Virtual power plant terminal processor heat dissipation structure

Abstract

The utility model relates to the field of virtual power plant terminal equipment, and discloses a virtual power plant terminal processor heat radiation structure comprising a cover plate, the cover plate is detachably arranged on the right side of the outer wall of a terminal processor body, a processor circuit board is arranged in the terminal processor body, the right side of the cover plate is provided with an air inlet hole, and the air inlet hole is communicated with the processor circuit board. The air inlet hole is gradually shrunk from right to left, a fan is fixed in the exhaust hole, a flow guide frame is fixed to the right side of the outer wall of the cover plate, and the flow guide frame is gradually shrunk from right to left. According to the utility model, through the cooperative use of the cover plate, the air inlet hole, the exhaust hole, the fan and the diversion frame, rapid heat dissipation of the processor circuit board and the terminal processor body is facilitated, the overall heat dissipation efficiency is improved, and it is ensured that the terminal processor body operates within a suitable temperature range; the problems of performance reduction, even damage and the like caused by overheating are effectively avoided, and the reliability and the stability of the terminal processor body are improved.

Description

Technical Field

[0001] This utility model relates to the technical field of virtual power plant terminal equipment, specifically to a heat dissipation structure for a virtual power plant terminal processor. Background Technology

[0002] A virtual power plant (VFP) is a power supply coordination and management system that uses advanced information and communication technologies and software systems to aggregate and coordinate distributed generation (DG), energy storage systems, controllable loads, electric vehicles, and other related energy management systems (DERs) to participate in the electricity market and grid operation as a special type of power plant. The core concept of a VFP can be summarized as "communication" and "aggregation." Key technologies of VFPs mainly include coordination control technology, smart metering technology, and information and communication technology. The most attractive feature of a VFP is its ability to aggregate DERs to participate in the electricity market and ancillary services market, providing management and ancillary services for distribution and transmission networks. The VFP terminal processor generates a significant amount of heat during operation.

[0003] According to Chinese Patent No. CN220235247U, a heat dissipation structure for a virtual power plant terminal processor includes a heat dissipation body. The heat dissipation body includes a fixed heat dissipation plate, a first heat dissipation plate, and a second heat dissipation plate. The first heat dissipation plate and the second heat dissipation plate are symmetrically arranged at both ends of the fixed heat dissipation plate. A first heat dissipation part, a second heat dissipation part, and a third heat dissipation part are respectively connected to the first heat dissipation plate and the second heat dissipation plate. The first heat dissipation part and the second heat dissipation part are respectively located on opposite sides of the first heat dissipation plate or the second heat dissipation plate. The third heat dissipation part is connected to the free end of the first heat dissipation plate or the second heat dissipation plate.

[0004] In the above solution, by installing the heat sink on the underside of the processor circuit board and then dissipating heat through it, the first heat sink, the second heat sink, and the third heat sink, the following disadvantages arise: when in use, this heat dissipation structure can only dissipate heat from the circuit board and cannot effectively dissipate heat from inside the terminal processor, thereby reducing the overall heat dissipation efficiency and leading to a decrease in the reliability and stability of the terminal processor. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation structure for a virtual power plant terminal processor, in order to solve the problem that the heat dissipation structure can only dissipate heat from the circuit board and cannot effectively dissipate heat from inside the terminal processor, thereby reducing the overall heat dissipation efficiency and leading to a decrease in the reliability and stability of the terminal processor.

[0006] To achieve the above-mentioned utility model objectives, the present utility model adopts the following technical solution: a heat dissipation structure for a virtual power plant terminal processor, including a cover plate, the cover plate being detachably disposed on the right side of the outer wall of the terminal processor body, the terminal processor body having a processor circuit board inside, an air inlet hole being provided on the right side of the cover plate, the air inlet hole gradually decreasing in size from right to left, an exhaust hole being provided on the top surface of the terminal processor body, a fan being fixed inside the exhaust hole, and a flow guide frame being fixed on the right side of the outer wall of the cover plate, the flow guide frame gradually decreasing in size from right to left.

