication position of the molecular pump with the coating chamber is only below the coating chamber, so that the pressure difference problem is prone to occur.

[0005] Therefore, it is necessary to improve the structure of the evaporation equipment to solve the above problems. UTILITY MODEL CONTENT

[0006] The main purpose of the utility model is to provide a perovskite Inline type vacuum coating equipment, which can prevent a large pressure difference between the upper cavity and the lower cavity and avoid large fluctuations in the deposition rate.

[0007] The utility model discloses a perovskite Inline formula vacuum coating equipment, including evaporation cavity, the evaporation source of lower center of being arranged in the evaporation cavity, the moving mechanism of being arranged in the upper portion of evaporation cavity, the carrier plate of moving of being driven by the moving mechanism and the vacuum pump of being arranged outside evaporation cavity, the evaporation cavity is with the transport surface of carrier plate as the demarcation surface and is divided into upper cavity and lower cavity, the vacuum pump is connected in the outside of evaporation cavity through mounting flange, forms a cavity in the mounting flange, the upper portion of cavity is directly communicated with lower cavity, the lateral side of cavity is communicated with the lateral wall of upper cavity through upper suction pipe, the lateral side of cavity still is communicated with the lateral wall of lower cavity through lower suction pipe.

[0008] Specifically, the carrier plate supports the substrate and exposes the middle part of the bottom surface of the substrate, the moving mechanism is located on the upper part of the lower cavity and includes several pairs of transmission wheels conveying the carrier plate in the same horizontal direction, the transmission wheels hold the side edges of the carrier plate and do not block the exposed part of the lower surface of the substrate.

[0009] Specifically, one vacuum pump is arranged on the inlet side and the outlet side of the evaporation cavity respectively, the inlet side vacuum pump is provided with at least three inlets on the inlet section of the evaporation cavity, and the outlet side vacuum pump is provided with at least three inlets on the outlet section of the evaporation cavity.

[0010] Further, a vacuum valve is arranged between the vacuum pump and the mounting flange.

[0011] Further, an upper pressure regulating valve is arranged in the upper suction pipe, and a lower pressure regulating valve is arranged in the lower suction pipe.

[0012] Further, an upper anti-coating net is arranged in the upper suction pipe, and the upper anti-coating net is closer to the upper cavity than the upper pressure regulating valve.

[0013] Further, a lower anti-coating net is arranged in the lower suction pipe, and the lower anti-coating net is closer to the lower cavity than the lower pressure regulating valve.

[0014] Specifically, the carrier plate is a square frame structure, and a plurality of gas distribution ports are arranged on each side frame of the carrier plate and penetrate the side frame from top to bottom, and all the gas distribution ports are located outside the substrate supporting area.

[0015] Further, an L-shaped anti-coating plate is arranged on the side frame of the carrier plate, and the horizontal part of the L-shaped anti-coating plate is higher than the upper surface of the carrier plate and located above the gas distribution port.

[0016] The utility model discloses the technical scheme has the advantages of:

[0017] In this invention, the upper and lower chambers have independent suction positions and are set to three. Therefore, the upper chamber does not need to draw air through the lower chamber, but directly obtains suction from the upper suction pipe. In this way, all the spaces in the vapor deposition chamber can be quickly evacuated to a vacuum state. There will not be a large pressure difference between the upper and lower chambers, avoiding large fluctuations in the deposition rate, resulting in stable coating and good repeatability. Attached Figure Description

[0018] Figure 1 This is a front view schematic diagram of a perovskite inline vacuum coating equipment for an embodiment.

[0019] Figure 2 This is a side view schematic diagram of the perovskite inline vacuum coating equipment used in this embodiment;

[0020] Figure 3 This is a bottom view of the carrier plate;

[0021] Figure 4 This is a cross-sectional view of the carrier plate and the substrate.

