Duplex screen mounting structure
By combining a heat-conducting panel, semiconductor heat sink, and cooling fan with a water-cooling component in a multi-stage collaborative heat dissipation path, the problem of low heat dissipation efficiency in traditional dual-screen displays is solved, achieving efficient heat dissipation, extending equipment life and improving reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-03
- Publication Date
- 2026-03-27
AI Technical Summary
Traditional dual-screen heat dissipation methods are inefficient and cannot meet the heat dissipation requirements under high load operation. This results in high-temperature environments that affect display performance, shorten device lifespan, and pose safety hazards.
The heat dissipation plate assembly, which uses a heat-conducting panel, a semiconductor heat sink, and a cooling fan to work together, combined with a water-cooling component, forms a stepped heat dissipation path, including multi-level collaborative heat dissipation of the heat-conducting panel, the semiconductor heat sink, the cooling fan, and the circulating coolant.
It improves heat dissipation efficiency, prevents dual screens from degrading or malfunctioning due to overheating, extends service life, and ensures stable operation under high load scenarios.
Smart Images
Figure CN224054642U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model mainly relates to double screen mounting technical field, concretely relates to a double screen mounting structure. BACKGROUND
[0002] In the traditional double screen mounting structure, the heat dissipation mode is relatively single, and most of them only rely on natural heat dissipation or simple air cooling heat dissipation. Natural heat dissipation completely relies on the temperature difference between the equipment itself and the surrounding environment to exchange heat, and the efficiency is extremely low, which is difficult to meet the heat dissipation demand of double screen in high load operation. And simple air cooling heat dissipation, usually only installs one or several ordinary fans in the equipment, and removes part of heat through air flow. But due to the limited wind power of the fan, and the poor heat conduction performance of air, for the large amount of heat generated by double screen, air cooling heat dissipation often cannot meet the demand, resulting in that double screen is in high temperature working state for a long time.
[0003] High temperature environment will bring many adverse effects to double screen. On the one hand, too high temperature will reduce the activity of liquid crystal molecules of display screen, and then affect the display effect of screen, color distortion, image blur and other problems, which seriously reduces the user experience. On the other hand, high temperature will also accelerate the aging of electronic components, shorten the service life, and increase the probability of equipment failure. For the application scene such as vehicle-mounted system which has very high requirement on reliability, it may cause serious safety hazard. UTILITY MODEL CONTENT
[0004] 1. The technical problem to be solved by the utility model:
[0005] The utility model provides a double screen mounting structure to solve the technical problems in the above background technology.
[0006] 2. Technical scheme:
[0007] In order to achieve the above purpose, the utility model provides a technical scheme: a double screen mounting structure, comprising a mounting frame, a double screen assembly is arranged on the mounting frame, the mounting frame comprises a mounting frame and a back plate, the double screen assembly is installed on the mounting frame, the mounting frame is provided with a heat dissipation plate assembly and a water cooling heat dissipation assembly, the heat dissipation plate assembly is in contact with the double screen assembly, and the water cooling heat dissipation assembly is arranged on the heat dissipation plate assembly.
[0008] Preferably, the mounting frame is provided with connecting holes on four corners, connecting pieces are arranged in the connecting holes, screw holes are arranged on the connecting pieces, and the back plate is fixedly connected with the screw holes on the mounting frame through screws.
[0009] Preferably, the heat dissipation plate assembly comprises a heat conduction panel, a heat conduction frame one is arranged on the mounting frame, the heat conduction frame one forms a mounting cavity of the heat conduction panel, the heat conduction panel is fixed in the mounting cavity through fixing bolts, one end of the heat conduction panel is in contact with the double screen assembly, and the other end is provided with a mounting groove at the center, and a semiconductor heat dissipation fin is arranged in the mounting groove.
[0010] Preferably, the mounting groove is further provided with a heat dissipation fan, the heat dissipation fan is arranged on the side, away from the heat conduction panel, of the semiconductor heat dissipation fin, a plurality of heat dissipation fins one are equidistantly arranged on the heat conduction panel, and the heat dissipation fins one are arranged around the mounting groove.
