Bonding type UV viscosity-reducing adhesive tape, preparation method thereof and application of bonding type UV viscosity-reducing adhesive tape in wafer cutting

Abstract

The invention discloses a bonding type UV viscosity-reducing adhesive tape as well as a preparation method and application thereof in wafer cutting, and the preparation method specifically comprises the following steps: (1) adding a thermal initiator into a photoinitiator monomer and an acrylate monomer, and carrying out free radical copolymerization reaction to obtain a matrix adhesive solution; (2) adding a photoactive monomer and an active tin reagent into the matrix glue solution, and carrying out grafting reaction to obtain a UV peelable glue solution; (3) coating the UV peelable glue solution on the surface of a base material layer to form a UV peelable glue layer; and (4) covering a release film on the surface of the UV peelable adhesive layer to obtain the bonding type UV viscosity-reducing adhesive tape. The bonding type UV viscosity-reducing adhesive tape prepared by the invention has the following characteristics: the initial peel strength is high, and a protected material can be firmly fixed; after UV irradiation, the peeling strength is obviously reduced, and the material is easy to peel off from the surface of the material; and the whole process is simple, and has the remarkable advantages of no pollution, no adhesive residue and the like.

Description

Technical Field

[0001] This invention relates to the field of adhesive materials technology, specifically to a bonding-type UV anti-adhesion tape, its preparation method, and its application in wafer dicing. Background Technology

[0002] During precision machining processes such as dicing and grinding, wafers require temporary fixation and protection using UV-removable tape (anti-adhesive tape). This type of tape must meet two core requirements: sufficient initial adhesive strength before UV irradiation to ensure stable wafer fixation during processing; and a significant reduction in adhesive strength after UV irradiation for easy peeling without leaving residual adhesive contaminating the wafer surface.

[0003] Currently, research in this field mainly focuses on "hybrid" technical routes, specifically including: (1) physical blending of acrylic copolymers, multifunctional monomers / oligomers, and photoinitiators; and (2) physical compounding of polymers containing photoinitiators with multifunctional oligomers / acrylate monomers. Representative examples are as follows: (1) In 2012, Ryu’s team (S.-W. Lee, J.-W. Park, H.-J. Kim, K.-M. Kim, H.-I. Kim, J.-M. Ryu, Adhesion Performance and Microscope Morphology of UV-Curable Semi-interpenetrated Dicing Acrylic PSAs in Si-Wafer Manufacture Process for MCP, J. Adhes. Sci. Technol. 26 (2012) 317-329) developed a semi-interpenetrating network (semi-IPN) system, which uses a simple process of physical blending of acrylic copolymer, photoinitiator and hexafunctional monomer; before UV irradiation, the components are in a physical mixed state and no chemical reaction occurs; after UV excitation, the multifunctional monomer cross-links to form a three-dimensional network, which interpenetrates with the linear structure of the acrylic copolymer, and finally forms a UV peelable tape with a semi-IPN structure; (2) In 2012, Sokolov et al. (S.-W. Lee, J.-W. Park, Y.-H. Lee, H.-J. Kim, M.Rafailovich, J. Sokolov, Adhesion Performance and UV-Curing Behaviors of Interpenetrated Structured pressure Sensitive Adhesives with 3-MPTS for Si-Wafer Dicing Process, J. Adhes. Sci. Technol. 26 (10-11) (2012) 1629-1643) improved the network structure through chemical crosslinking. They pre-constructed a polymer network by using the ring-opening reaction of the carboxyl group of the acrylate copolymer with aziridine, and then introduced a photoinitiator and a hexafunctional monomer to form an interpenetrating network (IPN) system. During UV curing, the multifunctional monomers self-crosslinked to form a secondary network, which entangled with the pre-crosslinked network, thereby preparing a UV peelable tape with an IPN structure. (3) In 2022, Liu's research group (BY Sun, HM Wang, YC Fan, XM Chu, SJLiu, S. Zhao, MZ Zhao, Fully cross-linked UV-induced peelable acrylic PSA prepared from a dual curable castor oil based urethane acrylate oligomer forwafer dicing, Prog. Org. Coat. 163 (2022) 106680) innovatively proposed a dual curing system (CO-PUB), which synergistically applies UV-induced polymerization and isocyanate / hydroxyl (NCO / OH) reaction. In the stage before UV treatment, the hydroxyl groups of the acrylic copolymer undergo a condensation reaction with the isocyanate groups in CO-PUB to construct a primary network; after UV irradiation, the double bond components in the system copolymerize with multifunctional monomers to form a fully cross-linked network structure of UV peelable tape. (4) In 2023, Liu and his team (YC Fan, HG Shen, CZ Zhang, XM Chu, SJLiu, XT Xing, EJ Tang, Fabrication of UV-induced peelable adhesives using acrylic copolymers containing photo-initiators and soybean oil based urethaneacrylate oligomers, Int. J. Adhes. Adhes. 126 (2023) 103476) mixed linear acrylic copolymers containing photoinitiators, SOP-PUB-PETA and multifunctional monomer PETA in a specific ratio. Before UV irradiation, the NCO groups in SOP-PUB-PETA react with the hydroxyl groups in the acrylic copolymer to obtain a pressure-sensitive adhesive (PSA) with suitable crosslinking degree. After UV irradiation, the double bonds in the multifunctional monomer PETA and SOP-PUB-PETA crosslink to form a UV peelable tape with a double network structure. By summarizing the existing "hybrid" methods, it can be found that these methods mostly rely on curing agents / prepolymers and linear acrylic copolymers to construct the primary network, and require the compounding of photoinitiators and the addition of multifunctional monomers / oligomers before photocuring. Therefore, the following problems exist: the preparation process is cumbersome and the reaction time is long; residual colloids are easily generated on the silicon wafer surface, contaminating the wafer; there are phenomena such as insufficient cohesion, poor stability and compatibility, and edge overflow.

