Earphone curved surface chip glue sealing tool

Abstract

An earphone curved surface chip glue sealing tool comprises a bottom plate and a pressing plate, one side of the pressing plate is hinged to the bottom plate, so that the pressing plate can be turned over to cover the upper end face of the bottom plate, one side of the bottom plate is provided with an extension block, and the upper end face of the extension block is provided with a chip placement groove; one side, far away from the bottom plate, of the chip placement groove is upwards inclined; an inclined surface structure and a profiling cambered surface structure which are consistent with the chip placement groove in inclination angle are arranged in the chip placement groove, and a curved surface structure at the bottom of the earphone integrated chip is placed through the profiling cambered surface structure; the upper end face of the bottom plate is provided with a circuit board containing groove connected with the chip containing groove, the pressing plate is provided with a protruding block capable of covering the upper end face of the extending block, and the lower end face of the protruding block is provided with a pressing face corresponding to the inclined face structure and consistent with the inclined face structure in inclination angle. According to the utility model, through the inclined chip placement groove and the inclined surface structure and the profiling cambered surface structure in the inclined chip placement groove, the close attachment of the earphone integrated chip and the circuit board and the uniform distribution of glue are ensured, and the packaging precision is improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic component processing technology, and in particular to a tooling for encapsulating curved chip in headphones. Background Technology

[0002] The internal components of the earphone include a circuit board and an integrated chip connected together. The bottom of the integrated chip is usually designed with a curved structure for easy assembly. In the process of dispensing and encapsulating the curved chip of the earphone, traditional dispensing fixtures have the following problems: First, the adhesive thickness is uneven and the direction of adhesive overflow is uncontrollable, resulting in an uneven encapsulation surface; second, the curvature adaptability is poor, and gaps are easily generated between the integrated chip and the contact surface of the fixture, resulting in uneven adhesive layer thickness; finally, the pick-and-place efficiency is low, and the chip replacement operation is cumbersome and time-consuming.

[0003] Therefore, in view of the shortcomings of the existing technology, it is necessary to design a tooling for encapsulating curved chip in headphones to solve the above problems.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solution of this utility model and facilitating the understanding of those skilled in the art. It should not be assumed that the above content is known to those skilled in the art simply because it has been described in the background section of this utility model. Utility Model Content

[0005] To overcome the shortcomings of the prior art, the present invention aims to disclose a headphone curved chip encapsulation tooling, which is used to improve the encapsulation efficiency and quality of integrated chips in headphone internal components.

[0006] This utility model discloses a tooling for encapsulating curved chip in headphones, including a base plate and a pressure plate. One side of the pressure plate is hinged to the base plate, allowing the pressure plate to flip and cover the upper surface of the base plate. An extension block is provided on one side of the base plate, and a chip placement groove is provided on the upper surface of the extension block. The chip placement groove is inclined upward on the side away from the base plate, allowing the encapsulating adhesive to flow towards the side with lower height, enhancing the uniformity of the adhesive encapsulation. The chip placement groove has a sloping structure and a contoured arc structure with the same inclination angle. The contoured arc structure is used to place the curved structure at the bottom of the headphone integrated chip. The upper surface of the base plate has a circuit board placement groove connected to the chip placement groove. The pressure plate has a protrusion that can cover the upper surface of the extension block. The lower surface of the protrusion has a pressing surface that corresponds to the sloping structure and has the same inclination angle. The pressing surface and the sloping structure work together to press and position the connection between the headphone integrated chip and the circuit board, making the curved structure at the bottom of the headphone integrated chip fit more tightly with the contoured arc structure.

[0007] Preferred technical solution: A connecting block is provided on the upper end surface of the base plate, and one side of the pressure plate is hinged to the connecting block to ensure that the flipping of the pressure plate is more stable and smooth.

[0008] Preferred technical solution: A clearance groove is provided at the position corresponding to the mounting groove of the circuit board and the pressure plate to avoid electronic components on the circuit board and prevent the pressure plate from pressing or damaging the electronic components.

[0009] Preferred technical solution: The base plate is provided with locking holes, and the corresponding position of the pressure plate is provided with locking bolts, which are used to lock the pressure plate after closing, so as to ensure that the headphone integrated chip and circuit board remain fixed during the dispensing process.

[0010] Preferred technical solution: The top of the locking bolt is equipped with a lifting handle for easy and quick flipping and locking of the pressure plate.

[0011] Preferred technical solution: The base plate and the extension block are integrally formed to ensure the connection accuracy of the circuit board mounting slot and the chip mounting slot and reduce assembly errors.

[0012] Preferred technical solution: The circuit board mounting slot is equipped with positioning posts for positioning the circuit board, ensuring accurate positioning of the headphone integrated chip and the circuit board.

[0013] Preferred technical solution: An overflow groove is provided at the connection between the circuit board mounting slot and the chip mounting slot to collect the overflowing glue and prevent the glue from contaminating other components.

