Universal wafer pre-calibration device

Abstract

The utility model provides a universal wafer pre-calibration device, comprising a carrying platform used for placing a wafer to be pre-calibrated; the positioning assembly is in driving connection with the carrying table and is used for driving the carrying table to perform position adjustment according to the size and the shape of the wafer; the optical detection assembly is arranged on one side of the positioning assembly, faces the carrying table and the wafer and is used for acquiring edge image information of the wafer and generating an image signal; and the control unit is electrically connected with the optical detection assembly and the positioning assembly and is used for receiving the image signal generated by the optical detection assembly and sending a control signal to the positioning assembly according to the image signal so as to drive the positioning assembly to drive the wafer to move and realize the pre-calibration action of the wafer. The universal wafer pre-calibration device can be compatible with wafers of various specifications, has the characteristics of high efficiency, high precision and high adaptability, and meets the ever-increasing production requirements of the semiconductor industry.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer detection device technical field, concretely relates to a general wafer pre -calibration device. BACKGROUND

[0002] In the field of semiconductor manufacturing, accurate positioning of wafers is a key step to ensure the accuracy of product processes. In many automated manufacturing processes, wafers often need to be pre-calibrated at the loading stage to ensure that their center deviation on the stage is within the process allowed range, thereby providing an accurate position basis for subsequent processing procedures and ensuring product quality and yield.

[0003] However, current wafer specifications are showing a trend of diversification, with wafers of different sizes, shapes and materials frequently switching on production lines. Traditional mechanical positioning and optical alignment systems have obvious adaptability problems when faced with such diverse needs.

[0004] Mechanical positioning systems often need to be adjusted and replaced for different specifications of wafers, which is tedious and time-consuming, and difficult to meet the needs of efficient production; while optical alignment systems are limited by optical imaging principles and sensor performance, and when faced with transparent, semi-transparent or special material wafers, positioning accuracy may decrease or even fail to position accurately, and they are sensitive to environmental light and other factors, further affecting the stability and reliability of calibration. These problems make it difficult for existing pre-calibration technology to achieve efficient and accurate positioning in the production scene of multi-specification wafers, becoming a bottleneck restricting the improvement of semiconductor manufacturing efficiency and cost control.

[0005] Therefore, it is urgent to design a general wafer pre-calibration device that can be compatible with wafers of multiple specifications, while having high efficiency, high precision and strong adaptability to meet the growing production needs of the semiconductor industry, overcome the shortcomings of existing technology and promote the technological progress of the industry. SUMMARY

[0006] Based on the above description, the general wafer pre-calibration device provided by the utility model solves the problems of low positioning accuracy, insufficient calibration efficiency and poor adaptability to different size wafers in the traditional wafer pre-calibration process by integrating an optical alignment system and a positioning mechanism.

[0007] The technical solution of the utility model to solve the above technical problems is as follows:

[0008] The utility model provides a general wafer pre-calibration device, comprising:

[0009] A stage for placing wafers to be pre-calibrated;

[0010] A positioning assembly is connected with the stage and is used to drive the stage to adjust the position according to the size and shape of the wafer;

[0011] An optical detection assembly is arranged on one side of the positioning assembly and faces the stage and the wafer, and is used to acquire edge image information of the wafer and generate an image signal;

[0012] A control unit is electrically connected with the optical detection assembly and the positioning assembly, and is used to receive the image signal generated by the optical detection assembly, and send a control signal to the positioning assembly according to the image signal, so as to drive the positioning assembly to move the wafer and realize the pre-calibration action of the wafer.

[0013] On the basis of the above technical solution, the utility model further can make improvement as follows.

[0014] Further, the stage comprises:

[0015] A support table;

[0016] A non-mark suction disc is arranged on the upper surface of the support table and is used to adsorb and fix the wafer.

[0017] Further, the positioning assembly comprises:

[0018] A vacuum adsorption mechanism is connected with the non-mark suction disc and is used to control the adsorption and release of the non-mark suction disc;

[0019] A driving mechanism;

[0020] A translation and rotation mechanism is connected with the driving mechanism and is fixedly connected with the bottom of the support table, and under the driving of the driving mechanism, the support table and the wafer are moved and rotated in the horizontal direction;

[0021] A jacking mechanism is connected with the driving mechanism and is fixedly connected with the bottom of the support table, and under the driving of the driving mechanism, the support table and the wafer are moved in the vertical direction.

[0022] Further, the translation and rotation mechanism comprises:

[0023] A rotary sliding table is connected with the bottom of the support table and is used to drive the wafer to rotate horizontally;

[0024] A linear sliding table is connected with the bottom of the support table and is used to drive the wafer to move horizontally.

