Storage device

Abstract

The embodiment of the utility model discloses a storage device. The storage device comprises a first shell, a substrate and a second shell, the first shell comprises a first extension part facing the second shell; the first shell comprises a first extension part facing the first shell, the second shell comprises a second extension part facing the first shell, and the first extension part and the second extension part are mutually clamped, so that the first shell and the second shell are mutually jointed to form a shell; the substrate is located in the shell, and the distance between the clamping position of the first extending part and the second extending part and the substrate in the height direction of the shell is larger than zero.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and to, but is not limited to, a memory device. Background Technology

[0002] Solid-state drives (SSDs), also known as solid-state drives, are hard drives made using arrays of solid-state electronic storage chips. Due to their advantages such as high read / write speeds, durability, low power consumption, and small size, SSDs are widely used in many fields, including military, automotive, industrial control, video surveillance, network monitoring, network terminals, power, medical, aerospace, and navigation equipment.

[0003] As SSDs become faster and larger, highly integrated SSDs face serious problems such as electromagnetic interference and electromagnetic interference immunity. Utility Model Content

[0004] This disclosure provides a storage device, including: a first housing, a substrate, and a second housing; the first housing includes a first extension toward the second housing; the second housing includes a second extension toward the first housing, wherein the first extension and the second extension are engaged with each other, such that the first housing and the second housing are joined together to form an outer shell; the substrate is located inside the outer shell, wherein the distance between the engagement position of the first extension and the second extension and the distance between the substrate and the height direction of the outer shell is greater than zero.

[0005] In some embodiments, the first extension has a first end and a second end opposite to each other along the height direction of the housing; the second extension has a third end and a fourth end opposite to each other along the height direction of the housing; the first housing further includes a first body portion that contacts the first end; the second housing further includes a second body portion that contacts the third end; wherein the second end contacts the second body portion; or, the second end is located between the first end and the second body portion.

[0006] In some embodiments, the fourth end contacts the first main body portion; or, the fourth end is located between the third end and the first main body portion.

[0007] In some embodiments, the first extension includes two first sub-extensions spaced apart, wherein the second extension is located between the two first sub-extensions.

[0008] In some embodiments, the second extension includes two second sub-extensions spaced apart, wherein the first extension is located between the two second sub-extensions.

[0009] In some embodiments, the distance between the first end and the third end in the height direction of the housing ranges from 1 mm to 3 mm.

[0010] In some embodiments, the sum of the widths of the first extension and the second extension ranges from 1 mm to 3 mm.

[0011] In some embodiments, the height of the first housing is less than the height of the second housing, wherein the substrate is mounted on the second housing.

[0012] In some embodiments, the ratio of the snap-fit ​​position to the distance of the substrate in the height direction of the housing and the height of the housing ranges from 0.1 to 0.3.

[0013] In some embodiments, the ratio of the height of the first housing to the height of the outer shell ranges from 0.2 to 0.4, and the ratio of the height of the second housing to the height of the outer shell ranges from 0.6 to 0.8.

[0014] In some embodiments, the storage device further includes a connector; an opening is provided on a first sidewall of the housing to expose the connector; and a heat dissipation hole is provided on a second sidewall of the housing, wherein the second sidewall and the first sidewall are disposed opposite to each other.

[0015] In some embodiments, the diameter of the heat dissipation hole is less than or equal to 5 mm.

[0016] In some embodiments, the shape of the heat dissipation hole includes at least one of the following: circular, elliptical, hexagonal, square, and rectangular.

[0017] In some embodiments, the storage device further includes a memory device and a controller, the memory device and the controller being integrated on the substrate.

[0018] In some embodiments, the memory device includes 3D NAND memory.

[0019] In some embodiments, the storage device includes a solid-state drive (SSD).

