Full-scale high-precision vacuum transmitter based on thermal conductivity chip

Abstract

The utility model discloses a full-scale high-precision vacuum transmitter based on a thermal conductivity chip, which relates to the technical field of vacuum degree detection and comprises a power supply unit, a vacuum probe unit, a main control unit and a structural component. The vacuum probe unit comprises an MEMS circuit, a vacuum probe microcontroller chip, a communication circuit and an air pressure sensor circuit, the MEMS circuit is connected with the vacuum probe microcontroller chip, and the vacuum probe microcontroller chip is connected with the communication circuit and the air pressure sensor circuit; the communication circuit transmits data corresponding to the vacuum probe microcontroller chip to the main control unit, and the power supply unit, the vacuum probe unit and the main control unit are installed in the structural component. According to the vacuum transmitter adopting the scheme, the MEMS thermal conductivity chip is used for measurement, signal measurement is completed in the sensor, and miniaturization of detection equipment can be realized. And meanwhile, the device has the advantages of long service life, simple structure, low power consumption, low cost and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to a circuit relates to the vacuum detection technical field, especially relates to a full range high accuracy vacuum transmitter based on thermal conductivity chip. BACKGROUND

[0002] The prior art patent CN209639892U discloses a visual vacuum transmitter, which comprises a switch, a charging interface, a transmission interface, a base, a sensor, a display screen and a main control board, the main control board is connected with the display screen, the switch, the charging interface and the output interface through a cable, the sensor is connected with the main control board through a cable, and the measurement structure of the sensor is a double vacuum gauge bridge structure; the visual vacuum transmitter in the technical scheme adopts a mechanical structure, is relatively large in size, and has low service life and precision due to the mechanical components, and is not convenient to use, which limits the use scene and cost.

[0003] The prior art patent CN105699007A discloses a resistance vacuum transmitter, which comprises a resistance vacuum gauge, a bridge device, an amplification device, an A / D analog-digital conversion device, a power supply device, a micro-control device and a display device; the resistance vacuum gauge is used to detect the vacuum degree, but the vacuum gauge is relatively large in size and inconvenient to use.

[0004] Therefore, in view of the above disclosed patents, we have developed a full range high accuracy vacuum transmitter which can save cost, has small size, long service life, high stability and precision, and has analog and digital interfaces. UTILITY MODEL CONTENT

[0005] The utility model aims at least to solve one of the technical problems existing in the prior art, and therefore, the utility model embodiment proposes a full range high accuracy vacuum transmitter based on thermal conductivity chip, which uses MEMS thermal conductivity chip and microcontroller chip to measure vacuum degree, has low cost, small size, long service life, high stability and precision, and has analog and digital interfaces, and can be easily integrated into various systems of customers, and is convenient to use.

[0006] The utility model discloses an embodiment based on thermal conductivity chip's full range high accuracy vacuum transmitter, include: power unit, vacuum probe unit, main control unit, structural component, power unit connects main control unit and vacuum probe unit, provides power supply; Vacuum probe unit includes MEMS circuit, vacuum probe microcontroller chip, communication circuit, baroceptor circuit, MEMS circuit with vacuum probe microcontroller chip is connected, vacuum probe microcontroller chip with communication circuit, baroceptor circuit is connected, by vacuum probe microcontroller chip gathers the analog signal of MEMS circuit generates and processes to obtain and vacuum degree related data, communication circuit passes vacuum probe microcontroller chip corresponding data to main control unit, carries out subsequent processing, power unit, vacuum probe unit, main control unit install in structural component.

[0007] Further, it also includes a baroceptor circuit, the baroceptor circuit includes a baroceptor chip, the baroceptor circuit and the vacuum probe microcontroller chip are connected with the communication circuit, and the main control unit microprocessor chip is accessed to obtain the barometric pressure value in real time for the main control unit.

[0008] Further, the communication circuit connects the main control unit microcontroller chip and the vacuum probe microcontroller chip through the socket to carry out digital communication, and the digital communication mode is IIC communication.

[0009] Further, the baroceptor circuit includes a baroceptor chip, the baroceptor chip is connected with the vacuum probe microcontroller chip, and provides the barometric pressure information for the main control unit.

