Wafer box loading system

Abstract

The utility model relates to the technical field of semiconductors, in particular to a wafer box loading system, which comprises a mounting frame, a loading platform, a box opener, a detection component, a lifting module and a horizontal module, the loading platform and the box opener are mounted on the mounting frame, the detection component is mounted on the box opener, the lifting module is mounted on the mounting frame, and the horizontal module is in driving connection with the lifting module. The box opener is used for clamping a box cover on the wafer box, the detection component is used for detecting wafers in the wafer box, and when the wafer box is installed on the loading platform, the opening side of the wafer box corresponds to the box opener; the mounting frame is provided with a loading space, the loading platform and the box opener are located on the two sides of the loading space respectively, and the loading platform is used for mounting a wafer box and driving the wafer box to be close to or away from the mounting frame in the front-back direction; according to the utility model, the loading of the wafer box and the detection of the wafer can be smoothly realized, the loading and the transportation of a larger substrate are facilitated, and the requirement of fan-out panel-level packaging can be met.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially a wafer box loading system. BACKGROUND

[0002] Fan-out panel level package (FOPLP) is a packaging technology based on re-distribution layer (RDL) process, which redistributes chips on a large panel for interconnection. FOPLP technology replaces the role of substrate signal transmission in traditional packaging through RDL, so that fan-out packaging can not need substrate, and the height of chip product will be lower. FOPLP adopts a larger substrate size, and the substrate size of FOPLP is 500mm, which provides cost-effective large-size interconnection, so that the area utilization rate of FOPLP is as high as 95%, much higher than 85% of substrate level fan-out packaging, effectively reducing waste, and being able to process more chips in one packaging process, significantly improving packaging efficiency. Due to high output efficiency and less material loss, FOPLP has strong cost advantage.

[0003] The existing mainstream open box machine (FOUP) is mainly designed for processing 300mm (12 inches) substrate, and the design of FOUP is based on the standard size of 300mm substrate. There are strict size standards in the semiconductor industry, and the design of equipment and tools follows these standards, so the internal structure, size and transmission mechanism of FOUP are specially designed for 300mm substrate.

[0004] The existing mainstream open box machine adopts independent supports for mapping and opening box mechanism, and the two independent supports occupy the internal space of FOUP, which is not conducive to loading and transporting larger substrate size, resulting in that the existing mainstream open box machine is limited to the transmission of 300mm substrate. UTILITY MODEL CONTENTS

[0005] The utility model provides a wafer box loading system in view of the deficiency of prior art, and successfully realizes the loading of wafer box and the detection of wafer, is favorable to loading and transporting larger substrate, and is convenient for meeting the demand of fan-out panel level package.

[0006] In order to solve the above technical problem, the utility model adopts the following technical scheme:

[0007] The utility model provides a wafer box loading system, including mounting frame, loading platform and open box machine of mounting in mounting frame, detection component of mounting in open box machine, lifting module of mounting in mounting frame and horizontal module of driving connection with lifting module, horizontal module is drivingly connected with open box machine, open box machine is used for clamping the lid of wafer box, detection component is used for detecting wafer in wafer box, when wafer box is installed on loading platform, the opening side of wafer box corresponds with open box machine;

[0008] The mounting rack is provided with a loading space, and the loading platform and the box opener are respectively located on two sides of the loading space, and the loading platform is used for mounting a wafer box and driving the wafer box to move close to or away from the mounting rack in the front-back direction;

[0009] When it is needed to detect a wafer, the wafer box loaded with the wafer is mounted on the loading platform, the loading platform drives the wafer box to move close to the mounting rack, so that the wafer box moves to a required position, the lifting mechanism drives the box opener to move to a required height, and the horizontal module drives the box opener to move close to the loading space, so that one end of the box opener is inserted into the loading space; the box opener clamps the box cover on the wafer box, the horizontal module drives the box opener to move away from the wafer box to a required position, so that the opening side of the wafer box is exposed, and the lifting mechanism drives the box opener to move in the up-down direction, so that the detection component synchronously detects the wafer in the wafer box while moving with the box opener.

