Electronic equipment, temperature detection device and battery pack
By combining inner and outer adhesive layers and using insulating tape, the cracking and gap problems of the temperature detection device under high pressure were solved, ensuring detection accuracy, simplifying assembly and maintenance, and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2026-03-31
AI Technical Summary
Existing temperature detection devices cannot be directly connected to the built-in power supply components of high-voltage, high-power electronic equipment, which leads to gel cracking or permanent gaps, affecting detection accuracy. In addition, the addition of a low-voltage isolation power supply increases assembly difficulty and cost.
The design employs a combination of inner and outer adhesive layers. The inner adhesive layer is harder than the outer adhesive layer. The inner adhesive layer is used to protect the thermistor, while the outer adhesive layer has good elasticity to buffer stress. Combined with insulating tape, it meets safety requirements. The thickness of the inner and outer adhesive layers is reduced to improve thermal conductivity.
It achieves the goal of maintaining the accuracy of temperature detection devices under high-pressure environments, simplifies assembly and maintenance, reduces costs, and supports miniaturized design.
Smart Images
Figure CN224066233U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of temperature detection technology, and in particular to an electronic device, a temperature detection device, and a battery pack. Background Technology
[0002] In related technologies, for some high-voltage, high-power electronic devices, when the temperature detection device is directly connected to the high-voltage power supply component built into the electronic device, it can cause cracking or permanent gaps in the gel of the temperature detection device. This results in errors in the heat conduction between the thermistor of the temperature detection device and the temperature point to be measured, thus reducing the detection accuracy of the temperature detection device. In order to ensure the measurement accuracy of the temperature detection device, an additional independent low-voltage isolated power supply is required. However, this will cause great difficulties in the assembly and maintenance of the temperature detection device, as well as increase the operating cost and the size of the electronic device. Utility Model Content
[0003] Embodiments of this application provide an electronic device, a temperature detection device, and a battery pack to solve the problem that the temperature detection device cannot be directly connected to the built-in power supply component of the electronic device.
[0004] In a first aspect, embodiments of this application provide an electronic device, which includes a power module and a temperature detection device. The temperature detection device includes a cable, a thermistor, an inner layer of adhesive covering the outside of the thermistor, an outer layer of adhesive covering the outside of the inner layer of adhesive, and a heat conductor disposed outside the outer layer of adhesive. The hardness of the inner layer of adhesive is greater than that of the outer layer of adhesive. The cable is electrically connected to the thermistor, and a portion of the cable extends out of the inner layer of adhesive, the outer layer of adhesive, and the heat conductor. The cable is electrically connected to the power module, and the heat conductor is used to contact the temperature point to be measured in the electronic device. In this embodiment, the thermistor is first covered by the inner layer of adhesive, which has a higher hardness, to effectively protect the thermistor and prevent damage. Then, the outer layer of adhesive, which has a lower hardness than the inner layer of adhesive, is covered by the inner layer of adhesive. Due to the difference in hardness between the inner and outer layers of adhesive, the outer layer of adhesive has just the right elasticity. Therefore, in a high-temperature environment, the expansion of the inner layer of adhesive can be appropriately buffered by the outer layer of adhesive, that is, the stress generated by the expansion of the inner layer of adhesive can be effectively released by the outer layer of adhesive, thereby effectively preventing the inner layer of adhesive from cracking or developing permanent gaps. The outer adhesive layer, being softer and more elastic, deforms appropriately under pressure from the inner adhesive layer to release expansion space. In low-temperature environments, the inner adhesive layer contracts, and the outer adhesive layer immediately fills the space created by this contraction, preventing gaps. In this embodiment, the inner and outer adhesive layers are located between the heat conductor and the thermistor. When the cable is connected to the power supply unit of the electronic device, the thermistor operates to detect the temperature of the measurement point. When the power supply unit of the electronic device is high-voltage, the combination of the inner and outer adhesive layers prevents cracking or permanent gaps between the thermistor and the heat conductor due to the high temperature generated by the connection to the high-voltage power supply unit. This effectively ensures that the detection accuracy of the temperature detection device does not decrease due to the connection to the high-voltage power supply unit. Furthermore, since the temperature detection device can be directly connected to the power supply unit of the electronic device, there is no need for an additional independent low-voltage isolation power supply. This simplifies the assembly and maintenance of the temperature detection device and effectively reduces operating costs and the size of the electronic device.
