Driving chip packaging structure

Abstract

The utility model relates to the technical field of drive chip packaging, in particular to a drive chip packaging structure, which comprises a packaging substrate, an LED drive chip main body and a positioning plate fixedly connected to the top end of the packaging substrate, and is characterized in that a drive chip packaging positioning structure is arranged above the positioning plate, and the LED drive chip main body is fixedly connected with the positioning plate. And a light weakening refraction structure is arranged above the positioning plate. According to the driving chip packaging structure, the packaging cover can be buckled above the LED driving chip main body along with welding of the welding ring and the butt welding plate, the antireflection film is made of silicon dioxide and is clamped between the sealing layer and the packaging cover, reflected light of optical surfaces such as a lens, a prism and a plane mirror can be reduced or eliminated through the antireflection film, and the brightness of the LED driving chip is improved. Therefore, the light transmission amount of the packaging cover is increased, stray light is reduced or eliminated, after the LED driving chip is packaged, excessive glare is not easily generated due to the fact that the packaging cover is arc-shaped, and the packaging effect of the driving chip packaging structure is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to drive chip packaging technical field, concretely is a kind of drive chip packaging structure. BACKGROUND

[0002] LED packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. LED packaging not only requires protecting the lamp core, but also needs to be light-transmitting. Therefore, LED packaging has special requirements for packaging materials. LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. Generally, the die of discrete device is sealed in the package, and the main function of packaging is to protect the die and complete electrical interconnection.

[0003] For example, the patent announcement number "CN216698409U" is named a LED drive chip packaging structure. The through hole at the bottom of the packaging substrate realizes the welding of the LED chip main body and the packaging substrate. Thus, it is not only convenient for the welding and fixation of the packaging substrate and the LED chip main body, but also convenient for the welding work between the packaging substrate and the LED chip main body. However, the existing LED drive chip packaging structure adopts a circular arc-shaped light-transmitting protective cover to package the positioned LED drive chip. Because the LED drive chip not only needs to realize electrical signal output, but also needs to bear the function of light-emitting, the inner wall of the circular arc-shaped light-transmitting protective cover is smooth and the arc surface design is easy to refract and reflect light, causing the light emitted by the packaging structure to have ghosting or glare problems, which affects the packaging effect of the LED drive chip. UTILITY MODEL CONTENTS

[0004] The utility model aims to solve the problem of poor packaging effect of the existing LED drive chip packaging structure, and proposes a drive chip packaging structure.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0006] A drive chip packaging structure is designed, which includes a packaging substrate, an LED drive chip main body and a positioning plate. The positioning plate is fixedly connected to the top end of the packaging substrate. The positioning plate is characterized in that: a drive chip packaging positioning structure is arranged above the positioning plate, and a light weakening and refracting structure is arranged above the positioning plate.

[0007] The drive chip packaging positioning structure includes a positioning ring and a bottom plate. The positioning ring is fixedly connected above the positioning plate. The inner side of the positioning ring is fixedly connected with a welding ring. The bottom plate is fixedly installed on the inner side of the positioning ring. The top end of the welding ring is fixedly connected with a butt welding plate.

[0008] The upper side of the butt welding plate is movably connected with the side of the LED driving chip body, and the outer wall of the butt welding plate is tightly attached to the inner wall of the positioning ring.

[0009] The light weakening refraction structure comprises an encapsulation cover and a sealing layer, the encapsulation cover is arranged above the positioning plate, the bottom end of the encapsulation cover is fixedly connected with the top end of the butt welding plate, the inner wall of the encapsulation cover is fixedly installed with an anti-reflection film, the inner wall of the sealing layer is fixedly connected with the anti-reflection film, and the bottom end of the sealing layer is fixedly connected with the top end of the butt welding plate.

[0010] The upper side of the bottom plate is fixedly installed with a plurality of supporting blocks, and the top end of the supporting block is movably connected with the bottom end of the LED driving chip body.

[0011] The inner wall of the sealing layer is fixedly installed with a plurality of pressing plates, and the lower end of the pressing plate is tightly abutted with the top end edge of the LED driving chip body.

[0012] The driving chip encapsulation structure has the beneficial effects that the encapsulation cover is buckled on the upper side of the LED driving chip body through welding of the welding ring and the butt welding plate, the anti-reflection film is made of silicon dioxide, the anti-reflection film is clamped between the sealing layer and the encapsulation cover, the anti-reflection film can reduce or eliminate reflected light of optical surfaces such as lenses, prisms and plane mirrors, the light transmittance of the encapsulation cover is increased, and stray light is reduced or eliminated, the encapsulation cover is arc-shaped, so that the encapsulation cover is not easy to produce excessive glare after the LED driving chip is encapsulated, and the encapsulation effect of the driving chip encapsulation structure is improved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0014] Figure 2 It is Figure 1 a top view schematic view of the utility model;

[0015] Figure 3 It is Figure 1 a front view schematic view of the utility model;

[0016] Figure 4 It is Figure 2 an enlarged sectional view of A part in the utility model;

[0017] Figure 5 It is Figure 3 an enlarged sectional view of B part in the utility model;

[0018] Figure 6 It is Figure 3 an enlarged sectional view of C part in the utility model.

