Deposition apparatus

Abstract

A deposition apparatus includes: a deposition source including at least one deposition nozzle that sprays a deposition material; an ejection angle limiting portion spaced apart from the deposition source and limiting an ejection angle of the deposition material ejected from the at least one deposition nozzle; and a cleaning module disposed between the deposition source and the ejection angle restricting portion and heating the deposition material accumulated on the ejection angle restricting portion.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0031995, filed on March 6, 2024, with the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to deposition equipment and cleaning methods thereof. Background Technology

[0004] Organic light-emitting display devices are display devices that utilize the following phenomenon: electrons injected from the cathode and holes injected from the anode recombine in an organic thin film to form excitons, and light of a specific wavelength is generated by the energy from the formed excitons.

[0005] As a method for depositing organic materials or metals as electrodes in an organic light-emitting display device, a vacuum deposition method utilizing a deposition apparatus can be used. The vacuum deposition method can be performed by the following steps: positioning a substrate on which an organic thin film to be formed is placed inside a vacuum chamber; bringing a deposition mask having a pattern identical to that of the thin film to be formed into close contact with the substrate; and depositing a deposition material such as an organic material onto the substrate by evaporating or sublimating the deposition material using a deposition source.

[0006] An ejection angle limiting section, used to limit the ejection angle of the deposited material ejected from the deposition nozzle of the deposition source, can be provided in the deposition apparatus in which a vacuum deposition method is performed. During the process of depositing the deposited material, the ejection angle of the deposited material ejected from the deposition nozzle may change when the deposited material accumulates in the ejection angle limiting section. Furthermore, the deposited material accumulated on the ejection angle limiting section may fall off and thus close the deposition nozzle. Utility Model Content

[0007] This disclosure provides a deposition apparatus and a cleaning method thereof, which can prevent changes in the spray angle of the deposition material by preventing the deposition material from accumulating on the spray angle limiting portion, and can ensure continuous operation of the deposition process by cleaning the deposition material that closes the deposition nozzle.

[0008] However, the embodiments of this disclosure are not limited to those described herein. The above and other embodiments of this disclosure will become more apparent to those skilled in the art upon reference to the following detailed description of this disclosure.

[0009] According to embodiments of the present disclosure, a deposition apparatus may include: a deposition source including at least one deposition nozzle for spraying deposition material; a spray angle limiting portion spaced apart from the deposition source and limiting the spray angle of the deposition material sprayed from the at least one deposition nozzle; and a cleaning module disposed between the deposition source and the spray angle limiting portion and heating the deposition material accumulated on the spray angle limiting portion.

[0010] The cleaning module can be set to be closer to the spray angle limitation area than the deposition source.

[0011] At least one deposition nozzle may include a plurality of deposition nozzles arranged in a first direction, and the cleaning module may be configured to move in the first direction.

[0012] The jetting angle limiting portion may include: an extension plate extending upward from the deposition source; and a blocking plate extending from the extension plate in a second direction and forming an opening region through which the deposited material passes.

[0013] The second direction can be a direction that is horizontally or orthogonal to the first direction.

[0014] The opening area can be positioned above multiple deposition nozzles and extends in the first direction.

[0015] The cleaning module may include: a moving track extending in a first direction below the baffle; a moving block disposed on the moving track and moving along the moving track; and a heating member extending from the moving block in a second direction.

[0016] The cleaning module may also include a first driver that connects the moving block and the heating element and moves the heating element in a second direction.

[0017] The cleaning module may also include a second driver that connects to the first driver and the heating element and rotates the heating element such that the extended end of the heating element faces a third direction.

[0018] The third direction can be a direction that is vertically orthogonal to the first and second directions.

[0019] The cleaning module may also include a third drive that connects to the second drive and the heating element and moves the heating element upwards in the third party.

[0020] The heating element can be moved by a third actuator and inserted into one of a plurality of deposition nozzles.

[0021] The extension plate may include multiple extension plates, which may include a first extension plate and a second extension plate. The first extension plate may extend upward from one side of the deposition source, and the second extension plate may extend upward from the other side of the deposition source, such that multiple deposition nozzles are disposed between the first extension plate and the second extension plate.

[0022] The baffle may include multiple baffles, which may include a first baffle and a second baffle. The first baffle may extend from a first extension plate in a second direction to point above the multiple deposition nozzles. The second baffle may extend from a second extension plate in the second direction to face the first baffle. The extension ends of the first baffle and the extension ends of the second baffle may be spaced apart from each other to form an opening region between the first baffle and the second baffle.

[0023] The cleaning module may include multiple cleaning modules, including a first cleaning module and a second cleaning module. The first cleaning module may be located below the first baffle plate, and the second cleaning module may be located below the second baffle plate.

[0024] According to embodiments of the present disclosure, a cleaning method for a deposition apparatus may include cleaning a spray angle limiting portion and cleaning a deposition nozzle. The cleaning spray angle limiting portion includes a cleaning module disposed below the spray angle limiting portion that moves along the spray angle limiting portion and removes the deposition material accumulated on the spray angle limiting portion by a heating member of the cleaning module. The spray angle limiting portion limits the spray angle of the deposition material sprayed from the deposition nozzle. Cleaning the deposition nozzle includes inserting a heating member into the deposition nozzle to remove the deposition material accumulated in the deposition nozzle.