[0010] Further, the main control unit includes a communication circuit and an output circuit, the output circuit includes a digital output and an analog output; the main control unit microcontroller chip obtains corresponding data and information from the vacuum probe microcontroller chip through the communication circuit, obtains the barometric pressure information from the baroceptor circuit through the communication circuit to calculate and process, calculates the corresponding vacuum degree data and the corresponding level, and then outputs the corresponding vacuum data through the digital output circuit and outputs the corresponding level through the analog output circuit.

[0011] Further, the main control unit output circuit outputs externally through a DAC chip and an operational amplifier circuit, the main control unit microcontroller chip controls the DAC chip to output the specified level through SPI communication, and the specified target level is output through the operational amplifier circuit.

[0012] Further, the structural component includes a probe joint, a connector, a fastening component, a connector joint, and a connector housing; the probe joint is a hollow structure made of stainless steel; the connector includes a connector housing and a connector joint; the connector housing is fastened to the probe joint by the fastening component; and the connector joint is an RJ45 connector joint.

[0013] The utility model discloses to the traditional vacuum degree detection method exists the problem, utilizes MEMS heat conductivity chip to measure, and signal measurement is completed in the sensor inside, can realize the miniaturization of detection equipment. BRIEF DESCRIPTION OF DRAWINGS

[0014] The above and / or additional aspects and advantages of the utility model will become apparent and more readily appreciated from the following description of the embodiments, with reference to the following drawings, in which:

[0015] Figure 1 It is a kind of full range high-precision vacuum transmitter power supply schematic diagram based on heat conductivity chip for the utility model embodiment;

[0016] Figure 2 It is a kind of full range high-precision vacuum transmitter power supply unit schematic diagram based on heat conductivity chip for the utility model embodiment;

[0017] Figure 3 It is a kind of full range high-precision vacuum transmitter vacuum probe unit MEMS circuit schematic diagram based on heat conductivity chip for the utility model embodiment;

[0018] Figure 4 It is a kind of full range high-precision vacuum transmitter vacuum probe unit microcontroller circuit schematic diagram based on heat conductivity chip for the utility model embodiment;

[0019] Figure 5 It is a kind of full range high-precision vacuum transmitter vacuum probe unit air pressure sensor circuit schematic diagram based on heat conductivity chip for the utility model embodiment;

[0020] Figure 6 It is a kind of full range high-precision vacuum transmitter main control unit microcontroller circuit schematic diagram based on heat conductivity chip for the utility model example;

[0021] Figure 7 It is a kind of full range high-precision vacuum transmitter main control unit output circuit schematic diagram based on heat conductivity chip for the utility model example;

[0022] Figure 8 It is a kind of full range high-precision vacuum transmitter vacuum probe unit circuit principle schematic diagram based on heat conductivity chip for the utility model example;

[0023] Figure 9 It is a kind of full range high accuracy vacuum transmitter main control unit circuit schematic diagram based on thermal conductivity chip for the utility model example;

[0024] Figure 10 It is a kind of full range high accuracy vacuum transmitter structural component schematic diagram based on thermal conductivity chip for the utility model example;

[0025] Figure 11 It is a kind of full range high accuracy vacuum transmitter structural component front view based on thermal conductivity chip for the utility model example;

[0026] Figure 12 It is a kind of full range high accuracy vacuum transmitter structural component right view based on thermal conductivity chip for the utility model example;

[0027] Figure 13 It is a kind of full range high accuracy vacuum transmitter structural component plan view based on thermal conductivity chip for the utility model example;

[0028] Figure 14 It is a kind of full range high accuracy vacuum transmitter structural component bottom view based on thermal conductivity chip for the utility model example.

[0029] BRIEF DESCRIPTION OF DRAWINGS: 10, probe connector;20, connector;101, fastening part;201, connector connector;202, connector housing. DETAILED DESCRIPTION

[0030] The embodiments of the utility model are described in detail below, the examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the utility model, and can not be understood as the limitation of the utility model.

[0031] Referring to Figures 1 to 11 The utility model discloses a kind of full range high accuracy vacuum transmitter based on thermal conductivity chip, and the electronic module structure can be divided into four parts, which are power unit, vacuum probe unit, main control unit, structural component respectively.

