PCBA circuit board for Bluetooth earphone
By introducing protective airbags, rubber buffer rings, and heat sinks onto the PCBA circuit board of Bluetooth headsets, the problem of circuit board damage when Bluetooth headsets are dropped is solved, thus improving the safety and heat dissipation of the circuit board.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-03
- Publication Date
- 2026-03-27
AI Technical Summary
Bluetooth earphones are prone to falling out during wear, which can damage the PCBA circuit board, and the existing shock absorption and cushioning effects are not ideal.
A PCBA circuit board for Bluetooth headsets was designed, which adopts a structure including a protective airbag, a first rubber buffer ring, a second rubber buffer ring, and a heat sink. These structures absorb impact and prevent the circuit board from directly contacting the inner wall of the mounting cavity. Combined with the heat sink and heat conduction plate, the temperature is controlled and moisture is prevented from entering.
It effectively absorbs the vertical impact force of the circuit board, preventing damage and maintaining the safety and heat dissipation of the circuit board. At the same time, it avoids excessive temperature and moisture ingress, improving impact resistance and consistent feel.
Smart Images
Figure CN224054601U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a circuit board technical field, concretely is a kind of PCBA circuit board for bluetooth headset. BACKGROUND
[0002] Bluetooth headset is to apply bluetooth technology to hands-free headset, so that users can be exempted from annoying wire's fetters, freely with various ways to easily talk, since bluetooth headset has come out, it is always the good tool of action business to improve efficiency.
[0003] Bluetooth headset is convenient to use, but it is easy to fall in wearing process, if the shock-absorbing buffering effect of bluetooth headset is not ideal, earphone is dropped on the ground to easily lead to the PCBA circuit board in bluetooth headset breakage, to cause bluetooth headset damage, in view of this, we provide a kind of PCBA circuit board for bluetooth headset. SUMMARY
[0004] To solve the defects that the shock-absorbing buffering effect of bluetooth headset is not ideal in prior art, the utility model provides a kind of PCBA circuit board for bluetooth headset.
[0005] To solve the above technical problem, the utility model provides the following technical scheme:
[0006] The utility model relates to a kind of PCBA circuit board for bluetooth headset, including earphone body, the inside of earphone body is provided with installation cavity, the bottom wall of installation cavity is fixedly connected with first rubber buffer ring, the upper side of first rubber buffer ring is fixedly connected with mounting plate, circuit board is provided on the mounting plate, the upper side surface of circuit board is provided with the heat dissipation groove extending out its lower side surface, fixed bolt is provided on the circuit board, the left and right side surfaces of circuit board are all fixedly connected with second rubber buffer ring, the side surface of two second rubber buffer rings away from each other is fixedly connected with contact plate, the lower side surface of protection air bag is fixedly connected with the upper side surface of mounting plate.
[0007] As a preferred technical scheme of the utility model, the outer surface of earphone body is provided with two embedding grooves, the inner wall of the side of two embedding grooves is all provided with the through groove extending into the inside of installation cavity.
[0008] As a preferred technical scheme of the utility model, the inside of embedding groove is fixedly connected with heat dissipation plate, and the heat dissipation plate is arranged as arc.
[0009] As a preferred technical scheme of the utility model, the surface of heat dissipation plate is flush with the outer surface of earphone body.
[0010] As a preferred technical scheme of the utility model, the side surface of two heat dissipation plates is fixedly connected with a heat conduction plate.
[0011] As a preferred technical scheme of the utility model, the heat conduction plate is arranged in an inclined mode.
[0012] As a preferred technical scheme of the utility model, the side surface of two heat conduction plates is fixedly connected with a second heat conduction plate.
[0013] As a preferred technical scheme of the utility model, the side surface of two second heat conduction plates is fixedly connected with a heat dissipation fin.
[0014] The utility model discloses a PCBA circuit board for bluetooth earphone, utilize the setting of protection air bag and first rubber buffer ring, can effectively absorb the vertical impact force that circuit board received, and with the second rubber buffer ring can avoid the circuit board when shaking and directly contact with the inner wall of installation cavity because of impact, further guarantee the security of circuit board.
