Adhesive removing device of ACF (anisotropic conductive film) material belt and ACF attaching machine

Abstract

The utility model discloses a degumming device of an ACF (anisotropic conductive film) material belt and an ACF attaching machine, and relates to the technical field of display. The adhesive removing device for the ACF material belt comprises a turnover mechanism, and the turnover mechanism is rotationally connected to a bearing platform; the adhesive removing plate is arranged on the turnover mechanism and can rotate along with the turnover mechanism so as to be switched between an initial position and an adhesive removing position. When the turnover mechanism rotates in the first direction, the adhesive removing plate is switched from the initial position to the adhesive removing position between the bearing platform and the ACF material belt with the adhesive layer to be removed, and when the ACF material belt with the adhesive layer to be removed is pressed on the adhesive removing plate, the conductive adhesive layer of the ACF material belt with the adhesive layer to be removed adheres to the adhesive removing plate. When the turnover mechanism rotates in the direction opposite to the first direction, the sticking and removing plate bonded with the conductive adhesive layer is switched to the initial position. According to the adhesive removing device for the ACF material belt, the redundant conductive adhesive layer on the ACF material belt is automatically removed, and the safety risk is reduced; and the completeness of removing the redundant adhesive layer is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to display technical field especially relates to a kind of ACF material belt's degumming device and ACF attaching machine. BACKGROUND

[0002] ACF (Aanisotropic Conductive Film, anisotropic conductive film) is used in TAB (tape automated bonding, tape automated bonding) process. ACF includes conductive adhesive layer and release film for protecting conductive adhesive layer, and ACF attaching machine is used to attach the conductive adhesive layer of ACF to the substrate, and then press the chip on the substrate to realize the conduction connection of chip and substrate.

[0003] The existing ACF attaching machine includes a bearing platform, a supporting assembly and a crimping tool bit, wherein the bearing platform is used to bear the substrate, the supporting assembly is located above the bearing platform and is used to support and position the ACF material belt, and the crimping tool bit is lowered to press the ACF material belt on the substrate on the bearing platform, so that the conductive adhesive layer is attached to the substrate. The conductive adhesive layer on a section of ACF material belt before the supporting assembly is not initialized after manual installation, and cannot be used for attachment. The conductive adhesive layer on this section of ACF material belt needs to be removed, otherwise it will fall on the substrate during the conveying process, which may cause substrate fragments and affect product quality.

[0004] Currently, when removing the conductive adhesive layer on this section of ACF material belt, the machine needs to be stopped, and the operator needs to manually remove the excess conductive adhesive layer on the ACF material belt in the machine. This operation has the following problems: 1. The product quality is affected due to the operator's negligence; 2. The operator has safety hazards; 3. The equipment downtime affects the equipment utilization rate.

[0005] Therefore, there is an urgent need for an ACF material belt degumming device and ACF attaching machine to solve the above technical problems. UTILITY MODEL CONTENTS

[0006] The utility model aims to provide an ACF material belt degumming device and ACF attaching machine to automatically remove the excess conductive adhesive layer during the conveying process of ACF material belt, ensure product quality, reduce safety hazards, and will not affect the equipment utilization rate.

[0007] To achieve this purpose, the utility model adopts the following technical solutions:

[0008] The ACF material belt degumming device comprises:

[0009] The turnover mechanism is rotatably connected to the bearing platform;

[0010] The adhesive removing plate is arranged on the turnover mechanism and can rotate with the turnover mechanism to switch between an initial position and a glue removing position.

[0011] When the turnover mechanism rotates in a first direction, the adhesive removing plate switches from the initial position to the glue removing position between the carrying platform and the ACF tape with the adhesive layer to be removed, and when the ACF tape with the adhesive layer to be removed is pressed against the adhesive removing plate, the conductive adhesive layer of the ACF tape with the adhesive layer to be removed is adhered to the adhesive removing plate; when the turnover mechanism rotates in the reverse direction of the first direction, the adhesive removing plate with the conductive adhesive layer adhered switches to the initial position.