[0025] The deposition nozzle may include a plurality of deposition nozzles arranged in a first direction, the spray angle limiting portion may include a baffle plate forming an opening area through which the deposition material passes, the opening area extending in the first direction above the plurality of deposition nozzles, and the cleaning spray angle limiting portion may include a cleaning module movable in the first direction below the baffle plate.

[0026] The cleaning module may also include: a moving track extending in a first direction below the baffle plate; and a moving block supporting the heating member and disposed on the moving track to move along the moving track, and the cleaning spray angle limiting portion may include the moving block moving along the moving track.

[0027] The cleaning module may further include: a first driver for moving a heating member in a second direction orthogonal to the first direction and positioning the heating member above a plurality of deposition nozzles; a second driver for rotating the heating member in a third direction orthogonal to the first and second directions, such that the heating member faces the plurality of deposition nozzles; and a third driver for moving the heating member in the third direction, such that the heating member is inserted into one of the plurality of deposition nozzles. Cleaning the deposition nozzles may further include: moving the heating member in the second direction by the first driver and positioning the heating member above the plurality of deposition nozzles; rotating the heating member positioned above one of the plurality of deposition nozzles to face one of the plurality of deposition nozzles by the second driver; and inserting the heating member rotated to face one of the plurality of deposition nozzles into one of the plurality of deposition nozzles by the third driver.

[0028] The cleaning deposition nozzle may further include: moving a heating element inserted into one of the plurality of deposition nozzles upward via a third actuator, such that the heating element is pulled out of one of the plurality of deposition nozzles; moving a moving block along a moving track such that the heating element pulled out of one of the plurality of deposition nozzles is positioned above another of the plurality of deposition nozzles adjacent to one of the plurality of deposition nozzles; and inserting the heating element positioned above the other of the plurality of deposition nozzles into the other of the plurality of deposition nozzles via the third actuator.

[0029] According to the deposition apparatus and cleaning method of the present disclosure, the spray angle of the deposition material can be prevented from changing by preventing the deposition material from accumulating on the spray angle limiting part, and the continuous operation of the deposition process can be ensured by cleaning the deposition material that closes the deposition nozzle.

[0030] The effects of embodiments according to this disclosure are not limited to those mentioned above, and many more effects are included in the following description of this disclosure. Attached Figure Description

[0031] The above and other aspects and features of this disclosure will become more apparent from the detailed description of embodiments thereof with reference to the accompanying drawings, in which:

[0032] Figure 1 This is a schematic cross-sectional view showing a deposition apparatus according to an embodiment of the present disclosure;

[0033] Figure 2 It is shown Figure 1 A plan view of the deposition source, the jet angle limiting section, and the cleaning module;

[0034] Figure 3 yes Figure 2 Left side view;

[0035] Figure 4 yes Figure 2 The right-side view;

[0036] Figure 5 Is Figure 2 The front view shows a schematic cross-sectional view of the state in which the first driver is driven;

[0037] Figure 6 Is Figure 5 A schematic cross-sectional view showing the state of the second driver being driven;

[0038] Figure 7 Is Figure 6 A schematic cross-sectional view showing the state of the third driver being driven;

[0039] Figure 8 This shows the spray angle of the deposition nozzle due to the accumulation in... Figure 1 A schematic cross-sectional view showing the change in state of the deposited material on the part limited by the spray angle;

[0040] Figure 9 It shows movement in the first direction. Figure 2 A plan view showing the status of the first and second cleaning modules in the process;

[0041] Figure 10 Is Figure 2 The front view shows a schematic cross-sectional view of the state in which the heating element is moved in the second direction by the first actuator;

[0042] Figure 11 Is Figure 10 The diagram shows a schematic cross-sectional view of the heating element being rotated to face a third direction via a second actuator.

[0043] Figure 12 Is Figure 11 The diagram shows a schematic cross-sectional view of the heating element being moved upward by a third actuator and inserted into the deposition nozzle.

[0044] Figure 13 Is Figure 12 The diagram shows a schematic cross-sectional view of the heating element being moved upward by a third actuator and pulled out of the deposition nozzle.

[0045] Figure 14 Is Figure 13 A schematic cross-sectional view showing the state of the first moving block moving along the first moving track in the first direction in the left-hand view; and

[0046] Figure 15 Is Figure 14The diagram shows a schematic cross-sectional view of the state in which the heating element is moved upward by a third drive and inserted into another deposition nozzle. Detailed Implementation

[0047] The advantages and features of this disclosure, and methods of implementing them, will become apparent from the following description of embodiments with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed herein, but can be implemented in various different ways. The embodiments provided are intended to make this disclosure thorough and to fully communicate the scope of this disclosure to those skilled in the art. It should be noted that the scope of this disclosure is defined only by the claims.

[0048] When an element, such as a layer, is referred to as being "on" another element or layer, "connected to," or "attached to" another element or layer, it can be directly on, directly connected to, or directly attached to the other element or layer, or there may be an intervening element or layer. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to," or "directly attached to" another element or layer, there is no intervening element or layer. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection with or without an intervening element. Furthermore, when an element is referred to as being "in contact" with or "in contact with" another element, the element can be in "electrical contact" or "physical contact" with the other element, or in "indirect contact" or "direct contact" with the other element. Throughout the specification, similar reference numerals denote similar elements.