[0020] In this embodiment, the first housing includes a first extension toward the second housing, and the second housing includes a second extension toward the first housing. The first and second extensions are interlocked, and the distance between the interlocking position of the first and second extensions and the substrate in the height direction of the housing is greater than zero. This achieves two advantages: first, it increases the interlocking depth and area of ​​the two housings, which improves the electromagnetic shielding effectiveness of the housing; second, the increased distance between the strong radiation and sensitive circuits on the substrate and the interlocking position reduces the radiated emissions of the storage device and enhances its anti-electrostatic interference capability, thereby solving the problems of excessive radiated emissions and failed electrostatic discharge interference tests. Attached Figure Description

[0021] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0022] Figure 1 This is a schematic diagram of an exemplary electronic device with a storage device provided in an embodiment of this disclosure.

[0023] Figure 2A This is a schematic diagram of an exemplary memory card with a storage device provided in an embodiment of this disclosure.

[0024] Figure 2B This is a schematic diagram of an exemplary solid-state drive with a storage device provided in an embodiment of this disclosure.

[0025] Figure 3A and Figure 3B This is a schematic diagram of a storage device provided in an embodiment of the present disclosure.

[0026] Figures 4A to 4D This is a schematic diagram showing a first extension and a second extension engaging with each other, provided in an embodiment of this disclosure.

[0027] Figure 5A and Figure 5B This is a schematic diagram showing another first extension and a second extension engaging with each other, provided in an embodiment of this disclosure. Detailed Implementation

[0028] To facilitate understanding of this disclosure, exemplary embodiments of the disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the disclosure are shown in the drawings, it should be understood that the disclosure may be implemented in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the disclosure and to fully convey the scope of the disclosure to those skilled in the art.

[0029] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of this disclosure. However, it will be apparent to those skilled in the art that this disclosure may be practiced without one or more of these details. In some embodiments, to avoid confusion with this disclosure, certain technical features well-known in the art are not described; that is, not all features of the actual embodiments, nor well-known functions and structures, may be described herein.

[0030] Generally, terms can be understood at least in part from their use in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or it can be used to describe a combination of features, structures, or characteristics in a plural sense. Similarly, terms such as "a" or "described" can also be understood to convey either a singular or a plural usage, depending at least in part on the context. Additionally, the use of "based on" can be understood to not necessarily convey an exclusive set of factors, and can alternatively allow for the presence of additional factors that are not necessarily explicitly described, also depending at least in part on the context.

[0031] Unless otherwise defined, the terminology used herein is intended only to describe particular embodiments and is not intended to limit the scope of this disclosure. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprise” and / or “comprising,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0032] To fully understand this disclosure, detailed steps and structures will be presented in the following description to illustrate the technical solutions of this disclosure. Preferred embodiments of this disclosure are described in detail below; however, other embodiments may also be implemented in addition to these detailed descriptions.

[0033] As SSDs become faster and larger, highly integrated SSDs face serious problems such as electromagnetic interference and electromagnetic interference immunity. Among these, radiated emissions and electrostatic discharge (ESD) are two particularly prominent issues for SSDs.

[0034] Taking enterprise-grade SSDs as an example, their casings are typically made of metal, which provides a certain degree of electromagnetic shielding. However, the ventilation holes on the metal casing and the gaps at the joints between the upper and lower casings significantly reduce its electromagnetic shielding effectiveness, making it difficult to achieve a good shielding effect. Therefore, it is urgent to incorporate electromagnetic compatibility design into the metal casing to improve its electromagnetic shielding performance.

[0035] Enterprise-grade SSDs typically use absorbing materials or shielding on the substrate to reduce electromagnetic interference (EMI) and improve EMI immunity. However, these measures can affect heat dissipation, increase costs, and the limited space on the substrate restricts the implementation of these methods.

[0036] In addition, the limited substrate space of SSDs, the compact device layout and wiring, and the placement of sensitive devices and surface traces at the substrate edges can lead to excessive radiated emissions and failure of electrostatic discharge interference tests.

[0037] Based on one or more of the above-mentioned technical problems, this disclosure provides a storage device.

[0038] Figure 1 This is a schematic diagram of an exemplary electronic device with a storage device provided in an embodiment of this disclosure. In this embodiment, the electronic device may be a mobile phone, desktop computer, laptop computer, tablet computer, vehicle computer, game console, printer, positioning device, wearable electronic device, smart sensor, virtual reality (VR) device, augmented reality (AR) device, or any other suitable electronic device having a storage device therein.