[0004] Therefore, providing a non-hybrid UV peelable tape with better performance and a simpler process, as well as its preparation method, is a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0005] To address the aforementioned problems, this invention provides a bonding-type UV anti-adhesion tape, its preparation method, and its application in wafer dicing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A method for preparing a bonding-type UV anti-adhesive tape specifically includes the following steps: (1) Add a thermal initiator to the photoinitiator monomer and the acrylate monomer to carry out a free radical copolymerization reaction to obtain the matrix adhesive; (2) Add photoactive monomers and active tin reagents to the matrix adhesive and carry out a grafting reaction to obtain a UV-exfoliable adhesive; (3) The UV peelable adhesive is applied to the surface of the substrate layer to form a UV peelable adhesive layer; (4) Cover the surface of the UV peelable adhesive layer with a release film to obtain a bonding type UV anti-adhesion tape.

[0007] Preferably, the photoinitiator monomer in step (1) is at least one of benzophenone photoinitiators; the acrylate monomer is a mixture of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and butyl acrylate; and the thermal initiator is at least one of azo initiators and peroxide initiators. The mass percentages of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, butyl acrylate, and photoinitiator monomer are 45-65%:15%:15-39%:1-5%; The thermal initiator is 0.1% of the mass of the acrylate monomer.

[0008] By systematically controlling the mass ratio of soft and hard monomers in the raw materials, not only was the peeling efficiency of the base adhesive improved, but also the optimal 180° peel strength before UV irradiation was determined.

[0009] Preferably, the conditions for the free radical copolymerization reaction in step (1) are: reacting at 80°C for 2-6 hours, preferably 4 hours. By optimizing the reaction time, the shortest time to achieve complete copolymerization was determined, which significantly improved the preparation efficiency.

[0010] Preferably, the free radical copolymerization reaction in step (1) further includes a solvent, which is ethyl acetate, and the amount used is 150% of the total mass of the acrylate monomer and the photoinitiator monomer.

[0011] Preferably, the benzophenone photoinitiator includes acryloyloxybenzophenone, methacryloyloxybenzophenone, and 4-acryloyloxy-2-hydroxybenzophenone; The thermal initiator is at least one of azobisisobutyronitrile (AIBN) and benzoyl peroxide.

[0012] The photoinitiator monomer selected in this invention can be directly used as a reaction component to participate in copolymerization, and at the same time, it also has the function of photosensitizer, without the need for subsequent compounding; even under the condition of not grafting photoactive monomer, the photoinitiator can also undergo hydrogen abstraction reaction after UV irradiation, effectively increasing the crosslinking density of the system, thereby forming a network structure with peelable properties.