[0010] The loading platform comprises a loading frame mounted on the mounting rack, a loading table slidingly connected to the loading frame in the front-back direction, at least three positioning members mounted on the loading table, a clamping mechanism mounted on the loading table, and a loading driving unit mounted on the loading frame, the loading driving unit is drivingly connected with the loading table, and the loading driving unit is used for driving the loading table to move close to or away from the mounting rack in the front-back direction;

[0011] When it is needed to mount the wafer box, the wafer box is placed on the loading table, the positioning members are inserted into the positioning holes in the bottom of the wafer box, the wafer box and the loading table are accurately positioned, and the wafer box and the loading table are locked by the clamping mechanism.

[0012] The clamping mechanism comprises a clamping member hinged to the loading table and a clamping driving unit with an output end hinged to the clamping member, the mounting end of the clamping driving unit is hinged to the loading table, the loading table is provided with a clamping opening, and the clamping member is provided with a clamping portion;

[0013] When it is needed to lock the wafer box and the loading table, the wafer box is positioned on the loading table, the clamping driving unit drives the clamping member to rotate, the clamping portion is driven to pass through the clamping opening, so that the clamping portion hooks the bottom of the wafer box;

[0014] When it is needed to unlock the wafer box and the loading table, the clamping driving unit drives the clamping member to rotate, the clamping portion is driven to be separated from the bottom of the wafer box and to be retracted into the clamping opening, so that the wafer box and the loading table are unlocked.

[0015] The bottom of the loading table is elastically connected with a pressing sensor, when the wafer box and the loading table are positioned, the bottom of the wafer box presses the pressing sensor, the pressing sensor is triggered, and it is determined that the wafer box is mounted on the loading table.

[0016] The inner side of the carrier is provided with a pressing seat, the carrier is provided with a pressing hole, a pressing guide column is slidably connected to the pressing seat, the pressing guide column is connected with a pressing sensor, the pressing sensor penetrates through the pressing hole, a reset component is connected between the pressing seat and the pressing guide column, and the pressing sensor is located at an initial position when the reset component is in a normal state.

[0017] The bottom end of the pressing hole is coaxially penetrated by an anti-dropping hole, the diameter of the anti-dropping hole is greater than that of the pressing hole, the pressing guide column is slidably fitted in the anti-dropping hole, and the top end of the pressing guide column abuts against the top wall of the anti-dropping hole when the reset component is in the normal state.

[0018] The loading driving unit comprises a loading motor mounted on the loading frame, a first chain wheel connected with the loading motor, a lead screw rotationally connected to the loading frame, a second chain wheel connected with one end of the lead screw, a chain connected between the first chain wheel and the second chain wheel, and a sliding block threadedly connected to the lead screw, one side of the sliding block abutting against the loading frame, and the sliding block being connected with the carrier.

[0019] When it is required to drive the carrier to move in the front-rear direction, the loading motor drives the first chain wheel to rotate, drives the lead screw to rotate under the action of the chain and the second chain wheel, and drives the sliding block to move on the loading frame in the front-rear direction, so that the carrier approaches or moves away from the mounting frame in the front-rear direction.

[0020] The bottom of the carrier is provided with a insertion hole, one end of the sliding block is provided with a insertion pin, the insertion hole is matched with the insertion pin, the loading frame is provided with a movable space, the sliding block penetrates through the movable space, and the loading driving unit is located on the side of the loading frame away from the carrier.

[0021] The mounting frame is provided with a protective cover, the lifting module and the horizontal module are located on the inner side of the protective cover, the mounting frame is provided with a lifting space, the output end of the horizontal module is connected with a support, the support is connected with the box opener, and the support penetrates through the lifting space.

[0022] The length and width of the support in the lifting space are L and M respectively, and the width of the lifting space is H; L, M and H satisfy M < L < H.

[0023] The utility model discloses the beneficial effect:

[0024] The loading and detection of the wafer box are successfully realized, the detection component and the box opener are integrated, the independent detection component mounting bracket is saved, the coverage area of the box opener in the loading space is effectively improved, the larger substrate is beneficial to load and transport, and therefore the substrate size 500mm substrate size transport is met, and the demand of the fan-out panel level packaging is met. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 Figure 1 is a front view of the wafer box loading system.