[0014] Preferred technical solution: The main body of the pressure plate is made of elastic material to avoid excessive pressure on the chip and circuit board; the upper end of the pressure plate is provided with a metal shaping plate to enhance the strength and durability of the pressure plate and ensure long-term stability.

[0015] Due to the application of the above technical solution, the beneficial effects of this utility model compared with the prior art are as follows:

[0016] 1) The contoured arc surface structure in the chip placement slot perfectly matches the curved surface structure at the bottom of the headphone integrated chip, ensuring that the chip is stably placed and avoiding displacement or misalignment during the packaging process;

[0017] 2) The inclined structure of the chip placement slot matches the pressing surface of the pressure plate to ensure a tight fit between the headphone integrated chip and the circuit board, improving the accuracy of dispensing and encapsulation.

[0018] 3) The chip mounting slot is tilted upwards, so that the adhesive flows naturally to the lower position under the action of gravity, ensuring that the adhesive evenly covers the headphone integrated chip and the connection between the headphone integrated chip and the circuit board, avoiding adhesive accumulation or uneven distribution.

[0019] 4) An overflow groove is provided at the connection between the circuit board mounting slot and the chip mounting slot to collect excess glue and prevent glue from overflowing and contaminating other components;

[0020] 5) The pressure plate is equipped with a clearance groove to prevent the pressure plate from pressing or damaging the electronic components on the circuit board, ensuring the safety of the electronic components during the dispensing process;

[0021] 6) The pressure plate body is made of elastic material to avoid applying excessive pressure to the chip and circuit board, further protecting the electronic components;

[0022] 7) The circuit board mounting slot is equipped with positioning posts to ensure quick and accurate positioning of the circuit board and the chip, reducing adjustment time;

[0023] 8) The pressure plate and the base plate are connected by a hinge, making the flipping operation more stable and smooth. The pressure plate can be quickly locked and released by tightening the bolts and pulling the handle, improving work efficiency. Attached Figure Description

[0024] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a headphone curved chip encapsulation fixture according to the present invention;

[0026] Figure 2 This is a schematic diagram of the structure of the base plate and extension block in this utility model;

[0027] Figure 3 This is a schematic diagram of the structure of the pressure plate of this utility model.

[0028] In the attached diagrams above, 1 is the base plate; 11 is the circuit board mounting slot; 12 is the connecting block; 13 is the locking hole; 14 is the positioning post; 15 is the overflow groove; 2 is the pressure plate; 21 is the protrusion; 21a is the pressing surface; 22 is the clearance groove; 23 is the locking bolt; 24 is the lifting handle; 25 is the metal shaping plate; 3 is the extension block; 31 is the chip mounting slot; 31a is the inclined surface structure; 31b is the contoured arc surface structure. Detailed Implementation

[0029] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0030] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be used interchangeably where appropriate for the description of embodiments of this application herein. Furthermore, the terms "comprising" and "having," and their synonyms, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0031] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this utility model and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0032] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0033] Furthermore, the terms "installation," "setting," "equipped with," "connection," "linking," "fitting," and "fitting" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Similarly, "fitting" can mean completely or partially fitted. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0035] Example:

[0036] like Figure 1 As shown, this utility model discloses a sealing fixture for curved chip in an earphone, including a base plate 1, a pressure plate 2, and an extension block 3. The main components of this utility model will be described in detail below:

[0037] like Figure 1 , Figure 2 and Figure 3 As shown, the upper end face of the base plate 1 is provided with a connecting block 12, and the upper end face of the base plate 1 is provided with a circuit board mounting groove 11 connected to the chip mounting groove 31. The circuit board mounting groove 11 is provided with a positioning post 14 corresponding to the positioning hole on the circuit board, which is used to quickly and accurately position the circuit board.

[0038] like Figure 1 , Figure 2 and Figure 3 As shown, the extension block 3 is located on one side of the base plate 1, and the upper end face of the extension block 3 is provided with a chip placement groove 31. The chip placement groove 31 is inclined upward on the side away from the base plate 1, so that the adhesive flows naturally downward under the action of gravity, ensuring that the adhesive evenly covers the headphone integrated chip and the connection between the headphone integrated chip and the circuit board. The chip placement groove 31 is provided with a sloping surface structure 31a and a contoured arc surface structure 31b with the same inclination angle. The contoured arc surface structure 31b is closely fitted with the curved surface structure at the bottom of the headphone integrated chip, ensuring that the headphone integrated chip is stably placed and avoiding displacement or misalignment during the packaging process. The sloping surface structure 31a cooperates with the pressing surface 21a of the protrusion 21 to ensure that the headphone integrated chip is tightly fitted with the chip placement groove 31.

[0039] like Figure 1 , Figure 2 and Figure 3 As shown, one side of the pressure plate 2 is hinged to the connecting block 12. It should be noted that in other embodiments, the pressure plate 2 can be directly hinged to the base plate 1 without the connecting block 12. The pressure plate 2 is provided with a protrusion 21 that can cover the upper surface of the extension block 3. The lower surface of the protrusion 21 is provided with a pressing surface 21a that corresponds to the inclined structure 31a and has the same inclination angle.

