Waterproof chip

Abstract

The waterproof chip comprises a chip body, the chip body is composed of a chip base, a chip top plate, a CPU core, pins, a buffer structure, a heat dissipation structure and a sealing structure, the chip top plate is arranged at the top of the chip base, the buffer structure is arranged at the top of the chip top plate, a heat conduction substrate is installed in the chip base, and the heat dissipation structure is arranged on the heat conduction substrate. The CPU core is connected to the top of the heat conduction substrate through a bonding wire, the outer side of the CPU core and located in the chip base are filled with heat conduction epoxy resin, the bottom and the two sides of the chip base are each provided with a heat dissipation structure, and a sealing structure is arranged between the chip base and the chip top plate. According to the utility model, the heat-conducting epoxy resin is filled inside the chip base, so that on one hand, the chip base can wrap the outer side of a CPU core in a filling manner and protect the CPU core (specifically, fixation, water prevention and insulation), and on the other hand, the sealing performance of the chip body structure is enhanced through the sealing structure, external moisture is prevented from entering, and long-term stable work of the chip is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip technical field, concretely is a waterproof chip. BACKGROUND

[0002] Chip refers to an integrated circuit, which is integrated with a large number of electronic components such as transistors, resistors and capacitors in a very small area on a semiconductor material through microfabrication technology. As the core component of modern electronic equipment, chip undertakes data processing, signal control and storage and other functions.

[0003] Through the search, China patent discloses a kind of waterproof chip, and its authorized announcement number is (CN220155320U), including chip, the chip is detachably installed on base assembly, the base assembly top is fixedly installed with shell assembly, interface assembly is fixedly connected on the side surface shell of shell assembly.

[0004] The patent can meet the unexpected rain in use, adopt the wrapping shell of closed fitting, so that moisture cannot contact the chip inside, interface assembly is arranged at the wiring port of the connecting parts of chip, external moisture cannot easily pass through elastomer, water absorption block is arranged in the second embedded body, even in the case of serious water inflow higher water pressure, a small amount of water inflow is also directly absorbed, reduce the probability of water inflow and prolong the remediation time, the waterproof device is simple to disassemble and reassemble, and the waterproof effect is excellent, can satisfy the unexpected rain in daily life very well.The patent solves the problem that the existing chip does not have a waterproof structure, but in actual use, the water absorption capacity of the water absorption block is limited, and water may still penetrate into the chip after saturation, affecting the performance of the chip. At the same time, the chip lacks a buffering and heat dissipation structure, which makes it vulnerable to external impact damage during use, and poor heat dissipation may cause overheating, affecting the normal operation of the chip. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of waterproof chip to solve the problems raised in the above background.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of waterproof chip, including chip body, the chip body is by chip base, chip top plate, CPU core, pin, buffering structure, heat dissipation structure and sealing structure, the top of chip base is provided with chip top plate, the top of chip top plate is provided with buffering structure, the inside of chip base is installed with heat conducting substrate, CPU core is connected in the top of heat conducting substrate by wire, the outside of CPU core and located in the inside of chip base are filled with heat conducting epoxy resin, the bottom of chip base and both sides are provided with heat dissipation structure, sealing structure is arranged between chip base and chip top plate.

[0007] As a further preferred of the technical solution, the buffer structure comprises a buffer groove, the buffer groove is arranged on the top of the chip top plate, the inner wall of the buffer groove is slidably connected with a compression-resistant plate, and the compression-resistant plate is fixedly connected with a buffer rubber strip between the buffer groove.

[0008] As a further preferred of the technical solution, the heat dissipation structure comprises a bottom heat conduction plate and two side heat conduction plates, the bottom heat conduction plate is fixedly connected to the bottom of the chip base, the two side heat conduction plates are respectively fixedly connected to the two sides of the chip base, and the inner wall of the bottom heat conduction plate and the two side heat conduction plates is fixedly connected with a heat dissipation fin.

[0009] As a further preferred of the technical solution, the sealing structure comprises an embedding groove and an embedding strip, the embedding groove is arranged on the top of the chip base, the embedding strip is fixedly connected to the bottom of the chip top plate, one end of the embedding strip extends to the inside of the embedding groove, and a sealing strip is fixedly arranged between the outer side of the chip base and the chip top plate.

[0010] As a further preferred of the technical solution, four positioning holes are arranged in the inside of the chip base, and four positioning blocks are fixedly connected to the bottom of the heat conduction base plate, and one end of the positioning block extends to the inside of the positioning hole.

[0011] As a further preferred of the technical solution, the connecting end of the pin extends to the inside of the chip base and is wire-bonded with the heat conduction base plate.

[0012] As a further preferred of the technical solution, one end of the bottom heat conduction plate is attached to the heat conduction base plate, and the two side heat conduction plates are in contact with the heat conduction epoxy resin.