[0025] Further, the jacking mechanism comprises:

[0026] A jacking column is fixedly connected with the bottom of the support table;

[0027] A lifting cylinder is in driving connection with the lifting column and is used to drive the lifting column to move vertically, thereby driving the wafer to move vertically.

[0028] Further, the optical detection assembly comprises:

[0029] A camera is arranged towards the wafer and is used to capture the edge of the wafer to obtain edge image information of the wafer.

[0030] A coaxial light source is arranged below a lens of the camera, is coaxially aligned with the lens and is used to provide illumination for the camera when capturing.

[0031] Further, the optical detection assembly further comprises:

[0032] An image processing module is in electrical connection with the control unit and is used to analyze and process the edge image information of the wafer obtained by the camera to determine the position deviation of the wafer.

[0033] Further, the optical detection assembly further comprises:

[0034] A surface light source is arranged at the bottom of the wafer and is used to provide light to the bottom surface of the wafer.

[0035] Further, the optical detection assembly further comprises:

[0036] A light source controller is in electrical connection with the coaxial light source and the surface light source and is used to control the on-off of the coaxial light source and the surface light source.

[0037] Further, the optical detection assembly further comprises:

[0038] A fan is arranged near the driving mechanism and the vacuum adsorption mechanism and is used to dissipate heat of the driving mechanism and the vacuum adsorption mechanism.

[0039] Compared with the prior art, the technical scheme of the present application has the following beneficial technical effects:

[0040] Compared with the prior art, the universal wafer pre-calibration device provided by the present application has the following advantages:

[0041] High precision: through the cooperation of the positioning optical detection assembly in capturing the edge features of the wafer and the generation of image signals, and the control of the control unit to drive the wafer to move to realize high-precision positioning;

[0042] Strong compatibility: through modular design and movable design, the device supports quick adaptation to wafers of different sizes, reducing the cost of equipment adjustment;

[0043] Efficiency: By controlling the power supply to provide an automatic calibration process, reducing the need for human intervention, reducing the risk of errors caused by human operation. BRIEF DESCRIPTION OF DRAWINGS

[0044] Figure 1 A schematic diagram of the overall structure of the general wafer pre-calibration device provided by the embodiment of the utility model;

[0045] Figure 2 A schematic diagram of the local structure of the general wafer pre-calibration device provided by the embodiment of the utility model;

[0046] Figure 3 A schematic diagram of the local structure of the general wafer pre-calibration device provided by the embodiment of the utility model;

[0047] Figure 4 A schematic diagram of the overall structure of the general wafer pre-calibration device provided by the embodiment of the utility model;

[0048] In the drawings, the component list represented by each number is as follows:

[0049] 1, the carrier;

[0050] 11, the support table; 12, the traceless suction cup;

[0051] 2, the positioning assembly;

[0052] 21, the vacuum adsorption mechanism;

[0053] 22, the driving mechanism;

[0054] 23, the translation rotation mechanism; 231, the rotary sliding table; 232, the linear sliding table;

[0055] 24, the jacking mechanism; 241, the jacking column; 242, the jacking cylinder;

[0056] 3, the optical detection assembly;

[0057] 31, the camera; 32, the coaxial light source; 33, the light source controller; 34, the area light source;

[0058] 4, the fan;

[0059] 5, the wafer. DETAILED DESCRIPTION

[0060] In the description of the utility model, it is necessary to explain, unless another explicit provision and limitation, the term "is equipped with", "connection" and so on, should do broad sense understanding, for example "connection", can be fixed connection, also can be detachable connection, or integral type connection, can be mechanical connection, also can be electrical connection, can be direct connection, also can through the indirect connection of intermediate medium, it also can be two element internal communication. For ordinary skilled person in the art, the specific meaning of the above terms in the utility model can be understood according to specific circumstances.

[0061] In order to make the purpose, technical scheme and advantage of the utility model more clear, the technical scheme in the utility model will be described clearly and completely below in combination with the drawings in the utility model, obviously, the described embodiment is a part of the embodiment of the utility model, not all embodiments. Based on the embodiment in the utility model, all other embodiments obtained by ordinary skilled person in the art without creative labor belong to the scope of protection of the utility model.

[0062] The universal wafer pre-calibration device provided in the utility model embodiment, as shown in Figure 1 and Figure 4 , comprises a support table 1, a positioning assembly 2, an optical detection assembly 3 and a control unit.

[0063] The support table 1, as shown in Figure 1 and Figure 2 , comprises a support table 11 and a traceless suction cup 12. The traceless suction cup 12 is arranged on the upper surface of the support table 11 and is used for adsorbing and fixing the wafer 5.

