Packaging unit with top heat dissipation and packaging structure

Abstract

The utility model belongs to the technical field of semiconductor packaging, and provides a top heat dissipation packaging unit and a packaging structure. The top heat dissipation packaging unit comprises a unit frame, a chip and a packaging body, the unit frame comprises a base island protruding out of the plane of the unit frame, the base island is provided with a working face and a heat dissipation face which are oppositely arranged, and the working face and the plane of the unit frame are oppositely arranged; the chip is arranged on the working surface; the packaging body is used for wrapping the unit frame and the chip, and the heat dissipation surface is exposed out of the packaging body. According to the utility model, top heat dissipation can be realized, the heat dissipation efficiency of the packaging unit can be improved, the temperature rise of a device can be reduced, and the power density and the working efficiency of the device can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor packaging technical field especially, it relates to a top heat dissipation's packaging unit and packaging structure. BACKGROUND

[0002] In the field of electronic packaging, the heat dissipation performance is one of the key factors affecting the reliability of the device and the system performance. With the continuous improvement of the power density of electronic devices, the heat dissipation problem is increasingly prominent. The traditional packaging technology is mainly divided into two types of plug-in packaging and SMD packaging, but they have certain limitations in heat dissipation performance and space utilization.

[0003] The traditional plug-in packaging has high dissipation power, but its heat dissipation path needs to be separated from the PCB board, usually through an additional heat sink or fin to achieve. This design leads to low space utilization, high system cost, and is difficult to meet the requirements of modern electronic equipment for miniaturization and high integration.

[0004] Although the traditional SMD packaging has high space utilization, its heat dissipation path needs to pass through the PCB board and then be connected to the heat sink. Due to the low thermal conductivity of the PCB board, the dissipation power of the entire system is limited, and usually only the bottom is cooled, the heat dissipation efficiency is low, and it is difficult to meet the heat dissipation demand of high-power devices.

[0005] Therefore, a new scheme is needed to solve the above technical problems. SUMMARY

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a top heat dissipation's packaging unit and packaging structure, which is used to solve the problem of low heat dissipation efficiency of the packaging structure in the prior art.

[0007] To achieve the above-mentioned purpose and other related purposes, the utility model provides a top heat dissipation's packaging unit, which is specifically set as follows: including unit frame, chip and packaging body, the unit frame includes the base island protruding from the plane of the unit frame, the base island has oppositely arranged working surface and heat dissipation surface, the working surface is arranged opposite to the plane of the unit frame;The chip is arranged on the working surface;The packaging body is used for covering the unit frame and the chip, and the heat dissipation surface is exposed to the packaging body.

[0008] Optionally, the unit frame further includes first pin and second pin oppositely arranged on both sides of the base island in the width direction and exposed to the packaging body, the first pin is connected with the base island as a whole;The second pin is arranged spaced apart from the base island, and the side of the second pin close to the base island is arranged in a staggered manner along the direction perpendicular to the plane of the unit frame.

[0009] Optionally, at least one pin groove is arranged on the side of the second pin towards the base island, and the pin groove is located inside the package.

[0010] Optionally, the two sides of the base island in the length direction are provided with bosses, the surface of the bosses parallel to and connected with the heat dissipation surface is the heat dissipation surface, and / or the corresponding positions of the package and the bosses are provided with press welding grooves, and the bosses are exposed on the bottom surface of the press welding grooves.

[0011] Optionally, the press welding groove is arranged on the side of the package away from the heat dissipation surface, and the press welding groove is arranged in a tapered structure which expands outwardly in the direction away from the heat dissipation surface.

[0012] Optionally, the heat dissipation surface is provided with a first step, the circumferential side wall of the base island is provided with a convex edge, the first step is connected with the convex edge, and the package covers the first step and the convex edge.

[0013] Optionally, a welding groove is arranged on the working surface where the chip is welded; and / or glue overflow grooves are arranged on the working surface close to the first pin and the second pin.

[0014] Optionally, a glue feeding opening is arranged on the side of the package away from the heat dissipation surface, and the glue feeding opening is located in the middle of the package.

[0015] Optionally, a foolproof hole is arranged on the side of the package exposed to the heat dissipation surface.