[0015] The utility model discloses a PCBA circuit board for bluetooth earphone, utilize the setting of heat dissipation plate, heat conduction plate, second heat conduction plate and heat dissipation fin, can effectively avoid the inside temperature of installation cavity too high, and there is no through -hole directly connected with the outside, can avoid moisture to enter, guarantee the security of circuit board, and the surface of heat dissipation plate and earphone body is flush, avoids the appearance of the feeling of being strange. DRAWINGS
[0016] The drawings are used to provide further understanding of the utility model, and constitute a part of the specification, are used to explain the utility model with the embodiment of the utility model, and do not constitute the limitation to the utility model.
[0017] Figure 1 It is the overall structure schematic drawing of a PCBA circuit board for bluetooth earphone of the utility model,
[0018] Figure 2 It is the embedded groove structure schematic drawing of a PCBA circuit board for bluetooth earphone of the utility model,
[0019] Figure 3 It is the first rubber buffer ring structure schematic drawing of a PCBA circuit board for bluetooth earphone of the utility model,
[0020] Figure 4 It is the fixed bolt structure schematic drawing of a PCBA circuit board for bluetooth earphone of the utility model,
[0021] Figure 5It is the protective air bag structure schematic view of PCBA circuit board for Bluetooth earphone.
[0022] In the figure: 1, earphone body;2, installation cavity;3, first rubber buffer ring;4, mounting plate;5, circuit board;6, heat dissipation groove;7, second rubber buffer ring;8, contact plate;9, protective air bag;10, embedded groove;11, through groove;12, heat dissipation plate;13, heat conduction plate;14, second heat conduction plate;15, heat dissipation fin;16, fixing bolt. Specific embodiments
[0023] The preferred embodiments of the utility model are described below in conjunction with the drawings, and it should be understood that the preferred embodiments described here are only used to illustrate and explain the utility model, and are not used to limit the utility model.
[0024] Embodiment: as Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 And Figure 5 Indicated, the utility model discloses a kind of PCBA circuit board for Bluetooth earphone, including earphone body 1, installation cavity 2 is set in the inside of earphone body 1, the bottom wall of installation cavity 2 is fixedly connected with first rubber buffer ring 3, the upper side of first rubber buffer ring 3 is fixedly connected with mounting plate 4, and mounting plate 4 is provided with circuit board 5, and the upper side surface of circuit board 5 is provided with heat dissipation groove 6 extending out its lower side surface, and fixed bolt 16 is provided on circuit board 5, and the left and right side surfaces of circuit board 5 are fixedly connected with second rubber buffer ring 7, and the side surface of two second rubber buffer ring 7 away from each other is fixedly connected with contact plate 8, and the lower side surface of circuit board 5 is fixedly connected with protective air bag 9, and the lower side surface of protective air bag 9 is fixedly connected with the upper side surface of mounting plate 4, by the setting of protective air bag 9 and first rubber buffer ring 3, the vertical impact force that circuit board 5 can be effectively absorbed, and by second rubber buffer ring 7, circuit board 5 can avoid direct contact with the inner wall of installation cavity 2 when shaking due to impact, further guarantee the security of circuit board 5.
[0025] The outer surface of the earphone body 1 is provided with two embedding grooves 10, the inner walls of the sides close to the two embedding grooves 10 are provided with through grooves 11 extending into the inside of the mounting cavity 2, the inside of the embedding groove 10 is fixedly connected with a heat dissipation plate 12, the heat dissipation plate 12 is arranged in an arc shape, the surface of the heat dissipation plate 12 is flush with the outer surface of the earphone body 1, the side surfaces close to the two heat dissipation plates 12 are fixedly connected with heat conduction plates 13, the side surfaces close to the two heat conduction plates 13 extend into the inside of the mounting cavity 2 through the through grooves 11, the lower heat conduction plate 13 is arranged in an inclined manner, the side surfaces close to the two heat conduction plates 13 are fixedly connected with second heat conduction plates 14, the side surfaces close to the two second heat conduction plates 14 are fixedly connected with heat dissipation fins 15, the arrangement of the heat dissipation plate 12, the heat conduction plate 13, the second heat conduction plate 14 and the heat dissipation fin 15 can effectively avoid that the temperature inside the mounting cavity 2 is too high, at the same time, there is no through hole directly connected with the outside, so that water can be prevented from entering, the safety of the circuit board 5 is ensured, and the heat dissipation plate 12 is flush with the surface of the earphone body 1, so that the hand feeling is not abnormal.