[0039] Reference Figure 1 As shown, the electronic device 100 may include a host 108 and a storage device 102, the storage device 102 having one or more memory devices 104 and a controller 106. The host 108 may be a processor of the electronic device (e.g., a central processing unit (CPU)) or a system-on-chip (SoC) (e.g., an application processor (AP)). The host 108 may be configured to send data to or receive data from the memory device 104.

[0040] In some embodiments, controller 106 is coupled to memory device 104 and host 108 and is configured to control memory device 104. Controller 106 can manage data stored in memory device 104 and communicate with host 108.

[0041] In some embodiments, the controller 106 is designed to operate in a low duty cycle environment, such as a Secure Digital (SD) card, a Compact Flash (CF) card, a Universal Serial Bus (USB) flash drive, or other media for use in electronic devices such as personal calculators, digital cameras, mobile phones, etc.

[0042] In other embodiments, the controller 106 is designed to operate in high duty cycle environments, such as SSDs or embedded Multi-Media Cards (eMMCs), and the SSDs or eMMCs are used as data storage for mobile devices such as smartphones, tablets, and laptops, as well as enterprise storage arrays.

[0043] In some embodiments, controller 106 may be configured to control operations of memory device 104, such as read, erase, and program operations. Controller 106 may also be configured to manage various functions relating to data stored or to be stored in memory device 104, including but not limited to bad block management, garbage collection, logical-to-physical address translation, wear leveling, etc. Controller 106 is also configured to process error correction codes (ECCs) relating to data read from or written to memory device 104.

[0044] It should be noted that controller 106 can also perform any other suitable functions, such as formatting memory device 104. Controller 106 can communicate with external devices (e.g., according to a specific communication protocol) according to a specific communication protocol. Figure 1The controller 106 communicates with the host 108 in the system. For example, the controller 106 can communicate with external devices through at least one of various interface protocols, such as USB, MMC, Peripheral Component Interconnect (PCI), PCI-E, Advanced Technology Attachment (ATA), Serial ATA, Parallel ATA, Small Computer System Interface (SCSI), Enhanced Small Disk Interface (ESDI), Integrated Development Equipment (IDE), and FireWire.

[0045] The controller 106 and one or more memory devices 104 can be integrated into various types of storage devices, for example, included in the same package (e.g., a Universal Flash Storage (UFS) package or an eMMC package). That is, the storage device 102 can be implemented and packaged into different types of end electronic products.

[0046] In such Figure 2A In one example shown, controller 106 and a single memory device 104 can be integrated into memory card 202. Memory card 202 may include PC card (Personal Computer Memory Card), CF card, Smart Media (SM) card, memory stick, Multimedia Card (MMC, RS-MMC (Reduced-Size MMC), MMCmicro), SD card (SD, miniSD, microSD, SDHC (Reduced-Size MMC)), UFS, etc. Memory card 202 may also include a connection between memory card 202 and a host (e.g., Figure 1 The memory card connector 204 is coupled to the host 108.

[0047] In such Figure 2BIn another example shown, controller 106 and multiple memory devices 104 may be integrated into SSD 206. SSD 206 may also include a connection between SSD 206 and a host (e.g., Figure 1 The SSD connector 208 is coupled to the host 108. In some embodiments, the storage capacity and / or operating speed of the SSD 206 is greater than the storage capacity and / or operating speed of the memory card 202.

[0048] Figure 3A and Figure 3B This is a schematic diagram of a storage device provided in an embodiment of this disclosure. The storage device includes, but is not limited to, SSDs, such as enterprise-grade SSDs. For ease of understanding, the following description will use an SSD as an example of a storage device.

[0049] Reference Figure 3A and Figure 3B As shown, the storage device 300 may include a first housing 302, a substrate 304, and a second housing 306.