[0026] Figure 2 Figure 2 is a perspective view of the wafer box loading system when the opener is away from the mounting frame.

[0027] Figure 3 Figure 3 is a perspective view of the wafer box loading system.

[0028] Figure 4 Figure 4 is a sectional view of the mounting structure of the clamping mechanism.

[0029] Figure 5 Figure 5 is an exploded view of the partial structure of the loading platform.

[0030] Figure 6 Figure 6 is a perspective view of the connection structure of the press sensor and the press seat.

[0031] Figure 7 Figure 7 is a sectional view of the mounting structure of the press sensor and the press seat.

[0032] Figure 8 Figure 8 is a structural schematic view of the loading platform.

[0033] Figure 9 Figure 9 is a perspective view of the mounting structure of the loading driving unit.

[0034] Figure 10 Figure 10 is an exploded view of the opener, the mounting frame and the support.

[0035] Figure 11 Figure 11 is a front view of the partial structure of the support, the mounting frame and the opener.

[0036] 1, mounting frame; 101, loading space; 102, lifting space; 11, protective cover;

[0037] 2, loading platform;

[0038] 21, loading frame; 211, movable space; 22, loading platform;

[0039] 221, clamping opening; 222, press hole; 223, anti-dropping hole; 224, insertion hole;

[0040] 23, positioning member; 24, clamping mechanism;

[0041] 241, clamping member; 2411, clamping part; 242, clamping driving unit;

[0042] 251, loading motor; 252, first sprocket; 253, screw rod; 254, second sprocket;

[0043] 255, chain; 256, sliding block; 2561, latch

[0044] 3. Box opener;

[0045] 4. Detection component;

[0046] 5. Lifting module; 6. Horizontal module; 61. Support;

[0047] 7. Pressing sensor;

[0048] 701. Pressing seat; 702. Pressing guide column; 703. Reset component. DETAILED DESCRIPTION

[0049] For the convenience of those skilled in the art, the present application will be further described below in conjunction with the embodiments and the accompanying drawings. The specific embodiments of the present application will be described below, and it should be noted that, in the specific description of these embodiments, the present specification cannot describe all the features of the actual embodiments in detail for the sake of brevity and conciseness.

[0050] Reference Figures 1 to 11 As shown in the drawings, the utility model provides a wafer box loading system, including mounting frame 1, install in mounting frame 1's loading platform 2 and box opener 3, install in detection component 4 of box opener 3, install in lifting module 5 of mounting frame 1 and with lifting module 5 drive connection's horizontal module 6, horizontal module 6 and box opener 3 drive connection, box opener 3 is used to clamp the box cover on wafer box, detection component 4 is used to detect wafer inside wafer box, when wafer box is installed in loading platform 2, the opening side of wafer box corresponds with box opener 3, mounting frame 1 is provided with loading space 101, loading platform 2 and box opener 3 are located respectively both sides of loading space 101, loading platform 2 is used to install wafer box and drive wafer box to approach or away from mounting frame 1 along the front and back direction.

