Falling-resistant miniature waterproof heat dissipation module

Abstract

The utility model discloses a drop-resistant miniature waterproof heat dissipation module, which comprises a base, a heat absorption bottom, a flexible circuit board assembly and a lead frame, the lead frame and the heat absorption bottom are integrally formed on the base through an insert injection molding process, the heat absorption bottom is embedded in the bottom surface of the base, the flexible circuit board assembly is arranged in an inner cavity of the base, and the lead frame is arranged in the inner cavity of the base. The lead frame is embedded in the side wall of the base, and one end of the lead frame extends to the inner cavity of the base and is in thermal compression welding with the flexible circuit board assembly. According to the utility model, the lead frame and the heat absorption bottom are directly embedded in the base through an insert injection molding process to form an integrated structure, so that a traditional FPC lead-out opening structure on the base is thoroughly eliminated, and the waterproof difficulty is fundamentally solved. Meanwhile, the lead frame, the heat absorption bottom and the base are combined more firmly through the insert injection molding technology, gaps generated by assembly of components in a traditional structure are eliminated, the waterproof performance is further improved, the overall structural strength is effectively enhanced, and falling impact and falling resistance are effectively resisted.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation technical field, concretely relates to a drop-resistant miniature waterproof heat dissipation module. BACKGROUND

[0002] With the continuous development of intelligent terminal products (such as notebook computers, tablet computers and mobile phones) to the light and thin direction, its heat dissipation assembly also faces higher design requirements. On the one hand, the heat dissipation assembly needs to achieve efficient heat dissipation in limited space; on the other hand, due to the accidental spilling of liquid in daily use, the waterproof performance of the heat dissipation assembly becomes a crucial design consideration.

[0003] Through in-depth research, it is found that the waterproof of the heat dissipation assembly is crucial to the lead-out structure of FPC (flexible printed circuit board) and the combination structure of the heat-absorbing bottom and the base. FPC is responsible for electrical connection between the inside and outside system of the fan, and its lead-out part is often the focus of waterproof design. However, the traditional FPC lead-out structure has many openings, which makes waterproofing a difficult point. In order to achieve waterproof effect, it is usually necessary to additionally increase the dispensing process, but this not only increases the production cost, but also may cause dispensing failure due to vibration. Therefore, developing a waterproof and vibration-resistant FPC lead-out structure has become an industry problem. At the same time, how to ensure that the heat-absorbing bottom and the base are tightly combined and waterproof is also a key problem to be solved. Solving these problems is crucial to improving the performance of the heat dissipation assembly. SUMMARY

[0004] In view of the above shortcomings, the purpose of the utility model is to provide a drop-resistant miniature waterproof heat dissipation module with good drop resistance and waterproof effect.

[0005] To achieve the above purpose, the technical scheme provided by the utility model is:

[0006] A drop-resistant miniature waterproof heat dissipation module, comprising a base, a heat-absorbing bottom, a flexible circuit board assembly and a lead frame, the flexible circuit board assembly is arranged in the inner cavity of the base, the lead frame and the heat-absorbing bottom are integrally formed on the base by insert injection molding process, wherein the heat-absorbing bottom is inlaid on the bottom surface of the base, the flexible circuit board assembly is arranged in the inner cavity of the base, the lead frame is inlaid on the side wall of the base, and one end of the lead frame extends into the inner cavity of the base and is thermally compression welded with the flexible circuit board assembly, and the other end extends to the outside of the base.

[0007] As a preferred scheme of the utility model, the end surface of the lead frame is tinned, which is more conducive to the realization of thermal compression welding process.

[0008] As a preferred scheme of the utility model, the edge position of the heat absorbing bottom is equipped with a dovetail groove. The dovetail groove structure makes the heat absorbing bottom and the plastic base tightly combined, and significantly improves the anti-falling performance of the module.

[0009] As a preferred scheme of the utility model, the base is coated with waterproof glue at the position corresponding to the heat pressure welding point of the lead frame through the point gluing process. Liquid intrusion is effectively blocked, and the waterproof level is improved.

[0010] As a preferred scheme of the utility model, the base is equipped with a groove extending along the contour line of the inner side position of the edge of the heat absorbing bottom, and the groove is coated with waterproof glue through the point gluing process. The groove design provides a space for glue, further enhancing the waterproof effect.

[0011] As a preferred scheme of the utility model, it further includes a heat dissipation fin, which is located in the inner cavity of the base and in contact with the heat absorbing bottom, and the upper surface of the heat dissipation fin is equipped with conductive foam. The heat dissipation fin can increase the heat dissipation area and improve the heat dissipation efficiency. At the same time, the direct contact between the heat absorbing bottom and the heat dissipation fin ensures that the heat can be quickly transferred from the heat absorbing bottom to the heat dissipation fin and dissipated.