[0040] The method and principle of this utility model are as follows: In use, the flip-over pressure plate 2 is used to open the fixture, and the circuit board is placed in the circuit board mounting slot 11. The positioning post 14 ensures that the circuit board and the chip are quickly and accurately positioned. The headphone integrated chip is placed in the chip mounting slot 31, so that the curved surface structure at the bottom of the headphone integrated chip is closely fitted with the contoured arc surface structure 31b. The flip-over pressure plate 2 covers the upper end surface of the base plate 1 and presses the circuit board into the circuit board mounting slot 11. During this process, the pressing surface 21a of the protrusion 21 cooperates with the inclined surface structure 31a of the chip mounting slot 31 to ensure that the connection between the headphone integrated chip and the circuit board is pressed and positioned. Glue is injected into the sealing area of ​​the headphone integrated chip. Under the action of gravity, the glue naturally flows to the lower part to ensure that the glue is evenly covered. After the glue has cured, the pressure plate 2 is flipped over, and the encapsulated headphone integrated chip and circuit board are taken out.

[0041] like Figure 1 , Figure 2 and Figure 3 As shown, the pressure plate 2 is provided with a clearance groove 22 at the position corresponding to the circuit board mounting groove 11, which is used to avoid electronic components on the circuit board and prevent the pressure plate 2 from causing pressure or damage to the electronic components.

[0042] like Figure 1 , Figure 2 and Figure 3 As shown, the base plate 1 is provided with a locking hole 13, and the pressure plate 2 is provided with a locking bolt 23 at the corresponding position. When the pressure plate 2 is closed, the locking bolt 23 can cooperate with the locking hole 13 to firmly lock the base plate 1 and the pressure plate 2 together, ensuring that the headphone integrated chip and the circuit board remain fixed during the dispensing process.

[0043] like Figure 1 , Figure 2 and Figure 3 As shown, the top of the locking bolt 23 is provided with a lifting handle 24, which facilitates quick flipping and locking of the pressure plate 2.

[0044] like Figure 1 , Figure 2 and Figure 3 As shown, the base plate 1 and the extension block 3 are integrally formed, which improves the positioning accuracy.

[0045] like Figure 1 , Figure 2 and Figure 3 As shown, an overflow groove 15 is provided at the connection between the circuit board mounting groove 11 and the chip mounting groove 31 to collect excess glue and prevent glue from overflowing and contaminating other components.

[0046] like Figure 1 , Figure 2 and Figure 3 As shown, the main body of the pressure plate 2 is made of elastic material, and its upper surface is provided with a metal shaping plate 25 to enhance the strength and durability of the main body of the pressure plate 2.

[0047] Finally, it should be noted that the above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An earphone curved chip encapsulation tooling, comprising a base plate (1) and a pressing plate (2), one side of the pressing plate (2) is hinged with the base plate (1), so that the pressing plate (2) can be turned over to cover the upper end face of the base plate (1), characterized in that: The bottom plate (1) is provided with an extension block (3) on one side, and the upper end surface of the extension block (3) is provided with a chip placing groove (31); the chip placing groove (31) is provided with an inclined surface structure (31a) and a profiled curved surface structure (31b) consistent with the inclination angle thereof, and is provided upwardly away from the side of the bottom plate (1); the upper end surface of the bottom plate (1) is provided with a circuit board placing groove (11) connected with the chip placing groove (31); the pressing plate (2) is provided with a protruding block (21) covering the upper end surface of the extension block (3); and the lower end surface of the protruding block (21) is provided with a pressing surface (21a) corresponding to the inclined surface structure (31a) and consistent with the inclination angle thereof.

2. The earphone curved chip encapsulation tooling according to claim 1, characterized in that: The upper end surface of the bottom plate (1) is provided with a connecting block (12), and one side of the pressing plate (2) is hinged to the connecting block (12).

3. The earphone curved chip encapsulation tooling of claim 1, wherein: The pressing plate (2) is provided with a clearance groove (22) corresponding to the circuit board placing groove (11) for avoiding the electronic elements on the circuit board.

4. The earphone curved chip encapsulation tooling of claim 1, wherein: The bottom plate (1) is provided with a locking hole (13), and the pressing plate (2) is provided with a locking bolt (23) at the corresponding position for locking after closing.

5. The earphone curved chip encapsulation tooling of claim 4, wherein: The top of the locking bolt (23) is provided with a pull handle (24).

6. The earphone curved chip encapsulation tooling of claim 1, wherein: The bottom plate (1) and the extension block (3) are integrally formed.

7. The earphone curved chip encapsulation tooling of claim 1, wherein: The circuit board placing groove (11) is provided with a positioning column (14) for positioning the circuit board.

8. The earphone curved chip encapsulation tooling of claim 1, wherein: The circuit board placing groove (11) is provided with an overflow groove (15) at the connecting position with the chip placing groove (31).

9. The earphone curved chip encapsulation tooling of claim 1, wherein: The main body of the pressing plate (2) is made of elastic material, and the upper end surface thereof is provided with a metal shaping plate (25).

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