[0051] Reference Figure 1 , 2As shown, in actual application, the motor module, oil cylinder or electric cylinder of the lifting module 5 and the horizontal module 6 are used to detect the wafer. When the wafer needs to be detected, the wafer box loaded with the wafer is installed on the loading platform 2, and the wafer box is driven by the loading platform 2 to approach the mounting frame 1, so that the wafer box is moved to the required position, and the front end of the wafer box is inserted into the loading space 101, reducing the exchange of internal and external media of the wafer box, preventing the pollution of the inside of the wafer box; the lifting mechanism drives the box opener 3 to move to the required height, and the horizontal module 6 drives the box opener 3 to approach the loading space 101, so that one end of the box opener is inserted into the loading space 101, and the box opener is sealed at the connection of the loading space 101, reducing the exchange of internal and external media between the wafer box and the box opener 3, preventing the pollution of the inside of the wafer box; the box opener 3 clamps the box cover on the wafer box, and the horizontal module 6 drives the box opener 3 to move away from the wafer box to the required position, so that the opening side of the wafer box is exposed. The box opener 3 is a prior art, and the wafer box cover is clamped smoothly, so it is not described in detail. The lifting mechanism drives the box opener 3 to move in the up-down direction. The detection component 4 can detect the wafer from top to bottom, and at this time the detection component 4 is installed on the top of the box opener 3. The detection component 4 can also detect the wafer from bottom to top, and at this time the detection component 4 is installed on the bottom of the box opener 3. According to the detection result, the manipulator grasps the wafer to perform corresponding operation, so that the detection component 4 synchronously detects the wafer in the wafer box while following the movement of the box opener 3. The detection component 4 is a wafer detection sensor, which realizes surface defect detection, film thickness measurement, metallization detection, wafer flatness detection, temperature and humidity detection of the wafer, etc., to ensure the yield and performance of the wafer, and smoothly realize the loading of the wafer box and the detection of the wafer. By integrating the detection component 4 and the box opener 3, the independent installation support of the detection component 4 is saved, the coverage area of the box opener 3 in the loading space 101 is effectively improved, the loading and transportation of larger substrates are facilitated, and the transportation of substrates with a size of 500mm is facilitated, thereby meeting the needs of fan-out panel level packaging.

[0052] Reference Figure 3 , 4 As shown, in the embodiment, the loading platform 2 includes a loading frame 21 installed on the mounting frame 1, a stage 22 slidably connected to the loading frame 21 in the front-rear direction, at least three positioning members 23 installed on the stage 22, a clamping mechanism 24 installed on the stage 22, and a loading driving unit installed on the loading frame 21. The loading driving unit is drivingly connected with the stage 22, and is used to drive the stage 22 to approach or move away from the mounting frame 1 in the front-rear direction. In actual application, when the wafer box needs to be installed, the wafer box is placed on the stage 22, and the positioning members 23 are inserted into the positioning holes at the bottom of the wafer box to realize the accurate positioning of the wafer box and the stage 22. The wafer box and the stage 22 are locked by the clamping mechanism 24, which facilitates the rapid loading of the wafer box.

[0053] Reference Figure 4As shown, in this embodiment, the clamping mechanism 24 includes a clamping piece 241 hinged to the carrier 22 and a clamping driving unit 242 hinged to the clamping piece 241, and the mounting end of the clamping driving unit 242 is hinged to the carrier 22. The carrier 22 is provided with a clamping opening 221, and the clamping piece 241 is provided with a clamping portion 2411.

[0054] In actual application, the wafer box has a cavity corresponding to the clamping portion 2411. When it is needed to lock the wafer box and the carrier 22, the wafer box is positioned on the carrier 22, the clamping driving unit 242 is a pneumatic cylinder or an oil cylinder, the clamping driving unit 242 drives the clamping piece 241 to rotate, drives the clamping portion 2411 to pass through the clamping opening 221, so that the clamping portion 2411 extends into the cavity to hook the bottom of the wafer box, thereby facilitating the locking of the wafer box and the carrier 22. When it is needed to unlock the wafer box and the carrier 22, the clamping driving unit 242 drives the clamping piece 241 to rotate, drives the clamping portion 2411 to separate from the bottom of the wafer box and retract into the clamping opening 221, so that the wafer box and the carrier 22 are unlocked, thereby facilitating the automatic transmission of the wafer box by the overhead crane and ensuring the continuity and efficiency of the production process.

[0055] Referring to Figure 5 , 7 As shown, in this embodiment, the bottom of the carrier 22 is elastically connected with a pressing sensor 7. When the wafer box is positioned on the carrier 22, the bottom of the wafer box presses the pressing sensor 7, so that the pressing sensor 7 is triggered. The pressing sensor 7 can sense the pressing force from the outside, and the pressing force is specifically the force acting on the pressing sensor 7 when the wafer box is placed on the carrier 22. The pressing sensor 7 can convert the mechanical force into an electrical signal. The signal can be recognized and processed by an external device to determine whether the wafer box is installed on the carrier 22, so as to perform corresponding operations and ensure the continuity and efficiency of the production process.