[0019] In the figure: 1, package substrate, 2, LED drive chip main body, 3, positioning plate, 4, drive chip packaging positioning structure, 41, positioning ring, 42, welding ring, 43, bottom plate, 44, butt welding plate, 5, light weakening refraction structure, 51, package cover, 52, sealing layer, 53, anti-reflection film, 6, supporting block, 7, pressing plate. DETAILED DESCRIPTION

[0020] The utility model will be further described below in combination with the drawings:

[0021] Example 1:

[0022] Please refer to Figures 1-6 In the embodiment, a drive chip packaging structure includes a package substrate 1, an LED drive chip main body 2 and a positioning plate 3. The package substrate 1 is made of BT resin material. The BT resin has high Tg, high heat resistance, moisture resistance, low dielectric constant and low loss factor and other excellent properties. The positioning plate 3 is fixedly connected to the top end of the package substrate 1. The positioning plate 3 is a plurality of square metal copper frames above the package substrate 1, which is used to assist positioning the position of the LED drive chip main body 2 packaging. The positioning plate 3 is provided with a drive chip packaging positioning structure 4 above it. The positioning plate 3 is provided with a light weakening refraction structure 5 above it.

[0023] The drive chip packaging positioning structure 4 includes a positioning ring 41 and a bottom plate 43. The positioning ring 41 is fixedly connected above the positioning plate 3. The positioning ring 41 is made of epoxy resin material protruding above the positioning plate 3. The inner side of the positioning ring 41 is fixedly connected with a welding ring 42. The welding ring 42 has a diameter slightly smaller than the inner diameter of the positioning ring 41. In this way, the welding ring 42 can be vertically placed in the protrusion inside the positioning ring 41, and then welded and fixed with the butt welding plate 44 below by using a welding gun. The bottom plate 43 is fixedly installed inside the positioning ring 41. The top end of the welding ring 42 is fixedly connected with the butt welding plate 44. The top end of the butt welding plate 44 is in close contact with the welding ring 42. The upper side of the butt welding plate 44 is movably connected with the side edge of the LED drive chip main body 2. The outer wall of the butt welding plate 44 is in close contact with the inner wall of the positioning ring 41.

[0024] The light weakening refraction structure 5 comprises an encapsulation cover 51 and a sealing layer 52, the encapsulation cover 51 is arranged above the positioning plate 3, the encapsulation cover 51 adopts a cover-shaped structure with trapezoidal slopes on two sides and a plane top end, the encapsulation cover 51 is made of transparent plastic material, the encapsulation cover 51 is buckled above the LED driving chip body 2 with the welding of the welding ring 42 and the butt welding plate 44, the bottom end of the encapsulation cover 51 is fixedly connected with the top end of the butt welding plate 44, the inner wall of the encapsulation cover 51 is fixedly installed with an anti-reflection film 53, the anti-reflection film 53 is made of silicon dioxide, the anti-reflection film 53 is clamped between the sealing layer 52 and the encapsulation cover 51, the anti-reflection film 53 can reduce or eliminate the reflected light of optical surfaces such as lenses, prisms and plane mirrors, thereby increasing the light transmission of the encapsulation cover 51 and reducing or eliminating stray light, so that the LED driving chip is not easy to produce excessive glare after being encapsulated due to the circular arc shape of the encapsulation cover, the encapsulation effect of the driving chip encapsulation structure is improved, the inner wall of the sealing layer 52 is fixedly connected with the anti-reflection film 53, the bottom end of the sealing layer 52 is fixedly connected with the top end of the butt welding plate 44, the sealing layer 52 is made of epoxy resin material, which can seal and ensure the light transmission of the LED driving chip body 2;

[0025] The encapsulation cover 51 adopts a cover-shaped structure with trapezoidal slopes on two sides and a plane top end, the encapsulation cover 51 is made of transparent plastic material, the encapsulation cover 51 is buckled above the LED driving chip body 2 with the welding of the welding ring 42 and the butt welding plate 44, the anti-reflection film 53 is made of silicon dioxide, the anti-reflection film 53 is clamped between the sealing layer 52 and the encapsulation cover 51, the anti-reflection film 53 can reduce or eliminate the reflected light of optical surfaces such as lenses, prisms and plane mirrors, thereby increasing the light transmission of the encapsulation cover 51 and reducing or eliminating stray light, so that the LED driving chip is not easy to produce excessive glare after being encapsulated due to the circular arc shape of the encapsulation cover, the encapsulation effect of the driving chip encapsulation structure is improved.

[0026] A plurality of supporting blocks 6 are fixedly installed above the bottom plate 43, the supporting blocks 6 are provided with a plurality of square blocks made of a plurality of hydroxyl compounds, then the supporting blocks 6 support the bottom surface of the LED driving chip body 2 upward to form auxiliary support for the LED driving chip body 2, the top ends of the plurality of supporting blocks 6 are movably connected with the bottom end of the LED driving chip body 2.

