Stamping die stress buffering device

Abstract

The utility model discloses a stamping die stress buffering device which comprises a movable die and a fixed die, a buffering mechanism extending towards the fixed die is arranged on the face, facing the fixed die, of the movable die, the buffering mechanism comprises a supporting cylinder and a telescopic piece installed in the supporting cylinder in a telescopic mode, and the end, facing the fixed die, of the telescopic piece is connected with a movable adjusting piece. A buffer block is installed at the end, facing the fixed mold, of the adjusting piece, and the adjusting piece moves to adjust the distance between the buffer block and the fixed mold. Therefore, the distance difference between the buffer block of each buffer mechanism and the fixed die caused by abrasion is compensated, so that each buffer mechanism can uniformly distribute pressure during pressing, and the buffer effect is ensured.

Description

Technical Field

[0001] This utility model relates to the field of stamping equipment technology, and more specifically, to a stress buffer device for stamping dies. Background Technology

[0002] The support structure for photovoltaic (PV) modules is typically formed into individual parts through stamping, and these parts are then assembled to form the overall support structure. During stamping, buffer devices are usually placed between the fixed die and the moving die. These buffer devices are typically installed at the four corners of the moving die. Different wear patterns occur among these buffer devices during stamping, resulting in uneven pressure distribution. This affects the forming accuracy of the support structure, which in turn affects the overall assembly accuracy of the support structure, and ultimately, the installation accuracy of the PV panels. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a stress buffer device for stamping dies that can adjust and compensate for wear.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a stress buffer device for stamping dies, comprising a moving die and a fixed die, wherein a buffer mechanism extending toward the fixed die is provided on the side of the moving die facing the fixed die, the buffer mechanism comprising a support cylinder and a telescopic member retractably installed in the support cylinder, wherein a movable adjusting member is connected to the end of the telescopic member facing the fixed die, and a buffer block is installed on the end of the adjusting member facing the fixed die, and the adjusting member moves to adjust the distance between the buffer block and the fixed die.

[0005] Furthermore, the end of the telescopic member facing the fixed mold is provided with an adjustment cavity, and the end of the adjustment member facing the telescopic member is provided with a connecting part that is embedded in the adjustment cavity and can move along the adjustment cavity.

[0006] Furthermore, the adjustment cavity is provided with a first limiting plate and a second limiting plate, and a limiting groove is formed between the first limiting plate and the second limiting plate. The side wall of the connecting part is provided with a plurality of connecting blocks arranged at equal intervals. The first limiting plate and the second limiting plate are provided with adjustment channels for the connecting blocks to pass through. The adjusting member rotates and drives the connecting blocks to be embedded in the limiting groove to restrict the movement of the adjusting member.

[0007] Furthermore, at least one of the sides of the first limiting plate facing the second limiting plate and the side of the second limiting plate facing the first limiting plate is provided with an elastic pad, and the connecting block squeezes the elastic pad when it is embedded in the limiting groove.

[0008] Furthermore, the support cylinder is provided with a telescopic groove, the telescopic member is inserted into the telescopic groove, and a spring is provided in the telescopic groove to abut against the telescopic member.

[0009] Furthermore, the adjusting member has an installation groove at the end facing the fixed mold, and the buffer block is embedded in the installation groove.

[0010] In summary, this utility model has the following beneficial effects:

[0011] The movement of the adjusting component can drive the movement of the entire adjusting component, which can adjust the distance between the buffer block and the fixed mold, thereby compensating for the distance difference between the buffer block and the fixed mold of each buffer mechanism caused by wear, thus ensuring that each buffer mechanism can distribute pressure evenly when pressing down, and ensuring the buffering effect. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the buffer mechanism;

[0014] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0015] Figure 4 This is a structural schematic diagram of the expansion joint;

[0016] Figure 5 This is a schematic diagram of the adjusting component;

[0017] Reference numerals: moving mold 100, fixed mold 200, buffer mechanism 300, support cylinder 310, telescopic groove 311, spring 312, telescopic component 320, adjusting cavity 321, first limiting plate 322, second limiting plate 323, elastic pad 324, adjusting channel 325, limiting groove 326, adjusting component 330, connecting part 331, connecting block 332, buffer block 340, mounting groove 341. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] See Figures 1 to 5This embodiment discloses a stress buffer device for stamping dies, including a moving die 100 and a fixed die 200. Two buffer mechanisms 300 extending towards the fixed die 200 are provided on the side of the moving die 100 facing the fixed die 200. Each buffer mechanism 300 includes a support cylinder 310 with a telescopic groove 311 into which a telescopic member 320 is inserted. A spring 312 abutting against the telescopic member 320 is also provided within the telescopic groove 311. A movable adjusting member 330 is connected to the end of the telescopic member 320 facing the fixed die 200. A mounting groove 341 is provided on the end of the adjusting member 330 facing the fixed die 200, and a buffer block 340 is embedded within the mounting groove 341. When the moving die 100 presses down on the fixed die 200, the springs buffer the stress generated during the pressing. The buffer block 340 is made of rubber and, through its elasticity, deforms when the fixed die 200 is pressed down, thus protecting the fixed die 200.