[0056] Referring to Figure 6 , 7 As shown, in this embodiment, the inner side of the carrier 22 is provided with a pressing seat 701, the carrier 22 is provided with a pressing hole 222, the pressing seat 701 is connected with a pressing guide column 702 in a sliding manner, the pressing guide column 702 is connected with the pressing sensor 7, the pressing sensor 7 is arranged in the pressing hole 222, and a reset component 703 is connected between the pressing seat 701 and the pressing guide column 702. When the reset component 703 is in a normal state, the pressing sensor 7 is located at an initial position, and the reset component 703 is a spring. When the pressing sensor 7 is subjected to a force, it is detected that the wafer box is placed on the carrier 22, and the reset component 703 is compressed. When the pressing sensor 7 loses the external force, the pressing sensor 7 is driven to move upward under the elastic force of the reset component 703 until the pressing sensor 7 is located at the initial position, thereby facilitating the repeated detection of whether the subsequent wafer box is placed on the carrier 22.

[0057] Referring to Figure 7 , 8 As shown in the drawings, in this embodiment, the bottom end of the pressing hole 222 is coaxially penetrated by an anti-falling hole 223, the diameter of the anti-falling hole 223 is greater than that of the pressing hole 222, the pressing guide column 702 is slidingly fitted in the anti-falling hole 223, so as to ensure that the pressing guide column 702 stably slides in the anti-falling hole 223; when the reset component 703 is in the normal state, the top end of the pressing guide column 702 abuts against the top wall of the anti-falling hole 223, so as to facilitate positioning the position of the pressing guide column 702, so that when the reset component 703 is in the normal state, i.e., when the reset component 703 is not subjected to external force, the position of the pressing guide column 702 can remain unchanged, thereby enabling the pressing sensor 7 to stably return to the initial position when not subjected to external force, and facilitating improvement of the detection accuracy of the pressing sensor 7.

[0058] Referring to Figure 5 , 9 As shown in the drawings, in this embodiment, the loading driving unit comprises a loading motor 251 mounted on the loading frame 21, a first sprocket 252 connected with the loading motor 251, a lead screw 253 rotationally connected with the loading frame 21, a second sprocket 254 connected with one end of the lead screw 253, a chain 255 connected between the first sprocket 252 and the second sprocket 254, and a sliding block 256 threadedly connected with the lead screw 253, one side of the sliding block 256 abutting against the loading frame 21, and the sliding block 256 being connected with the loading platform 22; in actual application, the loading motor 251 is a servo motor, a stepping motor, a linear motor or a permanent magnet synchronous motor, the wafer box is loaded on the loading platform 22, the loading motor 251 drives the first sprocket 252 to rotate, and drives the lead screw 253 to rotate under the action of the chain 255 and the second sprocket 254, since one side of the sliding block 256 abuts against the loading frame 21, the sliding block 256 is limited from rotating relative to the loading frame 21, and is smoothly driven to move back and forth on the loading frame 21, so as to smoothly drive the loading platform 22 and the wafer box to approach or move away from the mounting rack 1 along the front and back directions, the wafer box approaching the mounting rack 1 can reduce the time of the wafer being exposed to the external environment during the conveying process, reduce the risk of pollution or damage, save clean room space, and improve the space utilization rate; the wafer box moving away from the mounting rack 1 can avoid mechanical collision or misoperation when needed, protect the wafer, and also can leave more space for other equipment or operation, so as to facilitate flexible adjustment to meet the loading requirements of the wafer box.

[0059] Referring to Figure 5 , 9As shown, in the embodiment, the bottom of the carrier 22 is provided with a socket 224, one end of the sliding block 256 is provided with a latch 2561, the socket 224 cooperates with the latch 2561, the loading rack 21 is provided with a moving space 211, the sliding block 256 passes through the moving space 211, and the loading driving unit is located on the side of the loading rack 21 away from the carrier 22, so that the loading driving unit is hidden in the inside of the carrier 22, the loading driving unit is effectively protected, part of the sliding block 256 is hidden in the moving space 211 through the moving space 211, and the sliding block 256 is kept connected between the lead screw 253 and the carrier 22, and the structure arrangement is compact; the sliding block 256 is plug-connected with the carrier 22, is convenient to disassemble and assemble, and the carrier 22 is convenient to replace or clean.