[0013] Preferably, the photoactive monomer in step (2) is one or two of 2-isocyanoethyl acrylate, isocyanoethyl methacrylate, and 3-isopropene-α,α-dimethylbenzyl isocyanate; the active tin reagent is dibutyltin dilaurate; The present invention selects three photoactive monomers with different double bond activities and steric hindrances. When the steric hindrance and double bond activity of the monomer are both small, the exfoliation efficiency of the grafted product is higher. The amount of the photoactive monomer used is 0.74-7.4% of the mass of the matrix adhesive; The amount of the active tin reagent used is 0.074-0.74% of the mass of the matrix adhesive.

[0014] Preferably, the substrate layer in step (3) is a polyethylene terephthalate film with a thickness of 25 μm; The wet film thickness of the coating is 25 μm; The coating process also includes baking, with specific baking parameters as follows: first baking at 80°C for 25 minutes, then maturing at 35°C for 12 hours; or baking at 80°C for 25-40 minutes.

[0015] Preferably, the release film in step (4) is a PET release film with a thickness of 50 μm.

[0016] The bonding-type UV anti-adhesion tape is prepared by the method described above.

[0017] The bonding-type UV anti-adhesion tape prepared by the above-described method, or the application of the above-described bonding-type UV anti-adhesion tape in wafer dicing.

[0018] Compared with the prior art, the present invention has the following beneficial effects: (1) The present invention adopts a fully chemical bonding strategy: high-performance photoactive monomers are directly grafted onto the side chains of the base adhesive backbone; this method not only eliminates the complicated steps of pre-constructing the primary network (a double network structure is directly formed after UV irradiation, which is highly efficient), but also achieves a controllable improvement in the peeling efficiency after irradiation; at the same time, since no small molecule additives (such as multifunctional monomers / oligomers) are introduced throughout the process, the generation of residual adhesive is fundamentally eliminated. Thus, a simple and residue-free bonded UV peelable tape is prepared. (2) By optimizing the synthesis parameters of the base adhesive, such as reaction time, ratio of soft and hard monomers and amount of photoinitiator, the present invention significantly improves its initial performance (shortening reaction time and increasing peel strength before UV irradiation). (3) The bonding type UV anti-adhesion tape prepared by the present invention has the following characteristics: high initial peel strength (up to 22.65N / 25mm), which can firmly fix the protected material; after UV irradiation, the peel strength is significantly reduced (down to 0.13N / 25mm), making it easy to peel off from the material surface; and the overall process is simple, with significant advantages such as no pollution and no residue. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings in this description are merely embodiments of the present invention.

[0020] Figure 1 This is a schematic diagram of the structure of the bonding-type UV anti-adhesion tape of the present invention; Figure 2 SEM image of residual adhesive on the bonding-type UV anti-adhesion tape of this invention after silicon wafer dicing. Detailed Implementation

[0021] Embodiments of the present invention are described below, examples of which are shown in the accompanying drawings. The embodiments described with reference to the drawings are exemplary and intended to explain the present invention, but are not to be construed as limiting the present invention.

[0022] Example 1 This invention provides a method for preparing a bonding-type UV anti-adhesive tape, specifically including the following steps: (1) Under a nitrogen atmosphere, 2-ethylhexyl acrylate (50g, 271.33mmol), 2-hydroxyethyl acrylate (15g, 129.2mmol), butyl acrylate (32g, 249.67mmol), acryloyloxybenzophenone (3g, 11.89mmol) and ethyl acetate (150g, solvent) were added sequentially to a 500mL four-necked round-bottom flask equipped with a reflux condenser, a mechanical stirrer and a thermometer. After heating to 80℃, azobisisobutyronitrile (0.1g, accounting for 0.1wt% of the total mass of acrylate monomer and photoinitiator monomer) dissolved in 1.5mL ethyl acetate was slowly added dropwise to the flask. The reaction was stirred for 4 hours and then cooled to room temperature to terminate the reaction, and the matrix gel was obtained. (2) Take the base adhesive solution (50g, solid content 40%) and place it in a 250mL round bottom flask equipped with a mechanical stirrer. Stir at 50℃ for 15 minutes under a nitrogen atmosphere. Then, dissolve 2-isocyanoethyl acrylate (2.92g, accounting for 80% of the molar amount of hydroxyl) and dibutyltin dilaurate (0.292g) in 1.5mL of ethyl acetate and slowly add it dropwise to the flask. Continue stirring for 1.5 hours. Terminate the reaction after the reaction mixture cools to room temperature and adjust the final solid content to 40% to obtain the UV peelable adhesive solution. (3) Using a ZY-TB-UV type vacuum adsorption bar-scraper integrated coating tester (bar specification 25μm), UV peelable adhesive liquid is coated onto a PET film with a thickness of 25μm. The wet film thickness is 25μm. Then, it is placed in an 80℃ oven for 30 minutes to form a UV peelable adhesive layer 2 on the upper surface of the substrate layer 1 PET film. (4) Cover the UV-removable adhesive layer 2 with a PET release film of 50 μm thickness, and then cure at 25°C for at least 2 hours to form a release film layer 3 on the surface of the UV-removable adhesive layer 2, thus obtaining the desired product. Figure 1 The bonding type UV anti-adhesion tape shown.

