Radiator for host
By installing a heat sink bracket on the outside of the host housing cavity, the problem of component damage caused by the difficulty of disassembling traditional cooling fans is solved, realizing convenient disassembly and assembly of cooling fans and safe protection of components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-12
- Publication Date
- 2026-03-27
AI Technical Summary
Traditional host cooling fans are prone to dust accumulation or damage after prolonged use, requiring disassembly of the control box for cleaning or repair, which may damage electronic components.
Design a heat sink for the host computer, with the cooling fan installed on the outside of the housing chamber. The first and second cooling fans are placed outside the housing chamber by a heat sink bracket, which facilitates disassembly for dust cleaning or maintenance and avoids disassembly and entry into the housing chamber.
It enables convenient cleaning or maintenance of the cooling fan without disassembling the housing chamber, thus protecting the safety of electronic components.
Smart Images

Figure CN224052618U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to host computer heat dissipation technical field especially a radiator for host computer. BACKGROUND
[0002] Computer host is the terminal equipment about sending and receiving information in network technology, including CPU, memory, hard disk and control box for placing electronic components, the internal electronic components of control box will produce a large amount of heat when working, if these heat is not discharged in time, it can affect the running speed of host computer, the traditional heat dissipation is to install multiple heat dissipation fans in the control box to dissipate heat, but after long time use, dust will accumulate or damage in the heat dissipation fan, which will affect the heat dissipation efficiency, it is necessary to disassemble the control box and then disassemble the heat dissipation fan to clean dust or repair, which can touch the internal electronic components during disassembly, resulting in damage to the electronic components. SUMMARY
[0003] To solve the above problems, the utility model provides a radiator for host computer, by installing the heat dissipation frame on the outside of the containing chamber, the first heat dissipation fan and the second heat dissipation fan are placed outside the containing chamber, when the heat dissipation fan accumulates dust or is damaged, it can be disassembled in time for dust or repair, which is convenient and simple to disassemble and does not need to enter the containing chamber to disassemble, avoiding touching the electronic components in the containing chamber, ensuring the safety of the electronic components.
[0004] To achieve the above purpose, the utility model adopts the technical scheme of providing a radiator for host computer, including host computer case, the heat dissipation frame that can be detachably installed on the host computer case, the first heat dissipation fan and the second heat dissipation fan that can be detachably installed on the heat dissipation frame, the upper cover that can be detachably installed on the heat dissipation frame, and the first fastening screw and the second fastening screw, the first heat dissipation fan is installed on the heat dissipation frame through the first fastening screw, the second heat dissipation fan is installed on the heat dissipation frame through the second fastening screw, the first heat dissipation fan is located on the side of the host computer case, the second heat dissipation fan is located on the bottom of the host computer case, the host computer case is provided with containing chamber, first placing groove and second placing groove, the first placing groove and the second placing groove are located on the outside of the containing chamber, the first placing groove is communicated with the second placing groove, part of the heat dissipation frame is installed in the first placing groove, another part of the heat dissipation frame is installed in the second placing groove, the first heat dissipation fan, the second heat dissipation fan, the first fastening screw and the first fastening screw are multiple and are arranged at intervals, the first placing groove and the second placing groove form an L-shaped groove, and the heat dissipation frame is arranged in an L shape.
[0005] As a preferred solution, the heat dissipation frame has a first mounting portion and a second mounting portion, the first heat dissipation fan is mounted on the first mounting portion, and the second heat dissipation fan is mounted on the second mounting portion.
[0006] As a preferred solution, the first mounting portion is provided with a first mounting groove, a first fastening screw groove and a first electrical connection groove, the fastening screw groove is in communication with the first mounting groove, the first fastening screw groove is provided in plurality and is arranged at intervals, the first heat dissipation fan is mounted on the first mounting groove, the first fastening screw passes through the first fastening screw groove and is mounted on the first heat dissipation fan, and the upper cover covers the first mounting groove and the first electrical connection groove.
