Camera module and electronic equipment

Abstract

The utility model relates to the technical field of image capturing devices, and specifically provides a camera module comprising a circuit board; the photosensitive part is arranged on the circuit board; the bonding layer is attached to the circuit board and surrounds the photosensitive part; the voice coil motor is arranged on the bonding layer and covers the photosensitive part; and the lens is arranged in the voice coil motor, and the lens and the photosensitive piece are correspondingly arranged in the optical axis direction of the lens. According to the camera module, the voice coil motor is directly fixed on the circuit board through the bonding layer, so that the thickness of the camera module can be reduced, and light and thin arrangement of the camera module can be realized. In addition, the bonding layer is arranged around the photosensitive part, so that the connection stability of the voice coil motor and the circuit board can be improved, and the quality of the camera module is ensured. The utility model further provides electronic equipment comprising the shell and the camera module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of image capturing devices, in particular to an image capturing module and an electronic device. BACKGROUND

[0002] In the current image capturing module, a support is usually arranged between the voice coil motor and the circuit board to support the voice coil motor and the lens in the voice coil motor. However, the thickness adjustment range of the support is limited, which cannot meet the demand of customers for the thin image capturing module. CONTENT OF THE UTILITY MODEL

[0003] In view of the above, it is necessary to provide an image capturing module and an electronic device to realize the thin setting of the image capturing module.

[0004] An image capturing module is provided in the embodiments of the present application, which comprises:

[0005] a circuit board;

[0006] a photosensitive member arranged on the circuit board;

[0007] an adhesive layer arranged around the photosensitive member on the circuit board;

[0008] a voice coil motor arranged on the adhesive layer and covering the photosensitive member; and

[0009] a lens arranged in the voice coil motor, the lens being arranged in correspondence with the photosensitive member in the optical axis direction of the lens.

[0010] In the above image capturing module, the voice coil motor is directly fixed on the circuit board through the adhesive layer, which can reduce the thickness of the image capturing module and facilitate the thin setting of the image capturing module. In addition, the adhesive layer is arranged around the photosensitive member, which can increase the connection stability of the voice coil motor and the circuit board to ensure the quality of the image capturing module.

[0011] In some embodiments, a gap is arranged between the adhesive layer and the photosensitive member.

[0012] Therefore, the gap between the adhesive layer and the photosensitive member can provide sufficient space for the deformation of the adhesive layer to avoid the interference of the deformed adhesive layer to the photosensitive member.

[0013] In some embodiments, the height of the adhesive layer relative to the circuit board is greater than the height of the photosensitive member relative to the circuit board.

[0014] Therefore, the height of the adhesive layer relative to the circuit board is greater than the height of the photosensitive member relative to the circuit board, which can form a certain distance between the voice coil motor arranged on the adhesive layer and the photosensitive member in the optical axis direction of the lens, which is conducive to the installation of other optical components between the voice coil motor and the photosensitive member to improve the imaging quality of the image capturing module.

[0015] In some embodiments, the adhesive layer protrudes away from the periphery of the photosensitive member towards the circuit board.

[0016] Therefore, the adhesive layer protrudes away from the periphery of the photosensitive member towards the circuit board, which can form sufficient connection between the adhesive layer and the voice coil motor, and can protect the circuit board, thereby improving the service life of the camera module.

[0017] In some embodiments, the periphery of the adhesive layer away from the periphery of the photosensitive member is flush with the periphery of the voice coil motor in the optical axis direction of the lens.

[0018] Therefore, the periphery of the adhesive layer away from the periphery of the photosensitive member is flush with the periphery of the voice coil motor in the optical axis direction of the lens, which is conducive to improving the aesthetic appearance of the camera module.

[0019] In some embodiments, a connecting layer is arranged between the photosensitive member and the circuit board, and the photosensitive member is fixed to the circuit board through the connecting layer.

[0020] Therefore, the connecting layer can simplify the processing technology of the photosensitive member and the circuit board, and the manufacturing cost of the connecting layer is low, which can realize the connection between the photosensitive member and the circuit board at low cost.

[0021] In some embodiments, the adhesive layer is centrally symmetrically arranged with the photosensitive member as the center.

[0022] Therefore, the adhesive layer is centrally symmetrically arranged with the photosensitive member as the center, which is conducive to the stability of the voice coil motor relative to the photosensitive member.

[0023] In some embodiments, the camera module further comprises:

[0024] An optical filter is arranged on the adhesive layer and located between the photosensitive member and the lens.

[0025] Therefore, the optical filter can improve the imaging quality of the camera module.

[0026] In some embodiments, the adhesive layer comprises:

[0027] A first adhesive body is connected to the circuit board and arranged around the photosensitive member, and the optical filter is arranged on the first adhesive body.

[0028] A second adhesive body is attached to the first adhesive body and arranged around the optical filter, and the voice coil motor is arranged on the second adhesive body.