[0007] Preferably, a cooling box is fixed to the inner bottom surface of the terminal processor body, the top surface of the cooling box is in contact with the bottom surface of the processor circuit board, the cooling box contains coolant, a heat sink is fixed to the inner bottom surface of the cooling box, a plurality of heat dissipation holes are opened on the inner bottom surface of the cooling box, heat sinks are fixed inside the plurality of heat dissipation holes, the top ends of the plurality of heat sinks are fixedly connected to the bottom surface of the heat sink, the plurality of heat sinks penetrate the inner bottom surface of the terminal processor body and extend toward the bottom of the terminal processor body, and a plurality of support columns are fixed to the bottom surface of the terminal processor body.

[0008] Preferably, the inner wall of the terminal processor body is fixed with several arc-shaped plates.

[0009] Preferably, the outer right side of the guide frame is detachably provided with an installation frame, and a dustproof net is fixed inside the installation frame.

[0010] Preferably, a first magnet is fixed to the front and rear sides of the outer wall of the guide frame, and a second magnet is fixed to the front and rear sides of the outer wall of the mounting frame, with the two second magnets magnetically attracted to the two first magnets respectively.

[0011] Preferably, the outer wall of the terminal processor body has a plurality of threaded grooves on the right side, and the cover plate has a plurality of threaded holes on one side. Bolts are threaded into the plurality of threaded holes respectively, and the threaded ends of the plurality of bolts are threaded into the plurality of threaded grooves respectively.

[0012] Compared with existing technologies, the virtual power plant terminal processor heat dissipation structure that adopts the above technical solution has the following beneficial effects:

[0013] 1. In use, the combined use of the cover plate, air inlet, air outlet, fan and air guide frame facilitates rapid heat dissipation of the processor circuit board and the terminal processor body, improves the overall heat dissipation efficiency, ensures that the terminal processor body operates within a suitable temperature range, effectively avoids performance degradation or even damage caused by overheating, and improves the reliability and stability of the terminal processor body.

[0014] Second, during use, the coolant in the cooling tank cools the bottom of the processor circuit board. When the coolant temperature rises, the heat sink conducts the heat absorbed by the coolant to the heatsink, which then dissipates the heat into the air. The combined action of the heatsink and heatsink continuously cools the coolant, ensuring the bottom of the processor circuit board remains at a low temperature. This effectively improves the heat dissipation performance of the processor and extends its lifespan. The curved plate allows air to flow more smoothly through all corners, preventing heat accumulation in the internal corners of the processor and improving heat dissipation efficiency.

[0015] Thirdly, during use, the combined use of the mounting frame and dust filter effectively blocks dust and other impurities from the air, preventing them from entering the internal structure of the terminal processor and ensuring the device's heat dissipation performance and lifespan. The combined use of the first and second magnets allows for quick assembly and disassembly of the mounting frame and dust filter, facilitating cleaning or replacement. The use of threaded grooves, threaded holes, and bolts allows for easy assembly and disassembly of the cover plate, thus facilitating internal maintenance of the terminal processor. Attached Figure Description

[0016] Figure 1 This is a three-dimensional schematic diagram of an embodiment.

[0017] Figure 2 This is a breakdown diagram of an embodiment.

[0018] Figure 3 This is a cross-sectional schematic diagram of the cover plate and the guide frame in the embodiment.

[0019] Figure 4 This is a cross-sectional view of the cooling box and heat sink in an embodiment.

