Positionable semiconductor silicon carbide wafer molding sealing equipment

Abstract

The utility model relates to the technical field of molding sealing equipment, and discloses semiconductor silicon carbide wafer molding sealing equipment capable of being positioned, which comprises a device shell, supporting legs are arranged at the bottom of the device shell, and a box door is connected to the front end of the device shell through a hinge. A control panel is arranged at the front end of the device shell and located on the left side of the box door, a cooling table is arranged in the middle of the bottom end in the device shell, a packaging table is arranged on the top of the cooling table, a bearing table is arranged in the device shell and located on the side face of the cooling table, and a positioning air cylinder is installed on the top of the bearing table. According to the utility model, the bearing platform, the positioning cylinder and the positioning clamping block are arranged, and the mutual cooperation among the bearing platform, the positioning cylinder and the positioning clamping block is utilized, so that the wafer can be quickly positioned at the circle center of the packaging platform, the sealing quality of the wafer is improved, and the sealing work efficiency is also improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of plastic package head, concretely to a moulding and sealing equipment of semiconductor silicon carbide wafer of positionable. BACKGROUND

[0002] Silicon is a kind of grey, fragile, four-valence non-metallic chemical element, 27.8% of the crust composition is silicon element, and it is second only to oxygen element content, and silicon is the element that is relatively rich in nature. Silicon element can be found in quartz, agate and ordinary beach stone. Silicon wafer is processed from silicon ingot, and through special process, millions of transistors can be etched on the silicon wafer, and the silicon wafer is widely applied to the manufacture of integrated circuit. When moulding and sealing semiconductor silicon carbide wafer, plastic package head is used.

[0003] The existing moulding and sealing equipment of semiconductor silicon carbide wafer cannot quickly position wafer at the center of packaging table when in use, usually manual positioning is adopted through naked eye, positioning accuracy is not high, the sealing quality of wafer is poor, and sealing work efficiency is influenced, so there is an urgent need for a moulding and sealing equipment of semiconductor silicon carbide wafer to solve the above technical problems. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a moulding and sealing equipment of semiconductor silicon carbide wafer to solve the problems that the existing moulding and sealing equipment of semiconductor silicon carbide wafer cannot quickly position wafer at the center of packaging table when in use, usually manual positioning is adopted through naked eye, positioning accuracy is not high, the sealing quality of wafer is poor, and sealing work efficiency is influenced.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] The utility model provides a mould sealing equipment of positionable semiconductor silicon carbide wafer, including device casing, the bottom of device casing is provided with support foot, the front end of device casing is connected with the cabinet door through the hinge, the front end of device casing and left side of cabinet door are provided with the control panel, the inside bottom end of device casing is provided with the cooling platform, the top of cooling platform is provided with the packaging platform, the inside of device casing and the side of cooling platform are provided with the bearing platform, the top of bearing platform is installed with the positioning cylinder, one end of positioning cylinder is connected with the positioning clamping block, the inboard wall of positioning clamping block is installed with the rubber block, the inside top of device casing is provided with the telescopic link, one side of telescopic link is provided with the electric push rod, the lower end of electric push rod and telescopic link is connected with the connecting block, the lower end of connecting block is installed with the plastic sealing head, and the left side of plastic sealing head is connected to the heater through the conveying pipe.

[0007] As a preferred technical scheme of the utility model, the rubber block and the positioning clamping block are of the same shape.

[0008] As a preferred technical scheme of the utility model, the number of the bearing platform, the positioning cylinder and the positioning clamping block is two, and they are symmetrically arranged about the cooling platform.

[0009] As a preferred technical scheme of the utility model, the number of the telescopic link is two, and the two telescopic links are symmetrically arranged about the electric push rod.

[0010] As a preferred technical scheme of the utility model, the positioning clamping block is in the shape of a semicircular ring structure.

[0011] As a preferred technical scheme of the utility model, the cross section of the packaging platform is in the shape of a T structure.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] 1. By setting the bearing platform, the positioning cylinder and the positioning clamping block, the wafer can be quickly positioned at the center of the packaging platform, and the positioning is accurate, the sealing quality of the wafer is improved, and the sealing efficiency is also improved.

[0014] 2. By setting the rubber block on the inboard wall of the positioning clamping block, the edge of the wafer can be protected from being scratched. BRIEF DESCRIPTION OF DRAWINGS

[0015] Other features, objects and advantages of the application will become more apparent from the following detailed description of non-limiting embodiments, made with reference to the accompanying drawings:

[0016] Fig. 1 It is the internal structure schematic view of the utility model;

[0017] Fig. 2 It is the whole structure schematic view of the utility model;

[0018] Fig. 3 It is the overhead structure schematic view of the utility model position relation of positioning clamping block and rubber block.

[0019] In the drawing: 1, device shell; 2, support foot; 3, box door; 4, hinge; 5, control panel; 6, cooling table; 7, encapsulation table; 8, bearing table; 9, positioning cylinder; 10, positioning clamping block; 11, telescopic rod; 12, electric push rod; 13, connecting block; 14, plastic sealing head; 15, rubber block; 16, heater; 17, conveying pipe. Specific implementation

[0020] The application will be further described in detail below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the related utility model, and not limit the utility model. In addition, it needs to be explained that, for the convenience of description, only the parts related to the utility model are shown in the drawings, and the drawings in the utility model embodiments: different kinds of section lines in the drawing are not marked according to the national standard, and the material of the element is not required, which is to distinguish the section view of the element in the drawing.