[0023] Comparative Example 1 This invention provides a method for preparing a bonding-type UV anti-adhesive tape, specifically including the following steps: (1) Same as step (1) in Example 1; (2) Using a ZY-TB-UV type vacuum adsorption bar-scraper integrated coating tester (bar specification 25μm), UV peelable adhesive liquid is coated onto a PET film with a thickness of 25μm. The wet film thickness is 25μm. Then, it is placed in an 80℃ oven for 30 minutes to form a UV peelable adhesive layer 2 on the upper surface of the substrate layer 1 PET film. (3) Cover the UV-removable adhesive layer 2 with a PET release film of 50 μm thickness, and then cure at 25°C for at least 2 hours to form a release film layer 3 on the surface of the UV-removable adhesive layer 2, thus obtaining the desired product. Figure 1 The bonding type UV anti-adhesion tape shown.

[0024] Comparative Example 2 This invention provides a method for preparing a bonding-type UV anti-adhesive tape, specifically including the following steps: (1) Under a nitrogen atmosphere, 2-ethylhexyl acrylate (50g, 271.33mmol), 2-hydroxyethyl acrylate (15g, 129.2mmol), butyl acrylate (35g, 273.07mmol) and ethyl acetate (150g, solvent) were added sequentially to a 500mL four-necked round-bottom flask equipped with a reflux condenser, a mechanical stirrer and a thermometer. After heating to 80℃, azobisisobutyronitrile (0.1g, accounting for 0.1wt% of the total mass of acrylate monomer and photoinitiator monomer) dissolved in 1.5ml of ethyl acetate was slowly added dropwise to the flask. The reaction was stirred for 4 hours and then cooled to room temperature to terminate the reaction, and the matrix gel was obtained. (2) Take 50g of the base adhesive solution (40% solid content) and place it in a 250mL round-bottom flask equipped with a mechanical stirrer. Stir at 50℃ for 15 minutes under a nitrogen atmosphere. Then, dissolve 2-isocyanoethyl acrylate (2.92g, accounting for 80% of the molar amount of hydroxyl) and dibutyltin dilaurate (0.292g) in 1.5mL of ethyl acetate and slowly add it dropwise to the flask. Continue stirring for 1.5 hours. Terminate the reaction after the reaction mixture cools to room temperature and adjust the final solid content to 40% to obtain the photoactive pressure-sensitive adhesive solution. (3) Add 0.1g of acryloyloxybenzophenone to 25g of photoactive pressure-sensitive adhesive and mix well to obtain UV-removable adhesive; (4) Using a ZY-TB-UV type vacuum adsorption bar-scraper integrated coating tester (bar specification 25μm), UV peelable adhesive liquid is coated onto a PET film with a thickness of 25μm. The wet film thickness is 25μm. Then, it is placed in an 80℃ oven for 30 minutes to form a UV peelable adhesive layer 2 on the upper surface of the substrate layer 1 PET film. (5) Cover the UV-removable adhesive layer 2 with a PET release film of 50 μm thickness, and then cure at 25°C for at least 2 hours to form a release film layer 3 on the surface of the UV-removable adhesive layer 2, thus obtaining the desired product. Figure 1 The bonding type UV anti-adhesion tape shown.

[0025] Examples 2-4 The difference from Example 1 is that: in step (1), the monomer mass ratio is 45:15:39:1; the reaction time of the matrix adhesive is 2 hours, 4 hours and 6 hours respectively; in step (2), the amounts of 2-isocyanoethyl acrylate and dibutyltin dilaurate are 1.46g and 0.146g respectively; in step (3), the oven program is: first bake at 80℃ for 25 minutes, and then cure at 35℃ for 12 hours.