[0007] As a preferred solution, the first mounting portion is further provided with a first side heat dissipation hole, the first mounting portion has a plurality of clamping columns arranged at intervals, the mainframe case is provided with a plurality of clamping grooves arranged at intervals, the clamping grooves are in communication with the first mounting groove, the clamping columns are detachably mounted on the clamping grooves, and the first side heat dissipation hole is in communication with the first mounting groove.
[0008] As a preferred solution, the second mounting portion is provided with a second mounting groove, a second electrical connection groove and a second fastening screw groove, the second heat dissipation fan is mounted on the second mounting groove, the second electrical connection groove is in communication with the first electrical connection groove, and the second fastening screw passes through the second fastening screw groove and is mounted on the second heat dissipation fan.
[0009] As a preferred solution, the mainframe case is provided with a first bottom heat dissipation hole, a second bottom heat dissipation hole, a first top heat dissipation hole, a second side heat dissipation hole and a third side heat dissipation hole, the second bottom heat dissipation hole, the first top heat dissipation hole, the second side heat dissipation hole and the third side heat dissipation hole are all in communication with the accommodating chamber, the first bottom heat dissipation hole and the second bottom heat dissipation hole are both in communication with the second mounting groove, the first bottom heat dissipation hole and the second bottom heat dissipation hole are both correspondingly arranged with the second heat dissipation fan, and the first side heat dissipation hole and the second side heat dissipation hole are both correspondingly arranged with the first heat dissipation fan.
[0010] As a preferred solution, it further comprises a first bottom magnetic dustproof net, a first top magnetic dustproof net, a first side magnetic dustproof net and a third side magnetic dustproof net, the first bottom magnetic dustproof net, the first top magnetic dustproof net and the third side magnetic dustproof net are all magnetically attached to the mainframe case, the first side magnetic dustproof net is magnetically attached to the heat dissipation frame, the first bottom magnetic dustproof net is located outside the first bottom heat dissipation hole, the first top magnetic dustproof net is located outside the first top heat dissipation hole, the third side magnetic dustproof net is located outside the third side heat dissipation hole, and the first side magnetic dustproof net is located outside the first side heat dissipation hole.
[0011] As a preferred solution, a detachable side plate is further included, which is mounted on the mainframe cabinet, the mainframe cabinet is provided with a side mounting slot and a side limiting slot, the side plate is provided with a side limiting column, the side plate is mounted in the side mounting slot, the side limiting slot is communicated with the side mounting slot, and the side limiting column is mounted in the side limiting slot, and the side limiting slot and the side limiting column are both provided in plurality and are spaced.
[0012] The mainframe radiator has the advantages that the first and second heat dissipation fans are arranged outside the accommodating chamber by mounting the heat dissipation frame outside the accommodating chamber, and when the heat dissipation fans are accumulated with dust or damaged, the heat dissipation fans can be timely removed for dust removal or maintenance, the heat dissipation fans are convenient and simple to disassemble and assemble, it is not necessary to enter the accommodating chamber to disassemble the heat dissipation fans, electronic components in the accommodating chamber are avoided from being touched, and the safety of the electronic components is ensured. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 is a whole structure schematic view of the mainframe radiator.
[0014] Figure 2 For Figure 1 is an exploded structure schematic view of the mainframe radiator.
[0015] Figure 3 For Figure 1 is a structure schematic view of the mainframe cabinet in the mainframe radiator.
[0016] Figure 4 For Figure 1 is a structure schematic view of the heat dissipation frame in the mainframe radiator.
[0017] BRIEF DESCRIPTION OF DRAWINGS: 100, mainframe cabinet; 110, accommodating chamber; 120, first placing slot; 130, second placing slot; 140, first bottom heat dissipation hole; 150, second bottom heat dissipation hole; 160, first top heat dissipation hole; 170, second side heat dissipation hole; 180, third side heat dissipation hole; 190, side plate; 1a0, clamping groove; 200, heat dissipation frame; 210, first mounting part; 211, first mounting slot; 212, first fastening screw slot; 213, first electric connection slot; 214, first side heat dissipation hole; 215, clamping column; 220, second mounting part; 221, second mounting slot; 222, second electric connection slot; 223, second fastening screw slot; 300, first heat dissipation fan; 400, second heat dissipation fan; 500, upper cover; 600, first fastening screw; 700, second fastening screw. DETAILED DESCRIPTION
[0018] The technical solutions of the present application will be described clearly and completely in connection with the drawings. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0019] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.