[0032] Please refer to Figure 1 、 Figures 2 to 5The power supply unit includes a vacuum probe linear voltage stabilizing chip, a main control unit linear voltage stabilizing chip and a main control unit power supply control chip, and provides power supply for the vacuum probe unit and the main control unit. The main control unit power supply control chip can be of the model TPL730F33-5TR, and has the functions of anti-static protection, short circuit protection, low ESR, overheat protection, under-voltage lock, over-current protection and enable. The main control unit linear voltage stabilizing chip can be of the model CJ78D05.

[0033] After the external power supply DC power input terminal VIN is connected to the main control unit linear voltage stabilizing chip input terminal through capacitor filtering, the main control unit linear voltage stabilizing chip output terminal outputs 5V DC voltage, which is connected to the main control unit power supply control chip input terminal IN pin, EN pin and GND pin through capacitor filtering, and the main control unit linear voltage stabilizing chip output terminal OUT pin is connected to the VDD terminal, from which the working voltage is outputted. The vacuum probe unit is connected to the power supply unit, specifically, the power supply unit output VDD terminal is connected to a socket, from which the vacuum probe linear voltage stabilizing chip IN pin is connected. The vacuum probe linear voltage stabilizing chip can be of the model TPL730F12, and outputs 1.2V DC voltage through the vacuum probe linear voltage stabilizing chip output terminal OUT pin. The vacuum probe linear voltage stabilizing chip enable terminal EN pin is connected to the vacuum probe microcontroller chip PB0 / LVDIN terminal, and the VDD terminal is connected to the vacuum probe microcontroller chip VDD / VIN terminal. The vacuum probe linear voltage stabilizing chip output terminal OUT pin outputs 1.2V voltage, which provides power for the thermal conductivity chip MEMS.

[0034] Please refer to Figures 2 to 4 The vacuum probe unit includes a MEMS circuit, a vacuum probe microcontroller chip, a communication circuit and a barometric pressure sensor circuit. The connection relationship of the above parts is that the MEMS circuit is connected to the vacuum probe microcontroller chip, and the vacuum probe microcontroller chip is connected to the communication circuit and the barometric pressure sensor circuit. The power supply circuit provides power for each part of the vacuum probe unit. The MEMS circuit chip generates a small analog signal, which is collected by the vacuum probe microcontroller chip, and then processed to obtain data related to the vacuum degree. The communication circuit transmits the data corresponding to the vacuum probe microcontroller chip to the main control unit for subsequent processing.

[0035] The barometric pressure sensor circuit part and the vacuum probe microcontroller system share the communication part circuit, which is accessed by the main control microprocessor chip of the main control unit to obtain the barometric pressure value in real time for use by the main control unit.

[0036] Please refer to Figure 3, MEMS circuit part as follows, MEMS circuit includes MEMS chip, by power supply part output 1.2V power supply, TH+ and TH- output level signal, that is, MEMS chip Pin1 and Pin3 will produce and vacuum degree related micro level signal. MEMS chip Pin1 and Pin2 corresponding to connect to vacuum probe unit microcontroller chip AN1 and VCM pin.

[0037] In the embodiment, MEMS circuit chip selection model is: PTCD20-SMD02 (Bosonfa company product).

[0038] Please refer to Figure 4 , vacuum probe unit microcontroller chip Pin15 and Pin16 connect MEMS circuit, for collecting MEMS signal, vacuum probe unit microcontroller chip another side Pin9 and Pin12 connect communication circuit, for and master control unit microcontroller chip communication; vacuum probe unit microcontroller chip Pin7 and Pin8 provide online programming, provide data download.

[0039] In the embodiment, vacuum probe unit microcontroller chip can select model is: BH66F5242 (Hetai company product).

[0040] Communication circuit part through socket connection master control unit microcontroller chip and true control probe microcontroller chip, so that master control unit microcontroller chip and vacuum control probe microcontroller chip can carry out digital communication, in the embodiment, the actual communication mode is IIC communication, true control probe microcontroller chip is slave, master control unit microcontroller chip is host.

[0041] Please refer to Figure 5 , air pressure sensor circuit includes air pressure sensor chip, for example, can select model is: CPS122, air pressure sensor chip is connected with vacuum probe microcontroller chip, that is, air pressure sensor chip Pin6 and Pin5 and vacuum probe microcontroller chip Pin9 and Pin11 are connected, air pressure sensor chip Pin6 and Pin5, vacuum probe microcontroller chip Pin9 and Pin11 are general IIC interface, for master control unit to provide air pressure information.