[0064] The positioning assembly 2, as shown in Figure 2 , comprises a vacuum adsorption mechanism 21, a driving mechanism 22, a translation and rotation mechanism 23 and a jacking mechanism 24.

[0065] Specifically, the translation and rotation mechanism 23 comprises a rotary sliding table 231 and a linear sliding table 232 and is used for driving the wafer 5 to move and rotate in the horizontal direction.

[0066] The jacking mechanism 24 comprises a jacking column 241 and a jacking cylinder 242 and is used for driving the wafer 5 to move in the vertical direction.

[0067] The optical detection assembly 3, as shown in Figure 3 , comprises a camera 31, a coaxial light source 32, an image processing module, a surface light source 34 and a light source controller 33.

[0068] Specifically, the camera 31 is arranged towards the wafer 5 and is used for shooting the edge of the wafer 5 to obtain the edge image information of the wafer 5.

[0069] The coaxial light source 32 is positioned below the lens of the camera 31 and is coaxially aligned with the wafer 5 to provide illumination for the camera 31.

[0070] The surface light source 34 is located at the bottom of the wafer 5 to provide illumination to the bottom surface of the wafer 5 in order to better capture the edge features of the wafer 5.

[0071] The light source controller 33 is electrically connected to the coaxial light source 32 and the surface light source 34, and is used to control the switching of the light sources to ensure stable lighting conditions during shooting.

[0072] Control Unit: The control unit is electrically connected to the optical detection component 3 and the positioning component 2. It is used to receive the image signal generated by the optical detection component 3 and send a control signal to the positioning component 2 according to the image signal to drive the positioning component 2 to move the wafer 5 and realize the pre-calibration action of the wafer 5.

[0073] Optionally, the control unit also includes a storage module for storing calibration parameters for wafers of different specifications, so as to quickly adapt to wafers of different sizes.

[0074] Fan 4: such as Figure 2 As shown, the fan 4 is located near the drive mechanism 22 and the vacuum adsorption mechanism 21 to dissipate heat from the drive mechanism 22 and the vacuum adsorption mechanism 21, ensuring that the device remains stable during long-term operation.

[0075] To further introduce the universal wafer pre-calibration device provided by this utility model, its operation process in practical applications is now described:

[0076] 1. Loading: After the robotic arm picks up the material from the material box, it places the wafer 5 on the non-marking suction cup 12. The non-marking suction cup 12 uses the vacuum adsorption mechanism 21 to adsorb and fix the wafer 5.

[0077] 2. Image acquisition: The camera 31 takes pictures of the edge of the wafer 5 under the illumination of the coaxial light source 32, acquires edge image information and generates image signals.

[0078] 3. Image processing: The image processing module analyzes and processes the image signals acquired by the camera 31 to determine the positional deviation of the wafer 5.

[0079] 4. Calibration action: The control unit sends a control signal to the positioning component 2 based on the result of the image processing module. The drive mechanism 22 drives the translation and rotation mechanism 23 and the lifting mechanism 24 to perform corresponding horizontal, rotation and vertical movements according to the control signal, so as to adjust the position of the wafer 5 and realize the pre-calibration action.

[0080] 5. Unloading: After calibration, the lifting cylinder 242 descends, the linear slide 232 moves to the unloading position, and the robot arm takes the wafer 5 from the stage 1 for subsequent processes.

[0081] In an optional embodiment, further comprising:

[0082] 6. Switching wafer size: When switching between different sizes of wafers (such as 8 inches, 12 inches, etc.), the linear slide 232 adjusts adaptively according to the calibration parameters stored in the control unit, ensuring that the edge of the wafer 5 is always within the field of view of the camera 31, thereby achieving rapid adaptation without frequent hardware replacement or complex adjustments.

[0083] 7. Repeat calibration: In actual production process, the device can perform repeat calibration on each wafer, ensuring that the positional accuracy of each wafer is within the process range, thereby improving the overall quality and yield of the product.

[0084] In summary, the universal wafer pre-calibration device provided by the present application realizes high-precision pre-calibration of multiple sizes of wafers by integrating an optical alignment system and an adaptive mechanical positioning device. The device has the advantages of strong compatibility, high precision, high efficiency, strong adaptability, and low cost, etc., and can meet the growing production needs of the semiconductor industry, promoting the technological progress of the industry.

[0085] Specific advantages:

[0086] Low cost: Through modular design and universal design, the complexity and cost of the equipment are reduced, and the maintenance and replacement cost of the equipment is also reduced.

[0087] High integration: Compatible with multiple process requirements (such as detection, lithography, etc. Common production processes), promoting the development of the semiconductor manufacturing industry to higher integration.