[0022] The numbers in the image represent:

[0023] 100-Perovskite Inline Vacuum Coating Equipment

[0024] 1-Evaporation chamber, 11-Upper chamber, 12-Lower chamber;

[0025] 2-Evaporation source;

[0026] 3-Moving mechanism, 31-Transmission wheel;

[0027] 4-Carrier plate, 41-Air outlet, 42-L-shaped anti-plating plate;

[0028] 5-Vacuum pump, 51-Mounting flange, 52-Vacuum valve, 53-Upper suction pipe, 531-Upper pressure regulating valve, 532-Upper anti-plating mesh, 54-Lower suction pipe, 541-Lower pressure regulating valve, 542-Lower anti-plating mesh;

[0029] 200-Substrate. Detailed Implementation

[0030] The present invention will be further described in detail below with reference to specific embodiments.

[0031] Example 1:

[0032] like Figures 1 to 4 As shown, the present invention provides a perovskite inline vacuum coating equipment 100, which includes a evaporation chamber 1, an evaporation source 2 located at the lower center of the evaporation chamber 1, a moving mechanism 3 located at the upper part of the evaporation chamber 1, a carrier plate 4 driven to move by the moving mechanism 3, and a vacuum pump 5 located outside the evaporation chamber 1. The carrier plate 4 supports the substrate 200 and exposes the center of the bottom surface of the substrate 200.

[0033] As shown in Figure 1 and Figure 2 , the evaporation chamber 1 is divided into an upper chamber 11 and a lower chamber 12 by the transport surface of the carrier plate 4. The vacuum pump 5 is connected to the outside of the evaporation chamber 1 through a mounting flange 51. The mounting flange 51 forms a cavity. The upper part of the cavity is directly connected to the lower chamber 12. The side of the cavity is connected to the side wall of the upper chamber 11 through an upper suction pipe 53. The side of the cavity is also connected to the side wall of the lower chamber 12 through a lower suction pipe 52b.

[0034] The carrier plate 4 and the substrate 200 form a flat blocking structure, so it is difficult for air to flow between the upper chamber 11 and the lower chamber 12. In order to make the upper and lower surfaces of the substrate 200 be in a high vacuum environment, the suction positions of the upper chamber 11 and the lower chamber 12 are independent and are provided with three (i.e. the upper inlet of the cavity, the inlet of the upper suction pipe 53 and the inlet of the lower suction pipe 54). Therefore, the upper chamber 11 does not need to suck air through the lower chamber 12, but directly obtains suction force from the upper suction pipe 53. In this way, all spaces of the evaporation chamber 1 can be quickly pumped to a vacuum state. There is no large pressure difference between the upper chamber 11 and the lower chamber 12, avoiding large fluctuations in the deposition rate, stable film deposition and good repeatability.

[0035] As shown in Figure 1 , a vacuum valve 52 is provided between the vacuum pump 5 and the mounting flange 51.

[0036] The vacuum valve 52 can quickly cut off the air passage between the vacuum pump 5 and the mounting flange 51, thereby realizing emergency shutdown and avoiding accidental damage to the vacuum pump 5. In addition, during maintenance work, it is not necessary to close the molecular pump. After the maintenance work is completed, the plug-in valve 52 can be directly opened after the dry pump is pumped to a low vacuum, reducing the pumping time and improving the production rhythm.

[0037] As shown in Figure 1 , the moving mechanism 3 is located at the upper part of the lower chamber 12 and includes a plurality of pairs of transmission wheels 31 for transporting the carrier plate 4 in the same horizontal direction. The transmission wheels 31 hold the side edges of the carrier plate 4 and make the exposed part of the lower surface of the substrate 200 not be blocked by the transmission wheels 31.

[0038] The evaporation source 2 evaporates from the lower part of the lower chamber 12 to the middle part of the lower surface of the substrate 200, so the evaporation part cannot be blocked by the transmission wheels 31 or the carrier plate 4. Therefore, the transmission wheels 31 are arranged in pairs to hold the carrier plate 4 from both sides in the transport direction.