[0012] As an optional solution of the ACF tape glue removing device, the ACF tape glue removing device further comprises a buffer mechanism connected between the adhesive removing plate and the turnover mechanism.

[0013] As an optional solution of the ACF tape glue removing device, the buffer mechanism comprises two buffer assemblies symmetrically arranged at two ends of the adhesive removing plate.

[0014] Each buffer assembly comprises a guide rod and a buffer spring, one end of the guide rod is connected with the adhesive removing plate, the other end is limitingly connected with the turnover mechanism, the adhesive removing plate drives the guide rod to move relative to the turnover mechanism, and the buffer spring is sleeved on the guide rod.

[0015] As an optional solution of the ACF tape glue removing device, the turnover mechanism comprises an L-shaped support frame and a rotating shaft, the rotating shaft penetrates through the carrying platform, and two ends of the rotating shaft are respectively connected with one L-shaped support frame, the end of the rotating shaft is connected with the right angle connection of the L-shaped support frame, and two ends of the adhesive removing plate are respectively connected with a corresponding support arm of the two L-shaped support frames.

[0016] As an optional solution of the ACF tape glue removing device, the ACF tape glue removing device further comprises a driving member, the driving member is connected with the turnover mechanism, and the driving member can drive the turnover mechanism to rotate the adhesive removing plate.

[0017] As an optional solution of the ACF tape glue removing device, the turnover mechanism further comprises a connecting rod, the other support arm corresponding to the two L-shaped support frames is connected through the connecting rod, and the driving member is connected with the connecting rod.

[0018] As an optional solution of the ACF tape glue removing device, the driving member comprises a pneumatic cylinder, the pneumatic cylinder is arranged on the carrying platform, and a telescopic rod of the pneumatic cylinder is connected with the connecting rod through a connecting seat.

[0019] As an optional solution of the adhesive removing device of the ACF tape, the adhesive removing plate comprises an elastic plate, and the conductive adhesive layer of the ACF tape to be removed can be adhered to the elastic plate.

[0020] As an optional solution of the adhesive removing device of the ACF tape, the adhesive removing plate further comprises a paper adhesive tape, and the paper adhesive tape is adhered to the elastic plate, and the conductive adhesive layer of the ACF tape to be removed can be adhered to the paper adhesive tape.

[0021] An ACF attaching machine comprises a bearing platform, a supporting assembly, a crimping tool head and the adhesive removing device of the ACF tape as described in any of the above solutions, the supporting assembly is arranged above the bearing platform, the crimping tool head is arranged above the supporting assembly in a liftable manner, the supporting assembly is used for supporting and positioning the ACF tape to be removed, and the adhesive removing device of the ACF tape is rotationally connected with the bearing platform.

[0022] The ACF attaching machine has the following beneficial effects:

[0023] The adhesive removing device of the ACF tape provided by the utility model has the following beneficial effects: the adhesive removing plate is arranged on the turnover mechanism, the turnover mechanism drives the adhesive removing plate to switch from the initial position to the adhesive removing position between the ACF tape to be removed and the bearing platform, then the ACF tape to be removed is pressed on the adhesive removing plate, so that the conductive adhesive layer on the ACF tape to be removed is adhered to the adhesive removing plate, when the conductive adhesive layer is peeled from the release film, the turnover mechanism drives the adhesive removing plate with the conductive adhesive layer to switch to the initial position, thereby realizing automatic removal of the excess conductive adhesive layer on the ACF tape, without manual removal by the operator, reducing the number of times of entering the machine table for operation by the operator and reducing the safety risk; meanwhile, the completeness of the removal of the excess adhesive layer is ensured, and the influence on the product quality is reduced.