[0049] Crosshairs and / or shading are typically used in the accompanying drawings to clarify the boundaries between adjacent elements. Therefore, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for particular materials, material properties, dimensions, proportions, commonalities between illustrated elements, and / or any other characteristics, properties, etc., of the elements, unless otherwise stated. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. When embodiments can be implemented differently, a particular process sequence may be performed differently than the sequence described. For example, two consecutively described processes may be performed substantially simultaneously, or in the reverse order of their description.

[0050] Terms such as first, second, etc., are used to arbitrarily distinguish between the elements described by these terms, and therefore these terms are not necessarily intended to indicate the time priority or other priority of these elements. These terms are only used to distinguish one element from another. Therefore, as used herein, within the scope of the art disclosed, a first element may be a second element.

[0051] For descriptive purposes, spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side” (e.g., as in “sidewall”) may be used herein to describe the relationship between one element and another(s) as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, the spatial relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will consequently be oriented “above” other elements or features. Thus, the exemplary term “below” can encompass both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore, the spatial relative descriptive terms used herein are interpreted accordingly.

[0052] Features of the various embodiments of this disclosure can be combined in part or in whole. As will be clearly understood by those skilled in the art, various interactions and operations are technically possible. Various embodiments can be practiced individually or in combination.

[0053] Unless otherwise defined or implied herein, all terms used (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and should not be interpreted as having an ideal or overly formal meaning unless clearly defined in the specification.

[0054] In the following description, embodiments will be described with reference to the accompanying drawings.

[0055] Figure 1 This is a schematic cross-sectional view showing a deposition apparatus according to an embodiment of the present disclosure.

[0056] Figure 2 It is shown Figure 1 A plan view of the deposition source, the spray angle limiting section, and the cleaning module.

[0057] Figure 3 yes Figure 2 The left-side view. Figure 4 yes Figure 2 The right-side view.

[0058] refer to Figures 1 to 4 The deposition apparatus 10 according to embodiments of the present disclosure can deposit organic materials or metals used as electrodes on a substrate S. The deposition apparatus 10 may include a chamber 100, a substrate support 200, a mask assembly 300, a deposition source 400, a jet angle limiting portion, and a cleaning module.

[0059] Chamber 100 provides space for performing deposition processes. While performing the deposition process, the interior of chamber 100 can be maintained under vacuum. Maintaining the interior of chamber 100 under vacuum may mean maintaining the pressure within chamber 100 at a low pressure. Chamber 100 may include ports (not shown) for allowing the substrate S to enter and exit. Chamber 100 may also include a vacuum pump (not shown) for controlling the pressure within chamber 100 and discharging any deposited material not deposited on the substrate S, and an exhaust port (not shown) connected to the vacuum pump.

[0060] The substrate S on which the organic material or metal used as an electrode is deposited can be an insulating substrate, a semiconductor substrate, a display substrate, etc., but is not limited thereto. In this disclosure, a substrate S used in an organic light-emitting display device will be described as an embodiment. A structure can be formed on the substrate S by a deposition process. Depending on the process for manufacturing the organic light-emitting display device, the structure formed on the substrate S by the deposition process can be formed in various ways. For example, in the process of forming a hole injection layer, a pixel defining film and an anode electrode can be formed on the substrate S. In the process of forming an organic light-emitting layer, a hole injection layer and a hole transport layer, as well as a pixel defining layer and an anode electrode, can be formed on the substrate S.

[0061] The substrate support 200 can support the substrate S. The substrate support 200 can be disposed within the chamber 100. In one embodiment, the substrate support 200 can be disposed on the upper side within the chamber 100, and the substrate S can be placed on the lower portion of the substrate support 200 and supported by the substrate support 200. The substrate support 200 may include a fixing member (not shown). The fixing member can help fix the substrate S and the mask assembly 300, and can be used to maintain a constant distance between the substrate S and the mask assembly 300. The fixing member can be configured as a frame structure that can be installed separately.

[0062] Mask assembly 300 can define the area on which deposition material ejected from deposition source 400 is deposited on substrate S. Mask assembly 300 may include mask portion 310, transmission portion 320, and mask sidewall portion (not shown). Mask portion 310 can cover a portion of substrate S to prevent deposition material ejected from deposition source 400 from depositing on the corresponding area. Transmission portion 320, which is a region exposing a portion of substrate S, can be an opening region formed between mask portions 310. Deposition material can be ejected onto the exposed area of ​​substrate S exposed by transmission portion 320 and deposited on the exposed area of ​​substrate S. Thus, deposition material ejected from deposition source 400 can be deposited on substrate S through mask assembly 300 while forming a pattern. Mask sidewall portion can be positioned in the edge region of mask assembly 300 to prevent deposition material from spreading to areas outside substrate S. Mask assembly 300 can be a raw mask such as a fine metal mask (FMM) or multiple segmented masks, but is not limited thereto. The mask assembly 300 can be positioned close to and fixed to the substrate S, and the distance between the mask assembly 300 and the substrate S can be adjusted by the substrate support 200 and the fixing member.