[0020] The telescopic member 320 has an adjustment cavity 321 at one end facing the fixed mold 200, and the adjustment member 330 has a connecting part 331 at the other end facing the telescopic member 320, which is embedded in the adjustment cavity 321 and can move along the adjustment cavity 321. The movement of the connecting part 331 can drive the adjustment member 330 to move as a whole, thereby adjusting the distance between the buffer block 340 and the fixed mold 200. This can compensate for the distance difference between the buffer block 340 and the fixed mold 200 of each buffer mechanism 300 caused by wear, thereby ensuring that each buffer mechanism 300 can evenly distribute pressure when pressing down, and ensuring the buffering effect.

[0021] The adjustment cavity 321 is provided with a first limiting plate 322 and a second limiting plate 323, which together form a limiting groove 326. The side wall of the connecting part 331 is provided with multiple connecting blocks 332 arranged equidistantly along its length. The first limiting plate 322 and the second limiting plate 323 have adjustment channels 325 for the connecting blocks 332 to pass through. As the connecting part 331 moves, different connecting blocks 332 pass through the adjustment channels 325, allowing connecting blocks 332 at different positions to engage with the limiting groove 326. By rotating the adjusting member 330, the connecting blocks 332 at different positions can be embedded into the limiting groove 326, thereby restricting the movement of the connecting part 331 and fixing the telescopic member 320 and the adjusting member 330, thus achieving adjustment of the distance between the buffer block 340 and the fixed mold 200. Meanwhile, the multiple connecting blocks 332, which are equidistantly arranged along the length of the connecting part 331, also serve as a scale. During adjustment, the adjustment amount of the current buffer mechanism 300's adjusting member 330 can be determined based on the number of connecting blocks 332 exposed in the adjusting cavity 321. It also facilitates comparison with other buffer mechanisms 300 to determine the amount that needs to be adjusted.

[0022] Elastic pads 324 are provided on the side of the first limiting plate 322 facing the second limiting plate 323 and the side of the second limiting plate 323 facing the first limiting plate 322. The elastic pads 324 are made of rubber. When the connecting block 332 is embedded in the limiting groove 326, the connecting block 332 squeezes the elastic pads 324. The deformation of the elastic pads 324 can increase the friction between the first limiting plate 322, the second limiting plate 323 and the connecting block 332, thereby restricting the movement of the connecting block 332 relative to the first limiting plate 322 and the second limiting plate 323. This prevents the impact or vibration generated by the stamping from causing the connecting block 332 to move out of the limiting groove 326, and ensures the stability of the connection between the telescopic member 320 and the adjusting member 330.

[0023] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A stress buffering device for a punch die, characterized by, The mould (100) and the fixed mould (200) are provided with at least two buffering mechanisms (300) extending towards the fixed mould (200) on one side of the mould (100), the buffering mechanism (300) comprises a supporting cylinder (310) and a telescopic part (320) mounted in the supporting cylinder (310), one end of the telescopic part (320) towards the fixed mould (200) is connected with a movable adjusting part (330), one end of the adjusting part (330) towards the fixed mould (200) is mounted with a buffering block (340), and the adjusting part (330) is moved to adjust the distance between the buffering block (340) and the fixed mould (200).

2. A stress relieving device for a stamping die according to claim 1, wherein One end of the telescopic part (320) towards the fixed mould (200) is provided with an adjusting cavity (321), and one end of the adjusting part (330) towards the telescopic part (320) is provided with a connecting part (331) embedded in the adjusting cavity (321) and capable of moving along the adjusting cavity (321).

3. A stress relieving device for a stamping die according to claim 2, wherein The adjusting cavity (321) is provided with a first limiting plate (322) and a second limiting plate (323), a limiting groove (326) is formed between the first limiting plate (322) and the second limiting plate (323), the side wall of the connecting part (331) is provided with a plurality of equidistantly arranged connecting blocks (332), the first limiting plate (322) and the second limiting plate (323) are provided with adjusting channels (325) for the connecting blocks (332) to pass through, and the adjusting part (330) is rotated to drive the connecting blocks (332) to be embedded in the limiting groove (326) to limit the movement of the adjusting part (330).

4. A stress relieving device for a stamping die according to claim 3, wherein At least one of the side of the first limiting plate (322) towards the second limiting plate (323) and the side of the second limiting plate (323) towards the first limiting plate (322) is provided with an elastic pad (324), and the connecting blocks (332) extrude the elastic pad (324) when the connecting blocks (332) are embedded in the limiting groove (326).

5. The stress relieving apparatus for a stamping die according to claim 1, wherein The supporting cylinder (310) is provided with a telescopic groove (311), the telescopic part (320) is inserted into the telescopic groove (311), and the telescopic groove (311) is provided with a spring (312) abutting against the telescopic part (320).

6. A stress relieving device for a stamping die as defined in claim 1 wherein, One end of the adjusting part (330) towards the fixed mould (200) is provided with a mounting groove (341), and the buffering block (340) is embedded in the mounting groove (341).

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