[0026] Examples 5-8 The difference from Example 1 is as follows: in step (1), the ratio of soft and hard monomers is adjusted to 50:15:34:1, 55:15:29:1, 60:15:24:1, and 65:15:19:1 by mass percentage; in step (2), the amounts of ethyl 2-isocyanate and dibutyltin dilaurate are 1.46g and 0.146g, respectively; in step (3), the oven program is: first bake at 80°C for 25 minutes, and then cure at 35°C for 12 hours.

[0027] Examples 9-12 The difference from Example 1 is as follows: in step (1), the amount of photoinitiator is adjusted, and the mass ratio is 50:15:33:2, 50:15:32:3, 50:15:31:4, and 50:15:30:5 respectively; in step (2), the amounts of 2-isocyanoethyl acrylate and dibutyltin dilaurate are 1.46g and 0.146g respectively; in step (3), the oven program is: first bake at 80℃ for 25 minutes, and then cure at 35℃ for 12 hours.

[0028] Examples 13-17 The difference from Example 1 is that: in step (2), the molar ratio of 2-isocyanoethyl acrylate to the hydroxyl group of the matrix adhesive is adjusted to 20%, 60%, 80%, 100%, and 120%, respectively; in step (3), the oven program is: first bake at 80°C for 25 minutes, and then cure at 35°C for 12 hours.

[0029] Examples 18-20 The difference from Example 1 is that the oven program in step (3) is adjusted to bake at 80°C for 25 minutes, 80°C for 35 minutes, and 80°C for 40 minutes.

[0030] Performance testing The UV peelable tapes prepared in Examples 1-20 and Comparative Examples 1-2 were tested for peel strength before UV irradiation, peel strength after UV irradiation, and residual adhesive according to the following methods: UV peel strength test: Cut the tape into 250mm×25mm samples, remove the release film, and bond them to a cleaned 304 stainless steel test plate; use a 2kg pressure roller to roll back and forth on the sample three times at a speed of 300mm / min (ensuring no air bubbles). After sample preparation, let it stand in the test environment for 30 minutes; then, use a tape peel strength tester (Dongguan Huaguo, model: HG 8603) to test at a peel angle of 180° and a tensile speed of 300mm / min, and record the peel strength before UV irradiation. UV peel strength test and residual adhesive test: Cut the tape into 300mm×25mm samples, and paste them onto a 304 stainless steel plate as described above. Use a UV light source at 200mJ / cm². 2 After the tape was irradiated with UV light, the peel strength was tested under the same conditions using the same testing machine. After peeling, the surface of the 304 stainless steel plate was visually inspected for any adhesive residue. The test results are summarized in Table 1. Table 1. UV-releasable tapes of Examples 1-20 and Comparative Examples 1-3 under UV irradiation (200 mJ / cm²). 2 Results of 180° peel strength and residual adhesive test before and after peel strength.

[0031] Results analysis: 1) In Examples 2-4, the initial peel strength of the three was similar. After UV irradiation, the peel strength of Examples 3 and 4 was lower than that of Example 2. However, Example 3 had a shorter reaction time and better overall performance. 2) Comparing Example 3 with Examples 5-8, Example 5 exhibited the highest initial peel strength, and its peel strength after UV irradiation was comparable to that of the other groups, thus demonstrating the best performance; 3) In the comparison between Example 5 and Examples 9-12, Example 10 has the highest initial peel strength; although Examples 11 and 12 have slightly lower peel strength after UV irradiation, the initial strength of the latter two is too low, so Example 10 is better. 4) In Examples 10 and 13-17, the initial strength of each sample was comparable, but Example 15 had the lowest peel strength after UV irradiation, which met the peelability requirement and was therefore selected. 5) Comparing Example 15 with Examples 18-20 and Example 1, Example 1 showed the lowest peel strength after UV irradiation and a shorter baking time, demonstrating better peelability and process efficiency. 6) Compared with Comparative Example 1, which did not have photoactive monomer grafted, Example 1 has obvious advantages due to its lower peel strength after UV irradiation and no residue; compared with Comparative Example 2, which had a photoinitiator that was subsequently compounded (its strength after UV irradiation remained basically unchanged), the peel strength of Example 1 was significantly reduced; this comparison result confirms that the direct bonding of photoactive monomers in this invention is the key mechanism for imparting controllable peelability to the colloid.