[0060] Reference Figure 1 、 3 , as shown in 10, in the embodiment, the mounting rack 1 is provided with a protective cover 11, the lifting module 5 and the horizontal module 6 are located in the inside of the protective cover 11, the mounting rack 1 is provided with a lifting space 102, the output end of the horizontal module 6 is connected with a support 61, the support 61 is connected with the box opener 3, and the support 61 passes through the lifting space 102; the lifting space 102 is an area where the lifting module 5 and the horizontal module 6 contact with the external environment, so that the lifting module 5 and the horizontal module 6 are conveniently protected, the time when the lifting module 5 and the horizontal module 6 are exposed to the external environment is reduced, and the risk of pollution or damage is reduced; as shown in Figure 11 , the length and width of the support 61 in the lifting space 102 are L and M respectively, and the width of the lifting space 102 is H; L, M and H satisfy M < L < H, the longer side of the support 61 is used as a bottom side to support the box opener 3, and the support 61 is conveniently and stably moved in the lifting space 102; the size of the lifting space 102 is limited in the moving space 211 of the support 61, so that the flatness of the mounting rack 1 is conveniently ensured, and the overall rigidity of the mounting rack 1 is improved.

[0061] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as above, it is not used to limit the utility model. Any person skilled in the art can make some changes or modifications to the above-mentioned technical content without departing from the technical scheme of the utility model, and the equivalent embodiments with equivalent changes are equivalent to the above-mentioned technical content. Any simple modification, equivalent change and modification made to the above-mentioned embodiments according to the utility model technical scheme are within the scope of the utility model technical scheme.

Claims

1. A wafer cassette loading system, characterized by, The utility model relates to a wafer box detection device, including the mounting frame (1), install the loading platform (2) and the unboxing ware (3) of mounting frame (1), install detection component (4) of unboxing ware (3), install lifting module (5) of mounting frame (1) and with the horizontal module (6) drive connection of lifting module (5), horizontal module (6) with unboxing ware (3) drive connection, unboxing ware (3) are used for clamping the box cover on wafer box, detection component (4) are used for detecting wafer inside wafer box, when wafer box installs loading platform (2), wafer box's open side corresponds with unboxing ware (3), The mounting frame (1) is provided with a loading space (101), and the loading platform (2) and the unboxing ware (3) are located at both sides of the loading space (101) respectively, the loading platform (2) is used for installing the wafer box and driving the wafer box to approach or away from the mounting frame (1) along the front-back direction; When the wafer needs to be detected, the wafer box loaded with the wafer is installed on the loading platform (2), the loading platform (2) drives the wafer box to approach the mounting frame (1), so that the wafer box moves to the required position, the lifting mechanism drives the unboxing ware (3) to move to the required height, the horizontal module (6) drives the unboxing ware (3) to approach the loading space (101), so that one end of the unboxing ware is inserted into the loading space (101); the unboxing ware (3) clamps the box cover on the wafer box, the horizontal module (6) drives the unboxing ware (3) to move away from the wafer box to the required position, so that the open side of the wafer box is exposed, and the lifting mechanism drives the unboxing ware (3) to move along the up-down direction, so that the detection component (4) synchronously detects the wafer inside the wafer box while following the movement of the unboxing ware (3).

2. The FOUP loading system of claim 1, wherein, The loading platform (2) includes a loading rack (21) mounted on the mounting frame (1), a loading table (22) slidingly connected to the loading rack (21) along the front-back direction, at least three positioning members (23) mounted on the loading table (22), a clamping mechanism (24) mounted on the loading table (22), and a loading driving unit mounted on the loading rack (21), wherein the loading driving unit is drivingly connected to the loading table (22), and the loading driving unit is used to drive the loading table (22) to approach or away from the mounting frame (1) along the front-back direction; When the wafer box needs to be installed, the wafer box is placed on the loading table (22), the positioning members (23) are inserted into the positioning holes at the bottom of the wafer box to realize accurate positioning of the wafer box and the loading table (22), and the wafer box and the loading table (22) are locked by the clamping mechanism (24).