[0013] The waterproof chip has the following beneficial effects:

[0014] (1) The heat conduction epoxy resin is filled in the inside of the chip base, on the one hand, the CPU core is wrapped on the outside by the filling mode, and the CPU core is protected (specifically, fixed, waterproof, and insulated), on the other hand, the sealing structure strengthens the sealing property of the chip body structure, avoids the entry of external moisture, and guarantees the long-term stable work of the chip.

[0015] (2) The buffer structure strengthens the compression resistance of the chip body to external impact, and further helps to improve the stability of the chip in the process of use and transportation.

[0016] (3) The heat dissipation structure cooperates with the heat conduction epoxy resin, improves the heat dissipation capacity, strengthens the protection of the CPU core, enables the chip to be fully cooled during operation, reduces the temperature, and improves the performance and service life. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 is a perspective structural schematic view of the utility model;

[0018] Fig. 2 is a bottom structural schematic view of the utility model;

[0019] Fig. 3 is an explosive structural schematic view of the utility model;

[0020] Fig. 4 is a half cut structural schematic view of the utility model;

[0021] In the figure: 1, chip body; 2, chip base; 3, chip top plate; 4, compression plate; 5, buffer groove; 6, buffer rubber strip; 7, positioning hole; 8, positioning block; 9, heat-conducting base plate; 10, CPU core; 11, pin; 12, heat-conducting epoxy resin; 13, sealing strip; 14, bottom heat-conducting plate; 15, side heat-conducting plate; 16, heat-dissipating fin; 17, embedding groove; 18, embedding strip. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model.

[0023] The utility model provides technical scheme: as Figs. 1-4 shown, in the embodiment, a waterproof chip includes chip body 1, chip body 1 is by chip base 2, chip top plate 3, CPU core 10, pin 11, buffer structure, heat-dissipating structure and sealing structure constitute, the top of chip base 2 is provided with chip top plate 3, the top of chip top plate 3 is provided with buffer structure, the inside of chip base 2 is installed with heat-conducting base plate 9, CPU core 10 is connected in the top of heat-conducting base plate 9 by wire, the outside of CPU core 10 and located in the inside of chip base 2 is filled with heat-conducting epoxy resin 12, the bottom and both sides of chip base 2 are provided with heat-dissipating structure, and the sealing structure is arranged between chip base 2 and chip top plate 3, four positioning holes 7 are set up in the inside of chip base 2, and four positioning blocks 8 are fixedly connected to the bottom of heat-conducting base plate 9, one end of positioning block 8 extends to the inside of positioning hole 7, and the connecting end of pin 11 extends to the inside of chip base 2 and is connected with heat-conducting base plate 9 by wire.

[0024] In the waterproof chip is used, first according to the use requirements of the pin 11 at the bottom end of the solder wire connection in the electrical mainboard, in the process of use, through the heat conductive epoxy resin 12 wrapping CPU core 10, realize the fixed and waterproof protection of CPU core 10, the sealing structure effectively prevents the intrusion of external moisture, the buffer structure enhances the impact resistance of the chip body 1, the heat dissipation structure and the heat conductive epoxy resin 12 synergistic effect, improve the heat dissipation efficiency of chip body 1, guarantee the stable operation of chip body 1 in various environments.

[0025] As shown in Figs. 1-4 , the buffer structure includes buffer groove 5, buffer groove 5 is set in the top of chip top plate 3, the inner wall of buffer groove 5 is connected with the sliding connection of pressure plate 4, the pressure plate 4 is fixedly connected with the buffer rubber strip 6 between buffer groove 5.

[0026] When the chip body 1 is impacted by external impact, the buffer rubber strip 6 is deformed by moving the pressure plate 4 between the inner wall of the buffer groove 5, so as to achieve the effect of buffering.

[0027] As shown in Figs. 1-4 , the heat dissipation structure includes bottom heat conduction plate 14 and two side heat conduction plates 15, the bottom heat conduction plate 14 is fixedly connected to the bottom of the chip base 2, the two side heat conduction plates 15 are respectively fixedly connected to the two sides of the chip base 2, the inner wall of the bottom heat conduction plate 14 and the two side heat conduction plates 15 is fixedly connected with the heat dissipation fin 16, one end of the bottom heat conduction plate 14 is connected with the heat conductive substrate 9, and the two side heat conduction plates 15 are respectively fixedly connected to the two sides of the chip base 2.

[0028] In the process of chip operation, heat will be emitted, at this time, the heat can flow to the bottom heat conduction plate 14 and the two side heat conduction plates 15 through the heat conductive substrate 9 and the heat conductive epoxy resin 12 respectively, and finally complete the heat dissipation work through the heat dissipation fin 16.

[0029] As shown in Figs. 1-4 , the sealing structure includes embedded groove 17 and embedded strip 18, embedded groove 17 is set in the top of chip base 2, embedded strip 18 is fixedly connected to the bottom of chip top plate 3, one end of embedded strip 18 extends to the inside of embedded groove 17, and sealing strip 13 is fixedly arranged between the outer side of chip base 2 and chip top plate 3.