[0020] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0021] As Figures 1 to 4The utility model provides a radiator for host computer, including host computer case 100, the radiator frame 200 of detachable installation in host computer case 100, the first radiating fan 300 and second radiating fan 400 of detachable installation in radiator frame 200, the upper cover 500 of detachable installation in radiator frame 200 and first fastening screw 600 and second fastening screw 700, first radiating fan 300 is installed in radiator frame 200 through first fastening screw 600, second radiating fan 400 is installed in radiator frame 200 through second fastening screw 700, first radiating fan 300 is located in the side of host computer case 100, and second radiating fan 400 is located in the bottom of host computer case 100, and host computer case 100 is equipped with containing chamber 110, first placing groove 120 and second placing groove 130, and first placing groove 120 and second placing groove 130 are located in the outside of containing chamber 110, and first placing groove 120 is communicated with second placing groove 130, and the part of radiator frame 200 is installed in first placing groove 120, and another part of radiator frame 200 is installed in second placing groove 130, and first radiating fan 300, second radiating fan 400, first fastening screw 600 and first fastening screw 600 are multiple and interval arrangement, and first placing groove 120 and second placing groove 130 form an L-shaped groove, and radiator frame 200 is L-shaped arrangement, in the embodiment, multiple first radiating fan 300 and multiple second radiating fan 400 are in series, and first radiating fan 300 and second radiating fan 400 are also in series, by installing radiator frame 200 in the outside of containing chamber 110, first radiating fan 300 and second radiating fan 400 are placed in the outside of containing chamber 110, when the dust of radiating fan is accumulated or is damaged, can be promptly taken down and is carried out dust or maintenance, and the convenient and simple dismounting does not need to enter containing chamber 110 and is dismounted, avoids touching electronic components in containing chamber 110, guarantees the safety of electronic components.
[0022] Radiator frame 200 has first installation part 210 and second installation part 220, and first radiating fan 300 is installed in first installation part 210, and second radiating fan 400 is installed in second installation part 220.
[0023] First installation part 210 is equipped with first installation groove 211, first fastening screw groove 212 and first electric connection groove 213, and the first fastening screw groove 212 is communicated with first installation groove 211, and the first fastening screw groove 212 is multiple and interval arrangement, and first radiating fan 300 is installed in first installation groove 211, and first fastening screw 600 is installed in first radiating fan 300 through first fastening screw groove 212, and upper cover 500 is covered in first installation groove 211 and first electric connection groove 213.
[0024] The first mounting portion 210 is further provided with a first side heat dissipation hole 214, and the first mounting portion 210 is provided with a plurality of spaced-apart clamping columns 215. The mainframe case 100 is provided with a plurality of spaced-apart clamping grooves 1a0, the clamping grooves 1a0 are communicated with the first placing groove 120, the clamping columns 215 are detachably mounted in the clamping grooves 1a0, and the first side heat dissipation hole 214 is communicated with the first mounting groove 211.
[0025] The second mounting portion 220 is provided with a second mounting groove 221, a second electric connection groove 222 and a second fastening screw groove 223. The second heat dissipation fan 400 is mounted in the second mounting groove 221. The second electric connection groove 222 is communicated with the first electric connection groove 213. The second fastening screw 700 is mounted in the second heat dissipation fan 400 through the second fastening screw groove 223.
[0026] The mainframe case 100 is provided with a first bottom heat dissipation hole 140, a second bottom heat dissipation hole 150, a first top heat dissipation hole 160, a second side heat dissipation hole 170 and a third side heat dissipation hole 180. The second bottom heat dissipation hole 150, the first top heat dissipation hole 160, the second side heat dissipation hole 170 and the third side heat dissipation hole 180 are all communicated with the accommodating cavity 110. The first bottom heat dissipation hole 140 and the second bottom heat dissipation hole 150 are both communicated with the second placing groove 130. The first bottom heat dissipation hole 140 and the second bottom heat dissipation hole 150 are both correspondingly arranged with the second heat dissipation fan 400. The first side heat dissipation hole 214 and the second side heat dissipation hole 170 are both correspondingly arranged with the first heat dissipation fan 300.