[0088] Long-term stability: Through adaptive algorithm compensation for mechanical wear or tolerance, long-term high-precision positioning accuracy is maintained, ensuring that the equipment can still maintain high-precision calibration capability during long-term operation.

[0089] Easy to operate: Automated calibration process reduces the need for human intervention, reduces the risk of errors caused by human operation, and improves production efficiency and product quality.

[0090] In the description of the present application, the description of the terms "specific example" or "some examples" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.

[0091] It should be finally pointed out that: the above examples are only used to illustrate the technical solutions of the utility model, and not to limit them; although the utility model has been explained in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement to part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.

Claims

1. A universal wafer pre-calibration device, characterized by, The application relates to a wafer pre-calibration device. The device comprises a carrier (1) for placing a wafer (5) to be pre-calibrated; a positioning assembly (2) drivingly connected with the carrier (1) and used for driving the carrier (1) to adjust the position according to the size and shape of the wafer (5); an optical detection assembly (3) arranged on one side of the positioning assembly (2) and facing the carrier (1) and the wafer (5) and used for acquiring edge image information of the wafer (5) and generating an image signal; and a control unit electrically connected with the optical detection assembly (3) and the positioning assembly (2) and used for receiving the image signal generated by the optical detection assembly (3) and sending a control signal to the positioning assembly (2) according to the image signal so as to drive the positioning assembly (2) to move the wafer (5) and realize the pre-calibration of the wafer (5). The carrier (1) comprises a support table (11) and a non-marked suction disc (12) arranged on the upper surface of the support table (11) and used for adsorbing and fixing the wafer (5). The positioning assembly (2) comprises a vacuum adsorption mechanism (21) connected with the non-marked suction disc (12) and used for controlling the adsorption and release of the non-marked suction disc (12); a driving mechanism (22); a translation and rotation mechanism (23) connected with the driving mechanism (22) and fixedly connected with the bottom of the support table (11) and used for driving the support table (11) and the wafer (5) to move and rotate in the horizontal direction under the driving of the driving mechanism (22); and a jacking mechanism (24) connected with the driving mechanism (22) and fixedly connected with the bottom of the support table (11) and used for driving the support table (11) and the wafer (5) to move in the vertical direction under the driving of the driving mechanism (22). The translation and rotation mechanism (23) comprises a rotating sliding table (231) connected with the bottom of the support table (11) and used for driving the wafer (5) to rotate horizontally; and a linear sliding table (232) connected with the bottom of the support table (11) and used for driving the wafer (5) to move horizontally.

2. The universal wafer pre-calibration device of claim 1, wherein, The jacking mechanism (24) comprises a jacking column (241) fixedly connected with the bottom of the support table (11) and a jacking cylinder (242) drivingly connected with the jacking column (241) and used for driving the jacking column (241) to move vertically so as to drive the wafer (5) to move vertically. The optical detection assembly (3) comprises a camera (31) arranged towards the wafer (5) and used for shooting the edge of the wafer (5) to acquire the edge image information of the wafer (5); and a coaxial light source (32) arranged on the lower side of the lens of the camera (31) and coaxially aligned with the lens to the wafer (5) and used for providing illumination when the camera (31) is shooting. The optical detection assembly (3) further comprises an image processing module electrically connected with the control unit and used for analyzing and processing the edge image information of the wafer (5) acquired by the camera (31) to determine the position deviation of the wafer (5).

3. The universal wafer pre-calibration device of claim 2, wherein, ​ ​ ​ ​ ​ 4. The universal wafer precalibration device of claim 3, wherein, ​ ​ ​ 5. The universal wafer precalibration device of claim 3, wherein, ​ ​ ​ 6. The universal wafer precalibration device of claim 1, wherein, ​ ​ ​ 7. The universal wafer precalibration device of claim 6, wherein, ​ ​ 8. The universal wafer precalibration device of claim 6, wherein, The optical detection assembly (3) further comprises: A surface light source (34) arranged at the bottom of the wafer (5) and configured to provide light to the bottom surface of the wafer (5).

9. The universal wafer precalibration device of claim 6, wherein, The optical detection assembly (3) further comprises: A light source controller (33) electrically connected with the coaxial light source (32) and the surface light source (34) and configured to control the on-off of the coaxial light source (32) and the surface light source (34).

10. The universal wafer precalibration device of claim 3, wherein, Further comprising: A fan (4) arranged near the driving mechanism (22) and the vacuum adsorption mechanism (21) and configured to dissipate heat of the driving mechanism (22) and the vacuum adsorption mechanism (21).

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