[0005] In some embodiments, the inner layer adhesive has a Shore hardness of Type B or Type C to ensure sufficient impact resistance. The shear strength of the inner layer adhesive is greater than 6 MPa, for example, 6 MPa-10 MPa, to ensure stable performance under various stresses and improve its stability in complex stress environments. The outer layer adhesive has a Shore hardness of Type A. The Shore hardness of the outer layer adhesive can be Type A to improve its flexibility and elasticity, reducing the risk of cracking or gaps in either the inner or outer layer adhesive.
[0006] In some embodiments, the inner adhesive is a UV-curable or thermosetting adhesive, which can cure quickly, significantly shortening the production cycle and improving efficiency. Furthermore, it provides excellent adhesive strength, ensuring stable operation of the NTC probe in complex environments. It also possesses good high-temperature resistance, chemical stability, and insulation properties to guarantee the insulation and stability of the thermistor in complex environments. The outer adhesive is silicone or a UV-curable adhesive. Taking silicone as an example, due to its excellent softness and elasticity, silicone can adapt to the deformation of the inner adhesive at high and low temperatures. When the inner adhesive expands at high temperatures, the silicone can absorb some of the deformation to prevent cracking. When it shrinks at low temperatures, the silicone can also refill the space vacated after shrinkage, thus preventing gaps. Moreover, silicone itself has good temperature resistance and chemical stability, and will not experience significant aging or damage due to temperature changes, thus maintaining its cushioning properties.
[0007] In some embodiments, the temperature detection device further includes insulating tape disposed between the thermistor and the heat conductor. The insulating tape serves to insulate the heat conductor from the thermistor and the cable. This insulating tape design effectively reduces the thickness of the inner and outer adhesive layers while still meeting safety regulations, such as ensuring an insulation distance of at least 5 mm between the cable and the heat conductor, and a creepage distance of at least 15 mm between the thermistor and the cable and the heat conductor. The reduced thickness of the inner and outer adhesive layers facilitates miniaturization of the temperature detection device and effectively improves the thermal conductivity between the thermistor and the heat conductor, thereby enhancing the detection accuracy of the temperature detection device.
[0008] In some embodiments, insulating tape covers the outer side of the inner adhesive layer, positioned between the inner and outer adhesive layers, with a portion of the insulating tape extending beyond the outer adhesive layer and covering a section of the cable. In this embodiment, because the portion of the insulating tape extends beyond the outer adhesive layer and the heat conductor, covering a section of the cable, the creepage distance between the cable and the heat conductor is always less than the creepage distance between the thermistor and the heat conductor. Therefore, as long as the creepage distance requirement between the cable and the heat conductor is met, the creepage requirement between the thermistor and the heat conductor can also be met. The creepage distance to the heat conductor is closest at the junction of the portion of the cable covered by insulating tape and the portion not covered. As long as the creepage distance between this junction and the heat conductor meets the requirement, the creepage distance between any other part of the cable and the heat conductor will also meet the requirement. Understandably, provided that the creepage distance between the cable junction and the heat conductor is greater than 15mm, the longer the portion of the insulating paper extending beyond the outer layer of adhesive, the longer the section of the cable covered by the insulating paper extending beyond the outer layer of adhesive. This allows for a smaller outer layer of adhesive thickness between the cable and the heat conductor. Similarly, the longer the portion of the insulating paper extending beyond the outer layer of adhesive, the smaller the thickness of both the outer and inner layers of adhesive between the thermistor and the heat conductor. This results in higher heat transfer efficiency between the heat conductor and the thermistor, and thus higher detection accuracy of the temperature detection device. In this embodiment, by extending the insulating paper beyond the outer layer of adhesive and covering a section of the cable, the thickness of the outer layer of adhesive is reduced, thereby increasing the heat transfer efficiency between the thermistor and the heat conductor, and improving the detection accuracy of the temperature detection device.
[0009] In some embodiments, insulating tape is wrapped around the outer layer of adhesive, positioned between the outer layer of adhesive and the heat conductor, with a portion of the insulating tape extending beyond the heat conductor and covering a section of the cable. By using insulating tape, the thickness of the inner or outer layer of adhesive between the cable and the heat conductor can be effectively reduced, thereby improving the heat conduction efficiency between the heat conductor and the thermistor and enhancing the detection accuracy of the temperature detection device.