[0027] A plurality of pressing plates 7 are fixedly installed on the inner wall of the sealing layer 52, after the upper encapsulation cover 51 is buckled above the LED driving chip body 2, the plurality of pressing plates 7 protruding on the inner side of the encapsulation cover 51 will fall and press on the top end edge of the LED driving chip body 2, the pressing plates 7 can extrude and position the LED driving chip body 2, and can prevent shock and pressure, the lower ends of the plurality of pressing plates 7 abut against the top end edge of the LED driving chip body 2.

[0028] Working principle:

[0029] The driving chip packaging structure is used for packaging LED driving chip, and the packaging structure is complex in structure and process and directly affects the performance and service life of the LED. The functions of the LED packaging include mechanical protection, heat dissipation, power supply management, optical control, power supply control, etc.

[0030] Main part of the driving chip packaging structure:

[0031] The packaging substrate 1 is made of BT resin material, which has high Tg, high heat resistance, moisture resistance, low dielectric constant and low loss factor, etc. The positioning plate 3 is fixedly connected to the top end of the packaging substrate 1, and the positioning plate 3 is a plurality of square metal copper frames above the packaging substrate 1, which is used to assist the positioning of the packaging position of the LED driving chip main body 2.

[0032] Welding packaging positioning of the driving chip packaging structure:

[0033] The positioning ring 41 is made of epoxy resin material protruding above the positioning plate 3, and the welding ring 42 is slightly smaller than the inner diameter of the positioning ring 41. In this way, the welding ring 42 can be vertically placed in the protrusion inside the positioning ring 41, and then the welding gun is used to weld and fix the lower butt joint welding plate 44. The top end of the butt joint welding plate 44 is tightly attached to the welding ring 42.

[0034] Anti-glare structure of the driving chip packaging structure:

[0035] The packaging cover 51 is a cover-shaped structure with trapezoidal slopes on both sides and a flat top. The packaging cover 51 is made of transparent plastic material. The packaging cover 51 is buckled above the LED driving chip main body 2 by welding the welding ring 42 and the butt joint welding plate 44. The anti-reflective film 53 is made of silicon dioxide. The anti-reflective film 53 is sandwiched between the sealing layer 52 and the packaging cover 51. The anti-reflective film 53 can reduce or eliminate the reflected light of optical surfaces such as lenses, prisms, and flat mirrors, thereby increasing the light transmittance of the packaging cover 51 and reducing or eliminating stray light. In this way, the LED driving chip is not easy to produce too much glare after being packaged because the packaging cover is arc-shaped.

[0036] Protection and down pressure fixing structure of the driving chip packaging structure:

[0037] The support block 6 is provided with a plurality of square blocks made of polyhydroxy compound, and then the support block 6 supports the bottom surface of the LED driving chip body 2 upward to form auxiliary support for the LED driving chip body 2; after the upper packaging cover 51 is buckled above the LED driving chip body 2, the plurality of lower pressing plates 7 protruding on the inner sealing layer 52 of the packaging cover 51 will fall and press on the top edge of the LED driving chip body 2; the lower pressing plate 7 can extrude the LED driving chip body 2 for positioning, and can prevent shock and pressure.

[0038] Although the utility model has been illustrated and described by referring to the preferred embodiments, it should be understood by those skilled in the art that various changes in form and details can be made within the scope of the claims.

Claims

1. A driving chip packaging structure, comprising a packaging substrate (1), an LED driving chip body (2) and a positioning plate (3), the positioning plate (3) is fixedly connected to the top end of the packaging substrate (1), characterized in that: The upper side of the positioning plate (3) is provided with a driving chip packaging positioning structure (4), and the upper side of the positioning plate (3) is provided with a light weakening refraction structure (5). The driving chip packaging positioning structure (4) comprises a positioning ring (41) and a bottom plate (43). The positioning ring (41) is fixedly connected to the upper side of the positioning plate (3). The inner side of the positioning ring (41) is fixedly connected with a welding ring (42). The bottom plate (43) is fixedly installed on the inner side of the positioning ring (41). The top end of the welding ring (42) is fixedly connected with a butt welding plate (44). The upper side of the butt welding plate (44) is movably connected with the side edge of the LED driving chip body (2). The outer wall of the butt welding plate (44) is tightly attached to the inner wall of the positioning ring (41). The light weakening refraction structure (5) comprises a packaging cover (51) and a sealing layer (52). The packaging cover (51) is arranged on the upper side of the positioning plate (3). The bottom end of the packaging cover (51) is fixedly connected with the top end of the butt welding plate (44). The inner wall of the packaging cover (51) is fixedly installed with an anti-reflection film (53). The sealing layer (52) is fixedly connected to the inner wall of the anti-reflection film (53). The bottom end of the sealing layer (52) is fixedly connected with the top end of the butt welding plate (44).

2. The drive chip package structure of claim 1, wherein: A plurality of supporting blocks (6) are fixedly installed on the upper side of the bottom plate (43). The top end of each supporting block (6) is movably connected with the bottom end of the LED driving chip body (2).

3. The drive chip package structure of claim 2, wherein: A plurality of pressing plates (7) are fixedly installed on the inner wall of the sealing layer (52). The lower end of each pressing plate (7) is tightly abutted with the top edge of the LED driving chip body (2).

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