[0020] In the diagram: 1. Cover plate; 2. Terminal processor body; 3. Processor circuit board; 4. Air inlet; 5. Exhaust outlet; 6. Fan; 7. Airflow guide frame; 8. Cooling box; 9. Heat sink; 10. Heat dissipation hole; 11. Heat sink rod; 12. Support column; 13. Curved plate; 14. Mounting frame; 15. Dustproof net; 16. First magnet; 17. Second magnet; 18. Threaded groove; 19. Threaded hole; 20. Bolt. Detailed Implementation

[0021] The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0022] like Figures 1-3As shown, a heat dissipation structure for a virtual power plant terminal processor includes a cover plate 1. The cover plate 1 is detachably disposed on the right side of the outer wall of the terminal processor body 2. The terminal processor body 2 is a prior art device, and its model is PMC-1606. The terminal processor body 2 has a processor circuit board 3 inside. An air inlet 4 is provided on the right side of the cover plate 1, and the air inlet 4 gradually decreases in size from right to left. An exhaust vent 5 is provided on the top surface of the terminal processor body 2, and a fan 6 is fixed inside the exhaust vent 5. A guide frame 7 is fixed on the right side of the outer wall of the cover plate 1, and the guide frame 7 gradually decreases in size from right to left.

[0023] During use, when components such as the processor circuit board 3 inside the terminal processor body 2 generate a large amount of heat due to prolonged operation, causing the internal temperature to become too high, the fan 6 is activated. This allows the heat from the processor circuit board 3 and the terminal processor body 2 to be expelled to the external environment through the exhaust port 5. Simultaneously, the relatively cool external air is guided by the negative pressure created by the operation of the fan 6, passing through the guide frame 7 and the air intake port 4 into the interior of the terminal processor body 2. Both the guide frame 7 and the air intake port 4 are tapered channels that gradually decrease in size from right to left. According to the principles of fluid dynamics, as the airflow passes through this tapered channel, the airflow speed increases significantly as the cross-sectional area of ​​the channel decreases. This accelerated airflow can enter the interior of the terminal processor body 2 more quickly and powerfully, directly and efficiently cooling the heat-generating components such as the processor circuit board 3. At the same time, the accelerated airflow can also increase the flow speed of the hot air inside the terminal processor body 2, allowing it to be expelled through the exhaust port 5 more quickly, thus forming an efficient cooling system. The combined use of cover plate 1, air inlet 4, exhaust vent 5, fan 6 and air guide frame 7 facilitates rapid heat dissipation of processor circuit board 3 and terminal processor body 2, improves overall heat dissipation efficiency, ensures that terminal processor body 2 operates within a suitable temperature range, effectively avoids performance degradation or even damage caused by overheating, and improves the reliability and stability of terminal processor body 2.

[0024] like Figure 1 , Figure 2 and Figure 4 As shown, a cooling box 8 is fixed to the bottom surface of the terminal processor body 2. The top surface of the cooling box 8 is in contact with the bottom surface of the processor circuit board 3. Coolant is provided inside the cooling box 8. A heat sink 9 is fixed to the bottom surface of the cooling box 8. Several heat dissipation holes 10 are opened on the bottom surface of the cooling box 8. Heat sinks 11 are fixed inside the several heat dissipation holes 10 respectively. The top ends of the several heat sinks 11 are fixedly connected to the bottom surface of the heat sink 9 respectively. The several heat sinks 11 penetrate the bottom surface of the terminal processor body 2 and extend towards the bottom of the terminal processor body 2. Several support columns 12 are fixed to the bottom surface of the terminal processor body 2.

[0025] During use, the coolant in the cooling box 8 cools the bottom of the processor circuit board 3. When the coolant temperature rises, the heat absorbed by the coolant is directed to the heat sink 11 by the heat sink 9, and then the heat is dissipated into the air. The cooperation between the heat sink 11 and the heat sink 9 can continuously cool the coolant, thereby ensuring that the bottom of the processor circuit board 3 always maintains a low temperature, effectively improving the heat dissipation performance of the terminal processor body 2 and extending its service life.

[0026] like Figures 1-3 As shown, several arc-shaped plates 13 are fixed on the inner wall of the terminal processor body 2, and a mounting frame 14 is detachably provided on the right side of the outer wall of the flow guide frame 7. A dustproof net 15 is fixed inside the mounting frame 14.