[0063] The deposition source 400 can provide the deposition material to be deposited on the substrate S. The deposition source 400 can be disposed within the chamber 100 and can be positioned facing the substrate S. In an embodiment, if the substrate support 200 on which the substrate S is placed is disposed on the upper side within the chamber 100, the deposition source 400 can be disposed on the lower side within the chamber 100. The deposition source 400 may include a substrate 410, a deposition nozzle support 420, and a deposition nozzle 430.

[0064] The substrate 410 can support at least one of the deposition nozzle support 420 and the deposition nozzle 430. The substrate 410 can be disposed on the lower side within the chamber 100. The substrate 410 can be configured as a plate with thickness, configured such that its lower surface contacts the inner lower surface of the chamber 100, and can have an upper surface on which the deposition nozzle support 420 is disposed to support the deposition nozzle support 420.

[0065] The deposition nozzle support 420 can support the deposition nozzle 430. The deposition nozzle support 420 can be disposed on the upper surface of the substrate 410 and supported by the substrate 410. The deposition nozzle support 420 can be configured as a block with thickness and can be formed on the upper surface of the substrate 410 to extend in the first direction DR1.

[0066] The deposition nozzle 430 can spray deposition material and supply the deposition material to the substrate S. The deposition nozzle 430 can be disposed on and supported by the deposition nozzle support 420. Multiple deposition nozzles 430 can be disposed, and the multiple deposition nozzles 430 can be arranged to be spaced apart from each other along a first direction DR1 on the upper surface of the deposition nozzle support 420. The deposition nozzle 430 can be connected to a deposition material storage unit (not shown) and can spray deposition material stored in the deposition material storage unit. The deposition nozzle 430 can supply deposition material to the substrate S by spraying deposition material in an upward direction. In other words, the deposition nozzle 430 can spray deposition material upward on a third direction DR3. A spray channel 431 can be formed in the center of the deposition nozzle 430, and deposition material can be sprayed through the spray channel 431.

[0067] The jetting angle limiting section can be spaced apart from the deposition source 400 to limit the jetting angle of the deposited material jetted from the deposition nozzle 430. The jetting angle limiting section can adjust the area and thickness of the deposited material by limiting the jetting angle of the deposited material jetted from the deposition nozzle 430. Multiple jetting angle limiting sections can be provided. The jetting angle limiting section may include a first jetting angle limiting section 500 and a second jetting angle limiting section 600.

[0068] The first injection angle limiting part 500 can be set on the left side of the deposition source 400 in the second direction DR2. Figure 1 On the left side of the image, the first spray angle limiting portion 500 may include a first extension plate 510 and a first blocking plate 520. The second direction DR2 may be defined as a direction orthogonal to the first direction DR1.

[0069] The first extension plate 510 can extend upward from the substrate 410 and can support the first baffle plate 520. The first extension plate 510 can be disposed on the left side of the deposition nozzle 430. Figure 1 On the left side of the substrate 410. The first extension plate 510 may be configured as a plate with thickness and may extend along the first direction DR1 on the upper surface of the substrate 410. The extension length of the first extension plate 510 in the first direction DR1 may correspond to the extension length of the deposition nozzle support 420 in the first direction DR1.

[0070] The first baffle plate 520 can extend from the upper end of the first extension plate 510 to the right side in the second direction DR2. Figure 1(on the right side of the first extension plate 510), and can block a portion of the deposited material ejected from the deposition nozzle 430. The first blocking plate 520 can be configured as a plate with thickness and can extend along the first direction DR1 at the upper end of the first extension plate 510. The extension length of the first blocking plate 520 in the first direction DR1 can correspond to the extension length of the deposition nozzle support 420 in the first direction DR1.

[0071] The second injection angle limiting part 600 can be set on the right side of the deposition source 400 in the second direction DR2. Figure 1 On the right side of the middle, and blocking a portion of the deposition material ejected from the deposition nozzle 430, thereby adjusting the ejection angle of the deposition material. The second ejection angle limiting portion 600 may include a second extension plate 610 and a second blocking plate 620.

[0072] The second extension plate 610 can extend upward from the substrate 410 and can support the second baffle plate 620. The second extension plate 610 can be disposed on the right side of the deposition nozzle 430. Figure 1 On the right side of the substrate 410. The second extension plate 610 may be configured as a plate with thickness and may extend along the first direction DR1 on the upper surface of the substrate 410. The extension length of the second extension plate 610 in the first direction DR1 may correspond to the extension length of the deposition nozzle support 420 in the first direction DR1.

[0073] The second baffle plate 620 can extend from the upper end of the second extension plate 610 to the left side in the second direction DR2. Figure 1The second baffle plate 620 can be configured as a plate with thickness and can extend along the first direction DR1 on the upper end of the second extension plate 610. The extension length of the second baffle plate 620 in the first direction DR1 can correspond to the extension length of the deposition nozzle support 420 in the first direction DR1. The end of the second baffle plate 620 in the second direction DR2 can be spaced apart from the end of the first baffle plate 520 in the second direction DR2. In other words, since the ends of the first baffle plate 520 and the second baffle plate 620 in the second direction DR2 are spaced apart from each other, an opening region O can be formed between the first baffle plate 520 and the second baffle plate 620. The opening region O can be a region through which the deposition material passes. Since a portion of the deposition material is blocked by the first baffle plate 520 and the second baffle plate 620 and the deposition material passes through the opening region O, the spray angle α of the deposition material ejected from the deposition nozzle 430 can be limited. The spray angle α of the deposited material can be changed by adjusting the extension length of the first extension plate 510 and the second extension plate 610 in the third direction DR3, or by adjusting the extension length of the first baffle plate 520 and the second baffle plate 620 in the second direction DR2. The opening region O can be set above the deposition nozzle 430 and can extend along the first direction DR1.

