Wafer clamp and carrying mechanism

Abstract

The utility model provides a wafer clamp and a carrying mechanism. The wafer clamp comprises a top plate, a bottom plate is fixedly erected below the top plate, swing arm assemblies are arranged at the bottom of the bottom plate in a circumferential array mode, clamping jaws are arranged on the inner sides of the bottom ends of the swing arm assemblies, and a clamping adjusting mechanism is arranged in the bottom plate. A telescopic cylinder for driving the clamping adjusting mechanism to move up and down is arranged at the bottom of the top plate; the clamping adjusting mechanism is provided with an adjusting bolt rotationally connected with the end of a piston rod of the telescopic air cylinder, and a driving block is assembled on the outer side of the adjusting bolt in a threaded mode. The swing arm assembly is provided with a connecting rod hinged to the outer side of the driving block. According to the utility model, the wafer can be clamped instead of manual work, and the moving range of the clamping jaw can be adjusted so as to be matched with the processing of wafers with different outer diameters.

Description

TECHNICAL FIELD

[0001] The utility model belongs to semiconductor chip production equipment technical field, concretely relates to a wafer clamp and carrying mechanism. BACKGROUND

[0002] At present, manual transfer is used after debonding, and the wafer is directly transferred to the cleaning machine by hand. Because the waiting time for the wafer to cool completely is too long, in order to improve work efficiency and progress, the wafer is directly transferred by hand before it is completely cooled. Such a transfer method has a high risk of scalding the operator's hands or breaking the wafer due to sliding. The operation cannot be standardized.

[0003] In the prior art, the Chinese utility model patent document with the authorization announcement number CN216698327U discloses a clamp for clamping wafers, which comprises a cylinder, at least three clamping jaws, at least three supporting assemblies, and a driving assembly. A sliding groove is formed in the clamping jaw. The supporting assembly is fixedly connected with the cylinder, and the supporting assembly is correspondingly arranged with the clamping jaw. The supporting assembly comprises a supporting shaft, and part of the supporting shaft is arranged in the sliding groove. One end of the clamping jaw is rotatably connected with the driving assembly, which can realize the function of quickly clamping and transferring the wafer, and solve the problem of non-standardization and safety during wafer transfer after debonding. However, it still needs manual operation for clamping, which is not convenient for automatic clamping and transfer, and the moving range of the clamping jaw cannot be adjusted to match wafers of different diameters.

[0004] Therefore, it is necessary to design a wafer clamp and carrying mechanism that can replace manual clamping of wafers and adjust the moving range of the clamping jaw to match wafers of different diameters for processing to solve the current technical problems. SUMMARY

[0005] In view of the deficiencies in the prior art, the utility model provides a wafer clamp and carrying mechanism that can replace manual clamping of wafers and adjust the moving range of the clamping jaw to match wafers of different diameters for processing.

[0006] The technical scheme of the utility model is as follows: a wafer clamp comprises a top plate, a bottom plate fixedly arranged below the top plate, a swing arm assembly arranged in a circular array at the bottom of the bottom plate, a clamping jaw arranged at the bottom end of the swing arm assembly, a clamping adjustment mechanism arranged in the bottom plate, and a telescopic cylinder arranged at the bottom of the top plate to drive the clamping adjustment mechanism to move up and down.

[0007] The swing arm assembly also has an upper hinge seat fixedly disposed at the bottom of the base plate, a lower hinge seat parallel to the upper hinge seat is disposed below the upper hinge seat, an inner swing arm and an outer swing arm parallel to each other are disposed between the upper hinge seat and the lower hinge seat, one end of the connecting rod is rotatably connected to the lower inner side of the inner swing arm; the gripper is fixedly disposed at the bottom of the lower hinge seat.

[0008] The gripper has a clamping plate that is vertically fixed at the bottom of the lower hinge seat, and a support plate is fixedly provided at the bottom end of the clamping plate.

[0009] The piston rod of the telescopic cylinder is fixedly provided with a connecting seat at its bottom end, and the adjusting bolt is rotatably connected to the bottom of the connecting seat.

[0010] Locking nuts are fitted on the outer sides of the adjusting bolts on both the upper and lower sides of the drive block.

[0011] A connecting pipe is fixedly installed on the top of the top plate, and a mounting flange is fixedly installed on the top end of the connecting pipe.

[0012] The bottom of the base plate has four swing arm assemblies arranged in a circular array.

[0013] The transport mechanism has a wafer clamp as described in any of the preceding items.