[0010] In some embodiments, the flame retardancy rating of the insulating tape is UL94 V-1 or higher. A flame retardancy rating of UL94 V-1 or higher effectively ensures the stability of the insulating tape under high voltage conditions, thus effectively guaranteeing its insulation performance. This allows for a significant increase in the insulation distance and creepage distance between thermistors, cables, and heat conductors, thereby effectively reducing the thickness of the inner and outer adhesive layers.
[0011] In some embodiments, the thickness of the outer adhesive layer between the cable and the heat conductor is 3mm-15mm, for example, 5mm-10mm. By using insulating tape, the thickness of the outer adhesive layer between the cable and the heat conductor can be less than 15mm, while still meeting safety requirements. Furthermore, by reducing the thickness of both the inner and outer adhesive layers between the cable and the heat conductor, the heat transfer efficiency between the thermistor and the heat conductor can be improved, thereby enhancing the detection accuracy of the temperature detection device.
[0012] In some embodiments, the cable includes a flexible first segment and a rigid second segment. The second segment is electrically connected between the first segment and a thermistor. The first segment is used for electrical connection to a power supply assembly. A portion of the second segment extends out as an inner adhesive layer, an outer adhesive layer, and a heat conductor. Because the first segment is flexible, the installation position of the temperature detection device can be moved flexibly, thereby achieving a wider detection range. This allows the temperature detection device to detect more temperature samples and can be installed at different temperature points, increasing installation flexibility. Because the second segment is rigid, the relative positional stability between the second segment and the heat conductor is effectively ensured. This prevents the second segment from becoming too close to the heat conductor due to bending, which could result in insufficient insulation between the cable and the heat conductor, potentially leading to electrical arcing or short circuits.
[0013] In some embodiments, the temperature to be measured in the electronic device includes the device's housing or a liquid cooling assembly connected to the housing. The temperature detection device in this embodiment can effectively detect not only the temperature of protective earth components such as housings and liquid cooling assemblies, but also the temperature of high-voltage side electronic devices and communication devices.
[0014] Secondly, this application provides a temperature detection device. The temperature sensor includes a cable, a thermistor, an inner layer of adhesive covering the outside of the thermistor, an outer layer of adhesive covering the outside of the inner layer of adhesive, and a heat conductor located outside the outer layer of adhesive. The cable is electrically connected to the thermistor. A portion of the cable extends out of the inner layer of adhesive, the outer layer of adhesive, and the heat conductor and is used to connect to a power supply component. The power supply component is used to supply power to the thermistor. The heat conductor is used to contact the temperature point to be measured. The hardness of the inner layer of adhesive is greater than that of the outer layer of adhesive. In this embodiment, the thermistor is first covered by the harder inner layer of adhesive to effectively protect the thermistor and prevent damage. Then, the outer layer of adhesive, which is softer than the inner layer of adhesive, is used to cover the inner layer of adhesive. Due to the difference in hardness between the inner and outer layers of adhesive, the outer layer of adhesive has just the right elasticity. Therefore, in a high-temperature environment, the expansion of the inner layer of adhesive can be appropriately buffered by the outer layer of adhesive. That is, the stress generated by the expansion of the inner layer of adhesive can be effectively released by the outer layer of adhesive, thereby effectively preventing the inner layer of adhesive from cracking or developing permanent gaps. The outer adhesive layer, being softer and more elastic, deforms appropriately under pressure from the inner adhesive layer to release expansion space. In low-temperature environments, the inner adhesive layer shrinks, and the outer adhesive layer immediately fills the space created by this shrinkage, preventing gaps. The temperature detection device in this embodiment can operate in harsh environments such as high temperatures, expanding its application scenarios.
[0015] In some embodiments, the inner layer adhesive has a Shore hardness of type B or type C. Within this range, the inner layer adhesive can effectively protect the thermistor. The outer layer adhesive has a Shore hardness of type A. Within this range, the outer layer adhesive can effectively buffer the expansion of the inner layer adhesive, effectively preventing cracking or gaps in either the inner or outer layer adhesive.