[0016] The utility model also provides a kind of packaging structure, including lead frame, and the above-mentioned packaging unit of top heat dissipation of any one described above is set on the lead frame, the lead frame is provided with several frame units, and several packaging units are arranged in each frame unit.

[0017] As described above, the packaging unit of top heat dissipation and packaging structure of the utility model have the following beneficial effects:

[0018] By arranging working surface and heat dissipation surface on the base island protruding from the plane of unit frame, the working surface is arranged opposite to the plane of unit frame and used for installing chip, when package covers unit frame and chip, heat dissipation surface is exposed to package, so that heat generated by chip during work can be dissipated through heat dissipation surface, realize top heat dissipation, it is favorable to improve the heat dissipation efficiency of the packaging unit, also favorable to reduce the temperature rise of device, favorable to improve the power density and working efficiency of device. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1A first perspective structural schematic view of a top heat dissipation packaging unit according to an embodiment of the present application is shown.

[0020] Figure 2 A second perspective structural schematic view of a top heat dissipation packaging unit according to an embodiment of the present application is shown.

[0021] Figure 3 A partial structural schematic view of a top heat dissipation packaging unit according to an embodiment of the present application is shown. Figure 1

[0022] Figure 4 A structural schematic view of another perspective of a top heat dissipation packaging unit according to an embodiment of the present application is shown. Figure 3

[0023] Figure 5 A structural schematic view of a packaging structure according to an embodiment of the present application is shown.

[0024] Explanation of Reference Signs

[0025] 1 - chip

[0026] 2 - package; 21 - press welding groove; 22 - top glue port; 23 - foolproof hole

[0027] 3 - base island; 31 - working surface; 32 - heat dissipation surface; 33 - glue overflow groove; 34 - boss; 35 - first step; 36 - convex edge

[0028] 4 - first pin

[0029] 5 - second pin; 51 - pin groove

[0030] 6 - lead frame DETAILED DESCRIPTION

[0031] The implementation manner of the present application is described below through specific and concrete examples, and other advantages and effects of the present application can be easily understood by those skilled in the art according to the content disclosed in the present description. The present application can also be implemented or applied through other different specific implementation manners, and each detail in the present description can be modified or changed based on different viewpoints and applications without departing from the spirit of the present application.

[0032] ​​It should be noted that the diagrams provided in the embodiments only schematically illustrate the basic concept of the present application, and only show the components related to the present application in the diagrams, rather than being drawn according to the number, shape and size of the components in actual implementation. The shape, number and proportion of each component in actual implementation can be changed at will, and the component layout form can also be more complex. The structure, proportion, size and the like shown in the diagrams attached to the present specification are only used to cooperate with the content disclosed in the specification, so as to be understood and read by those skilled in the art, and do not limit the implementation conditions of the present application, and therefore do not have substantial technical significance. Any modification of structure, change of proportion relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" in the present specification are only for the convenience of clear description, and are not used to limit the scope of the present application. The change or adjustment of the relative relationship does not substantially change the technical content.

[0033] As shown in Figures 1 to 4 Some embodiments of the present application provide a top heat dissipation packaging unit, which comprises a unit frame, a chip 1 and a packaging body 2. The unit frame comprises an island 3 protruding from the plane of the unit frame, and the island 3 has oppositely arranged working surface 31 and heat dissipation surface 32. Since the island 3 is arranged in parallel with the plane of the unit frame, the working surface 31 is arranged opposite to the plane of the unit frame. The chip 1 can be mounted on the working surface 31 by solder or the like. When the packaging body 2 covers the unit frame and the chip 1, the heat dissipation surface 32 is exposed to the packaging body 2. The heat generated by the chip 1 is transmitted to the heat dissipation surface 32 through the island 3, and the heat is dissipated through the heat dissipation surface 32, achieving top heat dissipation, which is beneficial to improve the heat dissipation efficiency of the packaging unit, reduce the temperature rise of the device, and improve the power density and working efficiency of the device.

[0034] Exemplarily, the heat dissipation surface 32 is arranged flush with the surface of the packaging body 2.

[0035] In some embodiments, the working surface 31 of the island 3 is provided with a welding groove corresponding to the chip 1. The welding groove can enhance the uniformity of solder filling, and the groove structure increases the contact area between the solder and the island 3, improves the wettability of the solder, and ensures that the welding interface is more firm.

