Glue dispensing device for GaN transistor processing
By designing an adjustable combination of adjustment columns and limit blocks, the problem of insufficient dispensing volume for GaN transistors in existing technologies is solved, enabling flexible adjustment of dispensing volume, improving the versatility and accuracy of the dispensing machine, and making it suitable for various GaN transistor processing scenarios.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2026-03-31
AI Technical Summary
In existing technologies, the precision of dispensing volume adjustment for GaN transistors is insufficient, making it difficult to meet the dispensing requirements of different transistors and different parts. Manual dispensing relies on human judgment and is unreliable, while the fixed piston of automated dispensing machines is difficult to adapt to diverse needs.
A dispensing device for GaN transistor processing was designed. By combining an adjustable adjusting column and a limiting block, the piston's travel stroke can be flexibly adjusted to achieve precise control of the dispensing amount. The device includes a dispensing head, piston, adjusting groove, adjusting column, and limiting block, which, together with an electric cylinder and a control switch assembly, enables flexible adjustment of the dispensing amount.
It enables flexible adjustment of dispensing amount according to the needs of different GaN transistors, improving the versatility and accuracy of the dispensing machine, and making it suitable for processing GaN transistors of different specifications and dispensing requirements.
Smart Images
Figure CN224057850U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of GaN transistor processing technology, specifically to a dispensing device for GaN transistor processing. Background Technology
[0002] GaN (Gallium Nitride) transistors have been increasingly widely used in high-power electronic devices, high-frequency communication equipment, and power electronic systems due to their significant advantages such as large bandgap, high electron mobility, high temperature resistance, and strong radiation resistance. In the GaN transistor manufacturing process, the dispensing process is one of the key steps and plays a vital role in the performance, reliability, and packaging quality of the transistor. Precise and stable dispensing operations can ensure good connection between the chip and the substrate, effective fixation of the electrodes, and uniform coverage of the insulating layer, which are important guarantees for achieving high performance and high stability of GaN transistors.
[0003] In the existing technology, there are two main methods for dispensing GaN transistors: manual dispensing and automated dispensing. Manual dispensing machines rely on operators to manually squeeze the glue tube to control the amount of glue dispensed. During operation, the worker first installs the glue tube on the dispensing equipment, then holds the equipment and aligns it with the position of the GaN transistor to be dispensed. Pressure is generated by squeezing the glue tube with the fingers, causing the glue to flow out from the dispensing head. When using automated equipment to dispense GaN transistors, it is only necessary to place the GaN transistor in the dispensing area and then drive the automated equipment to work. The equipment drives the piston to move through the built-in mechanical device or control system, causing the glue to flow out from the dispensing head. This process does not require much human intervention and ensures that the amount of glue dispensed each time is basically consistent.
[0004] Existing technologies have several problems. Both manual and automated dispensing methods are severely lacking in precision for adjusting the dispensing volume. In GaN transistor fabrication, the dispensing volume requirements may vary for different GaN transistors and different parts of the GaN transistor. Manual dispensing, relying on human judgment and operation, simply cannot achieve such precise dispensing volume control. While automated dispensing machines improve dispensing consistency to some extent, the relatively fixed piston configuration makes it difficult to meet the dispensing volume requirements for these different volumes. Therefore, we propose a dispensing device for GaN transistor fabrication. Utility Model Content
[0005] The technical problem to be solved by this utility model is to overcome the existing defects and provide a dispensing device for GaN transistor processing, which can change the dispensing amount according to the different GaN transistors, and can effectively solve the problems in the background art.
[0006] To achieve the above objectives, the present invention provides the following technical solution: a dispensing device for GaN transistor processing, comprising a base, a dispensing frame provided in the middle of the upper side of the base, a dispensing platform provided at the front end of the upper side of the base, and a dispensing mechanism.
[0007] The dispensing mechanism includes a dispensing head, a piston, an adjusting groove, an adjusting column, and a limiting block. The dispensing head is located at the upper front end of the dispensing frame. A piston is slidably connected inside the dispensing head. A sliding hole is formed on the upper side of the piston, and an adjusting groove is formed inside the upper end of the piston, communicating with the sliding hole. An adjustable adjusting column is located at the front end of the dispensing frame, with its outer arc surface slidably connected to the sliding hole. A limiting block is located at the lower end of the adjusting column, inside the adjusting groove. The amount of dispensing material dispensed per cycle is adjusted by changing the movable stroke of the piston. This flexible adjustment method greatly improves the versatility of the dispensing machine for dispensing GaN transistors.
[0008] Furthermore, a control switch group is provided at the right end of the base, and the input end of the control switch group is electrically connected to an external power source for stable control.