[0050] The first housing 302 includes a first extension 3021 facing the second housing 306, and the second housing 306 includes a second extension 3061 facing the first housing 302. The first extension 3021 and the second extension 3061 are engaged with each other, such that the first housing 302 and the second housing 306 are joined together to form an outer shell. As an example, see... Figure 3A and Figure 3B As shown, the first housing 302 has a protrusion facing the second housing 306, and the second housing 306 has a protrusion facing the first housing 302. The two protrusions are interlocked by their complementary shapes, that is, the first extension 3021 and the second extension 3061 interlock with each other. Of course, in other examples, the first extension 3021 and the second extension 3061 can be interlocked with each other by any of the following methods: the cooperation of the interlocking part and the slot, the combination of the hook and the limiting member, the interlocking of the plates, the structure of the tongue and the window with a spring piece, and the design of the groove and the protrusion.

[0051] The substrate 304 serves as a physical substrate for fixing and connecting various components. Specifically, the substrate 304 can provide mechanical support, such as supporting the controller, memory device, and other components. Furthermore, the substrate 304 can also achieve electrical connections between the various components through internal wiring. As an example, see... Figure 3A and Figure 3BAs shown, the substrate 304 has a first surface 304A facing the first housing 302 and a second surface 304B facing the second housing 306. Components are integrated on both the first surface 304A and the second surface 304B. The components are electrically connected to each other through internal wiring disposed on the first surface 304A and / or on the second surface 304B and / or between the first surface 304A and the second surface 304B. The substrate 304 is typically made of semiconductor materials (e.g., silicon) or a printed circuit board (PCB).

[0052] The substrate 304 can be located inside the housing, wherein the distance between the snap-fit ​​positions of the first extension 3021 and the second extension 3061 and the substrate 304 in the height direction of the housing is greater than zero. Specifically, the substrate 304 can be first mounted on the second housing 306 and then joined with the first housing 302 to form a housing with an accommodating space. The substrate 304 is located within the accommodating space, and the housing can protect the various components integrated on the substrate 304. Here, the second housing 306 on which the substrate 304 is mounted and the first housing 302 are joined by the snap-fit ​​first extension 3021 and the second extension 3061. Of course, in other examples, the substrate 304 can also be first mounted on the first housing 302 and then joined with the second housing 306.

[0053] It should be noted that the snap-fit ​​positions of the substrate 304 with the first extension 3021 and the second extension 3061 have a certain vertical distance, that is, the height difference between the snap-fit ​​positions of the first extension 3021 and the second extension 3061 and the substrate 304 is greater than 0, which means that the distance between the snap-fit ​​positions of the first extension 3021 and the second extension 3061 and the substrate 304 in the height direction of the outer shell is greater than zero. Thus, firstly, the snap-fit ​​depth and snap-fit ​​area of ​​the two shells can be increased, which is beneficial to improving the electromagnetic shielding effectiveness of the outer shell; secondly, the increased distance between the strong radiation and sensitive circuits on the substrate and the snap-fit ​​positions can reduce the radiated emissions of the storage device and enhance the storage device's anti-electrostatic interference capability, thereby solving the problems of excessive radiated emissions and failure of electrostatic discharge interference tests; thirdly, the electromagnetic shielding effectiveness of the outer shell is enhanced through the structural design of the first and second shells, eliminating the need for absorbing materials or additional shielding covers, thus not affecting heat dissipation and saving costs and space.

[0054] In some embodiments, the height of the first housing 302 is less than the height of the second housing 306, wherein the substrate 304 is mounted on the second housing 306. As an example, see... Figure 3A and Figure 3BAs shown, screw holes 308 are provided at the four corners of the substrate 304, and screws 310 are provided at the four corners of the first housing 302. The substrate 304 is fixedly mounted to the second housing 306 by screws passing through the corresponding screw holes 308. In this example, the number of screws 310 and screw holes 308 is not limited to... Figure 3A and Figure 3B As shown, other quantities are also possible. Of course, in other examples, the substrate 304 can also be mounted on the second housing 306 by at least one of various technologies such as snap-fit, latching, and magnetic attraction.