[0012] As a preferred scheme of the utility model, it further includes a top cover, which covers the base, and the edge position of the top cover is equipped with a hook ear, and the base is equipped with a hook foot matched with the hook ear. By hooking the hook foot into the hook ear, not only is the assembly convenient, but also the assembly process is simplified, the production cost is reduced, the production efficiency is improved, the connection between the top cover and the base is more firm and reliable, the loosening or falling caused by vibration is prevented, and the overall anti-falling performance is improved.

[0013] As a preferred scheme of the utility model, an elastic waterproof gasket is arranged between the top cover and the base, which can ensure the sealing between the top cover and the base, effectively preventing liquid from penetrating. The upper surface of the heat dissipation fin is equipped with conductive foam. The conductive foam has the functions of conducting electricity and vibration isolation, can effectively absorb impact force, protect internal components, and prolong the service life of the product.

[0014] As a preferred scheme of the utility model, it further includes a coil group and a impeller group, the coil group is arranged on the flexible circuit board assembly, and the impeller group is arranged on the middle pipe of the base. The coil group includes a plurality of stator coils arranged in a replicated circular array on the flexible circuit board assembly; the impeller group includes a fan blade, a motor shell, a magnetic sheet and a shaft core, the shaft core is fixed at the center position of the motor shell, the fan blade is sleeved on the outer wall of the motor shell, and the magnetic sheet is arranged on the motor shell; the middle pipe of the base is provided with a bearing, and the shaft core is inserted into the bearing.

[0015] As a preferred scheme of the utility model, the length of the drop-resistant miniature waterproof heat dissipation module is ≤25mm, the width is ≤25mm, and the height is ≤6mm.

[0016] The utility model discloses the beneficial effect is: the utility model has reasonable structure design, directly inlaying lead frame and heat absorption bottom in base through insert injection molding process and forms integrated structure, completely eliminates traditional FPC lead-out opening structure on base, fundamentally solves waterproof difficulty.

[0017] The utility model is further illustrated below in connection with the drawings and examples. DRAWINGS

[0018] Figure 1 It is the three-dimensional structure schematic diagram of the utility model.

[0019] Figure 2 It is the sectional structure schematic diagram of the utility model.

[0020] Figure 3 It is the exploded structure schematic diagram of the utility model.

[0021] Figure 4 It is the bottom surface structure schematic diagram of the utility model Figure 1 .

[0022] Figure 5 It is the bottom surface structure schematic diagram of the utility model Figure 2 . Specific implementation

[0023] Example, see Figures 1 to 5 The utility model discloses a drop-resistant miniature waterproof heat dissipation module, which comprises a base 1, a heat absorption bottom 2, a flexible circuit board assembly 3, a lead frame 4, a coil group 5, an impeller group 6, a heat dissipation fin 7 and a top cover 8. In the embodiment, the length, the width and the height of the drop-resistant miniature waterproof heat dissipation module are 15*15*4.5mm.

[0024] The lead frame 4 and the heat absorbing bottom 2 are integrally formed on the base 1 by insert injection molding process. Specifically, the heat absorbing bottom 2 is inlaid on the bottom surface of the base 1, and preferably, a dovetail groove 21 is provided at the edge position of the heat absorbing bottom 2. The dovetail groove 21 structure enables the heat absorbing bottom 2 to be tightly combined with the plastic base 1, thereby significantly improving the drop resistance performance of the module. A groove 11 extending along the contour line of the edge inside of the heat absorbing bottom 2 is provided on the base 1, and the groove 11 is designed to provide a space for the glue. The groove 11 can be coated with waterproof glue by the dispensing process, thereby further enhancing the waterproof effect.

[0025] The flexible circuit board assembly 3 and the coil assembly 5 are arranged in the inner cavity of the base 1, and the flexible circuit board assembly 3 includes an FPC and electronic components arranged on the FPC. The lead frame 4 is inlaid on the side wall of the base 1, and one end of the lead frame 4 extends into the inner cavity of the base 1 and is thermally welded with the FPC of the flexible circuit board assembly 3 by a thermal compression welding process. Preferably, the end surface of the lead frame 4 is tinned, which is more conducive to the thermal compression welding process. After the thermal compression welding process is completed, waterproof glue can be coated at the position 12 of the base 1 corresponding to the thermal compression welding point of the lead frame 4 by the dispensing process, thereby effectively preventing liquid from entering and improving the waterproof level.