[0024] The ACF attaching machine provided by the utility model comprises a bearing platform, a supporting assembly, a crimping tool head and the adhesive removing device of the ACF tape, the supporting assembly is used for positioning and supporting the ACF tape to be removed, the turnover mechanism rotates along the first direction, so that the adhesive removing plate is switched from the initial position to the adhesive removing position between the bearing platform and the ACF tape to be removed, then the crimping tool head is lowered, the ACF tape to be removed is pressed on the adhesive removing plate, the conductive adhesive layer on the ACF tape to be removed is adhered to the adhesive removing plate, the conductive adhesive layer is peeled from the release film, then the turnover mechanism rotates along the reverse direction of the first direction, so that the adhesive removing plate with the conductive adhesive layer is switched to the initial position, thereby realizing automatic removal of the excess adhesive layer of the ACF tape, without stopping and manual removal by the operator, reducing the safety risk, meanwhile, the equipment utilization rate is not affected, and the product quality is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a structure schematic view of the attaching machine provided by the embodiment of the utility model;

[0026] Figure 2 is a structure schematic view of the adhesive removing device of the ACF material belt provided by the embodiment of the utility model;

[0027] Figure 3 is Figure 2 the local enlarged view of A in the figure.

[0028] in the figure:

[0029] 100, bearing platform; 101, bearing surface; 102, extension plate;

[0030] 200, support assembly; 201, support wheel;

[0031] 300, crimping tool bit;

[0032] 400, ACF material belt to be removed from the adhesive layer;

[0033] 1, turnover mechanism; 11, L-shaped support frame; 111, first connecting plate; 112, second connecting plate; 12, rotating shaft; 13, connecting rod;

[0034] 2, adhesive removing plate;

[0035] 3, buffer assembly; 31, guide rod; 311, limiting head; 32, buffer spring; 321, first limiting ring; 322, second limiting ring;

[0036] 4, air cylinder; 41, telescopic rod;

[0037] 5, connecting seat; 51, first connecting lug; 52, connecting bolt; 53, second connecting lug. EMBODIMENT

[0038] In order to make the technical problems solved by the utility model, the technical scheme adopted and the technical effects reached more clear, the technical scheme of the utility model will be further explained below by combining with the drawings and through specific embodiments.

[0039] In the description of the utility model, unless another explicit provision and limitation, the terms "connected", "connected", "fixed" should be understood broadly, for example, can be fixedly connected, can be detachably connected, or be integrated; can be mechanically connected, can be electrically connected; can be directly connected, can be indirectly connected through intermediate medium, can be the communication inside two elements or the interaction relationship of two elements. For the person skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0040] In the production process of the display panel, the chip is bonded on the substrate by pre-pressing, and the line between the chip and the substrate needs to be well connected. The ACF is usually used to realize the conductive connection between the chip and the substrate. The ACF has good conductive anisotropy. The ACF includes a substrate layer, conductive particles, a resin adhesive and a release film. The conductive particles are fixed on the substrate layer to form a conductive adhesive layer through the resin adhesive. The release film covers the surface of the conductive adhesive layer and is removed to protect the conductive adhesive layer during use. The conductive principle of the ACF is to connect the electrodes between the chip and the substrate to make them conductive, while avoiding short circuit between the adjacent two electrodes.

[0041] Figure 1 The structure diagram of the attaching machine is provided in the specific embodiment of the utility model, as shown in the figure, Figure 1 The embodiment provides an ACF attaching machine for pasting the conductive adhesive layer of the ACF on the substrate. After the ACF attaching machine pastes the conductive adhesive layer of the ACF on the substrate, the substrate is transferred to the next process, and the chip is pressed on the conductive adhesive layer to realize the conductive connection between the chip and the substrate.