[0027] During use, the curved plate 13 facilitates smoother airflow through all corners, preventing heat buildup in the internal corners of the terminal processor body 2 and improving heat dissipation efficiency. The combined use of the mounting frame 14 and the dust filter 15 effectively blocks dust and other impurities from entering the interior of the terminal processor body 2, ensuring the device's heat dissipation performance and lifespan.

[0028] like Figures 1-3 As shown, a first magnet 16 is fixed to the front and rear sides of the outer wall of the flow guide frame 7, and a second magnet 17 is fixed to the front and rear sides of the outer wall of the mounting frame 14. The two second magnets 17 are magnetically attracted to the two first magnets 16 respectively. A number of threaded grooves 18 are opened on the right side of the outer wall of the terminal processor body 2, and a number of threaded holes 19 are opened on one side of the cover plate 1. Bolts 20 are threadedly connected to the threaded holes 19 respectively, and the threaded ends of the bolts 20 are threadedly connected to the internal threads of the threaded grooves 18 respectively.

[0029] During use, the cooperation of the first magnet 16 and the second magnet 17 facilitates the quick assembly and disassembly of the mounting frame 14 and the dustproof net 15, making cleaning or replacement easier. The cooperation of the threaded groove 18, the threaded hole 19, and the bolt 20 facilitates the disassembly and assembly of the cover plate 1, thereby enabling maintenance of the internal components of the terminal processor body 2.

[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation structure for a virtual power plant terminal processor, comprising a cover plate (1), wherein the cover plate (1) is detachably disposed on the right side of the outer wall of the terminal processor body (2), characterized in that, The terminal processor body (2) has a processor circuit board (3) inside. An air inlet (4) is provided on the right side of the cover plate (1). The air inlet (4) gradually decreases in size from right to left. An exhaust hole (5) is provided on the top surface of the terminal processor body (2). A fan (6) is fixed inside the exhaust hole (5). A guide frame (7) is fixed on the right side of the outer wall of the cover plate (1). The guide frame (7) gradually decreases in size from right to left.

2. The heat dissipation structure for a virtual power plant terminal processor according to claim 1, characterized in that: A cooling box (8) is fixed to the bottom surface of the terminal processor body (2). The top surface of the cooling box (8) is in contact with the bottom surface of the processor circuit board (3). Coolant is provided inside the cooling box (8). A heat sink (9) is fixed to the bottom surface of the cooling box (8). Several heat dissipation holes (10) are opened on the bottom surface of the cooling box (8). Heat sinks (11) are fixed inside the several heat dissipation holes (10). The tops of the several heat sinks (11) are fixedly connected to the bottom surface of the heat sink (9). The several heat sinks (11) penetrate the bottom surface of the terminal processor body (2) and extend toward the bottom of the terminal processor body (2). Several support columns (12) are fixed to the bottom surface of the terminal processor body (2).

3. The heat dissipation structure for a virtual power plant terminal processor according to claim 2, characterized in that: The inner wall of the terminal processor body (2) is fixed with several arc-shaped plates (13).

4. The heat dissipation structure for a virtual power plant terminal processor according to claim 1, characterized in that: The guide frame (7) is detachably provided with an installation frame (14) on the right side of its outer wall, and a dustproof net (15) is fixed inside the installation frame (14).

5. The heat dissipation structure for a virtual power plant terminal processor according to claim 4, characterized in that: The front and rear sides of the outer wall of the flow guide frame (7) are respectively fixed with a first magnet (16), and the front and rear sides of the outer wall of the mounting frame (14) are respectively fixed with a second magnet (17). The two second magnets (17) are magnetically attracted to the two first magnets (16).

6. The heat dissipation structure for a virtual power plant terminal processor according to claim 5, characterized in that: The outer wall of the terminal processor body (2) has several threaded grooves (18) on the right side, and the cover plate (1) has several threaded holes (19) on one side. Bolts (20) are threaded into the several threaded holes (19) respectively, and the threaded ends of the several bolts (20) are threaded into the several threaded grooves (18) respectively.

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