[0009] Furthermore, an electric cylinder is provided on the upper side of the dispensing frame. The telescopic end of the electric cylinder passes through the upper end of the dispensing frame. An adjustment column is provided at the telescopic end of the electric cylinder. The input end of the electric cylinder is electrically connected to the output end of the control switch group for stable driving.
[0010] Furthermore, the dispensing mechanism also includes a guide groove and a mounting ring. The upper middle part of the dispensing frame is provided with a guide groove, and the outer arc surface of the piston is provided with a mounting ring. The rear end of the mounting ring is slidably connected to the guide groove, and the left end of the outer arc surface of the mounting ring is provided with a handle to provide sliding support for the piston.
[0011] Furthermore, the dispensing mechanism also includes a rack and a gear. Mounting plates are provided on both the left and right sides of the upper middle part of the dispensing frame. A mounting shaft is provided between the two mounting plates. A gear is rotatably connected to the middle of the mounting shaft. A rack is provided at the rear end of the mounting ring. The rack is meshed with the gear. A torsion spring is provided between the right side of the gear and the right side mounting plate. The torsion spring is sleeved on the right end of the outer arc surface of the mounting shaft and can reset the piston.
[0012] Furthermore, the upper side of the dispensing frame is provided with an adhesive tank, which is connected to the dispensing head through a pipe. A dispensing pump is connected in series in the middle of the pipe, and the input end of the dispensing pump is electrically connected to the output end of the control switch group to stably deliver adhesive.
[0013] Furthermore, a one-way valve is connected in series at the front end of the pipe to prevent glue backflow.
[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This dispensing device for GaN transistor processing has the following advantages:
[0015] This dispensing device for GaN transistor processing can adjust the dispensing volume according to different applications. By driving the adjustment column to move and adjust the position of the limiting block inside the adjustment groove, the range of motion of the piston inside the dispensing head can be flexibly limited, thereby changing the dispensing volume. This allows the dispensing machine to function smoothly in different GaN transistor processing scenarios. When processing GaN transistors of different specifications and with different dispensing requirements, operators only need to fine-tune the position of the adjustment column according to the actual situation to easily change the dispensing volume. For example, when filling large areas of thermal adhesive, the piston's range of motion can be expanded to increase the single dispensing volume; when performing fine electrode dispensing, the piston's range of motion can be reduced to achieve micro-volume, precise dispensing. This powerful multi-scenario adaptability greatly improves the versatility of the dispensing machine. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of this utility model;
[0017] Figure 2 This is an enlarged structural schematic diagram of point A of this utility model;
[0018] Figure 3 This is a partial cross-sectional structural diagram of the dispensing mechanism of this utility model;
[0019] Figure 4 This is a schematic diagram of the rear end structure of this utility model;
[0020] Figure 5 This is an enlarged structural schematic diagram of section B of this utility model.
[0021] In the diagram: 1. Base, 2. Dispensing mechanism, 21. Dispensing head, 22. Piston, 221. Sliding hole, 23. Adjusting groove, 24. Adjusting column, 25. Limiting block, 26. Guide groove, 27. Mounting ring, 28. Rack plate, 29. Gear, 3. Glue tank, 4. Pipe, 5. Dispensing pump, 6. One-way valve, 7. Electric cylinder, 8. Dispensing platform, 9. Dispensing frame, 10. Mounting plate, 11. Mounting shaft, 12. Torsion spring, 13. Handle, 14. Control switch assembly. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] Please see Figure 1-5This embodiment provides a technical solution: a dispensing device for GaN transistor processing, including a base 1, a control switch group 14 at the right end of the base 1, the input end of the control switch group 14 being electrically connected to an external power supply, a dispensing frame 9 at the middle of the upper side of the base 1, a dispensing table 8 at the front end of the upper side of the base 1, and a dispensing mechanism 2.