[0016] In some embodiments, the temperature detection device further includes insulating tape, which covers the outer layer of the inner adhesive layer and is located between the inner and outer adhesive layers. A portion of the insulating tape extends beyond the outer adhesive layer and covers a section of the cable. By using insulating tape, the thickness of the inner and outer adhesive layers between the thermistor and the heat conductor can be effectively reduced, for example, to a combined thickness of less than 15 mm, while still meeting safety requirements. This improves the heat transfer efficiency between the thermistor and the heat conductor, thereby enhancing the detection accuracy of the temperature detection device.
[0017] In some embodiments, the flame retardancy rating of the insulating tape is above UL94 V-1. A flame retardancy rating of above UL94 V-1 effectively ensures the stability of the insulating tape under high voltage conditions, thus effectively guaranteeing its insulation performance under high voltage.
[0018] In some embodiments, the thickness of the outer adhesive layer between the cable and the heat conductor is 3mm-15mm. By reducing the thickness of the inner and outer adhesive layers between the cable and the heat conductor, the heat conduction efficiency between the thermistor and the heat conductor is improved, thereby increasing the detection accuracy of the temperature detection device.
[0019] In some embodiments, the cable includes a flexible first segment and a rigid second segment. The second segment is electrically connected between the first segment and a thermistor. The first segment is used for electrical connection to a power supply assembly. A portion of the second segment extends out as an inner adhesive layer, an outer adhesive layer, and a heat conductor. Because the first segment is flexible, the installation position of the temperature detection device can be moved flexibly, thereby achieving a wider detection range. This allows the temperature detection device to detect more temperature samples and can be installed at different temperature points, increasing installation flexibility. Because the second segment is rigid, the relative positional stability between the second segment and the heat conductor is effectively ensured. This prevents the second segment from becoming too close to the heat conductor due to bending, which could result in insufficient insulation between the cable and the heat conductor, potentially leading to electrical arcing or short circuits.
[0020] Thirdly, embodiments of this application provide a battery pack, which includes a housing, a plurality of battery cells, a liquid cooling plate, and a temperature detection device as described in any of the second aspects above, wherein a heat conductor is disposed on the outer surface of the liquid cooling plate, and the temperature detection device is used to detect the temperature of the liquid cooling plate. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.
[0022] Figure 1 A simplified structural diagram of an electronic device provided in an embodiment of this application;
[0023] Figure 2 for Figure 1 An exploded view of the electronic devices in the diagram;
[0024] Figure 3A for Figure 1 Cross-sectional view of the temperature detection device in the middle;
[0025] Figure 3B for Figure 1 Another cross-sectional view of the temperature detection device in the middle.
[0026] Figure 4 A cross-sectional view of yet another temperature detection device provided in an embodiment of this application;
[0027] Figure 5A This is a schematic diagram of the structure of another temperature detection device provided in the embodiments of this application;
[0028] Figure 5B This is a schematic diagram of the structure of another temperature detection device provided in the embodiments of this application;
[0029] Figure 6 This is a simplified structural diagram of a battery pack provided in an embodiment of this application.
[0030] Explanation of reference numerals in the attached figures:
[0031] 1. Electronic equipment; 2. Housing; 3. Circuit board; 4. Power supply assembly; 5. Liquid cooling assembly; 6. Battery pack; 7. Casing; 8. Liquid cooling plate; 9. Battery cell;
[0032] 10. Temperature detection device;
[0033] 11. Cable; 111. First segment; 112. Second segment; 113. Junction location;
[0034] 12. Thermistor; 13. Inner adhesive layer; 14. Outer adhesive layer;
[0035] 15. Heat conductor; 151. First part; 152. Bottom wall; 153. Outer peripheral wall; 154. Second part; 155. Assembly port;
[0036] 16. Insulating tape; 17. Circuit board. Detailed Implementation
[0037] The following section will first explain some of the terms used in the embodiments of this application.
[0038] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0039] Explanation of terms such as "parallel" in this specification.
[0040] Parallelism: The parallelism defined in this application is not limited to absolute parallelism. This definition of parallelism can be understood as basic parallelism, allowing for situations where the parallelism is not absolute due to factors such as assembly tolerances, design tolerances, and structural flatness. These situations may lead to the sliding mating part and the first door panel not being absolutely parallel, but this application also defines such situations as parallelism.