3. The FOUP loading system of claim 2, wherein, The clamping mechanism (24) includes a clamping member (241) hinged to the loading table (22) and a clamping driving unit (242) with an output end hinged to the clamping member (241), wherein the mounting end of the clamping driving unit (242) is hinged to the loading table (22), the loading table (22) is provided with a clamping opening (221), and the clamping member (241) is provided with a clamping portion (2411). When the wafer box needs to be locked with the carrier (22), the wafer box is positioned on the carrier (22), the clamping driving unit (242) drives the clamping piece (241) to rotate, and the clamping part (2411) penetrates through the clamping opening (221) to hook the bottom of the wafer box; When the wafer box needs to be unlocked from the carrier (22), the clamping driving unit (242) drives the clamping piece (241) to rotate, and the clamping part (2411) is separated from the bottom of the wafer box and retracted into the clamping opening (221), so that the wafer box is unlocked from the carrier (22).

4. The FOUP loading system of claim 2, wherein, The bottom of the carrier (22) is elastically connected with a pressing sensor (7), and when the wafer box is positioned on the carrier (22), the bottom of the wafer box presses the pressing sensor (7), so that the pressing sensor (7) is triggered to determine that the wafer box is installed on the carrier (22).

5. The FOUP loading system of claim 4, wherein, The inner side of the carrier (22) is provided with a pressing seat (701), the carrier (22) is provided with a pressing hole (222), the pressing seat (701) is connected with a pressing guide column (702) in sliding mode, the pressing guide column (702) is connected with the pressing sensor (7), the pressing sensor (7) penetrates through the pressing hole (222), and the pressing seat (701) and the pressing guide column (702) are connected with a reset component (703), and when the reset component (703) is in a normal state, the pressing sensor (7) is located at an initial position.

6. The FOUP loading system of claim 5, wherein, The bottom end of the pressing hole (222) is coaxially penetrated through an anti-extraction hole (223), the diameter of the anti-extraction hole (223) is larger than that of the pressing hole (222), the pressing guide column (702) is slidingly fitted in the anti-extraction hole (223), and when the reset component (703) is in a normal state, the top end of the pressing guide column (702) abuts against the top wall of the anti-extraction hole (223).

7. The FOUP loading system of claim 2, wherein, The loading driving unit comprises a loading motor (251) mounted on the loading frame (21), a first sprocket (252) connected with the loading motor (251), a lead screw (253) rotatably connected with the loading frame (21), a second sprocket (254) connected with one end of the lead screw (253), a chain (255) connected between the first sprocket (252) and the second sprocket (254), and a sliding block (256) threadedly connected with the lead screw (253), one side of the sliding block (256) abutting against the loading frame (21), and the sliding block (256) being connected with the carrier (22); When the carrier (22) needs to be driven to move in the front-rear direction, the loading motor (251) drives the first sprocket (252) to rotate, drives the lead screw (253) to rotate under the action of the chain (255) and the second sprocket (254), drives the sliding block (256) to move forward and backward on the loading frame (21), so that the carrier (22) approaches or moves away from the mounting rack (1) in the front-rear direction.

8. The FOUP loading system of claim 7, wherein, The bottom of the carrier (22) is provided with a socket (224), one end of the slider (256) is provided with a latch (2561), the socket (224) is matched with the latch (2561), the loading frame (21) is provided with a movable space (211), the slider (256) is arranged in the movable space (211), and the loading driving unit is located on the side of the loading frame (21) away from the carrier (22).

9. The FOUP loading system of claim 1, wherein, The mounting frame (1) is provided with a protective cover (11), the lifting module (5) and the horizontal module (6) are located inside the protective cover (11), the mounting frame (1) is provided with a lifting space (102), the output end of the horizontal module (6) is connected with a support (61), the support (61) is connected with the box opener (3), and the support (61) is arranged in the lifting space (102). The length and width of the support (61) in the lifting space (102) are L and M respectively, and the width of the lifting space (102) is H; L, M and H satisfy M < L < H.

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