[0024] Dispensing mechanism 2: It includes a dispensing head 21, a piston 22, an adjusting groove 23, an adjusting column 24, and a limiting block 25. The dispensing head 21 is located on the upper front side of the dispensing frame 9, and the glue tank 3 is located on the upper side of the dispensing frame 9. The glue tank 3 and the dispensing head 21 are connected by a pipe 4. A dispensing pump 5 is connected in series in the middle of the pipe 4. The input end of the dispensing pump 5 is electrically connected to the output end of the control switch group 14. A one-way valve 6 is connected in series at the front end of the pipe 4. The piston 22 is slidably connected inside the dispensing head 21. The dispensing mechanism 2 also includes a guide groove 26 and a mounting ring 27. The guide groove 26 is opened in the middle of the upper end of the dispensing frame 9. The mounting ring 27 is located on the outer arc surface of the piston 22. The rear end of the mounting ring 27 is slidably connected to the guide groove 26. The left end of the outer arc surface of the mounting ring 27 is provided with a guide groove 26. The handle 13 and the dispensing mechanism 2 also include a rack plate 28 and a gear 29. Mounting plates 10 are provided on both the left and right sides of the upper middle part of the dispensing frame 9. A mounting shaft 11 is provided between the two mounting plates 10. A gear 29 is rotatably connected to the middle of the mounting shaft 11. A rack plate 28 is provided at the rear end of the mounting ring 27, meshing with the gear 29. A torsion spring 12 is provided between the right side of the gear 29 and the right side mounting plate 10. The torsion spring 12 is sleeved on the right end of the outer arc surface of the mounting shaft 11. A sliding hole 221 is provided on the upper side of the piston 22. An adjusting groove 23 is provided inside the upper end of the piston 22, communicating with the sliding hole 221. An adjustable adjusting column 24 is provided at the front end of the dispensing frame 9. An electric cylinder 7 is provided on the upper side of the dispensing frame 9. The extension and retraction of the electric cylinder 7... The end of the dispensing machine passes through the upper end of the dispensing frame 9. An adjusting column 24 is provided at the telescopic end of the electric cylinder 7. The input end of the electric cylinder 7 is electrically connected to the output end of the control switch group 14. The outer arc surface of the adjusting column 24 is slidably connected to the sliding hole 221. A limiting block 25 (the diameter of the limiting block 25 is larger than the diameter of the sliding hole 221) is provided at the lower end of the adjusting column 24. The limiting block 25 is located inside the adjusting groove 23. When the dispensing machine is working, the GaN transistor to be dispensed is first placed on the dispensing table 8. Then, by starting the dispensing pump 5, the glue in the glue tank 3 flows through the pipe 4 to the dispensing head 21 under the action of the dispensing pump 5. Since a one-way valve 6 is connected in series at the front end of the pipe 4, it can effectively prevent glue backflow and ensure that the glue flows in the predetermined direction. Then, the control switch group 14 is operated to control the upper... Pressing the button on the electric cylinder 7 activates it. The telescopic end of the electric cylinder 7 moves the adjusting column 24 up and down. The outer arc surface of the adjusting column 24 slides within the sliding hole 221 on the upper side of the piston 22. The limiting block 25 at its lower end moves within the adjusting groove 23 inside the upper end of the piston 22. When dispensing adhesive to the GaN transistor, the worker pulls down the handle 13, which in turn moves the piston 22 downwards via the mounting ring 27. During this downward movement, the adhesive inside the dispensing head 21 is squeezed into the GaN transistor. During this process, when the piston 22 moves downwards, the top wall of the adjusting groove 23 contacts the limiting block 25, causing the worker to feel resistance. Releasing the handle 13 then completes the dispensing operation. Note that in the initial state before dispensing begins...The farther the top wall of the adjusting groove 23 is from the limiting block 25, the farther the piston 22 moves downward during subsequent dispensing, and the more adhesive is extruded. Furthermore, the rear end of the mounting ring 27 on the outer arc surface of the piston 22 slides within the guide groove 26 in the middle of the upper end of the dispensing frame 9, providing stable guidance for the movement of the piston 22 and ensuring its accuracy. When the piston 22 moves, the rack plate 28 drives the gear 29 to rotate. When the operator releases the handle 13, the elastic potential energy of the torsion spring 12 allows the gear 29 to drive the rack plate 28, automatically resetting the piston 22 for the next dispensing operation. This cyclical operation completes the dispensing of GaN transistors. The amount of adhesive extruded can be adjusted by limiting the movement distance of the piston 22, making it highly versatile.