[0041] Figure 1 This is a simplified structural diagram of an electronic device 1 provided in an embodiment of this application.
[0042] Reference Figure 1 This application provides an electronic device 1, which can be a power module, such as a power supply module in an energy storage cabinet. The electronic device 1 can also be a battery pack, BCU (Battery Control Unit), BMS (Battery Management System), or other devices requiring temperature detection. It is understood that... Figure 1 This is merely an exemplary structure of electronic device 1 and does not represent the actual structural form of the power module, battery pack, etc. Figure 1 As shown.
[0043] Electronic device 1 includes housing 2, circuit board 3 housed in housing 2, power supply component 4, and temperature detection device 10. Temperature detection device 10 can be used to detect the temperature point to be measured in electronic device 1. Power supply component 4 is disposed on circuit board 3 and is electrically connected to temperature detection device 10, and can supply power to temperature detection device 10. Temperature detection device 10 can detect the temperature of the temperature point to be measured after being powered on. The temperature point to be measured in electronic device 1 can be housing 2, which has electrical characteristics belonging to protective ground, or electronic devices with electrical characteristics belonging to high voltage, or the temperature of some communication devices.
[0044] For example, in some embodiments, the electronic device 1 may also include a liquid cooling assembly 5, and the temperature detection device 10 may also be used to detect the temperature of the liquid cooling assembly 5, such as detecting the temperature of the input coolant. The liquid cooling assembly 5 is usually connected to the housing 2, and its electrical characteristics are also protected ground. Specifically, the liquid cooling assembly 5 includes a liquid cooling plate, piping assembly, heat exchanger, and pump, etc. The temperature detection device 10 can determine the temperature of the coolant at the corresponding position of the liquid cooling plate by detecting the temperature of the outer surface of the liquid cooling plate. The temperature detection device 10 can also determine the temperature of the coolant at the outlet or inlet of the heat exchanger by detecting the temperature of the outer surface of the outlet or inlet of the heat exchanger, so as to realize the detection of the temperature of the coolant when it enters the heat exchanger and when it exits the heat exchanger.
[0045] For some high-voltage, high-power electronic devices 1, temperature detection is even more critical to the safety of the electronic device 1. In related technologies, the thermistor 12 of the temperature detection device 10 is coated with gel to protect it. However, when directly connected to the high-voltage power supply component 4 of the electronic device 1, the gel of the temperature detection device 10 may crack or develop permanent gaps, causing errors in the heat conduction between the thermistor 12 and the temperature point to be measured, thus reducing the detection accuracy of the temperature detection device 10. To ensure the safe use and measurement accuracy of the temperature detection device 10, the temperature detection device 10 in related technologies cannot be powered by the power supply component 4 of the electronic device 1. Instead, it requires an additional independent low-voltage isolated power supply, which makes the assembly and maintenance of the temperature detection device 10 very difficult, increases the cost of use, and increases the size of the electronic device 1.
[0046] Reference Figure 1 In this embodiment, the electronic device 1 has a new design for the temperature detection device 10, which allows the temperature detection device 10 to be directly connected to the power supply component 4 on the circuit board 3 while meeting safety requirements, without the need to add an additional low-voltage isolated power supply. This not only reduces the difficulty of assembly and maintenance, but also reduces the cost of use and facilitates the miniaturization design of the electronic device 1.
[0047] To prevent the temperature detection device 10 from cracking or developing a permanent gap when connected to the high-voltage power supply component 4 integrated with the electronic device 1, Figure 2 for Figure 1 An exploded view of electronic device 1 in the diagram. Figure 3A for Figure 1 A cross-sectional view of the temperature detection device 10 in the middle. Figure 3B for Figure 1 Another cross-sectional view of the temperature detection device 10, with reference to Figure 2 , Figure 3A and Figure 3B In some embodiments, the temperature detection device 10 includes a cable 11, a thermistor 12, an inner adhesive layer 13, an outer adhesive layer 14, and a heat conductor 15.
[0048] The thermistor 12 is used to detect temperature after being powered on. The thermistor 12 can be a positive temperature coefficient thermistor (PTC thermistor) or a negative temperature coefficient thermistor (NTC thermistor). In this embodiment, the thermistor 12 is used to detect the temperature point to be measured.