[0014] The beneficial effects of this utility model are:

[0015] (1) In the utility model, the clamping adjustment mechanism is driven to move up and down by the telescopic cylinder. The clamping adjustment mechanism is driven by the connecting rod and the swing arm assembly, which can make the swing arm assembly swing back and forth. During the swinging process of the swing arm assembly, the gripper moves synchronously to achieve clamping or releasing of the wafer, which can replace manual clamping of the wafer.

[0016] (2) When the piston rod of the telescopic cylinder is in the telescopic state, rotate the adjusting bolt. The thread structure between the adjusting bolt and the drive block drives the drive block to move up and down along its axis on the outside of the adjusting bolt. When the drive block moves, it will drive the swing arm assembly to move through the connecting rod, thereby realizing the final clamping position adjustment of the gripper and adjusting the range of movement of the gripper to match the processing of wafers with different outer diameters. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the wafer fixture in this utility model.

[0018] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle.

[0019] Figure 3 This is a schematic diagram of the clamping arm assembly in this utility model. Detailed Implementation

[0020] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely intended to illustrate and not to limit the present application and its application or use. The present application can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided so that the present application is thorough and complete and fully conveys the scope of the present application to those skilled in the art. It should be noted that: unless otherwise specifically stated, the relative arrangement of components and steps, the composition of materials, numerical expressions, and numerical values set forth in these embodiments should be interpreted as merely exemplary and not as a limitation.

[0021] In the present application, "first", "second" and similar words do not represent any order, quantity or importance, but are only used to distinguish different parts. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements. "Up", "down", "left", "right" and the like are only used to represent relative positional relationship, which may also change accordingly when the absolute position of the described object changes.

[0022] As shown in Figures 1 to 3 The wafer clamp includes a top plate 3, a bottom plate 4 fixedly arranged below the top plate 3, a swing arm assembly 6 arranged in a circumferential array at the bottom of the bottom plate 4, a clamping jaw 7 arranged at the inner side of the bottom end of the swing arm assembly 6, a clamping adjusting mechanism 8 arranged in the interior of the bottom plate 4, and a telescopic cylinder 9 arranged at the bottom of the top plate 3 and used to drive the clamping adjusting mechanism 8 to move up and down; the clamping adjusting mechanism 8 has an adjusting bolt 82 rotationally connected with the end portion of the piston rod 91 of the telescopic cylinder 9, and a driving block 83 threadedly fitted at the outer side of the adjusting bolt 82; the swing arm assembly 6 has a connecting rod 63 hingedly connected with the outer side of the driving block 83; in this embodiment, the clamping adjusting mechanism 8 is driven by the telescopic cylinder 9 to move up and down, the clamping adjusting mechanism 8 is transmitted by the connecting rod 63 with the swing arm assembly 6, so that the swing arm assembly 6 can reciprocate, and the clamping jaw 7 is synchronously moved in the reciprocating process of the swing arm assembly 6, so as to clamp or release the wafer, and the wafer can be clamped and taken by the clamp instead of manually; when the piston rod of the telescopic cylinder 9 is in the telescopic state, the adjusting bolt 82 is rotated, the thread structure between the adjusting bolt 82 and the driving block 83 drives the driving block 83 to move up and down along the axial direction of the outer side of the adjusting bolt 82, and when the driving block 83 moves, the swing arm assembly 6 is moved through the connecting rod 63, so that the final clamping position of the clamping jaw 7 is adjusted, and the moving range of the clamping jaw is adjusted to match the processing and use of wafers with different outer diameters.

[0023] In some embodiments, as Figure 3As shown, the swing arm assembly 6 further has an upper hinge base 61 fixedly arranged at the bottom of the base plate 4, and a lower hinge base 62 arranged below the upper hinge base 61 in parallel therewith, and an inner swing arm 64 and an outer swing arm 65 arranged in parallel between the upper hinge base 61 and the lower hinge base 62, and one end of the connecting rod 63 rotatably connected to the lower inner side of the inner swing arm 64; the clamping jaw 7 is fixedly arranged at the bottom of the lower hinge base 62, when the upper end of the connecting rod 63 is driven by the driving block 83 to move downward, the connecting rod 63 drives the inner swing arm 64 and the outer swing arm 65 to swing outward, and the lower hinge base 62 is driven by the inner swing arm 64 and the outer swing arm 65 to move outward while keeping parallel with the upper hinge base 61; when the upper end of the connecting rod 63 is driven by the driving block 83 to move upward, the connecting rod 63 drives the inner swing arm 64 and the outer swing arm 65 to swing inward, and the lower hinge base 62 is driven by the inner swing arm 64 and the outer swing arm 65 to move inward while keeping parallel with the upper hinge base 61.