[0042] The ACF attaching machine includes a bearing platform 100, an ACF tape conveying mechanism, a pressure bonding cutter head 300 and a stripping mechanism. The upper surface of the bearing platform 100 is provided as a bearing surface 101 for bearing the substrate. The ACF tape conveying mechanism includes a supply assembly, a support assembly 200 and a recovery assembly. The supply assembly includes a driving wheel, and the recovery assembly includes a driven wheel. The ACF tape roll is arranged on the driving wheel, and one end of the ACF tape is arranged on the driven wheel through the support assembly 200 for conveying the ACF tape. The support assembly 200 is arranged directly above the bearing platform 100 for supporting and positioning the ACF tape. The support assembly 200 includes two support wheels 201 arranged at the two ends of the bearing platform 100 respectively, and the two support wheels 201 are located in the same horizontal plane so that the ACF tape between the two support wheels 201 is opposite to the substrate on the bearing surface 101 of the bearing platform 100. The pressure bonding cutter head 300 is arranged above the support assembly 200 and can be lifted and lowered. When the pressure bonding cutter head 300 is lowered, the ACF tape between the two support wheels 201 is pressed, so that the conductive adhesive layer on the ACF tape is adhered to the substrate. The stripping mechanism is located on one side of the ACF tape between the two support wheels 201 for stripping the conductive adhesive layer on the substrate from the release film, thereby completing the adhesion of the conductive adhesive layer to the substrate.

[0043] The specific structure and working principle of the ACF tape conveying mechanism, the pressure bonding cutter head 300 and the stripping mechanism can be designed according to the prior art, which is not the focus of the invention of the embodiment, and will not be described here.

[0044] The conductive adhesive layer on the ACF tape between the support assembly 200 and the driven wheel is a redundant adhesive layer when the ACF tape is just pasted after manual installation without initialization processing, and the conductive adhesive layer on the ACF tape needs to be removed, otherwise, the conductive adhesive layer on the ACF tape will fall on the substrate during the conveying process, which can easily cause the substrate to be broken and affect the product quality. In order to automatically remove the redundant conductive adhesive layer of the ACF tape, the ACF attaching machine provided in the embodiment further comprises an adhesive removing device of the ACF tape, and the adhesive removing device of the ACF tape is rotationally connected with the bearing platform 100, can rotate to the upper side of the bearing platform 100 when the ACF tape 400 with the adhesive layer to be removed is conveyed to between the two support wheels 201, and the redundant conductive adhesive layer can be automatically removed by pressing the ACF tape 400 with the adhesive layer to be removed through the pressure contact cutter head 300, and after the redundant conductive adhesive layer is automatically removed, the adhesive removing device of the ACF tape can rotate to one side of the bearing platform 100, without affecting the adhesion of the ACF and the substrate.

[0045] The adhesive removing device of the ACF tape can realize that the ACF attaching machine does not need to be stopped when the redundant conductive adhesive layer is removed, and the operator does not need to enter the machine, and can ensure the completeness of the removal of the redundant conductive adhesive layer, reduce the influence on the equipment utilization rate and the safety risk of the operator, and improve the product quality.

[0046] Figure 2 is a structural schematic view of the adhesive removing device of the ACF tape provided in the embodiment, as shown in Figure 1 and Figure 2 The adhesive removing device of the ACF tape provided in the embodiment is applied to the ACF attaching machine, and comprises a turnover mechanism 1 and a removing plate 2. The turnover mechanism 1 is rotationally connected with the bearing platform 100. The removing plate 2 is arranged on the turnover mechanism 1 and can rotate with the turnover mechanism 1 to switch between an initial position and an adhesive removing position. When the turnover mechanism 1 rotates in a first direction, the removing plate 2 switches from the initial position to the adhesive removing position between the bearing platform 100 and the ACF tape 400 with the adhesive layer to be removed. When the ACF tape 400 with the adhesive layer to be removed is pressed on the removing plate 2, the conductive adhesive layer of the ACF tape 400 with the adhesive layer to be removed is adhered to the removing plate 2. When the turnover mechanism 1 rotates in the opposite direction of the first direction, the removing plate 2 with the conductive adhesive layer is switched to the initial position.