[0029] The periphery of the first adhesive body away from the periphery of the photosensitive member is flush with the periphery of the second adhesive body away from the periphery of the optical filter in the optical axis direction of the lens.

[0030] Therefore, the first adhesive body and the second adhesive body can form a stepped structure, which can reduce the thickness of the adhesive layer on the basis of realizing the connection of the filter and the circuit board.

[0031] The embodiment of the present application further provides an electronic device, comprising:

[0032] A shell;

[0033] The camera module described above is installed in the shell.

[0034] In the camera module of the electronic device described above, the voice coil motor is directly fixed to the circuit board through the adhesive layer, which can reduce the thickness of the camera module and is conducive to the thin and light setting of the electronic device. In addition, the adhesive layer is arranged around the photosensitive member, which can increase the connection stability of the voice coil motor and the circuit board to ensure the imaging quality of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 It is a cross-sectional schematic view of the camera module of the embodiment of the present application.

[0036] Figure 2 It is a structural schematic view of the electronic device of the embodiment of the present application.

[0037] Main element symbol explanation: camera module 100, gap 100a, circuit board 110, photosensitive member 120, adhesive layer 130, first adhesive body 131, second adhesive body 132, voice coil motor 140, lens 150, connection layer 160, filter 170, filter support 171, filter 172, electronic device 1000, shell 200. DETAILED DESCRIPTION

[0038] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0039] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the term "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. In the description of the present application, it should be noted that the meaning of "multiple" is two or more than two, unless otherwise explicitly specified and limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0040] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0041] Please refer to Figure 1 The embodiment of the present application provides a camera module 100, which comprises a circuit board 110, a photosensitive element 120, an adhesive layer 130, a voice coil motor 140 and a lens 150. The circuit board 110 can be a flexible circuit board, a rigid circuit board, a flexible-rigid combined board, etc. The photosensitive element 120 is arranged at the middle part of the circuit board 110. The adhesive layer 130 is attached to the circuit board 110 and arranged around the photosensitive element 120. The voice coil motor 140 is arranged on the adhesive layer 130 and covers the photosensitive element 120. The lens 150 is arranged in the voice coil motor 140. The lens 150 and the photosensitive element 120 are arranged in correspondence in the optical axis direction of the lens 150.

[0042] In the above-mentioned camera module 100, the voice coil motor 140 is directly fixed on the circuit board 110 through the adhesive layer 130, which can reduce the thickness of the camera module 100 and is beneficial to realize the thin and light setting of the camera module 100. In addition, the adhesive layer 130 is arranged around the photosensitive element 120, which can increase the connection stability of the voice coil motor 140 and the circuit board 110 to ensure the quality of the camera module 100.

[0043] In the embodiment, the adhesive layer 130 is formed by curing the glue containing cyanoacrylate.

[0044] In some embodiments, a gap 100a is arranged between the adhesive layer 130 and the photosensitive element 120.

[0045] Therefore, the gap 100a between the adhesive layer 130 and the photosensitive element 120 can provide sufficient space for the deformation of the adhesive layer 130 to avoid interference of the deformed adhesive layer 130 to the photosensitive element 120.

[0046] In some embodiments, the height of the adhesive layer 130 relative to the circuit board 110 is greater than the height of the photosensitive element 120 relative to the circuit board 110.

[0047] Therefore, the height of the adhesive layer 130 relative to the circuit board 110 is greater than the height of the photosensitive element 120 relative to the circuit board 110, so that the voice coil motor 140 disposed on the adhesive layer 130 and the photosensitive element 120 form a certain spacing in the optical axis direction of the lens 150, which is beneficial to installing other optical components between the voice coil motor 140 and the photosensitive element 120, so as to improve the imaging quality of the camera module 100.

[0048] Please refer to Figure 1 In some embodiments, the adhesive layer 130 protrudes from the circuit board 110 away from the periphery of the photosensitive element 120.

[0049] Therefore, the adhesive layer 130 protrudes from the circuit board 110 away from the periphery of the photosensitive element 120, which can form sufficient connection strength of the adhesive layer 130 to the voice coil motor 140 and can protect the circuit board 110 to some extent, which is beneficial to improve the service life of the camera module 100.

[0050] In some embodiments, the periphery of the adhesive layer 130 away from the periphery of the photosensitive element 120 is flush with the periphery of the voice coil motor 140 in the optical axis direction of the lens 150.

[0051] Therefore, the periphery of the adhesive layer 130 away from the periphery of the photosensitive element 120 is flush with the periphery of the voice coil motor 140 in the optical axis direction of the lens 150, which is beneficial to improve the aesthetic appearance of the camera module 100.

[0052] Please refer to Figure 1 In some embodiments, a connecting layer 160 is arranged between the photosensitive element 120 and the circuit board 110, and the photosensitive element 120 is fixed to the circuit board 110 through the connecting layer 160.

[0053] Therefore, the connecting layer 160 can simplify the processing technology of the photosensitive element 120 and the circuit board 110, and the connecting layer 160 has low manufacturing cost, so that the connection of the photosensitive element 120 and the circuit board 110 can be realized at low cost.