[0074] Figure 5 Is Figure 2 The front view shows a schematic cross-sectional view of the state in which the first driver is driven. Figure 6 Is Figure 5 The diagram shows a schematic cross-sectional view of the state of driving the second driver. Figure 7 Is Figure 6 The diagram shows a schematic cross-sectional view of the state of the third drive.

[0075] Further reference Figures 5 to 7 The cleaning module can be configured to move between the deposition source 400 and the jet angle limiting portion along the jet angle limiting portion. The cleaning module can be positioned close to and move along the jet angle limiting portion to remove deposited material accumulated on the jet angle limiting portion. The cleaning module can be configured to move in a first direction DR1. Multiple cleaning modules can be provided. The cleaning modules may include a first cleaning module 700 and a second cleaning module 800.

[0076] The first cleaning module 700 can remove deposited material accumulated on the first baffle plate 520. The first cleaning module 700 can also remove deposited material accumulated in the spray channel 431 of the deposit nozzle 430. The first cleaning module 700 can be disposed below the first baffle plate 520. The first cleaning module 700 may include a first moving track 710, a first moving block 720, a first heating element 730, a first driver 740, a second driver 750, and a third driver 760.

[0077] The first moving track 710 provides a path for the first moving block 720 to move along. The first moving track 710 can be positioned below and spaced a certain distance from the first blocking plate 520. The first moving track 710 can extend along the first blocking plate 520 in the first direction DR1. In other words, the first moving track 710 can extend from one side of the first blocking plate 520 in the first direction DR1. Figure 2 The lower side of the first baffle plate 520 extends to the other side of the first baffle plate 520 in the first direction DR1. Figure 2 (The upper side of the middle). In the first direction DR1, the extension length of the first moving track 710 can be less than the extension length of the first blocking plate 520.

[0078] The first moving block 720 can move along the first moving track 710. The first moving block 720 can be disposed on the first moving track 710 between the first moving track 710 and the first blocking plate 520. A moving driver (not shown) can be disposed within the first moving block 720, so that the first moving block 720 can move along the first moving track 710 according to the driving of the moving driver. Since the first moving block 720 moves along the first moving track 710, the first moving block 720 can move in the first direction DR1.

[0079] The first heating element 730 can be supported by the first movable block 720 and is movable along the first movable block 720 in a first direction DR1. The first heating element 730 can extend from the first movable block 720 to the right side in a second direction DR2. Figure 2(Right side of the image). The first heating member 730 can extend such that the extended end of the first heating member 730 contacts the same virtual vertical surface as the extended end of the first baffle plate 520. The first heating member 730 can be heated by induction heating or can be configured as a cylindrical heater, etc., but is not limited thereto. When the first moving block 720 moves along the first moving track 710, the first heating member 730 can be movable in the first direction DR1 and can contact the deposited material accumulated on the first baffle plate 520. Therefore, the first heating member 730 can heat the deposited material accumulated on the first baffle plate 520 to evaporate and remove the deposited material. In this way, as the first heating member 730 removes the deposited material accumulated on the first baffle plate 520, the first baffle plate 520 can be cleaned.

[0080] The first actuator 740 can move the first heating element 730 in the second direction DR2. The first actuator 740 can connect the first moving block 720 and the first heating element 730 to each other. The first actuator 740 can include multiple stages with different diameters. The first actuator 740 can be configured to insert a stage with a smaller diameter into a stage with an arbitrary diameter. For example, the first actuator 740 can include a first stage and a second stage, and can be configured to insert the second stage into the first stage. The first stage can be connected to the first moving block 720, and the second stage can be connected to the second actuator 750. A separate actuator (not shown) can be disposed within the first actuator 740, so that by driving the actuator, the second stage can be pulled into or out of the first stage. The first actuator 740 can be disposed within the first moving block 720. When the first actuator 740 is disposed within the first moving block 720, the first heating element 730 can be disposed in contact with the first moving block 720. The first stage is moved to the right side of the first moving block 720 in the second direction DR2 by driving the actuator of the first actuator 740. Figure 5 In the case that the second stage is pulled to the right from the first stage in the second direction DR2, the first heating element 730 can move to the right from the first moving block 720 in the second direction DR2.

[0081] The second actuator 750 can rotate the first heating element 730 such that the extended end of the first heating element 730 points towards the third direction DR3. The second actuator 750 can connect the first actuator 740 and the third actuator 760 to each other. The second actuator 750 can be connected to the second stage of the first actuator 740 via a rotating shaft and rotate about the rotating shaft. By rotating the second actuator 750, the extended end of the first heating element 730 can be rotated to face downwards on the third direction DR3. Figure 6(Lower side of the middle). In other words, by driving the second actuator 750, the extended end of the first heating member 730 can be rotated to face the deposition nozzle 430. A separate rotary motor (not shown) can be connected to the rotation shaft, so that the second actuator 750 can be rotated by driving the rotary motor. The third direction DR3 can be defined as a direction that is vertically orthogonal to the first direction DR1 and the second direction DR2.