[0047] Specifically, the removing plate 2 is arranged on one end of the turnover mechanism 1 close to the bearing surface 101 of the bearing platform 100, and the initial position of the removing plate 2 is located on one side of the bearing surface 101 and on the side opposite to the peeling mechanism. The first direction is a clockwise direction (as Figure 1The flipping mechanism 1 drives the adhesive removal plate 2 to rotate in the clockwise direction, and the adhesive removal plate 2 can be moved to the bearing surface 101. At this time, the ACF attaching machine controls the pressing cutter head 300 to descend, presses the ACF tape 400 to be removed from the adhesive layer on the adhesive removal plate 2, so that the conductive adhesive layer on the ACF tape 400 to be removed from the adhesive layer is adhered to the adhesive removal plate 2, and then the ACF attaching machine controls the stripping mechanism to strip the conductive adhesive layer adhered to the adhesive removal plate 2 from the release film. When the conductive adhesive layer adhered to the adhesive removal plate 2 is stripped from the release film, the flipping mechanism 1 drives the adhesive removal plate 2 to rotate in the counterclockwise direction, and the adhesive removal plate 2 returns to the initial position again. The automatic removal of the excess adhesive layer of the ACF tape is realized, and manual removal by the operator is not required, thereby reducing the influence on the equipment operation rate and the safety risk and improving the attachment quality of the product.

[0048] In other embodiments, the first direction can also be the counterclockwise direction, which is determined according to the specific position of the adhesive removal plate 2 relative to the bearing surface 101.

[0049] The ACF tape adhesive removal device provided in the embodiment can automatically remove the excess adhesive layer on the ACF tape. During production, the conductive adhesive layer on the adhesive removal plate 2 only needs to be treated periodically. The ACF tape adhesive removal device can automatically remove the excess adhesive layer on the ACF tape multiple times a day, and the adhesive removal plate 2 only needs to be cleaned once a day.

[0050] The adhesive removal plate 2 includes an elastic plate, and the conductive adhesive layer of the ACF tape 400 to be removed from the adhesive layer can be adhered to the elastic plate. The adhesive removal plate 2 is provided as a flat plate made of a material with elasticity, such as a rubber plate. First, the rubber material has a suitable elastic modulus. Under the vertical pressure applied by the pressing cutter head 300, the rubber plate can provide sufficient rigid support to ensure accurate positioning of the pressing cutter head 300, and can effectively buffer the impact stress through elastic deformation, thereby avoiding the phenomenon of uneven peeling of the adhesive layer caused by stress concentration of the traditional rigid plate. Second, the flat plate has a surface flatness error of ≤0.02 mm, and the viscoelastic properties of the rubber can form uniform intermolecular forces between the conductive adhesive layer of the ACF tape during the adhesion process. Experimental verification shows that the peeling qualification rate can be increased to more than 98.5%.

[0051] Further, the adhesive removal plate 2 further includes a paper tape, and the paper tape is attached to the elastic plate, and the conductive adhesive layer of the ACF tape 400 to be removed from the adhesive layer can be adhered to the paper tape. By adding the paper tape to the elastic plate, when the adhesive removal plate 2 is cleaned, the paper tape with the conductive adhesive layer is only needed to be torn off, and a new paper tape is only needed to be attached, so that the cleaning of the adhesive removal plate 2 is more convenient and faster.

[0052] The turnover mechanism 1 comprises an L-shaped support frame 11 and a rotating shaft 12, the rotating shaft 12 penetrates the bearing platform 100, and the two ends of the rotating shaft 12 are respectively connected with one L-shaped support frame 11, the end of the rotating shaft 12 is connected with the right-angle connection of the L-shaped support frame 11, and the two ends of the adhesive removal plate 2 are respectively connected with the corresponding support arm of the two L-shaped support frames 11. The L-shaped support frames 11 are symmetrically distributed at the two ends of the rotating shaft 12, forming a stable double-point support structure, which can effectively disperse the torque and load in the turnover process. The design of the rotating shaft 12 at the right-angle connection enhances the anti-torsion ability, avoids deformation or deviation caused by single-side stress, and can ensure that the adhesive removal plate 2 is accurately moved to the bearing surface 101 under the driving of the turnover mechanism 1 and located directly below the ACF tape 400 to be removed, thereby ensuring that the conductive adhesive layer of the ACF tape 400 to be removed is bonded to the adhesive removal plate 2 and will not be bonded to the bearing surface 101.