[0054] In the embodiment, the connecting layer 160 can be formed by curing glue with waterproof and corrosion-resistant components.

[0055] In some embodiments, the adhesive layer 130 is centrally symmetrically arranged with the photosensitive element 120 as the center.

[0056] Therefore, the adhesive layer 130 is centrally symmetrically arranged with the photosensitive element 120 as the center, which is beneficial to the stability of the voice coil motor 140 relative to the photosensitive element 120.

[0057] Please refer to Figure 1 In some embodiments, the camera module 100 further comprises a filter 170. The filter 170 is arranged on the adhesive layer 130 and located between the photosensitive element 120 and the lens 150.

[0058] Therefore, the imaging quality of the camera module 100 can be improved by the light filter 170.

[0059] In the embodiment, the light filter 170 includes a light filter support 171 arranged on the adhesive layer 130 and arranged above the photosensitive element 120, and a light filter 172 embedded on a side of the light filter support 171 away from the photosensitive element 120.

[0060] Please refer to Figure 1 In some embodiments, the adhesive layer 130 includes a first adhesive body 131 and a second adhesive body 132. The first adhesive body 131 is connected to the circuit board 110 and arranged around the photosensitive element 120, the light filter 170 is arranged on the first adhesive body 131, the second adhesive body 132 is attached to the first adhesive body 131 and arranged around the light filter 170, and the voice coil motor 140 is arranged on the second adhesive body 132. Wherein, the periphery of the first adhesive body 131 away from the photosensitive element 120 is flush with the periphery of the second adhesive body 132 away from the light filter 170 in the optical axis direction of the lens 150.

[0061] Therefore, the first adhesive body 131 and the second adhesive body 132 can form a stepped structure, which can reduce the thickness of the adhesive layer 130 on the basis of realizing the connection of the light filter 170 and the circuit board 110.

[0062] Please refer to Figure 2 The embodiment of the present application also provides an electronic device 1000, which includes a shell 200 and the camera module 100 described above, and the camera module 100 is installed in the shell 200. Wherein, the electronic device 1000 can be a mobile phone, a tablet computer, etc.

[0063] In the camera module 100 of the electronic device 1000 described above, the voice coil motor 140 is directly fixed on the circuit board 110 through the adhesive layer 130, which can reduce the thickness of the camera module 100, and is conducive to realizing the thin and light setting of the electronic device 1000. In addition, the adhesive layer 130 is arranged around the photosensitive element 120, which can stabilize the connection between the voice coil motor 140 and the circuit board 110, so as to ensure the imaging quality of the electronic device 1000.

[0064] It is apparent for those skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as illustrative and not restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and range of equivalents of the claims are intended to be embraced therein.

[0065] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. An image capturing module, comprising: The camera module comprises: a circuit board; a photosensitive element disposed on the circuit board; an adhesive layer attached to the circuit board and surrounding the photosensitive element; a voice coil motor disposed on the adhesive layer and covering the photosensitive element; and a lens disposed in the voice coil motor, the lens being disposed in correspondence with the photosensitive element in the optical axis direction of the lens. A gap is provided between the adhesive layer and the photosensitive element.

2. The camera module of claim 1, wherein, The height of the adhesive layer relative to the circuit board is greater than the height of the photosensitive element relative to the circuit board.

3. The camera module of claim 1, wherein the lens module is configured to focus light onto the image sensor. The adhesive layer protrudes away from the periphery of the photosensitive element towards the circuit board.

4. The camera module of claim 1, wherein, The periphery of the adhesive layer away from the periphery of the photosensitive element is flush with the periphery of the voice coil motor in the optical axis direction of the lens.

5. The camera module of claim 1, wherein the lens is disposed on the substrate. A connecting layer is provided between the photosensitive element and the circuit board, and the photosensitive element is fixed to the circuit board via the connecting layer.

6. The camera module of claim 1, wherein, The adhesive layer is centrally symmetric about the photosensitive element.

7. The camera module of claim 1, wherein the lens is a lens having a focal length of 2.5 mm or less. The camera module further comprises:

8. The camera module of claim 1, wherein, a filter disposed on the adhesive layer and located between the photosensitive element and the lens. The adhesive layer comprises:

9. The camera module of claim 8, wherein the lens is disposed on the substrate. a first adhesive body connected to the circuit board and surrounding the photosensitive element, the filter being disposed on the first adhesive body; a second adhesive body attached to the first adhesive body and surrounding the filter, the voice coil motor being disposed on the second adhesive body; wherein the periphery of the first adhesive body away from the periphery of the photosensitive element is flush with the periphery of the second adhesive body away from the periphery of the filter in the optical axis direction of the lens. The camera module comprises:

10. An electronic device, comprising: a housing; the camera module according to any one of claims 1 to 9, the camera module being mounted in the housing. ​

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