[0024] In some embodiments, the clamping jaw 7 has a clamping plate 71 fixedly arranged vertically at the bottom of the lower hinge base 62, and a supporting plate 72 fixedly arranged vertically at the bottom end of the clamping plate 71, since the lower hinge base 62 keeps parallel with the upper hinge base 61 during the clamping and releasing of the clamping jaw 7, the supporting plate 72 keeps parallel with the base plate 4, and the supporting plate 72 can keep close to the bottom of the wafer during the clamping of the wafer.

[0025] In some embodiments, the bottom end of the piston rod 91 of the telescopic cylinder 9 is fixedly arranged with a connecting base 81, the connecting base 81 is fixedly assembled at the end of the piston rod 91, and the adjusting bolt 82 is rotatably connected to the bottom of the connecting base 81.

[0026] In some embodiments, the outer side of the adjusting bolt 82 on both upper and lower sides of the driving block 83 is assembled with a locking nut 84, after the final clamping position of the clamping jaw 7 is adjusted by the adjusting bolt 82, the locking nut 84 is screwed to abut against both upper and lower sides of the driving block 83, so as to lock between the driving block 83 and the adjusting bolt 82, and the final clamping position of the clamping jaw 7 is kept fixed.

[0027] In some embodiments, the top of the top plate 3 is fixedly arranged with a connecting pipe 2, and the top end of the connecting pipe 2 is fixedly arranged with a mounting flange 1, and the connecting pipe 2 is used for the fixed connection between the mounting flange 1 and the top plate 3.

[0028] In some embodiments, the bottom of the base plate 4 is circumferentially arranged with four swing arm assemblies 6, and the bottom end of the four swing arm assemblies 6 is arranged with four clamping jaws 7, and the four clamping jaws 7 are cooperated to clamp and hold the wafer around.

[0029] In some embodiments, a carrying mechanism is disclosed, which has a wafer clamp as in any one of the above embodiments, and further has a mechanical arm, wherein the top of the wafer clamp is fixedly arranged at the end of the mechanical arm, and the carrying mechanism is driven to move by the mechanical arm to realize the carrying of the wafer; specifically, the wafer clamp is assembled and fixed at the end of the mechanical arm through the mounting flange 1.

[0030] So far, the various embodiments of the present application have been described in detail. In order to avoid obscuring the concept of the present application, some details known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein according to the above description.

[0031] The above-described embodiments only express some implementation manners of the present application, which are described in detail and specifically, but should not be understood as a limitation on the scope of the present application. It should be pointed out that, for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A wafer chuck, characterized by: The device includes a top plate, a bottom plate fixedly mounted below the top plate, a swing arm assembly arranged in a circular array at the bottom of the bottom of the bottom plate, a gripper provided on the inner side of the bottom end of the swing arm assembly, a clamping adjustment mechanism provided inside the bottom plate, and a telescopic cylinder provided at the bottom of the top plate to drive the clamping adjustment mechanism to move up and down. The clamping adjustment mechanism has an adjusting bolt that is rotatably connected to the piston rod end of the telescopic cylinder, and a drive block is threaded onto the outer side of the adjusting bolt; the swing arm assembly has a connecting rod that is hinged to the outer side of the drive block.

2. The wafer clamp of claim 1, wherein: The swing arm assembly also has an upper hinge seat fixedly disposed at the bottom of the base plate, a lower hinge seat parallel to the upper hinge seat is disposed below the upper hinge seat, an inner swing arm and an outer swing arm parallel to each other are disposed between the upper hinge seat and the lower hinge seat, one end of the connecting rod is rotatably connected to the lower inner side of the inner swing arm; the gripper is fixedly disposed at the bottom of the lower hinge seat.

3. The wafer chuck of claim 2, wherein: The gripper has a clamping plate that is vertically fixed at the bottom of the lower hinge seat, and a support plate is fixedly provided at the bottom end of the clamping plate.

4. The wafer clamp of claim 1, wherein: The piston rod of the telescopic cylinder is fixedly provided with a connecting seat at its bottom end, and the adjusting bolt is rotatably connected to the bottom of the connecting seat.

5. The wafer clamp of claim 4, wherein: Locking nuts are fitted on the outer sides of the adjusting bolts on both the upper and lower sides of the drive block.

6. The wafer clamp of claim 1, wherein: A connecting pipe is fixedly installed on the top of the top plate, and a mounting flange is fixedly installed on the top end of the connecting pipe.

7. The wafer clamp of claim 1, wherein: The bottom of the base plate has four swing arm assemblies arranged in a circular array.

8. A carrying mechanism characterized by: It has a wafer clamp as described in any one of claims 1 to 7.

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