[0082] The third actuator 760 can move the first heating element 730 on the third-direction DR3. The third actuator 760 can connect the second actuator 750 and the first heating element 730 to each other. The third actuator 760 can be disposed within the second actuator 750. A separate actuator (not shown) can be disposed within the third actuator 760, so that the third actuator 760 can be pulled out from the interior of the second actuator 750 by driving the actuator. When the third actuator 760 is disposed within the second actuator 750, the first heating element 730 can be disposed in contact with the second actuator 750. The actuator that drives the third actuator 760 moves the third actuator 760 from the second actuator 750 downward on the third-direction DR3. Figure 7 When the first heating member 730 is pulled out (from the lower side), it can move from the second driver 750 to the lower side on the third-direction DR3 and be inserted into the injection channel 431 of the deposition nozzle 430. In this way, when the first heating member 730 is inserted into the injection channel 431 of the deposition nozzle 430, the deposited material accumulated in the injection channel 431 of the deposition nozzle 430 can be heated to evaporate and remove the deposited material.

[0083] The second cleaning module 800 can remove deposited material accumulated on the second baffle plate 620. The second cleaning module 800 can be disposed below the second baffle plate 620. The second cleaning module 800 may include a second moving track 810, a second moving block 820, and a second heating element 830.

[0084] The second moving track 810 provides a path for the second moving block 820 to move along. The second moving track 810 can be positioned below and spaced a certain distance from the second blocking plate 620. The second moving track 810 can extend along the second blocking plate 620 in the first direction DR1. In other words, the second moving track 810 can extend from one side of the second blocking plate 620 in the first direction DR1. Figure 2 The lower side of the middle) extends to the other side of the second baffle plate 620 in the first direction DR1 ( Figure 2 (The upper side of the middle). In the first direction DR1, the extension length of the second moving track 810 can be less than the extension length of the second blocking plate 620.

[0085] The second moving block 820 can move along the second moving track 810. The second moving block 820 can be disposed on the second moving track 810 between the second moving track 810 and the second stop plate 620. A moving driver (not shown) can be disposed within the second moving block 820, so that the second moving block 820 can move along the second moving track 810 according to the driving of the moving driver. Because the second moving block 820 moves along the second moving track 810, the second moving block 820 can move in the first direction DR1.

[0086] The second heating element 830 can be supported by the second movable block 820 and is movable along the second movable block 820 in the first direction DR1. The second heating element 830 can extend from the second movable block 820 to the left side in the second direction DR2. Figure 2 (Left side of the image). The second heating member 830 can extend such that the extended end of the second heating member 830 contacts the same virtual vertical surface as the extended end of the second baffle plate 620. The second heating member 830 can be heated by induction heating or can be configured as a cylindrical heater, etc., but is not limited thereto. Since the second moving block 820 moves along the second moving track 810, the second heating member 830 can be movable in the first direction DR1 and can contact the deposited material accumulated on the second baffle plate 620. Therefore, the second heating member 830 can heat the deposited material accumulated on the second baffle plate 620 to evaporate and remove the deposited material. In this way, as the second heating member 830 removes the deposited material accumulated on the second baffle plate 620, the second baffle plate 620 can be cleaned.

[0087] In the following description, a cleaning method for a deposition apparatus according to an embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0088] Figure 8 This shows the spray angle of the deposition nozzle due to the accumulation in... Figure 1 A schematic cross-sectional view showing the state of the deposited material on the restricted section due to the spray angle.

[0089] refer to Figure 8As the deposition apparatus 10 is used over time, the deposited material ejected from the deposition nozzle 430 may accumulate on the lower portion of the first baffle plate 520 of the first ejection angle limiting portion 500 and the lower portion of the second baffle plate 620 of the second ejection angle limiting portion 600. The ejection angle β of the deposition nozzle 430 may decrease due to the accumulation of deposited material M on the lower portions of the first baffle plate 520 and the second baffle plate 620. If the ejection angle β of the deposition nozzle 430 decreases, the area and thickness of the deposited material on the substrate S may change, which may lead to defects in the organic light-emitting display device. Since the deposited material M accumulated on the lower portions of the first baffle plate 520 and the second baffle plate 620 may fall onto the deposition nozzle 430, the ejection channel 431 of the deposition nozzle 430 may close. Since defects in organic light-emitting display devices may be caused by deposited material M accumulating on the lower part of the first baffle plate 520 and the lower part of the second baffle plate 620, as well as deposited material accumulating in the spray channel 431 of the deposition nozzle 430, it is necessary to remove the deposited material accumulating on the first baffle plate 520, the second baffle plate 620 and the deposition nozzle 430.

[0090] A cleaning method for a deposition apparatus according to embodiments of the present disclosure may include a cleaning step for a spray angle limiting portion and a cleaning step for the deposition nozzle.

[0091] Figure 9 It shows movement in the first direction. Figure 2 A plan view showing the status of the first and second cleaning modules.