[0039] Example 2:

[0040] As shown in Figure 1As shown, the difference from Embodiment 1 is that: the upper suction pipe 53 is provided with an upper pressure regulating valve 531 and an upper anti-plating mesh 532, and the upper anti-plating mesh 532 is closer to the upper cavity 11 than the upper pressure regulating valve 531; the lower suction pipe 54 is provided with a lower pressure regulating valve 541 and a lower anti-plating mesh 542, and the lower anti-plating mesh 542 is closer to the lower cavity 12 than the lower pressure regulating valve 541.

[0041] Because the upper suction pipe 53 and the lower suction pipe 54 have different lengths and different numbers of bends, although they generate suction from the same vacuum pump 5, the resistance is different, which will still cause a pressure difference between the upper chamber 11 and the lower chamber 12. The upper pressure regulating valve 531 and the lower pressure regulating valve 541 can adjust the flow resistance by adjusting the opening degree to achieve a balance of the upper and lower vacuum. The evaporation source 2 contains vapor deposition material. During the vapor deposition process, the vapor of the vapor deposition material will diffuse in the vapor deposition chamber 1. Under the action of suction, it will enter the pressure regulating valve or vacuum valve 52 behind it through the upper suction pipe 53 or the lower suction pipe 54. The vapor deposition material cools inside these parts, which will cause the pipe passage area to decrease, the flow resistance to increase, or even blockage, making cleaning inconvenient. Therefore, it is necessary to use the upper anti-plating mesh 532 and the lower anti-plating mesh 542 to filter out the vapor of the vapor deposition material, thereby protecting the parts. The anti-plating mesh can adopt a louvered structure.

[0042] Example 3:

[0043] like Figure 1 As shown, the difference from Embodiment 1 is that: a vacuum pump 5 is provided on both the inlet and outlet sides of the vapor deposition chamber 1. The inlet side vacuum pump has at least three inlets in the inlet section of the vapor deposition chamber 1, and the outlet side vacuum pump has at least three inlets in the outlet section of the vapor deposition chamber 1.

[0044] This configuration allows for a more uniform vacuum level in the transport direction, and the simultaneous suction of multiple vacuum pumps 5 accelerates the pumping speed. Compared to a single vacuum pump, this enables the vapor deposition chamber 1 to reach the required vacuum level more quickly, while ensuring that the inlet and outlet of the vapor deposition chamber 1 are in a high vacuum state, resulting in a more stable vacuum level inside the vapor deposition chamber 1. The technical features of Embodiment 2 can also be applied to the design of Embodiment 3, thereby achieving greater pressure uniformity over a wider range in the vapor deposition chamber 1.

[0045] Example 4:

[0046] The difference from Embodiment 1 is that the carrier plate 4 has a square frame structure, and several air distribution ports 41 are provided vertically through each frame of the carrier plate 4. All air distribution ports 41 are located on the outside of the area of ​​the supporting substrate 200.

[0047] The air distribution port 41 leaves space for air to flow in the upper and lower chambers on the carrier plate 4, allowing air to flow up and down even when the front and rear carrier plates 4 are close together, which helps to balance the pressure difference between the upper and lower chambers.

[0048] The frame of the carrier plate 4 is also provided with an L-shaped plating prevention plate 42, the horizontal part of the L-shaped plating prevention plate 42 is higher than the upper surface of the carrier plate 4 and is located above the gas distribution port 41.

[0049] Although the gas distribution port 41 facilitates the air flow, it also makes the evaporation material more easily enter the space of the upper cavity 11, so the L-shaped plating prevention plate 42 is used to shield the upper part of the gas distribution port 41. The horizontal part of the L-shaped plating prevention plate 42 and the upper surface of the carrier plate 4 have a space for air flow, but the evaporation material is more likely to deposit on the lower surface of the horizontal part of the L-shaped plating prevention plate 42, thereby facilitating cleaning.