[0049] The inner adhesive layer 13 covers the outside of the thermistor 12 to protect it and prevent damage. Specifically, the inner adhesive layer 13 has a certain strength; for example, in some embodiments, the Shore hardness of the inner adhesive layer 13 can be type B or type C to ensure sufficient impact resistance. The shear strength of the inner adhesive layer 13 is greater than 6 MPa, for example, it can be 6 MPa-10 MPa, so that the inner adhesive layer 13 can maintain stable performance when subjected to various stresses (such as tension, compression, and shear), thus improving the stability of the inner adhesive layer 13 under complex stress environments.
[0050] In some embodiments, the inner adhesive 13 can be a UV-curable adhesive or a thermosetting adhesive, which can cure quickly, significantly shortening the production cycle and improving efficiency. Furthermore, it provides excellent adhesive strength, ensuring stable operation of the NTC probe in complex environments (such as high temperature, high humidity, vibration, etc.). It also possesses good high-temperature resistance, chemical stability, and insulation properties to guarantee the insulation and stability of the thermistor 12 under complex environments.
[0051] Reference Figure 3A and Figure 3B In some embodiments, the outer adhesive layer 14 covers the outer side of the inner adhesive layer 13, wherein the hardness of the inner adhesive layer 13 is greater than that of the outer adhesive layer 14. Because the outer adhesive layer 14 has lower hardness and better flexibility and elasticity, it can effectively buffer the inner adhesive layer 13 when it expands at high temperatures, releasing stress and preventing cracking. When the inner adhesive layer 13 recovers at low temperatures, the outer adhesive layer 14 can also promptly fill any gaps that may result from this recovery. In this embodiment, the cooperation between the inner adhesive layer 13 and the outer adhesive layer 14 can resist the impact and stress of the external environment and adapt to deformation at high and low temperatures, preventing gaps or cracks, thereby improving the overall performance and reliability of the temperature detection device 10.
[0052] For example, in some embodiments, the Shore A hardness of the outer adhesive 14 can be Type A to improve its flexibility and elasticity, reducing the risk of cracking or gaps in the inner adhesive 13 or the outer adhesive 14. For instance, the outer adhesive 14 can be a UV-curable adhesive with lower hardness (compared to the inner adhesive 13 being a UV-curable adhesive), or it can be silicone. Taking silicone as an example, because silicone has excellent softness and elasticity, it can adapt to the deformation of the inner adhesive 13 at high and low temperatures. When the inner adhesive 13 expands at high temperatures, the silicone can absorb some of the deformation to prevent cracking. When it shrinks at low temperatures, the silicone can also refill the space vacated after shrinkage, thus preventing gaps. Moreover, silicone itself has good temperature resistance and chemical stability, and will not experience significant aging and damage due to temperature changes, thus maintaining the cushioning properties of the silicone itself.
[0053] To facilitate assembly and connection with the temperature point to be measured, a heat conductor 15 is disposed on the outside of the outer adhesive layer 14. The heat conductor 15 is used to contact the temperature point to be measured of the electronic device 1. The temperature detection device 10 can be quickly connected to the temperature point to be measured via the heat conductor 15. Furthermore, the heat conductor 15 can be shaped to facilitate connection with the temperature point, such as a UT terminal or OT terminal as described below, to improve the assembly and connection between the temperature detection device 10 and the temperature point to be measured. To improve the thermal conductivity of the heat conductor 15, it can be made of metal, thereby ensuring its thermal conductivity and improving the temperature detection capability of the temperature detection device 10 at the temperature point to be measured.
[0054] Reference Figure 3A In some embodiments, cable 11 connects power supply assembly 4 and thermistor assembly to power thermistor 12 via power supply assembly 4. Specifically, one end of cable 11 is electrically connected to thermistor 12, and a portion of cable 11 extends out through inner adhesive 13, outer adhesive 14, and heat conductor 15 and is electrically connected to power supply assembly 4. That is, a portion of cable 11 is covered by inner adhesive 13, outer adhesive 14, and heat conductor 15, while another portion is outside of inner adhesive 13, outer adhesive 14, and heat conductor 15.