[0011] Preferably, the water-cooled heat dissipation assembly comprises a heat conduction frame two, the heat conduction frame two is arranged outside the heat conduction frame one, a circulating pipe is arranged in the heat conduction frame two, the circulating pipe is arranged around the heat conduction panel, and the circulating pipe is connected with a circulating pump.
[0012] Preferably, the heat conduction panel is further provided with a heat conduction block, the heat conduction block is in contact with the heat conduction frame two, a plurality of heat dissipation fins two are arranged on the heat conduction panel, and the circulating pipe penetrates the heat dissipation fins two.
[0013] 3. Beneficial effects:
[0014] Compared with the prior art, the technical scheme has the following beneficial effects:
[0015] The heat conduction panel, the semiconductor heat dissipation fin and the heat dissipation fan in the heat dissipation plate assembly work cooperatively, and can rapidly dissipate the heat generated by the double screen assembly. The water-cooled heat dissipation assembly further enhances the heat dissipation effect through circulating cooling liquid, and effectively prevents the double screen from performance degradation or failure due to overheating. The heat conduction plate conduction, the semiconductor active refrigeration, the air-cooled forced convection and the water-cooled circulation are integrated, a ladder type heat dissipation path is formed, the screen temperature is gradually reduced, compared with a single heat dissipation mode, the multi-stage cooperation improves the heat dissipation efficiency, and the heat dissipation efficiency is particularly high in a double screen high load scene. The heat dissipation fins one equidistantly arranged on the heat conduction panel and the heat dissipation fins two around the heat conduction panel are helpful to uniformly distribute the heat, avoid local overheating and prolong the service life of the double screen assembly. BRIEF DESCRIPTION OF DRAWINGS
[0016] Fig. 1 It is a whole structure schematic view of the utility model;
[0017] Fig. 2 It is a structure schematic view of the utility model omitting a back plate;
[0018] Fig. 3 It is a mounting frame structure schematic view of the utility model;
[0019] Fig. 4 Structure diagram of the heat dissipation plate assembly of the utility model;
[0020] Fig. 5 Structure diagram of the heat conduction block of the utility model.
[0021] Reference signs:
[0022] 1, double screen assembly; 2, mounting frame; 21, heat conduction frame one; 22, connecting piece; 23, connecting hole; 24, fixing bolt; 25, mounting cavity; 3, back plate; 4, heat dissipation plate assembly; 41, heat conduction panel; 42, mounting groove; 43, semiconductor heat dissipation fin; 44, heat dissipation fan; 45, heat dissipation fin one; 46, heat conduction block; 47, heat dissipation fin two; 5, water-cooled heat dissipation assembly; 51, heat conduction frame two; 52, circulating pipe. DETAILED DESCRIPTION
[0023] In order to facilitate the understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings, the drawings show several embodiments of the utility model, however, the utility model can be realized in many different forms, and is not limited to the embodiments described herein, on the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.
[0024] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "page", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.
[0025] In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0026] In the utility model, unless another definite provision and limitation, the terms "mount", "link", "connect", "fix", "have" and so on should be broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connect, can be mechanical connection, also can be electrical connection, can be direct connection, also can indirectly connect through intermediate medium, can be two element internal communication. For ordinary skilled person in the art, the above terms can be understood according to specific circumstances the specific meaning of the utility model.
[0027] It should be noted that the structures not introduced in the utility model are the same as the prior art or can be implemented using the prior art since they do not involve the design points and improvement direction of the utility model, and therefore will not be described in detail here. Embodiment
[0028] Refer to the accompanying Figs. 1-5 A double screen mounting structure, comprising a mounting rack, a double screen assembly 1 is arranged on the mounting rack, the mounting rack comprises a mounting frame 2 and a back plate 3, the double screen assembly 1 is installed on the mounting frame 2, a heat dissipation plate assembly 4 and a water-cooled heat dissipation assembly 5 are arranged on the mounting frame 2, the heat dissipation plate assembly 4 is in contact with the double screen assembly 1, and the water-cooled heat dissipation assembly 5 is arranged on the heat dissipation plate assembly 4.