[0055] In some embodiments, the ratio of the height of the first housing 302 to the height of the outer shell ranges from 0.2 to 0.4, and the ratio of the height of the second housing 306 to the height of the outer shell ranges from 0.6 to 0.8. As an example, the ratio of the height of the first housing 302 to the height of the outer shell is 0.3, and the ratio of the height of the second housing 306 to the height of the outer shell is 0.7. Of course, in other examples, the ratios of the height of the first housing 302 to the height of the outer shell, and the ratios of the height of the second housing 306 to the height of the outer shell, can also be other values.

[0056] In some embodiments, the storage device 300 may further include a controller and a memory device, both integrated on the substrate 304, with the memory device connected to the controller. The memory device includes 3D NAND memory. As an example, Figure 3A This shows that multiple NAND chips 2 are integrated on the first surface 304A of the substrate 304. Figure 3B The diagram shows a main control chip 4 and multiple NAND chips 2 integrated on the second surface 304B of substrate 304. The main control chip 4 can constitute part or all of the controller, and the NAND chips 2 can serve as memory devices. Of course, in other examples, the number and arrangement of the NAND chips 2 and the main control chip 4 are not limited to... Figure 3A and Figure 3B As shown. For information on the controller and memory device, please refer to [reference needed]. Figure 1 , Figure 2A and Figure 2B Description of the controller 106 and memory device 104 shown.

[0057] In some embodiments, the storage device 300 may further include a DRAM chip 3 located on the substrate 304. The DRAM chip 3 can serve as a cache for the storage device 300, temporarily storing various configuration tables (e.g., a mapping table recording the logical address to physical address mapping relationship), data to be written to the NAND chip 2, or data to be read from the NAND chip 2, thereby reducing read / write latency. Of course, in other examples, the storage device 300 may also employ a design that omits the DRAM chip (DRAM-less) or uses an external DRAM chip.

[0058] In some embodiments, the storage device 300 may further include a power management integrated circuit (PMIC) 1, which is located on the substrate 304. The input terminal of the power management chip 1 can be connected to a power supply pin, and the output terminal of the power management chip 1 can be connected to various chips. The power management chip 1 can convert the external input voltage received from the power supply pin into the operating voltage required by the functional units and power the various chips. As an example, Figure 3A The diagram shows that multiple power management chips 1 are integrated on the first surface 304A of substrate 304. These power management chips 1 supply power to the main control chip 4, NAND chip 2, and DRAM chip 3 integrated on substrate 304. Of course, in other examples, the number and arrangement of the power management chips 1 are not limited to... Figure 3A As shown.

[0059] In some embodiments, the storage device 300 may further include a capacitor 312. The capacitor 312 stores electrical energy and can provide temporary power in the event of a sudden power outage in the storage device 300, ensuring data reliability and security. It should be noted that enterprise-grade SSDs have higher requirements for reliability and power failure protection, and typically employ a backup power solution integrating a power management chip 1 and capacitor 312. As an example, Figure 3A An opening is shown on substrate 304 that extends through a first surface 304A and a second surface 304B, into which a capacitor 312 can be integrated.

[0060] In some embodiments, the storage device 300 may further include a connector 314 located on the substrate 304. The connector may include a SATA interface, a PCIe interface, an NVMe interface, or a SAS interface, etc. As an example, Figure 3B The diagram shows a connector 314 integrated on the second surface 304B of the substrate 304. An opening is provided on the first sidewall of the housing, exposing the connector 314. For more information on the connector 314, please refer to... Figure 2A and Figure 2B Description of the memory card connector 204 or SSD connector 208 shown.

[0061] In some embodiments, a heat dissipation hole 316 is provided on the second sidewall of the housing, and the second sidewall and the first sidewall are disposed opposite to each other. As an example, Figure 3A The diagram shows that the side wall of the second housing 306 has multiple heat dissipation holes 316 for heat dissipation. Of course, in other examples, the number and arrangement of the heat dissipation holes 316 are not limited to... Figure 3A As shown.

[0062] In this embodiment, by providing heat dissipation holes on the second side wall of the housing, air circulation can be promoted, forming an effective heat dissipation channel, thereby helping to quickly dissipate the heat generated by the solid-state drive during operation, maintaining its normal operating temperature and extending its service life.