[0025] The working principle of the dispensing device for GaN transistor processing provided by this utility model is as follows: When the dispensing machine is working, the GaN transistor to be dispensed is first placed on the dispensing table 8. Then, by starting the dispensing pump 5, the glue in the glue tank 3 flows through the pipe 4 to the dispensing head 21 under the action of the dispensing pump 5. Since the front end of the pipe 4 is connected in series with a one-way valve 6, the glue backflow can be effectively prevented, ensuring that the glue flows in the predetermined direction. Next, the button for controlling the electric cylinder 7 on the control switch group 14 is operated, the electric cylinder 7 is started, and the telescopic end of the electric cylinder 7 drives the adjusting column 24 to move up and down. The outer arc surface of the adjusting column 24 slides in the sliding hole 221 on the upper side of the piston 22, and the limiting block 25 at its lower end moves in the adjusting groove 23 inside the upper end of the piston 22. Then, when it is necessary to dispense glue to the GaN transistor, the worker pulls down the handle 13, which in turn drives the piston 22 to move down through the mounting ring 27. During the downward movement of the piston 22, the dispensing head is dispensed. The adhesive inside 21 is extruded into the GaN transistor. During this process, when the piston 22 moves downward, the top wall of the adjusting groove 23 contacts the limiting block 25, and the worker will feel resistance. Then, the handle 13 is released, which ends the dispensing operation. In the initial state before dispensing, the farther the top wall of the adjusting groove 23 is from the limiting block 25, the farther the piston 22 moves downward and the more adhesive is extruded during dispensing. In addition, the rear end of the mounting ring 27 on the outer arc surface of the piston 22 slides in the guide groove 26 in the middle of the upper end of the dispensing frame 9, providing a stable guide for the movement of the piston 22 and ensuring its accuracy. When the piston 22 moves, the rack plate 28 drives the gear 29 to rotate. When the worker releases the handle 13, the elastic potential energy of the torsion spring 12 can drive the rack plate 28 through the gear 29 to automatically reset the piston 22, which is convenient for the next dispensing operation. By repeating this cycle, the dispensing operation of the GaN transistor can be completed.
[0026] It is worth noting that the dispensing pump 5 disclosed in the above embodiments can be the SC-2000 series, the electric cylinder 7 can be the SMCMGP series, and the control switch group 14 is provided with control buttons that correspond one-to-one with the dispensing pump 5 and the electric cylinder 7 and are used to control their switching.
[0027] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. A dispensing device for GaN transistor processing, comprising a base (1), a dispensing frame (9) is arranged in the middle of the upper side of the base (1), and a dispensing table (8) is arranged at the front end of the upper side of the base (1), characterized in that: Also include dispensing mechanism (2); The dispensing mechanism (2) comprises a dispensing head (21), a piston (22), an adjusting groove (23), an adjusting column (24) and a limiting block (25), the upper end of the dispensing frame (9) is provided with a dispensing head (21), the inside of the dispensing head (21) is slidably connected with a piston (22), the upper side of the piston (22) is provided with a sliding hole (221), the inside of the upper end of the piston (22) is provided with an adjusting groove (23), the adjusting groove (23) is communicated with the sliding hole (221), the front end of the dispensing frame (9) is provided with an adjustable adjusting column (24), the outer arc surface of the adjusting column (24) is slidably connected with the sliding hole (221), and the lower end of the adjusting column (24) is provided with a limiting block (25), and the limiting block (25) is located in the inside of the adjusting groove (23).
2. The dispensing device for GaN transistor processing according to claim 1, characterized in that: The right end of the base (1) is provided with a control switch group (14), and the input end of the control switch group (14) is electrically connected with an external power supply.
3. The dispensing device for GaN transistor processing according to claim 2, characterized in that: The upper side of the dispensing frame (9) is provided with an electric cylinder (7), the telescopic end of the electric cylinder (7) penetrates the upper end of the dispensing frame (9), the telescopic end of the electric cylinder (7) is provided with an adjusting column (24), and the input end of the electric cylinder (7) is electrically connected with the output end of the control switch group (14).
4. The dispensing device for GaN transistor processing according to claim 1, characterized in that: The dispensing mechanism (2) further comprises a guide groove (26) and a mounting ring (27), the upper end of the dispensing frame (9) is provided with a guide groove (26), the outer arc surface of the piston (22) is provided with a mounting ring (27), the rear end of the mounting ring (27) is slidably connected with the guide groove (26), and the outer arc surface of the mounting ring (27) is provided with a handle (13).
5. The dispensing device for GaN transistor processing according to claim 4, characterized in that: The dispensing mechanism (2) further comprises a rack plate (28) and a gear (29), the left and right sides of the upper end of the dispensing frame (9) are provided with mounting plates (10), the mounting shaft (11) is arranged between the two mounting plates (10), the middle part of the mounting shaft (11) is rotatably connected with a gear (29), the rear end of the mounting ring (27) is provided with a rack plate (28), the rack plate (28) is meshed with the gear (29), and the right side of the gear (29) is provided with a torsional spring (12) between the right mounting plate (10).
6. The dispensing device for GaN transistor processing according to claim 2, characterized in that: The upper side of the dispensing frame (9) is provided with a glue warehouse (3), the glue warehouse (3) and the dispensing head (21) are communicated through a pipeline (4), the middle part of the pipeline (4) is connected with a dispensing pump (5), and the input end of the dispensing pump (5) is electrically connected with the output end of the control switch group (14).
7. The dispensing device for GaN transistor processing according to claim 6, characterized in that: The front end of the pipeline (4) is connected with a one-way valve (6).