[0029] Connecting holes 23 are arranged on four corners of the mounting frame 2, connecting pieces 22 are arranged in the connecting holes 23, screw holes are arranged on the connecting pieces 22, and the back plate 3 is fixedly connected with the screw holes on the mounting frame 2 through screws.
[0030] The heat dissipation plate assembly 4 comprises a heat conduction panel 41, a heat conduction frame one 21 is arranged on the mounting frame 2, the heat conduction frame one 21 forms a mounting cavity 25 of the heat conduction panel 41, the heat conduction panel 41 is fixed in the mounting cavity 25 through fixing bolts 24, one end of the heat conduction panel 41 is in contact with the double screen assembly 1, a mounting groove 42 is arranged at the center of the other end of the heat conduction panel 41, and semiconductor heat dissipation fins 43 are arranged in the mounting groove 42.
[0031] A heat dissipation fan 44 is further arranged on the mounting groove 42, the heat dissipation fan 44 is arranged on the side, away from the heat conduction panel 41, of the semiconductor heat dissipation fin 43, a plurality of heat dissipation fins one 45 are equidistantly arranged on the heat conduction panel 41, and the heat dissipation fins one 45 are arranged around the four peripheries of the mounting groove 42.
[0032] The water-cooled heat dissipation assembly 5 comprises a heat conduction frame two 51, the heat conduction frame two 51 is arranged outside the heat conduction frame one 21, a circulating pipe 52 is arranged in the heat conduction frame two 51, the circulating pipe 52 is arranged around the heat conduction panel 41, and the circulating pipe 52 is connected with a circulating pump.
[0033] The heat-conducting panel 41 is also provided with a heat-conducting block 46 in contact with the heat-conducting frame two 51. The heat-conducting panel 41 is provided with a plurality of heat-dissipating fins two 47. The circulating pipe 52 is arranged in the heat-dissipating fins two 47.
[0034] Working principle: The double-screen assembly 1 generates a large amount of heat during operation. Since the heat-conducting panel 41 of the heat-dissipating panel assembly 4 is in contact with the double-screen assembly 1, according to the principle of heat transfer, heat will be conducted from the high-temperature double-screen assembly 1 to the low-temperature heat-conducting panel 41. Because the heat-conducting panel 41 has good heat-conducting performance, it can quickly absorb and dissipate the heat generated by the double-screen assembly 1, preventing the heat from accumulating locally in the double-screen assembly 1.
[0035] After one end of the heat-conducting panel 41 absorbs heat, the semiconductor heat-dissipating fin 43 in the installation groove 42 at the other end begins to work. Based on the Peltier effect, when an electric current passes through, a temperature difference is generated at both ends of the semiconductor heat-dissipating fin 43, one end absorbs heat, and the other end releases heat. Here, the semiconductor heat-dissipating fin 43 absorbs the heat absorbed by the heat-conducting panel 41 from the end in contact with the double-screen assembly 1, and then releases it at the end away from the double-screen assembly 1, thereby reducing the temperature of the end of the heat-conducting panel 41 in contact with the double-screen assembly 1, and achieving active refrigeration of the double-screen assembly 1.
[0036] After the semiconductor heat-dissipating fin 43 releases heat to the end away from the double-screen assembly 1, in order to speed up the dissipation of this part of heat, the heat-dissipating fan 44 on the installation groove 42 starts to operate. Through forced convection, the heat-dissipating fan 44 accelerates air flow, causing the surrounding air to quickly flow over the side of the semiconductor heat-dissipating fin 43 that releases heat, carrying away the heat and preventing heat accumulation in that area, further improving heat dissipation efficiency. The heat exchange between the heat-dissipating fin one 45 and the air enables the heat on the heat-conducting panel 41 to be dissipated more quickly to the surrounding environment.