[0063] In some embodiments, the diameter of the heat dissipation hole 316 is less than or equal to 5 millimeters (mm). For example, the diameter of the heat dissipation hole 316 can be 1mm, 2mm, 3mm, 4mm, or 5mm. Of course, the diameter of the heat dissipation hole 316 can also be other positive numbers less than or equal to 5mm. It should be noted that when multiple heat dissipation holes are provided on the second sidewall of the housing, the diameters of any two heat dissipation holes can be the same or different, and this disclosure does not impose any special limitations on this.

[0064] In this embodiment, by setting the diameter of the heat dissipation holes to be less than or equal to 5 mm, the number of pores per unit area can be increased, forming a more uniform distributed heat dissipation structure. This facilitates the entry of cool air into the heat dissipation area through the dense pores, enhancing the heat exchange efficiency with the heat dissipation fins or thermally conductive materials. Furthermore, setting the diameter of the heat dissipation holes to be less than or equal to 5 mm can effectively prevent larger dust particles or foreign objects from entering the solid-state drive.

[0065] In some embodiments, the shape of the heat dissipation hole includes at least one of the following: circular, elliptical, hexagonal, square, and rectangular. It should be noted that the shape of the heat dissipation hole can also be other geometric shapes. When multiple heat dissipation holes are provided on the second sidewall of the housing, the shapes of any two heat dissipation holes can be the same or different, and this disclosure does not impose any special limitations on this.

[0066] Figures 4A to 4D This is a schematic diagram of a first extension and a second extension engaging with each other, provided in an embodiment of this disclosure. Figures 4A to 4D All along Figure 3A and Figure 3B The sectional view obtained by the dashed line A-A'. For ease of understanding, Figures 4A to 4D The cross-section of the first extension 3021 is shown to be an inverted "L" shape, and the cross-section of the second extension 3061 is an "L" shape. The first extension 3021 and the second extension 3061 are interlocked by the complementary inverted "L" shape and the "L" shape.

[0067] Reference Figure 3A , 3BAs shown in 4A, the first extension 3021 has a first end S1 and a second end S2 opposite to each other along the height direction of the housing; the second extension 3061 has a third end S3 and a fourth end S4 opposite to each other along the height direction of the housing; the first housing also includes a first main body 3022, which contacts the first end S1; the second housing also includes a second main body 3062, which contacts the third end S3; wherein, the second end S2 contacts the second main body 3062, and the fourth end S4 contacts the first main body 3022.

[0068] Understandable, Figure 4A In the example shown, the height of the first extension 3021 and the height of the second extension 3061 can be the same, and both the height of the first extension 3021 and the height of the second extension 3061 are equal to the distance between the first main body 3022 and the second main body 3062. This allows the first extension 3021 and the second extension 3061 to be fully engaged, thereby increasing the engagement depth and area of ​​the two housings, and ensuring a tight fit without gaps, which is beneficial for further improving the electromagnetic shielding effectiveness of the housing. It should be noted that the engagement position of the first extension 3021 and the second extension 3061 can be the area where the first extension 3021 and the second extension 3061 overlap.

[0069] In other embodiments, reference is made to Figure 4B As shown, the second end S2 is located between the first end S1 and the second main body 3062, and the fourth end S4 contacts the first main body 3022.

[0070] Understandable, Figure 4B In the example shown, the height of the second extension 3061 is greater than the height of the first extension 3021, and the height of the second extension 3061 is equal to the distance between the first main body 3022 and the second main body 3062. The height of the first extension 3021 is less than the distance between the first main body 3022 and the second main body 3062. This allows the first extension 3021 and the second extension 3061 to partially engage, thereby increasing the engagement depth and area of ​​the two housings, which is beneficial for further improving the electromagnetic shielding effectiveness of the housing. Furthermore, the gap formed by the engagement of the two housings is physically isolated from the accommodating space within the housing through the second extension 3061, thereby improving the electromagnetic interference immunity of the housing.

[0071] In other embodiments, reference is made to Figure 4C As shown, the second end S2 contacts the second main body 3062, and the fourth end S4 is located between the third end S3 and the first main body 3022.