[0026] When the inside of the earphone body 1 is at a high temperature, the temperature can be transmitted to the second heat conduction plate 14 through the heat dissipation fin 15, and then transmitted to the heat conduction plate 13 through the second heat conduction plate 14, and finally transmitted to the outside air through the heat dissipation plate 12, so that the air temperature inside the mounting cavity 2 is effectively controlled, the temperature of the circuit board 5 is ensured to run, at the same time, when the earphone body 1 is accidentally dropped, the vertical impact force can be absorbed by the first rubber buffer ring 3, so that the first rubber buffer ring 3 is contracted, when the first rubber buffer ring 3 is contracted, the circuit board 5 is fixed to the mounting plate 4 through the fixing bolt 16, so that the circuit board 5 is driven to move synchronously, when the circuit board 5 moves, the bottom of the circuit board 5 can be protected from being damaged by the protection air bag 9, the vertical impact force is further absorbed, and by arranging the second rubber buffer ring 7 and the contact plate 8, when the first rubber buffer ring 3 is temporarily inclined due to the impact force, the body of the circuit board 5 can be prevented from directly contacting the inner wall of the mounting cavity 2, so that the side surface of the circuit board 5 is prevented from being damaged, and the overall impact resistance is improved.
[0027] Finally, it should be noted that: the above only describes the preferred embodiments of the present application and is not intended to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacement for some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A PCBA circuit board for a Bluetooth earphone, comprising an earphone body (1), characterized in that, The earphone body (1) is internally provided with an installation cavity (2), the bottom wall of the installation cavity (2) is fixedly connected with a first rubber buffer ring (3), the upper side of the first rubber buffer ring (3) is fixedly connected with an installation plate (4), the installation plate (4) is provided with a circuit board (5), the upper side surface of the circuit board (5) is provided with a heat dissipation groove (6) extending out of the lower side surface, the circuit board (5) is provided with a fixing bolt (16), the left and right side surfaces of the circuit board (5) are fixedly connected with second rubber buffer rings (7), the side surfaces of the two second rubber buffer rings (7) away from each other are fixedly connected with contact plates (8), the lower side surface of the circuit board (5) is fixedly connected with a protection air bag (9), and the lower side surface of the protection air bag (9) is fixedly connected with the upper side surface of the installation plate (4).
2. The PCBA circuit board for a Bluetooth earphone according to claim 1, wherein, The outer surface of the earphone body (1) is provided with two embedded grooves (10), and the inner walls of the side surfaces of the two embedded grooves (10) are provided with through grooves (11) extending into the installation cavity (2).
3. The PCBA circuit board for a Bluetooth earphone according to claim 2, wherein, The embedded groove (10) is fixedly connected with a heat dissipation plate (12), and the heat dissipation plate (12) is arranged in an arc shape.
4. The PCBA circuit board for a Bluetooth earphone according to claim 3, wherein, The surface of the heat dissipation plate (12) is flush with the outer surface of the earphone body (1).
5. The PCBA circuit board for a Bluetooth earphone according to claim 4, wherein, The side surfaces of the two heat dissipation plates (12) are fixedly connected with heat conduction plates (13), and the side surfaces of the two heat conduction plates (13) extend into the installation cavity (2) through the through grooves (11).
6. The PCBA circuit board for a Bluetooth earphone according to claim 5, wherein, The lower heat conduction plate (13) is arranged in an inclined manner.
7. The PCBA circuit board for a Bluetooth earphone according to claim 6, wherein, The side surfaces of the two heat conduction plates (13) are fixedly connected with second heat conduction plates (14).
8. The PCBA circuit board for a Bluetooth earphone according to claim 7, wherein, The side surfaces of the two second heat conduction plates (14) are fixedly connected with heat dissipation fins (15).