[0050] The perovskite inline vacuum coating device 100 will start the front and rear vacuum pumps 5, the vacuum valve 52, the upper pressure regulating valve 531 and the lower pressure regulating valve 541 before formal evaporation, so that the evaporation cavity 1 can be fully evacuated. A plurality of carrier plates 4 with substrates 200 enter the evaporation cavity 1 one by one at a close distance, and the inlet and outlet of the evaporation cavity 1 can maintain the high vacuum state of the internal evaporation cavity 1 due to timely vacuumizing. The gas distribution port 41 allows the carrier plate 4 to ventilate up and down, keeping the pressure uniform above and below the substrate 200. The transmission wheel 31 successively uniformly passes the plurality of carrier plates 4 through the evaporation source 2 at a process speed, the evaporation source 2 evaporates the evaporation material to the lower surface of the substrate 200, and the substrate is deposited with the target film thickness of the material after the carrier plate passes through the evaporation area at the process speed.

[0051] The above only describes some embodiments of the present application. For those skilled in the art, without departing from the inventive concept of the present application, a number of modifications and improvements can be made, which are all within the scope of protection of the present application.

Claims

1. A perovskite Inline vacuum coating device, comprising an evaporation chamber, an evaporation source arranged at the lower center of the evaporation chamber, a moving mechanism arranged at the upper part of the evaporation chamber, a carrier plate driven to move by the moving mechanism, and a vacuum pump arranged outside the evaporation chamber; characterized in that: The evaporation cavity is divided into an upper cavity and a lower cavity by a conveying surface of the carrier plate, the vacuum pump is connected to the outside of the evaporation cavity through a mounting flange, an inner cavity is formed in the mounting flange, the upper part of the inner cavity is directly communicated with the lower cavity, the lateral part of the inner cavity is communicated with the lateral wall of the upper cavity through an upper suction pipe, and the lateral part of the inner cavity is also communicated with the lateral wall of the lower cavity through a lower suction pipe.

2. The perovskite inline vacuum coating apparatus according to claim 1, wherein: The carrier plate supports the substrate and exposes the middle part of the bottom surface of the substrate, the moving mechanism is located at the upper part of the lower cavity and includes a plurality of pairs of transmission wheels conveying the carrier plate in the same horizontal direction, the transmission wheels hold the lateral edges of the carrier plate and do not shield the exposed part of the lower surface of the substrate.

3. The perovskite inline vacuum coating apparatus according to claim 1, wherein: The inlet side and the outlet side of the evaporation cavity are each provided with a vacuum pump, the inlet side vacuum pump is provided with at least three inlets in the inlet section of the evaporation cavity, and the outlet side vacuum pump is provided with at least three inlets in the outlet section of the evaporation cavity.

4. The perovskite inline vacuum coating apparatus according to claim 1 or 3, characterized in that: A vacuum valve is arranged between the vacuum pump and the mounting flange.

5. The perovskite inline vacuum coating apparatus according to claim 1 or 3, characterized in that: An upper pressure regulating valve is arranged in the upper suction pipe, and a lower pressure regulating valve is arranged in the lower suction pipe.

6. The perovskite inline vacuum coating apparatus according to claim 5, characterized in that: An upper anti-evaporation net is further arranged in the upper suction pipe, and the upper anti-evaporation net is closer to the upper cavity than the upper pressure regulating valve.

7. The perovskite inline vacuum coating apparatus according to claim 5, wherein: A lower anti-evaporation net is further arranged in the lower suction pipe, and the lower anti-evaporation net is closer to the lower cavity than the lower pressure regulating valve.

8. The perovskite inline vacuum coating apparatus according to claim 1, wherein: The carrier plate is a square frame structure, a plurality of gas distribution ports are arranged on each side frame of the carrier plate and penetrate the side frame from top to bottom, and all the gas distribution ports are located outside the substrate supporting area.

9. The perovskite inline vacuum coating apparatus according to claim 8, characterized in that: An L-shaped anti-evaporation plate is further arranged on the side frame of the carrier plate, and the horizontal part of the L-shaped anti-evaporation plate is higher than the upper surface of the carrier plate and located above the gas distribution ports.

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