[0021] Please refer to Figs. 1-3 A moulding and sealing equipment of positionable semiconductor silicon carbide wafer, including device shell 1, the bottom of device shell 1 is provided with support foot 2, the front end of device shell 1 is connected with box door 3 through hinge 4, the front end of device shell 1 and the left side of box door 3 are provided with control panel 5, the inside bottom end of device shell 1 is provided with cooling table 6, the top of cooling table 6 is provided with encapsulation table 7, the inside of device shell 1 and the side of cooling table 6 are provided with bearing table 8, the top of bearing table 8 is installed with positioning cylinder 9, one end of positioning cylinder 9 is connected with positioning clamping block 10, rubber block 15 is installed on the inner side wall of positioning clamping block 10, the inside top of device shell 1 is provided with telescopic rod 11, one side of telescopic rod 11 is provided with electric push rod 12, the lower end of electric push rod 12 and telescopic rod 11 is connected with connecting block 13, the lower end of connecting block 13 is installed with plastic sealing head 14, the left side of plastic sealing head 14 is connected to heater 16 through conveying pipe 17.

[0022] Among them, the shape of rubber block 15 and positioning clamping block 10 is same, by setting rubber block 15 on the inner side wall of positioning clamping block 10, so that the edge of wafer can be prevented from being scratched.

[0023] The quantity of the load-bearing table 8, the positioning cylinder 9 and the positioning clamping block 10 is two, and they are symmetrically arranged about the cooling table 6, and the mutual cooperation between them can realize the fast positioning of the wafer at the center of the packaging table 7, and the positioning is accurate, the sealing quality of the wafer is improved, and the sealing work efficiency is also improved.

[0024] The quantity of the telescopic rod 11 is two, and the two telescopic rods 11 are symmetrically arranged about the electric push rod 12.

[0025] The positioning clamping block 10 is in a semicircular ring structure.

[0026] The cross section of the packaging table 7 is in a T-shaped structure.

[0027] The working principle and the use process of the utility model are as follows: first, the heater 16 heats the packaging material to a molten state, and then the packaging material is conveyed to the plastic sealing head 14 position through the conveying pipe 17, and the semiconductor silicon carbide wafer to be sealed is placed on the packaging table 7, then the positioning cylinder 9 on both sides is started to drive the positioning clamping block 10 to quickly position the wafer at the center of the packaging table 7, and the positioning is accurate, the sealing quality of the wafer is improved, and the sealing work efficiency is also improved, after positioning, the electric push rod 12 is started to drive the plastic sealing head 14 on the connecting block 13 to mold and seal the wafer at the center of the packaging table 7.

[0028] The rubber block 15 is arranged on the inner side wall of the positioning clamping block 10, so that the edge of the wafer can be protected from scratching during positioning, and the contents not described in detail in the description belong to the prior art known to those skilled in the art.

[0029] The above description is only the preferred embodiment of the application and the explanation of the applied technical principles. Those skilled in the art should understand that the utility model range involved in the application is not limited to the technical solutions formed by the specific combination of the above technical features, and also covers other technical solutions formed by the above technical features or equivalent features in any combination without departing from the utility model concept. For example, the above features are replaced with the technical features disclosed in the application (but not limited to) having similar functions to form a technical solution.

Claims

1. A molding and sealing device for a positionable semiconductor silicon carbide wafer, comprising a device housing (1), characterized in that: The bottom of the device housing (1) is provided with a support foot (2). The front end of the device housing (1) is connected to a door (3) via a hinge (4). The front end of the device housing (1) and the left side of the door (3) are provided with a control panel (5). The bottom center of the inside of the device housing (1) is provided with a cooling platform (6). The top of the cooling platform (6) is provided with a sealing platform (7). The inside of the device housing (1) and the side of the cooling platform (6) are provided with a load-bearing platform (8). The top of the load-bearing platform (8) is equipped with a positioning cylinder (9). One end of the positioning cylinder (9) is connected to a positioning clamp (10). A rubber block (15) is installed on the inner side wall of the positioning clamp (10). A telescopic rod (11) is provided at the top inside the device housing (1). An electric push rod (12) is provided on one side of the telescopic rod (11). A connecting block (13) is connected to the lower end of the electric push rod (12) and the telescopic rod (11). A plastic sealing head (14) is installed at the lower end of the connecting block (13). The left side of the plastic sealing head (14) is connected to the heater (16) through a delivery pipe (17).

2. The molding and sealing device for a positionable semiconductor silicon carbide wafer according to claim 1, characterized in that: The rubber block (15) has the same shape as the positioning clamp (10).

3. The molding and sealing device for a positionable semiconductor silicon carbide wafer according to claim 1, characterized in that: The number of the load-bearing platform (8), the positioning cylinder (9) and the positioning clamp (10) are all set to two, and they are all arranged symmetrically about the cooling platform (6) on the left and right axes.

4. The molding and sealing device for a positionable semiconductor silicon carbide wafer according to claim 1, characterized in that: The number of telescopic rods (11) is set to two, and the two telescopic rods (11) are arranged symmetrically about the electric push rod (12) on the left and right axes.

5. The molding and sealing device for a positionable semiconductor silicon carbide wafer according to claim 1, characterized in that: The positioning clamp (10) is a semi-circular ring structure.

6. The molding and sealing device for a positionable semiconductor silicon carbide wafer according to claim 1, characterized in that: The packaging stage (7) has a T-shaped cross-section.

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