[0027] Further comprising a first bottom magnetic dustproof screen, a first top magnetic dustproof screen, a first side magnetic dustproof screen and a third side magnetic dustproof screen mounted on the first bottom magnetic dustproof screen, the first top magnetic dustproof screen, the first side magnetic dustproof screen and the third side magnetic dustproof screen are all magnetically attached to the mainframe case 100. The first side magnetic dustproof screen is magnetically attached to the heat dissipation frame 200. The first bottom magnetic dustproof screen is located outside the first bottom heat dissipation hole 140. The first top magnetic dustproof screen is located outside the first top heat dissipation hole 160. The third side magnetic dustproof screen is located outside the third side heat dissipation hole 180. The first side magnetic dustproof screen is located outside the first side heat dissipation hole 214. The first bottom magnetic dustproof screen is used for dustproofing the first bottom heat dissipation hole 140. The first top magnetic dustproof screen is used for dustproofing the first top heat dissipation hole 160. The third side magnetic dustproof screen is used for dustproofing the third side heat dissipation hole 180. The first side magnetic dustproof screen is used for dustproofing the first side heat dissipation hole 214.
[0028] Further comprising a side plate 190 detachably mounted on the mainframe case 100. The mainframe case 100 is provided with a side mounting groove and a side limiting groove. The side plate 190 is provided with a side limiting column. The side plate 190 is mounted in the side mounting groove. The side limiting groove is communicated with the side mounting groove. The side limiting column is mounted in the side limiting groove. The side limiting groove and the side limiting column are both provided with a plurality of spaced-apart columns.
[0029] In one embodiment, the upper cover 500 has a lower electrical connection socket and an upper electrical connection socket, the lower electrical connection socket is electrically connected with the upper electrical connection socket, the lower electrical connection socket is used for electrically connecting the first and second heat dissipation fans, and the upper electrical connection socket is used for electrical connection with the host chassis.
[0030] In one embodiment, the first mounting portion 210 has a handle, and the side plate 190 has a protrusion, the handle facilitates the disassembly of the heat dissipation rack 200 from the host chassis 100, and the protrusion facilitates the mounting and disassembly of the side plate 190.
[0031] The working principle of the utility model is: during assembly, the side plate 190 is first disassembled, then various electronic components are mounted into the accommodation chamber 110, then the side plate 190 is covered, then the plurality of second heat dissipation fans 400 are mounted into the second mounting portion 220 and connected in series, then the plurality of first heat dissipation fans 300 are mounted into the first mounting portion 210 and connected in series, then the second heat dissipation fans 400 and the first heat dissipation fans 300 are connected in series, then the first heat dissipation fans 300 are connected with the upper cover, then the upper cover is covered, finally the second mounting portion 220 of the heat dissipation rack 200 is placed into the second placing groove 130, the first mounting portion 210 is placed into the first placing groove 120, and the first mounting portion 210 is fixed through the cooperation of the clamping column 215 and the clamping groove 1a0, so that the heat dissipation rack 200 is mounted onto the host chassis 100, and the heat dissipation rack 200, the first heat dissipation fans 300 and the second heat dissipation fans 400 are separated from the electronic components in the accommodation chamber 110 after mounting, so that the electronic components are prevented from being touched during disassembly of the heat dissipation rack 200, the first heat dissipation fans 300 and the second heat dissipation fans 400, and the safety of the electronic components is ensured.
[0032] The above embodiments only describe the preferred embodiments of the utility model, and do not limit the scope of the utility model, and various deformations and improvements of the technical scheme of the utility model made by the ordinary engineering technicians in the art without departing from the design spirit of the utility model shall fall within the protection scope determined by the claims of the utility model.