[0026] The heat dissipation fins 7 are located in the inner cavity of the base 1 and are in contact with the heat absorbing bottom 2. The heat dissipation fins 7 can increase the heat dissipation area and improve the heat dissipation efficiency. At the same time, the direct contact between the heat absorbing bottom 2 and the heat dissipation fins 7 ensures that the heat can be quickly transferred from the heat absorbing bottom 2 to the heat dissipation fins 7 and dissipated.

[0027] The top cover 8 is covered on the base 1, and preferably, an elastic waterproof gasket 10 is provided between the top cover 8 and the base 1. The elastic waterproof gasket 10 can ensure the sealing between the top cover 8 and the base 1, thereby effectively preventing liquid from entering. An electrically conductive foam 9 is provided between the top cover 8 and the heat dissipation fins 7. The electrically conductive foam 9 has the functions of electrical conduction and vibration isolation, can effectively absorb impact force, protect internal components, and prolong the service life of the product. A hook 81 is provided at the edge position of the top cover 8, and a hook 13 adapted to the hook 81 is provided on the base 1. By inserting the hook 13 into the hook 81, not only is the assembly convenient, but also the assembly process is simplified, the production cost is reduced, the production efficiency is improved, the connection between the top cover 8 and the base 1 is more firm and reliable, and the loosening or falling caused by vibration is prevented, thereby improving the overall drop resistance performance.

[0028] In the production and manufacturing process, the following steps are included:

[0029] (1) injection molding: the lead frame 4 and the heat absorbing bottom 2 are positioned in the injection mold in advance, then the molten plastic material is injected through the insert injection molding process to combine and solidify with the lead frame 4 and the heat absorbing bottom 2, and the base 1 with integrated structure is manufactured;

[0030] (2) fin welding: tin paste is brushed on the bottom surface of the heat dissipation fin 7, then the heat dissipation fin 7 is placed in the inner cavity of the base 1 and welded with the heat absorbing bottom 2 to be fixed together;

[0031] (3) hot-press welding: the flexible circuit board assembly 3 and the coil assembly 5 are loaded into the inner cavity of the base 1, the coil assembly 5 comprises a plurality of stator coils, and the plurality of stator coils are arranged in a replicative circumferential array on the FPC of the flexible circuit board assembly 3. The FPC is provided with four circuit pads 31, the inner end and the outer end of the lead frame 4 are respectively provided with four lead pads 41, the four lead pads 41 on the inner end of the lead frame 4 are welded with the four circuit pads 31 on the FPC through the hot-press welding process, and the four lead pads 41 on the outer end of the lead frame 4 can be connected with the fan control system, so that the electrical connection is realized;

[0032] (4) waterproof glue coating: the matching positions of the base 1, the FPC and related components are coated with waterproof glue 20, such as the hot-press welding position 12, and the specific coating positions are shown in Figure 4 and Figure 5 ;

[0033] (5) other part assembly: the wear-resistant sheet and the bearing are assembled in the middle pipe 13 of the base 1, and the back iron 14 is fixed on the bottom surface of the base 1;

[0034] (6) impeller assembly: the impeller assembly 6 comprises a fan blade, a motor shell, a magnetic sheet and a shaft core, the shaft core is fixed at the center position of the motor shell, the fan blade is sleeved on the outer wall of the motor shell, and the magnetic sheet is arranged on the motor shell; the shaft core of the impeller assembly 6 is aligned with the bearing and is loaded into the bearing;

[0035] (7) cotton ring assembly: the conductive foam 9 is attached to the top surface of the heat dissipation fin 7, and the elastic waterproof gasket 10 is assembled at the opening edge position of the inner cavity of the base 1;

[0036] (8) cover assembly: the top cover 8 is buckled on the opening of the inner cavity of the base 1, and the hook ear 81 on the top cover 8 is buckled with the hook leg 13 on the base 1, so that the drop-resistant miniature waterproof heat dissipation module is manufactured.

[0037] The drop-resistant miniature waterproof heat dissipation module has the following advantages:

[0038] 1. High strength and drop resistance: the integrated structure significantly enhances the overall strength and effectively resists drop impact.

[0039] 2. Excellent waterproof performance: the combination of dispensing process and insert injection molding effectively blocks the invasion of liquid and improves the waterproof level. The insert injection molding process makes the lead frame 4, heat absorbing bottom 2 and base 1 form an integral structure, completely eliminating the traditional FPC lead-out opening structure on the base 2, and fundamentally solving the waterproof difficulty. At the same time, the insert injection molding process makes the lead frame 4 and the heat absorbing bottom 2 and the base 1 combine more firmly, not only eliminating the gap caused by the assembly between the components in the traditional structure, but also further improving the waterproof performance.