[0072] Understandable, Figure 4CIn the example shown, the height of the first extension 3021 is greater than the height of the second extension 3061, the height of the first extension 3021 is equal to the distance between the first main body 3022 and the second main body 3062, and the height of the second extension 3061 is less than the distance between the first main body 3022 and the second main body 3062. This allows the first extension 3021 and the second extension 3061 to partially engage, thereby increasing the engagement depth and area of ​​the two housings, which is beneficial for further improving the electromagnetic shielding effectiveness of the outer casing. Furthermore, the gap formed by the engagement of the two housings is physically isolated from the outside through the first extension 3021, thereby improving the electromagnetic interference capability of the outer casing.

[0073] In other embodiments, reference is made to Figure 4D As shown, the second end S2 is located between the first end S1 and the second main body 3062, and the fourth end S4 is located between the third end S3 and the first main body 3022.

[0074] Understandable, Figure 4D In the example shown, the height of the first extension 3021 and the height of the second extension 3061 are both less than the distance between the first main body 3022 and the second main body 3062. This allows the first extension 3021 and the second extension 3061 to partially engage, thereby increasing the engagement depth and area of ​​the two housings, which is beneficial for further improving the electromagnetic shielding effectiveness of the housing. Furthermore, the first gap formed by the engagement of the two housings is physically isolated from the accommodating space inside the housing through the second extension 3061, and the second gap formed by the engagement of the two housings is physically isolated from the outside through the first extension 3021, thereby simultaneously improving the electromagnetic interference immunity and electromagnetic interference resistance of the housing.

[0075] In some embodiments, refer to Figures 4A to 4D As shown, the distance between the first end S1 and the third end S3 in the height direction of the outer casing ranges from 1 mm to 3 mm. As an example, the distance between the first end S1 and the third end S3 in the height direction of the outer casing is 1 mm, 2 mm, or 3 mm. Of course, the distance between the first end S1 and the third end S3 in the height direction of the outer casing can also be any value between 1 mm and 3 mm.

[0076] In some embodiments, refer to Figures 4A to 4D As shown, the sum of the widths of the first extension 3021 and the second extension 3061 ranges from 1 mm to 3 mm. As an example, the sum of the widths of the first extension 3021 and the second extension 3061 can be 1 mm, 2 mm, or 3 mm. Of course, the sum of the widths of the first extension 3021 and the second extension 3061 can also be any value from 1 mm to 3 mm.

[0077] In some embodiments, the ratio of the distance between the snap-fit ​​position and the substrate in the height direction of the housing to the height of the housing ranges from 0.1 to 0.3. Taking the substrate being mounted on the second housing as an example, combined with... Figures 4A to 4D As shown, the ratio of the height difference between the second end S2 and the substrate to the height of the outer shell is 0.1, 0.2, or 0.3.

[0078] Figure 5A and Figure 5B This is a schematic diagram showing another embodiment of the present disclosure where the first extension and the second extension are interlocked. Figure 5A and Figure 5B All along Figure 3A and Figure 3B The sectional view obtained by the dashed line A-A'.

[0079] Reference Figure 5A As shown, the first extension 3021 includes two first sub-extensions spaced apart, wherein the second extension 3061 is located between the two first sub-extensions. As an example, Figure 5A The diagram shows a second extension 3061 located between first sub-extensions 3021A and 3021B, with its fourth end contacting the first main body 3022. Alternatively, in other examples, the second extension 3061 may be located between two first sub-extensions, with its fourth end located between its third end and the first main body 3022. For details regarding the third and fourth ends of the second extension 3061, please refer to... Figures 4A to 4D The third terminal S3 and the fourth terminal S4.

[0080] Understandable, Figure 5A In the example shown, the first extension 3021 has a concave cross-section, and the second extension 3061 has a convex cross-section. The first extension 3021 and the second extension 3061 are interlocked by the complementary shapes of the concave and convex shapes.