[0030] Through the end of the embedded strip 18 extending to the inside of the embedded groove 17, so as to facilitate the chip base 2 and the chip top plate 3 to form a whole, and the sealing strip 13 is arranged outside the connection, which further improves the sealing property of the whole structure of the chip body 1, thereby avoiding the external moisture into the chip body 1, and improving the waterproof performance.

[0031] The utility model provides a waterproof chip, specific working principle is as follows: when using waterproof chip, the pin 11 of chip base 2 bottom end passes through the welding line and is connected firmly with the electric appliance mainboard, guarantees that the electrical path of chip and external circuit is stable and reliable, CPU core 10 is welded in the top of heat conduction base plate 9, and is filled with heat conduction epoxy resin 12, not only fixed CPU core 10, but also realized waterproof and insulation protection, and the top of chip roof 3 is provided with buffer groove 5, and the inner wall of buffer groove 5 is slidably connected with compression plate 4, and the compression plate 4 is filled with buffer rubber strip 6 between the inner wall of groove. When the chip body 1 is impacted by external, compression plate 4 moves along the inner wall of buffer groove 5, makes buffer rubber strip 6 produce deformation and absorbs impact energy, significantly improves the tolerance of chip to mechanical impact, protects the internal structure from being damaged, and the bottom of chip base 2 is respectively provided with bottom heat conduction plate 14 and two side heat conduction plates 15, and the inner wall of the three is provided with radiating fin 16. Heat is generated by CPU core 10 in operation, first conduction to heat conduction base plate 9, then respectively flows to bottom heat conduction plate 14 and side heat conduction plate 15, and heat conduction epoxy resin 12 is in close contact with side heat conduction plate 15, auxiliary heat conduction, and radiating fin 16 greatly increases the heat dissipation area, and the heat is released to the surrounding environment through natural convection, effectively reduces the temperature of chip, guarantees the continuous and stable operation of chip, and the top of chip base 2 is provided with embedding groove 17, and the bottom of chip roof 3 is fixedly embedded with strip 18, and the strip 18 is embedded in the embedding groove 17 to form close combination. Chip base 2 and chip roof 3 outside are further provided with sealing strip 13, which further enhances the sealing performance of the connecting part. The above sealing structure effectively prevents external moisture and dust from entering the inside of chip body 1, significantly improves the waterproof level of chip, and prolongs the service life of chip.

[0032] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A waterproof chip, comprising a chip body (1), characterized in that: The chip body (1) is composed of a chip base (2), a chip top plate (3), a CPU core (10), pins (11), a buffer structure, a heat dissipation structure and a sealing structure. The chip base (2) is provided with a chip top plate (3) on top. The chip top plate (3) is provided with a buffer structure on top. A thermally conductive substrate (9) is installed inside the chip base (2). The CPU core (10) is wire-connected to the top of the thermally conductive substrate (9). The outside of the CPU core (10) and inside the chip base (2) is filled with thermally conductive epoxy resin (12). Heat dissipation structures are provided at the bottom and on both sides of the chip base (2). A sealing structure is provided between the chip base (2) and the chip top plate (3).

2. The waterproof chip according to claim 1, characterized in that: The buffer structure includes a buffer groove (5), which is opened on the top of the chip top plate (3). A pressure-resistant plate (4) is slidably connected between the inner walls of the buffer groove (5), and a buffer strip (6) is fixedly connected between the pressure-resistant plate (4) and the buffer groove (5).

3. A waterproof chip according to claim 1, characterized in that: The heat dissipation structure includes a bottom heat-conducting plate (14) and two side heat-conducting plates (15). The bottom heat-conducting plate (14) is fixedly connected to the bottom of the chip base (2), and the two side heat-conducting plates (15) are respectively fixedly connected to the two sides of the chip base (2). Heat dissipation fins (16) are fixedly connected between the inner walls of the bottom heat-conducting plate (14) and the two side heat-conducting plates (15).

4. A waterproof chip according to claim 1, characterized in that: The sealing structure includes an embedding groove (17) and an embedding strip (18). The embedding groove (17) is opened on the top of the chip base (2). The embedding strip (18) is fixedly connected to the bottom of the chip top plate (3). One end of the embedding strip (18) extends into the interior of the embedding groove (17). A sealing strip (13) is fixedly provided between the outer side of the chip base (2) and the chip top plate (3).

5. A waterproof chip according to claim 1, characterized in that: The chip base (2) has four positioning holes (7) inside, and the bottom of the heat-conducting substrate (9) is fixedly connected to four positioning blocks (8), one end of the positioning block (8) extends into the interior of the positioning hole (7).

6. A waterproof chip according to claim 1, characterized in that: The connection end of the pin (11) extends into the interior of the chip base (2) and is wire-connected to the thermally conductive substrate (9).

7. A waterproof chip according to claim 3, characterized in that: One end of the bottom heat-conducting plate (14) is attached to the heat-conducting substrate (9), and the ends of the two side heat-conducting plates (15) that are close to each other are in contact with the heat-conducting epoxy resin (12).

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