[0040] 3. Reliable electrical connection: the lead frame 4 is tinned, and the FPC and the lead frame 4 are welded together by hot pressing welding process, ensuring long-term stable electrical connection between the FPC pads.

[0041] 4. Enhanced structural stability: the dovetail groove structure makes the heat absorbing bottom 2 and the base 1 tightly combined, significantly improving the drop resistance of the module.

[0042] 5. Strengthened waterproof performance: the groove design provides space for waterproof glue 20, further enhancing the waterproof effect.

[0043] 6. Improve impact resistance and shock absorption: increase conductive foam 9, effectively absorb impact force, protect internal components, prolong product life.

[0044] 7. Reliable waterproof seal: elastic waterproof gasket 10 ensures the sealing between top cover 8 and base 1, effectively preventing liquid from penetrating.

[0045] 8. Stable structural combination: the design of hook 13 and hook ear 81 ensures the tight combination of top cover 8 and base 1, improving the overall drop resistance.

[0046] 9. Simple and efficient assembly: the cooperation of hook 13 and hook ear 81 and the combination with gasket simplifies the assembly process, reduces production cost and improves production efficiency.

[0047] According to the disclosure and teaching of the above description, those skilled in the art of the present application can also make changes and modifications to the above embodiments. Therefore, the present application is not limited to the specific embodiments disclosed and described above, and some modifications and changes of the present application should fall within the protection scope of the claims of the present application. In addition, although some specific terms are used in the present specification, these terms are only for convenience of explanation and do not constitute any limitation on the present application. As described in the above embodiments of the present application, other heat dissipation modules obtained by using the same or similar structure are also within the scope of the present application.

Claims

1. A drop-resistant miniature waterproof heat dissipation module, comprising a base, a heat absorbing bottom and a flexible circuit board assembly, characterized in that, It also comprises a lead frame which is integrally formed on the base by insert injection molding process, wherein the heat absorbing bottom is inlaid on the bottom surface of the base, the flexible circuit board assembly is arranged in the inner cavity of the base, the lead frame is inlaid on the side wall of the base, and one end of the lead frame extends into the inner cavity of the base and is thermally compression welded with the flexible circuit board assembly, and the other end extends to the outside of the base. 2.The drop-resistant miniature waterproof heat dissipation module according to claim 1, characterized in that: The end surface of the lead frame is tinned. 3.The drop-resistant miniature waterproof heat dissipation module of claim 1, wherein: The edge position of the heat absorbing bottom is provided with a dovetail groove.

4. The drop-resistant miniature waterproof heat dissipation module according to claim 1, characterized in that: The base is coated with waterproof glue at the position corresponding to the thermal compression welding point of the lead frame.

5. The drop-resistant miniature waterproof heat dissipation module according to claim 1, characterized in that: The base is provided with a groove extending along the contour line at the position corresponding to the inner side of the edge of the heat absorbing bottom, and the groove is coated with waterproof glue. 6.The drop-resistant miniature waterproof heat dissipation module of claim 1, wherein: It also comprises a heat dissipation fin which is located in the inner cavity of the base and in contact with the heat absorbing bottom, and the upper surface of the heat dissipation fin is provided with conductive foam.

7. The drop-resistant miniature waterproof heat dissipation module according to claim 1, characterized in that: It also comprises a top cover which covers the base, the edge position of the top cover is provided with a hook ear, the base is provided with a hook leg matched with the hook ear, and an elastic waterproof gasket is arranged between the top cover and the base. 8.The drop-resistant miniature waterproof heat dissipation module of claim 1, wherein: It also comprises a coil assembly and an impeller assembly, the coil assembly is arranged on the flexible circuit board assembly, and the impeller assembly is arranged on the middle tube of the base. 9.The drop-resistant miniature waterproof heat dissipation module according to claim 8, characterized in that: The coil assembly comprises a plurality of stator coils arranged in a replicated circumferential array on the flexible circuit board assembly; the impeller assembly comprises a fan blade, a motor shell, a magnetic sheet and a shaft core, the shaft core is fixed at the center position of the motor shell, the fan blade is sleeved on the outer wall of the motor shell, and the magnetic sheet is arranged on the motor shell; the middle tube of the base is provided with a bearing, and the shaft core is inserted into the bearing. 10.The drop-resistant miniature waterproof heat dissipation module according to claim 9, characterized in that: The length thereof is ≤25mm, the width is ≤25mm, and the height is ≤6mm.

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