[0081] In other embodiments, reference is made to Figure 5B As shown, the second extension 3061 includes two second sub-extensions spaced apart, wherein the first extension 3021 is located between the two second sub-extensions. As an example, Figure 5BThe diagram shows a first extension 3021 located between second sub-extensions 3061A and 3061B, with the second end of the first extension 3021 contacting the second main body 3062. Of course, in other examples, the first extension 3021 is located between two second sub-extensions, and the second end of the first extension 3021 is located between the first end of the first extension 3021 and the second main body 3062. For details regarding the first and second ends of the first extension 3021, please refer to... Figures 4A to 4D The first end S1 and the second end S2.

[0082] Understandable, Figure 5B In the example shown, the first extension 3021 has a convex cross-section, and the second extension 3061 has a concave cross-section. The first extension 3021 and the second extension 3061 are interlocked by the complementary shapes of the concave and convex shapes.

[0083] The features disclosed in the several device embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new device embodiments.

[0084] It should be understood that the phrase "an embodiment" or "one embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this disclosure. Therefore, "in one embodiment" or "one embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this disclosure, the sequence numbers of the above-described processes do not imply a sequential order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this disclosure. The sequence numbers of the above-described embodiments are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0085] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0086] The above description is merely an embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A storage device, characterized in that, include: First housing, substrate, and second housing; The first housing includes a first extension toward the second housing; The second housing includes a second extension toward the first housing, wherein the first extension and the second extension engage with each other, such that the first housing and the second housing are joined together to form an outer shell; The substrate is located inside the housing, wherein the snap-fit ​​position of the first extension and the second extension is at a distance greater than zero from the substrate in the height direction of the housing.

2. The storage device according to claim 1, characterized in that, The first extension has a first end and a second end opposite to each other along the height direction of the housing; the second extension has a third end and a fourth end opposite to each other along the height direction of the housing. The first housing also includes a first main body portion, which contacts the first end; The second housing also includes a second main body portion, which contacts the third end; The second end contacts the second main body portion; or the second end is located between the first end and the second main body portion.

3. The storage device according to claim 2, characterized in that, The fourth end contacts the first main body portion; or, the fourth end is located between the third end and the first main body portion.

4. The storage device according to claim 2, characterized in that, The first extension includes two first sub-extensions spaced apart, wherein the second extension is located between the two first sub-extensions.

5. The storage device according to claim 2, characterized in that, The second extension includes two second sub-extensions spaced apart, wherein the first extension is located between the two second sub-extensions.

6. The storage device according to claim 2, characterized in that, The distance between the first end and the third end in the height direction of the outer casing ranges from 1 mm to 3 mm.

7. The storage device according to claim 1, characterized in that, The sum of the widths of the first extension and the second extension ranges from 1 mm to 3 mm.

8. The storage device according to claim 1, characterized in that, The height of the first housing is less than the height of the second housing, wherein the substrate is mounted on the second housing.

9. The storage device according to claim 1, characterized in that, The ratio of the distance between the snap-fit ​​position and the distance between the substrate and the height of the housing in the height direction of the housing ranges from 0.1 to 0.

3.

10. The storage device according to claim 1, characterized in that, The ratio of the height of the first housing to the height of the outer shell ranges from 0.2 to 0.4, and the ratio of the height of the second housing to the height of the outer shell ranges from 0.6 to 0.

8.

11. The storage device according to claim 1, characterized in that, The storage device also includes a connector; An opening is provided on the first sidewall of the housing, and the opening exposes the connector; The second sidewall of the housing is provided with heat dissipation holes, wherein the second sidewall and the first sidewall are arranged opposite to each other.

12. The storage device according to claim 11, characterized in that, The diameter of the heat dissipation holes is less than or equal to 5 mm.

13. The storage device according to claim 11, characterized in that, The shape of the heat dissipation hole includes at least one of the following: circular, elliptical, hexagonal, square, and rectangular.

14. The storage device according to claim 1, characterized in that, The storage device further includes a memory device and a controller, which are integrated on the substrate.

15. The storage device according to claim 14, characterized in that, The memory device includes 3D NAND memory.

16. The storage device according to claim 1, characterized in that, The storage device includes a solid-state drive (SSD).

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