[0032] In summary, Example 1 of this invention was determined to be the optimal formulation. This formulation provides a high initial peel strength (22.65 N / 25 mm) for reliable material fixation, while exhibiting a sharp decrease in peel performance after UV irradiation: dropping to 0.2213 N / 25 mm under the conditions of 200 mJ / cm² as described in the table; further testing shows that when the dosage is increased to 900 mJ / cm², its peel strength can be further reduced to an extremely low level of 0.13 N / 25 mm. Furthermore, this formulation also has significant advantages such as simple processing, no pollution, and no residue.

[0033] Figure 2 The image shows the residual adhesive of bonded UV-reducing tape after silicon wafer dicing and UV irradiation at 200 mJ / cm². The image compares three samples: blank, comparative example 1 (A-PSA), and UV-removable adhesive of example 1 (PSA-AOI). The results show that after UV irradiation, the 180° peel strength of A-PSA decreases due to the hydrogen abstraction reaction initiated by the photoinitiator monomer, but some residual adhesive remains due to insufficient crosslinking density. Under the same irradiation conditions, PSA-AOI exhibits a sharp decrease in peel strength through the dual effects of hydrogen abstraction reaction and olefin reduction, and leaves no residual adhesive.

[0034] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for preparing a bonding-type UV anti-adhesive tape, characterized in that, Specifically, the following steps are included: (1) Add a thermal initiator to the photoinitiator monomer and the acrylate monomer to carry out a free radical copolymerization reaction to obtain the matrix adhesive; (2) Add photoactive monomers and active tin reagents to the matrix adhesive and carry out a grafting reaction to obtain a UV-exfoliable adhesive; (3) The UV peelable adhesive is applied to the surface of the substrate layer to form a UV peelable adhesive layer; (4) Cover the surface of the UV peelable adhesive layer with a release film to obtain a bonding type UV anti-adhesion tape.

2. The method for preparing a bonding-type UV anti-adhesive tape according to claim 1, characterized in that, The photoinitiator monomer in step (1) is at least one of benzophenone photoinitiators; the acrylate monomer is a mixture of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and butyl acrylate; the thermal initiator is at least one of azo initiators and peroxide initiators; The mass percentages of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, butyl acrylate, and photoinitiator monomer are 45-65%:15%:15-39%:1-5%; The thermal initiator is 0.1% of the mass of the acrylate monomer.

3. The method for preparing a bonding-type UV anti-adhesive tape according to claim 1, characterized in that, The conditions for the free radical copolymerization reaction in step (1) are: react at 80°C for 2-6 hours.

4. The method for preparing a bonding-type UV anti-adhesive tape according to claim 1, characterized in that, The free radical copolymerization reaction in step (1) also includes a solvent, which is ethyl acetate, and the amount used is 150% of the total mass of the acrylate monomer and the photoinitiator monomer.

5. The method for preparing a bonding-type UV anti-adhesive tape according to claim 2, characterized in that, The benzophenone photoinitiators include acryloyloxybenzophenone, methacryloyloxybenzophenone, and 4-acryloyloxy-2-hydroxybenzophenone; The thermal initiator is at least one of azobisisobutyronitrile (AIBN) and benzoyl peroxide.

6. The method for preparing a bonding-type UV anti-adhesive tape according to claim 1, characterized in that, The photoactive monomer mentioned in step (2) is one or two of 2-isocyanoethyl acrylate, isocyanoethyl methacrylate, and 3-isopropene-α,α-dimethylbenzyl isocyanate; the active tin reagent is dibutyltin dilaurate; The amount of the photoactive monomer used is 0.74-7.4% of the mass of the matrix adhesive; The amount of the active tin reagent used is 0.074-0.74% of the mass of the matrix adhesive.

7. The method for preparing a bonding-type UV anti-adhesive tape according to claim 1, characterized in that, The substrate layer mentioned in step (3) is a polyethylene terephthalate film with a thickness of 25 μm; The wet film thickness of the coating is 25 μm; The coating process also includes baking, with specific baking parameters as follows: first baking at 80°C for 25 minutes, then maturing at 35°C for 12 hours; or baking at 80°C for 25-40 minutes.

8. The method for preparing a bonding-type UV anti-adhesive tape according to claim 1, characterized in that, The release film mentioned in step (4) is a PET release film with a thickness of 50 μm.

9. The bonding-type UV anti-adhesion tape obtained by the preparation method according to any one of claims 1-8.

10. The application of the bonding-type UV anti-adhesion tape obtained by the preparation method according to any one of claims 1-8 or the bonding-type UV anti-adhesion tape according to claim 9 in wafer dicing.

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