[0036] Exemplarily, the welding groove includes but is not limited to a cross-shaped groove and the like.

[0037] In some embodiments, in order to improve the reliability and stability of the package, the working surface 31 of the base island 3 is provided with a glue overflow groove 33, which is located on both sides close to the first pin 4 and the second pin 5, so that the fluid overflowing during the installation of the chip 1 can flow into the glue overflow groove 33.

[0038] For example, the glue overflow groove 33 includes but is not limited to a V-shaped groove.

[0039] In some embodiments, the unit frame further includes a first pin 4 and a second pin 5, which are oppositely arranged and located on both sides of the base island 3 in the width direction, and the first pin 4 and the second pin 5 are partially exposed on the package 2. The first pin 4 is connected with the base island 3 as a whole. The second pin 5 is arranged with a spacing between the base island 3, and the side of the second pin 5 close to the base island 3 is arranged in a direction perpendicular to the plane of the unit frame, and the base island 3 is arranged in a staggered manner. Such arrangement can reduce the thermal coupling between the base island 3 and the pin, avoid the heat concentration in a certain area, cause local overheating, and also be beneficial to improve the overall heat dissipation efficiency.

[0040] In an example, the first pin 4 and the second pin 5 are both provided with a plurality of pins, and the plurality of first pins 4 or second pins 5 extend along the width direction of the base island 3, and the adjacent two first pins 4 or second pins 5 are arranged with a spacing. In this embodiment, the first pin 4 and the second pin 5 are both provided with 8 pins, and the combination of the 8 second pins 5 can be 1+1+6, 1+7, 2+6, etc.

[0041] For example, the first pin 4 and the second pin 5 can be both arranged as seagull pins.

[0042] In some embodiments, in order to improve the reliability and stability of the package, the side of the second pin 5 close to the base island 3 is provided with at least one pin groove 51, so that the fluid overflowing during the welding of the chip 1 and the pin can flow into the pin groove 51. The number of pin grooves 51 can be 1, 2, 3, etc., which can be adaptively arranged according to actual needs. In this embodiment, each second pin 5 is provided with 2 pin grooves 51. Furthermore, the pin groove 51 is located inside the package 2.

[0043] For example, the pin groove 51 includes but is not limited to a V-shaped groove.

[0044] In some embodiments, the base island 3 is provided with protrusions 34 on both sides in the length direction, and one side of the protrusions 34 parallel to the heat dissipation surface 32 is part of the heat dissipation surface 32, so as to increase the area of the heat dissipation surface 32 and improve the heat dissipation efficiency. The package 2 is provided with a press welding groove 21 corresponding to the protrusions 34, and the side of the protrusions 34 away from the heat dissipation surface 32 is exposed to the bottom surface of the press welding groove 21, which is conducive to improving the heat dissipation efficiency and facilitating the connection between the electrodes of the chip 1 in the package 2 and external pins or other circuits through welding technology.

[0045] For example, the side of the protrusions 34 exposed to the bottom surface of the press welding groove 21 is flush with the bottom surface of the press welding groove 21.

[0046] In an example, the press welding groove 21 is arranged on the side of the package 2 away from the heat dissipation surface 32, and the press welding groove 21 is in a tapered structure that expands outward in the direction away from the heat dissipation surface 32, so that the operator can press the bottom surface of the press welding groove 21 using a tool.

[0047] In some embodiments, in order to improve the stability of the connection between the unit frame and the package 2, the heat dissipation surface 32 of the base island 3 is provided with a first step 35, and the circumferential side wall of the base island 3 is provided with a protrusion 36 connected with the first step 35. When the package 2 covers the base island 3, the package 2 covers the first step 35 and the protrusion 36.

[0048] In an example, the first step 35 is arranged on both sides of the base island 3 towards the first pin 4 and the second pin 5, and on both sides in the length direction of the base island 3, and the first step 35 arranged on both sides in the length direction of the base island 3 is located on both sides of the protrusion 34. The first step 35 towards the first pin 4 is not provided with a protrusion 36 connected therewith, and the remaining first steps 35 are all provided with a protrusion 36 connected therewith.