[0042] Refer to Figure 6 and Figure 7 , the master control unit of the embodiment is further described as follows:

[0043] Power supply circuit through socket such as J1, to master control unit microcontroller chip provides power supply, master control unit includes communication circuit, output circuit, output circuit includes digital type output and analog type output.

[0044] The relationship of each part is: the master unit microcontroller chip obtains corresponding data and information from the vacuum probe microcontroller chip through the communication circuit, and also obtains air pressure related information from the air pressure sensor circuit through the communication circuit, then performs calculation and processing, calculates the corresponding vacuum degree data and the corresponding level, and then outputs the corresponding vacuum data through the digital output circuit and the corresponding level through the analog output circuit.

[0045] Please refer to Figure 6 , the master unit microcontroller chip Pin8 and Pin9 pins and the vacuum probe unit communicate, and also communicate with the air pressure sensor, the master unit microcontroller chip Pin21, Pin22 is a digital output part; the master unit microcontroller chip Pin33, Pin35, Pin36 is an analog output part, which controls the external DAC chip through digital communication, and then realizes analog output, for example, the DAC chip can be selected as model: 16-bit digital-to-analog conversion chip TPC116S1-VR. The master unit microcontroller chip Pin46, Pin47 is an interface for debugging, and the master unit microcontroller chip of course also has a download port and other parts.

[0046] The master unit communication part adopts a socket, for example, socket J4, which connects the master unit communication part and the vacuum probe unit communication part, and also supplies power to the vacuum probe unit.

[0047] In this embodiment, the master unit microcontroller chip can be selected as model: NANO130SE3BN

[0048] (New Tang Company product).

[0049] Please refer to Figure 7 , the master unit output circuit outputs externally through the DAC chip and the operational amplifier circuit, the master unit microcontroller chip controls the DAC chip output specified level through SPI communication, and then outputs through the amplification circuit, for example, the TPA1881-TR operational amplifier can be selected, through these circuits, the master unit microcontroller can output the specified target level.

[0050] The master unit microcontroller outputs the specified target level VOUT through the Pin3 pin of socket J1 to output the analog level. The corresponding digital output is output through the Pin7 and Pin8 of socket J1, and the digital output is output in digital quantity through the UART mode. In order to improve the voltage output precision, the voltage reference chip can be selected to be connected with the DAC chip, for example, model: ME431AXG voltage reference chip.

[0051] In order to facilitate debugging and parameter configuration, socket J6 is a parameter configuration interface, which is also a debugging port, and communicates with the master unit microcontroller chip through the UART mode.

[0052] In summary, the principle of the technical scheme of the utility model as a whole is:

[0053] The whole system is powered by a power supply, the main control unit microcontroller chip and the vacuum probe microcontroller chip can work, the vacuum probe microcontroller chip collects the level signal of the thermal conductivity MEMS circuit, carries out certain processing, and the processed data is standby, and the main control unit microcontroller chip reads.

[0054] The main control unit microcontroller chip reads the data of the vacuum probe unit microcontroller chip and also reads the data of the air pressure sensor chip, then processes and calculates the vacuum value, and then calculates the corresponding level according to the agreed formula, outputs the target level through the control DAC chip, which represents the corresponding vacuum degree. At the same time, the digital interface of the main control unit microcontroller chip outputs digital information according to the communication protocol, which also represents the corresponding vacuum degree.

[0055] The function of the air pressure sensor chip is that when the vacuum degree is very low or the air pressure is relatively high, the vacuum value calculated by the MEMS circuit has a larger error, and the value of the air pressure sensor is more accurate. In order to have better accuracy in the state of low vacuum degree, the air pressure sensor chip is added to obtain reference air pressure data, and the main control unit microcontroller chip real-time captures the air pressure sensor chip data for standby at any time.