Claims
1. A heat sink for a host, characterized by, The application relates to a computer cooling device, which comprises a mainframe, a detachable cooling frame installed on the mainframe, a first cooling fan and a second cooling fan detachably installed on the cooling frame, an upper cover detachably installed on the cooling frame, and a first fastening screw and a second fastening screw, wherein the first cooling fan is installed on the cooling frame through the first fastening screw, the second cooling fan is installed on the cooling frame through the second fastening screw, the first cooling fan is located on the side of the mainframe, the second cooling fan is located on the bottom of the mainframe, the mainframe is provided with a containing chamber, a first placing groove and a second placing groove, the first placing groove and the second placing groove are located on the outside of the containing chamber, the first placing groove is communicated with the second placing groove, part of the cooling frame is installed on the first placing groove, and another part of the cooling frame is installed on the second placing groove, the first cooling fan, the second cooling fan, the first fastening screw and the second fastening screw are multiple and are arranged at intervals, the first placing groove and the second placing groove form an L-shaped groove, and the cooling frame is arranged in an L shape.
2. A heat sink for a host device as claimed in claim 1, wherein: The cooling frame is provided with a first installation part and a second installation part, the first cooling fan is installed on the first installation part, and the second cooling fan is installed on the second installation part.
3. A heat sink for a host device as claimed in claim 2, wherein: The first installation part is provided with a first installation groove, a first fastening screw groove and a first electric connection groove, the fastening screw groove is communicated with the first installation groove, the first fastening screw groove is multiple and is arranged at intervals, the first cooling fan is installed on the first installation groove, the first fastening screw is installed on the first cooling fan through the first fastening screw groove, and the upper cover covers the first installation groove and the first electric connection groove.
4. The heat sink for a host device of claim 3, wherein: The first installation part is further provided with a first side cooling hole, the first installation part is provided with multiple spaced clamping columns, the mainframe is provided with multiple spaced clamping grooves, the clamping grooves are communicated with the first placing groove, the clamping columns are detachably installed on the clamping grooves, and the first side cooling hole is communicated with the first installation groove.
5. The heat sink for a host device of claim 3, wherein: The second installation part is provided with a second installation groove, a second electric connection groove and a second fastening screw groove, the second cooling fan is installed on the second installation groove, the second electric connection groove is communicated with the first electric connection groove, and the second fastening screw is installed on the second cooling fan through the second fastening screw groove.
6. The heat sink for a host device of claim 4, wherein: The mainframe is provided with a first bottom cooling hole, a second bottom cooling hole, a first top cooling hole, a second side cooling hole and a third side cooling hole, the second bottom cooling hole, the first top cooling hole, the second side cooling hole and the third side cooling hole are all communicated with the containing chamber, the first bottom cooling hole and the second bottom cooling hole are both communicated with the second placing groove, the first bottom cooling hole and the second bottom cooling hole are both arranged correspondingly to the second cooling fan, and the first side cooling hole and the second side cooling hole are both arranged correspondingly to the first cooling fan.
7. A heat sink for a host device as claimed in claim 6, wherein: Also include installed in the first bottom magnetic dust screen, the first top magnetic dust screen, the first side magnetic dust screen, the third side magnetic dust screen, the first bottom magnetic dust screen, the first top magnetic dust screen and the third side magnetic dust screen are all magnetic adsorbed in the mainframe case, the first side magnetic dust screen is magnetic adsorbed in the heat dissipation frame, the first bottom magnetic dust screen is located outside the first bottom heat dissipation hole, the first top magnetic dust screen is located outside the first top heat dissipation hole, the third side magnetic dust screen is located outside the third side heat dissipation hole, and the first side magnetic dust screen is located outside the first side heat dissipation hole.
8. The heat sink for a host device of claim 1, wherein: Also include a detachable side plate installed in the mainframe case, the mainframe case is provided with a side installation slot and a side limiting slot, the side plate has a side limiting column, the side plate is installed in the side installation slot, the side limiting slot is communicated with the side installation slot, and the side limiting column is installed in the side limiting slot, the side limiting slot and the side limiting column are both multiple and are arranged at intervals.