[0053] Specifically, the rotating shaft 12 is located at the middle and lower part of the bearing platform 100, has a certain interval with the bearing surface 101 in height, and can ensure that the adhesive removal plate 2 can be located on the bearing surface 101 and directly below the ACF tape 400 to be removed after the turnover mechanism 1 rotates clockwise by a set angle.

[0054] The adhesive removal device of the ACF tape further comprises a driving member, the driving member is arranged at one end of the bearing platform 100 away from the bearing surface 101, the driving member is connected with the turnover mechanism 1, and the lifting of the driving member can drive the turnover mechanism 1 to rotate the adhesive removal plate 2. The driving member is arranged at one end away from the bearing surface 101 to drive the turnover mechanism 1, the linear motion of the driving member is converted into the rotating action of the rotating shaft 12, a short-path power transmission is formed, and a three-dimensional transmission structure is formed by the vertically arranged driving member and the horizontally arranged rotating shaft 12, so that the longitudinal space occupation of the equipment is reduced by more than 30%.

[0055] Specifically, the turnover mechanism 1 further comprises a connecting rod 13, the corresponding other support arms of the two L-shaped support frames 11 are connected through the connecting rod 13, and the driving member is connected with the connecting rod 13. The driving member drives the two L-shaped support frames 11 to rotate through the connecting rod 13, ensures the uniformity of the stress at the two ends of the adhesive removal plate 2, and further ensures the accuracy of the rotation of the adhesive removal plate 2 to the adhesive removal position on the bearing surface 101 under the driving of the turnover mechanism 1.

[0056] Specifically, the driving component includes a cylinder 4, which is fixed to an extension plate 102 on one side of the support platform 100. The telescopic rod 41 of the cylinder 4 is connected to the connecting rod 13 via a connecting seat 5, eliminating intermediate transmission components such as gears and shortening the power transmission path by more than 30%, thus enabling rapid response. By connecting the telescopic rod 41 of the cylinder 4 to the middle of the connecting rod 13, the extension of the telescopic rod 41 of the cylinder 4 drives the connecting rod 13 to rise, ensuring stability during the rotation of the cylinder 4 driving the flipping mechanism 1. The cylinder 4 can achieve precise pressing displacement of the adhesive removal plate 2 through air pressure adjustment. Combined with the symmetrical L-shaped support frames 11 at both ends, it ensures that the flipping angle error is less than 0.5°, preventing the adhesive removal plate 2 from tilting.

[0057] Of course, in other embodiments, the driving component may also include a motor and a ball screw. The motor drives the ball screw to rotate. The ball screw is connected to the flipping mechanism 1 through a nut seat. The rotation of the ball screw causes the nut seat to move up and down, thereby driving the flipping mechanism 1 to rotate.

[0058] In this embodiment, a cylinder 4 is provided, which is connected to the connecting rod 13 via a connecting seat 5, to ensure the stability and balance of the driving force. In other embodiments, synchronous driving with two cylinders or multi-stage cylinder linkage can also be used, and the needs of different sized load-bearing platforms 100 can be adapted by increasing or decreasing the number of cylinders.

[0059] Furthermore, two first connecting lugs 51 are spaced apart at one end of the connecting seat 5, and the telescopic rod 41 is connected between the two first connecting lugs 51 by connecting bolts 52; two second connecting lugs 53 are spaced apart at the other end of the connecting seat 5, and through holes are provided on the second connecting lugs 53, and the connecting rod 13 passes through the two through holes in sequence and is connected to the two L-shaped support frames 11.

[0060] Figure 3 yes Figure 2 A magnified view of a portion of point A, as shown below. Figure 2 and Figure 3 As shown, the ACF strip adhesive removal device also includes a buffer mechanism connected between the adhesive removal plate 2 and the flipping mechanism 1. The buffer mechanism provides cushioning force to the adhesive removal plate 2 when the ACF strip 400 with the adhesive layer to be removed is pressed onto it. The buffer mechanism absorbs the instantaneous impact force generated when the crimping head 300 presses down through elastic deformation, preventing hard contact that could scratch the ACF strip or wear the adhesive removal plate 2. Simultaneously, the dynamic adjustment characteristic of the buffering force allows the adhesive removal plate 2 to maintain uniform adhesion pressure to the ACF strip surface, improving the completeness of conductive adhesive layer removal. This design also reduces the load fluctuation of the drive components of the flipping mechanism 1, extends the service life of power components such as the cylinder 4, and can adapt to ACF materials of different thicknesses or viscosities by adjusting the buffer stroke, thus achieving a comprehensive balance between high-precision peeling and equipment protection.