[0037] The circulating pump of the water-cooled heat-dissipating assembly 5 is started, driving the cooling liquid in the circulating pipe 52 to circulate. The circulating pipe 52 is arranged around the heat-conducting panel 41 and is in close contact with the heat-conducting block 46 and the heat-conducting frame two 51 on the heat-conducting panel 41. The heat on the heat-conducting panel 41 is transferred to the cooling liquid in the circulating pipe 52 through the heat-conducting block 46 and the heat-conducting frame two 51. At the same time, the circulating pipe 52 is arranged in the heat-dissipating fins two 47, and the heat on the heat-dissipating fins two 47 is also transferred to the cooling liquid in the circulating pipe 52. The cooling liquid continuously absorbs heat during circulation and then carries the heat to other parts of the water-cooled heat-dissipating system for cooling, such as dissipating heat to the external environment through a radiator, thereby keeping the heat-conducting panel 41 at a relatively low temperature and achieving continuous cooling of the double-screen assembly 1. Through this water-cooled heat-dissipating method, a large amount of heat can be carried away more efficiently, especially when the double-screen assembly 1 generates a large amount of heat, effectively maintaining its operating temperature within a reasonable range.
[0038] The above-described embodiments only express certain implementation manners of the present application, and the description is relatively specific and detailed, but should not be understood as a limitation on the scope of the present application; it should be pointed out that, for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application; therefore, the protection scope of the present application patent should be subject to the appended claims.
Claims
1. A twin screen mounting structure comprising a mounting frame, a twin screen assembly (1) being provided on the mounting frame, characterized in that: The mounting frame comprises a mounting frame (2) and a back plate (3), the double screen assembly (1) is mounted on the mounting frame (2), the mounting frame (2) is provided with a heat dissipation plate assembly (4) and a water-cooled heat dissipation assembly (5), the heat dissipation plate assembly (4) is in contact with the double screen assembly (1), and the water-cooled heat dissipation assembly (5) is arranged on the heat dissipation plate assembly (4).
2. The dual screen mounting structure of claim 1, wherein: The mounting frame (2) is provided with connecting holes (23) at four corners, connecting pieces (22) are arranged in the connecting holes (23), the connecting pieces (22) are provided with screw holes, and the back plate (3) is fixedly connected with the screw holes on the mounting frame (2) through screws.
3. The dual screen mounting structure of claim 1, wherein: The heat dissipation plate assembly (4) comprises a heat conduction panel (41), the mounting frame (2) is provided with a heat conduction frame one (21), the heat conduction frame one (21) forms a mounting cavity (25) of the heat conduction panel (41), the heat conduction panel (41) is fixed in the mounting cavity (25) through fixing bolts (24), one end of the heat conduction panel (41) is in contact with the double screen assembly (1), and the other end is provided with a mounting groove (42) at the center, and the mounting groove (42) is provided with a semiconductor heat dissipation fin (43).
4. The dual screen mounting structure of claim 3, wherein: The mounting groove (42) is also provided with a heat dissipation fan (44), the heat dissipation fan (44) is arranged on the side, away from the heat conduction panel (41), of the semiconductor heat dissipation fin (43), a plurality of heat dissipation fins one (45) are arranged at equal distances on the heat conduction panel (41), and the heat dissipation fins one (45) are arranged around the mounting groove (42).
5. The dual screen mounting structure of claim 3, wherein: The water-cooled heat dissipation assembly (5) comprises a heat conduction frame two (51), the heat conduction frame two (51) is arranged outside the heat conduction frame one (21), the heat conduction frame two (51) is provided with a circulating pipe (52), the circulating pipe (52) is arranged around the heat conduction panel (41), and the circulating pipe (52) is connected with a circulating pump.
6. The dual screen mounting structure of claim 5, wherein: The heat conduction panel (41) is also provided with a heat conduction block (46), the heat conduction block (46) is in contact with the heat conduction frame two (51), a plurality of heat dissipation fins two (47) are arranged on the heat conduction panel (41), and the circulating pipe (52) penetrates the heat dissipation fins two (47).