[0049] In some embodiments, in order to ensure uniform filling and effective injection of the plastic sealing material into the cavity, the side of the package 2 away from the heat dissipation surface 32 is provided with a top glue port 22. At the same time, the top glue port 22 can also serve as a fulcrum when the package 2 is ejected from the cavity. Specifically, the top glue port 22 is arranged in the middle of the package 2.

[0050] In some embodiments, in order to ensure that the package unit is correctly installed on the circuit board or other components in a specific direction, the side of the package 2 exposed to the heat dissipation surface 32 is provided with a foolproof hole 23 to simplify the installation process and reduce the complexity and error rate of manual operation.

[0051] In summary, the packaging unit with top heat dissipation provided by the utility model, through setting the working surface 31 and the heat dissipation surface 32 on the base island 3 which protrudes from the plane of the unit frame, wherein the working surface 31 is oppositely arranged with the plane of the unit frame and is used for mounting the chip 1, when the package 2 covers the unit frame and the chip 1, the heat dissipation surface 32 is exposed to the package 2, so that the heat generated by the chip 1 during work can be dissipated through the heat dissipation surface 32, realizing the top heat dissipation, which is conducive to improving the heat dissipation efficiency of the packaging unit, also conducive to reducing the temperature rise of the device, and conducive to improving the power density and working efficiency of the device.

[0052] As Figure 5 shown, some embodiments of the utility model still provide a packaging structure, including lead frame 6, and the above-mentioned packaging unit with top heat dissipation which is arranged on the lead frame 6. The lead frame 6 is provided with a plurality of frame units, and a plurality of packaging units are arranged in each frame unit.

[0053] In the embodiment, 72 frame units are divided on the lead frame 6, and each frame unit is provided with 4 rows of 18 columns of packaging units, and a pre-cutting channel is arranged between the adjacent two frame units.

[0054] Exemplarily, the material of the lead frame 6 includes but is not limited to KFC copper alloy and the like.

[0055] The above-mentioned embodiments only exemplarily illustrate the principle and effect of the utility model, and are not used for limiting the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.

Claims

1. A top heat dissipating package unit, characterized by, The application relates to a top heat dissipation packaging unit. The unit frame further comprises a first pin and a second pin oppositely arranged on both sides of the base island in the width direction and exposed to the packaging body, the first pin is integrated with the base island, the second pin is arranged in a spaced mode with the base island, and the side of the second pin close to the base island is arranged in a dislocation mode with the base island in the direction perpendicular to the plane of the unit frame. The side of the second pin close to the base island is provided with at least one pin groove, and the pin groove is located in the interior of the packaging body. Both sides of the base island in the length direction are provided with bosses, the surface of the bosses parallel to and connected with the heat dissipation surface is the heat dissipation surface, and / or the corresponding positions of the packaging body and the bosses are provided with press welding grooves, and the bosses are exposed to the bottom surface of the press welding grooves.

2. The top thermally-via package unit of claim 1, wherein: The press welding groove is arranged on the side of the packaging body away from the heat dissipation surface, and the press welding groove is arranged in a tapered structure which expands outward in the direction away from the heat dissipation surface.

3. The top thermally-via package unit of claim 2, wherein: The heat dissipation surface is provided with a first step, the circumferential side wall of the base island is provided with a convex edge, the first step is connected with the convex edge, and the packaging body covers the first step and the convex edge.

4. The top thermally-via package unit of claim 1, wherein: The welding groove is arranged on the working surface at the position where the chip is welded; and / or the overflow groove is arranged on the working surface close to the first pin and the second pin.

5. The top thermally-via package unit of claim 4, wherein: The side of the packaging body away from the heat dissipation surface is provided with a glue feeding opening, and the glue feeding opening is located in the middle part of the packaging body.

6. The top thermally-via package unit of claim 1, wherein: The side of the packaging body exposed to the heat dissipation surface is provided with an anti-fool hole.

7. The top thermally dissipated package unit according to claim 2 or 3, wherein: The application relates to a top heat dissipation packaging unit.

8. The top thermally-via package unit of any one of claims 1-6, wherein: The lead frame is provided with a plurality of frame units.

9. The top thermally-via package unit of any one of claims 1-6, wherein: The top heat dissipation packaging unit according to any one of claims 1-9 is arranged on the lead frame, and a plurality of the packaging units are arranged in each frame unit.

10. A package structure, characterized by, ​ ​ ​

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