[0092] refer to Figure 9 The cleaning step of the spray angle limiting part can be the step of moving the first cleaning module 700 and the second cleaning module 800 along the first spray angle limiting part 500 and the second spray angle limiting part 600 below the first spray angle limiting part 500 and the second spray angle limiting part 600 in the first direction DR1.

[0093] In the cleaning step of the spray angle limitation section, as the first moving block 720 of the first cleaning module 700 moves along the first moving track 710 in the first direction DR1, the first heating member 730 can move below the first baffle plate 520 in the first direction DR1. The first heating member 730 can move below the first baffle plate 520 and contact the deposited material M accumulated on the lower side of the first baffle plate 520. The first heating member 730, in contact with the deposited material M accumulated on the lower side of the first baffle plate 520, can evaporate the deposited material M accumulated on the lower side of the first baffle plate 520 and remove the deposited material M from the first baffle plate 520, thereby cleaning the first baffle plate 520. The first moving block 720 can move from one side of the first moving track 710 ( Figure 9 (lower side) towards the other side of the first moving track 710 ( Figure 9 The upper side of the first heating element 730 moves back and forth in the first direction DR1 below the first baffle plate 520.

[0094] In the cleaning step where the spray angle is limited, as the second moving block 820 of the second cleaning module 800 moves along the second moving track 810 in the first direction DR1, the second heating member 830 can move below the second baffle plate 620 in the first direction DR1. The second heating member 830 can move below the second baffle plate 620 and contact the deposited material M accumulated on the lower side of the second baffle plate 620. The second heating member 830, in contact with the deposited material M accumulated on the lower side of the second baffle plate 620, can evaporate the deposited material M accumulated on the lower side of the second baffle plate 620 and remove the deposited material M from the second baffle plate 620, thereby cleaning the second baffle plate 620. The second moving block 820 can move from one side of the second moving track 810 ( Figure 9 (lower side) towards the other side of the second moving track 810 ( Figure 9 The upper side of the middle) moves back and forth to move the second heating member 830 back and forth in the first direction DR1 below the second baffle plate 620.

[0095] In the cleaning step where the spray angle is limited, the first cleaning module 700 and the second cleaning module 800 can move independently, or they can move equally in parallel positions, but are not limited thereto.

[0096] Figure 10 Is Figure 2 The front view shows a schematic cross-sectional view of the state in which the heating element is moved in the second direction by the first driver. Figure 11 Is Figure 10 The diagram shows a schematic cross-sectional view of the heating element being rotated to face a third direction by a second actuator. Figure 12 Is Figure 11 The diagram shows a schematic cross-sectional view of the heating element being moved upward by a third actuator and inserted into the deposition nozzle. Figure 13 Is Figure 12 The diagram shows a schematic cross-sectional view of the state in which the heating element is moved upward by a third actuator and pulled out of the deposition nozzle. Figure 14 Is Figure 13 The left-hand view shows a schematic cross-sectional view of the state in which the first moving block moves along the first moving track in the first direction. Figure 15 Is Figure 14 The diagram shows a schematic cross-sectional view of the state in which the heating element is moved upward by a third drive and inserted into another deposition nozzle.

[0097] refer to Figures 10 to 15 The deposition nozzle cleaning step may be a step of inserting the first heating member 730 into the spray channel 431 of the deposition nozzle 430 to remove the deposited material accumulated in the spray channel 431 of the deposition nozzle 430. The deposition nozzle cleaning step may include a first driving step, a second driving step, a third driving step, a fourth driving step, a fifth driving step, and a sixth driving step.

[0098] refer to Figure 10 The first driving step can be to the right in the second direction DR2 via the first driver 740. Figure 10 The step of moving the first heating element 730 and positioning it above the deposition nozzle 430 (right side of the first stage). In the first driving step, when the actuator of the first driver 740 is driven, the first stage can move from the first moving block 720 to the right side in the second direction DR2 (right side of the first stage). Figure 10 (on the right side of the first stage), and when the second stage is pulled out to the right side in the second direction DR2, the first heating element 730 can be positioned above the deposition nozzle 430.

[0099] refer to Figure 11 The second driving step can be a step in which the first heating member 730, positioned above the deposition nozzle 430, is rotated to face the deposition nozzle 430 by the second actuator 750. In the second driving step, the second actuator 750 can rotate about a rotation axis such that the extended end of the first heating member 730 can be rotated to face the lower side on the third direction DR3. Figure 11 (Lower side of the middle). In other words, in the second driving step, the extended end of the first heating member 730 can be rotated by the second driver 750 to face the deposition nozzle 430.

[0100] refer to Figure 12 The third driving step can be the step of inserting the first heating member 730, rotated to face the deposition nozzle 430, into the deposition nozzle 430 via the third actuator 760. In the third driving step, when the actuator of the third actuator 760 is driven, the third actuator 760 can move from the second actuator 750 to the lower side on the third-direction DR3 ( Figure 12 The first heating element 730 can be inserted into the injection channel 431 of the deposition nozzle 430 when the third driver 760 moves to the lower side on the third direction DR3. The first heating element 730 inserted into the injection channel 431 of the deposition nozzle 430 can heat the deposited material accumulated in the injection channel 431 of the deposition nozzle 430 and evaporate and remove the deposited material.