[0061] Specifically, the buffer mechanism comprises two buffer assemblies 3 symmetrically arranged at two ends of the removing plate 2; each buffer assembly 3 comprises a guide rod 31 and a buffer spring 32, one end of the guide rod 31 is connected with the removing plate 2, the other end is limitingly connected to the turnover mechanism 1, the removing plate 2 can drive the guide rod 31 to move relative to the turnover mechanism 1, and the buffer spring 32 is sleeved on the guide rod 31. The removing plate 2 can drive the guide rod 31 to move along the axial direction of the guide rod 31 and compress the buffer spring 32, and the elastic restoring force of the buffer spring 32 drives the removing plate 2 to reset. The buffer mechanism realizes the buffering effect through the buffer assemblies 3 symmetrically arranged at two ends, and the nested design of the guide rod 31 and the buffer spring 32 can absorb more than 90% of the instantaneous impact energy when the crimping tool bit 300 presses the ACF tape, thereby avoiding damage to the components caused by hard contact; the guide rod 31 also plays a guiding role, preventing the buffer spring 32 from deviating laterally and ensuring that the buffering direction is perpendicular and stable; the symmetrical layout of the two ends makes the removing plate 2 bear force evenly, and in combination with the elastic restoring characteristics of the buffer spring 32, the removing plate 2 can automatically maintain a constant contact pressure of 0.05N-0.2N when bonding the conductive adhesive layer; the structure can also adapt to the buffering stroke requirements of ACF tapes of different thicknesses by adjusting the pre-tightening force of the buffer spring 32, and the modular design facilitates quick replacement of damaged components, thereby comprehensively realizing the unity of precise buffering and convenient equipment maintenance.

[0062] Specifically, the first connecting plate 111 and the second connecting plate 112 are arranged on the side wall of the turnover mechanism 1 at intervals, the two ends of the buffer spring 32 are respectively provided with a first limiting ring 321 and a second limiting ring 322, the buffer spring 32 is arranged between the first connecting plate 111 and the second connecting plate 112, one end of the guide rod 31 is provided with a limiting head 311, the removing plate 2 is fixed to one end of the guide rod 31 through the limiting head 311, the other end of the guide rod 31 sequentially passes through the first connecting plate 111, the first limiting ring 321, the buffer spring 32, the second limiting ring 322 and the second connecting plate 112, and the first limiting ring 321 is clamped and fixed to the guide rod 31, and the second limiting ring 322 is slidably arranged on the guide rod 31. When the removing plate 2 is subjected to a pressing force, the removing plate 2 drives the guide rod 31 to move downward, after the second limiting ring 322 abuts against the second connecting plate 112, the guide rod 31 continues to move downward, the buffer spring 32 is compressed, and when the pressing force on the removing plate 2 is removed, the guide rod 31 is driven to reset the removing plate 2 under the action of the elastic restoring force of the buffer spring 32.

[0063] Of course, in other embodiments, the limiting head 311 can also be arranged at both ends of the guide rod 31, the buffer spring 32 is arranged between the removing plate 2 and the first connecting plate 111, and the first limiting ring 321 and the second limiting ring 322 are not required.

[0064] Specifically, the first connecting plate 111 and the second connecting plate 112 are arranged at one side of the support arm of the L-shaped support frame 11 away from the bearing platform 100, so that the buffer assembly 3 does not interfere with the bearing platform 100, facilitating disassembly and maintenance.

[0065] The above is only the preferred embodiment of the present application, and for those skilled in the art, according to the idea of the present application, the specific implementation and application range will be changed, and the content of the specification should not be understood as limiting the present application.