[0056] Please refer to Figures 10 to 14 The structure part includes 10, a probe connector; 20, a connector; 101, a fastening part; 201, a connector connector; 202, a connector housing. The probe connector 10 can be made of stainless steel, and the probe connector 10 is a hollow structure, such as a KF-16 probe connector, which is convenient to connect with the user's vacuum environment. The vacuum probe unit and the main control unit are made into a circuit board and placed in the connector 20. The connector includes a connector housing and a connector connector 201, and the connector housing 202 is fastened and connected with the probe connector 10 through the fastening part 101, for example, by screw fastening. The main control unit circuit board output is output by the connector connector, and the user's connector connector can be an RJ45 connector connector. They are all standard connection parts, which are convenient for connecting the vacuum transmitter to various application environments.

[0057] According to the technical scheme in the utility model, the corresponding medium vacuum transmitter electronic module is made, the actual vacuum degree test is carried out, it is found that the electronic module can indeed sensitively test the change of the vacuum degree, and the stability, precision and ease of use are very good.

[0058] The utility model embodiment has been described in detail above in combination with the drawings, but the utility model is not limited to the above-mentioned embodiments, and various changes can be made within the knowledge range possessed by ordinary skilled in the art without departing from the purpose of the utility model.

[0059] The device embodiments described above are merely illustrative, wherein the units described as separate components can or can not be physically separated, that is, can be located in one place, or can be distributed to multiple network units. Part or all of the modules can be selected to achieve the purpose of the embodiment scheme according to actual needs.

[0060] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0061] Although the embodiments of the utility model have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the utility model, and the scope of the utility model is defined by the claims and their equivalents.

Claims

1. A full range high precision vacuum transmitter based on thermal conductivity chip, characterized in that, It includes: including: power supply unit, vacuum probe unit, main control unit, structural components, the power supply unit connects main control unit and vacuum probe unit, provides power supply; The vacuum probe unit includes MEMS circuit, vacuum probe microcontroller chip, communication circuit, air pressure sensor circuit, the MEMS circuit with the vacuum probe microcontroller chip is connected, the vacuum probe microcontroller chip is connected with the communication circuit, air pressure sensor circuit;The analog signal generated by the MEMS circuit is collected by the vacuum probe microcontroller chip and processed to obtain data related to vacuum degree, the communication circuit passes the data corresponding to the vacuum probe microcontroller chip to the main control unit, and subsequent processing is carried out, the power supply unit, vacuum probe unit, main control unit is installed in the structural components.

2. The full range high precision vacuum transmitter based on thermal conductivity chip according to claim 1, characterized in that, It also includes an air pressure sensor circuit, the air pressure sensor circuit includes an air pressure sensor chip, the air pressure sensor circuit and the vacuum probe microcontroller chip are connected with the communication circuit, and the main control unit microprocessor chip is accessed to obtain the air pressure value in real time for the main control unit.

3. The full range high precision vacuum transmitter based on thermal conductivity chip according to claim 1, characterized in that, The communication circuit connects the main control unit microcontroller chip and the vacuum probe microcontroller chip for digital communication through the socket, and the digital communication mode is IIC communication.

4. The full range high precision vacuum transmitter based on thermal conductivity chip according to claim 1, characterized in that, The air pressure sensor circuit includes an air pressure sensor chip, which is connected with the vacuum probe microcontroller chip to provide air pressure information for the main control unit.

5. The full range high precision vacuum pressure transmitter based on thermal conductivity chip according to claim 1, characterized in that, The main control unit includes a communication circuit and an output circuit, and the output circuit includes digital output and analog output;The main control unit microcontroller chip obtains corresponding data and information from the vacuum probe microcontroller chip through the communication circuit, obtains air pressure information from the air pressure sensor circuit through the communication circuit, and calculates the corresponding vacuum degree data and the corresponding level, and then outputs the corresponding vacuum data through the digital output circuit and outputs the corresponding level through the analog output circuit.

6. The full range high precision vacuum pressure transmitter based on thermal conductivity chip according to claim 3, characterized in that, The main control unit output circuit outputs through the DAC chip and the operational amplifier circuit, and the main control unit microcontroller chip controls the DAC chip to output the specified level through SPI communication, and the specified target level is output through the operational amplifier circuit.

7. The full range high precision vacuum pressure transmitter based on thermal conductivity chip according to claim 1, characterized in that, The structural components include probe connector, connector, fastening component, connector connector and connector shell;The probe connector is a hollow structure made of stainless steel, the connector includes a connector shell and a connector connector, the connector shell is fastened to the probe connector through the fastening component, and the connector connector is an RJ45 connector connector.

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