[0101] refer to Figure 13The fourth driving step can be a step in which the first heating member 730, inserted into the injection channel 431 of the deposition nozzle 430, is pulled out of the injection channel 431 of the deposition nozzle 430 by the third actuator 760. In the fourth driving step, when the actuator of the third actuator 760 is driven, the third actuator 760 can move to the upper side on the third-direction DR3 ( Figure 13 (on the upper side of the middle), and when the third drive 760 moves to the upper side on the third direction DR3, the first heating member 730 can be pulled out from the injection channel 431 of the deposition nozzle 430.

[0102] refer to Figure 14 The fifth driving step may be to move the first moving block 720 along the first moving track 710 such that the first heating member 730 pulled out from the injection channel 431 of the deposition nozzle 430 is positioned above another adjacent deposition nozzle 430. In the fifth driving step, when the moving driver is driven such that the first heating member 730 is positioned above another deposition nozzle 430 adjacent to the deposition nozzle 430 into which the first heating member 730 is inserted, the first moving block 720 may move to the left along the first moving track 710 in the first direction DR1 ( Figure 14 Move to the left side of the middle.

[0103] refer to Figure 15 The sixth driving step may be the step of inserting the first heating member 730, positioned above the other deposition nozzle 430, into the other deposition nozzle 430 via the third actuator 760. In the sixth driving step, when the actuator of the third actuator 760 is driven, the third actuator 760 may move downwards on the third-direction DR3 ( Figure 15 (Lower side of the third drive 760), and when the third drive 760 moves to the lower side on the third-direction DR3, the first heating member 730 can be inserted into the injection channel 431 of the other deposition nozzle 430. The first heating member 730 inserted into the injection channel 431 of the other deposition nozzle 430 can heat the deposited material accumulated in the injection channel 431 of the other deposition nozzle 430 and evaporate and remove the deposited material. After the deposited material accumulated in the other deposition nozzle 430 has been removed, the fifth drive step and the sixth drive step can be repeated to remove all the deposited material accumulated in the deposition nozzle 430.

[0104] The above description is an example of the technical features of this disclosure, and those skilled in the art to which this disclosure pertains will be able to make various modifications and variations. Therefore, the embodiments of this disclosure described above can be implemented individually or in combination with each other.

[0105] Therefore, the embodiments disclosed herein are not intended to limit the technical spirit of this disclosure, but rather to describe it, and the scope of the technical spirit of this disclosure is not limited by these embodiments. The scope of protection of this disclosure should be interpreted by the appended claims, and it should be understood that all technical spirit within the equivalent scope is included within the scope of this disclosure.

Claims

1. A deposition apparatus, characterized by, Comprising: a deposition source including at least one deposition nozzle that sprays a deposition material; a spray angle limiting portion spaced apart from the deposition source and limiting a spray angle of the deposition material sprayed from the at least one deposition nozzle; and a cleaning module disposed between the deposition source and the spray angle limiting portion and heating the deposition material accumulated on the spray angle limiting portion.

2. The deposition apparatus of claim 1, wherein: the at least one deposition nozzle includes a plurality of deposition nozzles, the plurality of deposition nozzles are arranged in a first direction, and the cleaning module is disposed to be movable in the first direction. the spray angle limiting portion includes:

3. The deposition apparatus of claim 2, wherein an extension plate extending in an upward direction from the deposition source; and a blocking plate extending in a second direction from the extension plate and forming an open area through which the deposition material passes. the cleaning module includes:

4. The deposition apparatus of claim 3, wherein a moving rail extending in the first direction below the blocking plate; a moving block disposed on the moving rail and moving along the moving rail; and a heating member extending in the second direction from the moving block. the cleaning module further includes a first driver connecting the moving block and the heating member and moving the heating member in the second direction.

5. The deposition apparatus of claim 4, wherein the cleaning module further includes a second driver connecting the first driver and the heating member and rotating the heating member so that an extending end of the heating member faces a third direction.

6. The deposition apparatus of claim 5, wherein the cleaning module further includes a third driver connecting the second driver and the heating member and moving the heating member in the third direction.

7. The deposition apparatus of claim 6, wherein 8. The deposition apparatus of claim 3, wherein: the extension plate includes a plurality of extension plates, the plurality of extension plates includes a first extension plate and a second extension plate, the first extension plate extends in the upward direction from one side of the deposition source, and the second extension plate extends in the upward direction from another side of the deposition source so that the plurality of deposition nozzles is disposed between the first extension plate and the second extension plate.

9. The deposition apparatus of claim 8, wherein: the blocking plate includes a plurality of blocking plates, the plurality of blocking plates includes a first blocking plate and a second blocking plate, the first blocking plate extends in the second direction from the first extension plate to point to an upper side of the plurality of deposition nozzles, the second blocking plate extends in the second direction from the second extension plate to face the first blocking plate, and extending ends of the first blocking plate and the second blocking plate are spaced apart from each other, thereby forming the open area between the first blocking plate and the second blocking plate.

10. The deposition apparatus of claim 9, wherein: the cleaning module includes a plurality of cleaning modules, the plurality of cleaning modules includes a first cleaning module disposed below the first blocking plate, and a second cleaning module disposed below the second blocking plate. ​

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