Claims

1. An ACF tape degumming device, characterized by comprising: include: A flipping mechanism (1) is rotatably connected to a support platform (100); Adhesive removal plate (2), the adhesive removal plate (2) is disposed on the flipping mechanism (1) and can rotate with the flipping mechanism (1) to switch between the initial position and the adhesive removal position; When the flipping mechanism (1) rotates along the first direction, the adhesive removal plate (2) switches from its initial position to the adhesive removal position between the bearing platform (100) and the ACF strip (400) to which the adhesive layer is to be removed. When the ACF strip (400) to which the adhesive layer is to be removed is pressed against the adhesive removal plate (2), the conductive adhesive layer of the ACF strip (400) to which the adhesive layer is to be removed is bonded to the adhesive removal plate (2). When the flipping mechanism (1) rotates in the opposite direction along the first direction, the adhesive removal plate (2) with the conductive adhesive layer bonded to it switches back to its initial position.

2. The adhesive removal apparatus of the ACF tape according to claim 1, wherein The adhesive removal device for the ACF strip also includes a buffer mechanism, which is connected between the adhesive removal plate (2) and the flipping mechanism (1).

3. The adhesive removal apparatus of the ACF tape according to claim 2, wherein The buffer mechanism includes two buffer components (3), which are symmetrically arranged at both ends of the adhesive removal plate (2); Each of the buffer components (3) includes a guide rod (31) and a buffer spring (32). One end of the guide rod (31) is connected to the adhesive removal plate (2), and the other end is limited and connected to the flipping mechanism (1). The adhesive removal plate (2) can drive the guide rod (31) to move relative to the flipping mechanism (1). The buffer spring (32) is sleeved on the guide rod (31).

4. The adhesive removal apparatus of the ACF tape according to claim 1, wherein The flipping mechanism (1) includes an L-shaped support frame (11) and a rotating shaft (12). The rotating shaft (12) passes through the bearing platform (100), and each end of the rotating shaft (12) is connected to one of the L-shaped support frames (11). The end of the rotating shaft (12) is connected to the right angle connection of the L-shaped support frame (11). The two ends of the adhesive removal plate (2) are respectively connected to one of the support arms corresponding to the two L-shaped support frames (11).

5. The adhesive removal apparatus of the ACF tape according to claim 4, wherein The adhesive removal device for the ACF strip also includes a driving component, which is connected to the flipping mechanism (1). The driving component can drive the flipping mechanism (1) to rotate the adhesive removal plate (2).

6. The adhesive removal apparatus of the ACF tape according to claim 5, wherein The flipping mechanism (1) also includes a connecting rod (13), and the other supporting arm of the two L-shaped support frames (11) is connected through the connecting rod (13). The driving member is connected to the connecting rod (13).

7. The adhesive removal apparatus of the ACF tape according to claim 6, wherein The driving component includes a cylinder (4), which is mounted on the support platform (100). The telescopic rod (41) of the cylinder (4) is connected to the connecting rod (13) via a connecting seat (5).

8. The adhesive removal apparatus of the ACF tape according to any one of claims 1 to 7, characterized by The adhesive removal plate (2) includes an elastic plate, and the conductive adhesive layer of the ACF tape (400) to be removed can adhere to the elastic plate.

9. The adhesive removal apparatus of the ACF tape according to claim 8, wherein The adhesive removal plate (2) also includes paper tape, which is adhered to the elastic plate, and the conductive adhesive layer of the ACF tape (400) to be removed can be adhered to the paper tape.

10. An ACF attaching machine, characterized by comprising: The adhesive removing device comprises a bearing platform (100), a supporting assembly (200), a crimping cutter head (300) and an ACF tape as claimed in any one of claims 1-9, the supporting assembly (200) is arranged above the bearing platform (100), the crimping cutter head (300) is arranged above the supporting assembly (200) and can be lifted, the supporting assembly (200) is used for supporting and positioning the ACF tape (400) from which the adhesive layer is to be removed, and the adhesive removing device is rotationally connected with the bearing platform (100).

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