[0055] To improve the installation flexibility of the temperature detection device 10 and the diversity of detection points, refer to Figure 3A In some embodiments, the cable 11 includes a flexible first segment 111. Because the first segment 111 is flexible, the installation position of the temperature detection device 10 can be moved flexibly through the first segment 111, thereby obtaining a larger detection range, enabling the temperature detection device 10 to detect more temperature samples, and can also be installed at different temperature samples, thus improving installation flexibility.
[0056] When cable 11 is connected to the power supply assembly 4 on the high-voltage side of electronic device 1, cable 11 is considered part of the high-voltage side. Similarly, the thermistor 12 connected to cable 11 is also considered part of the high-voltage side. Therefore, the heatsink 15 of the temperature sensor must meet safety regulations regarding its relationship with cable 11 and thermistor 12. Likewise, the heatsink 15 and thermistor 12 must also meet safety regulations regarding their relationship with the circuit board 3 and power supply assembly 4 on the high-voltage side. For example, the insulation distance between the heatsink 15 and thermistor 12 must be greater than or equal to 5 mm, and the creepage distance must be greater than or equal to 15 mm. Similarly, the insulation distance between the heatsink 15 and cable 11 must be greater than or equal to 5 mm, and the creepage distance must be greater than or equal to 15 mm. And again, the insulation distance between the heatsink 15 and power supply assembly 4 must be greater than or equal to 5 mm, and the creepage distance must be greater than or equal to 15 mm.
[0057] To meet safety requirements, in some implementations, the thickness of the inner adhesive layer 13 or the outer adhesive layer 14 can be increased to ensure that the insulation distance between the thermistor 12 and the cable 11 and the heat conductor 15 is greater than or equal to 5mm and the creepage distance is greater than or equal to 15mm. For example, the thickness of the outer adhesive layer 14 between the cable 11 and the heat conductor 15 can be greater than or equal to 15mm to ensure that the creepage distance between the cable 11 and the heat conductor 15 is greater than or equal to 15mm. In this case, the insulation distance between the cable 11 and the heat conductor 15 can also be effectively guaranteed to be greater than or equal to 5mm.
[0058] However, the higher the thermal conductivity of the inner adhesive layer 13 and the outer adhesive layer 14, the greater the risk of cracking; conversely, the lower the risk of cracking, the lower the thermal conductivity of the inner and outer adhesive layers 13 and 14. Therefore, increasing the thickness of the inner and outer adhesive layers 13 and 14 to meet safety requirements between the cable 11, the thermistor 12, and the heat conductor 15 can negatively impact the heat transfer efficiency between the thermistor 12 and the heat conductor 15, thus affecting the detection accuracy of the temperature detection device 10. Furthermore, it increases the overall size of the temperature detection device 10, hindering its miniaturization design.
[0059] In order to meet safety requirements while also ensuring the miniaturization and detection accuracy of the temperature detection device 10, referencing Figure 2 , Figure 3A and Figure 3BIn some embodiments, the temperature detection device 10 further includes insulating tape 16, which is disposed between the thermistor 12 and the heat conductor 15. The insulating tape 16 serves to insulate and isolate the heat conductor 15 from the thermistor 12 and the cable 11. The design of the insulating tape 16 effectively reduces the thickness of the inner adhesive layer 13 and the outer adhesive layer 14 while still meeting safety requirements, such as ensuring an insulation distance of at least 5 mm between the cable 11 and the heat conductor 15, and a creepage distance of at least 15 mm between the thermistor 12, the cable 11, and the heat conductor 15. Because the thickness of the inner adhesive layer 13 and the outer adhesive layer 14 can be reduced, it facilitates the miniaturization of the temperature detection device 10 and effectively improves the thermal conductivity between the thermistor 12 and the heat conductor 15, thereby improving the detection accuracy of the temperature detection device 10.
[0060] In some embodiments, the flame retardant rating of the insulating tape 16 is above UL94 V-1. A flame retardant rating of UL94 V-1 or higher for the insulating tape 16 effectively ensures its stability under high-voltage conditions, thus effectively guaranteeing its insulation performance. This allows for a significant increase in the insulation distance and creepage distance between the thermistor 12, the cable 11, and the heat conductor 15, thereby effectively reducing the thickness of the inner adhesive layer 13 and the outer adhesive layer 14.
[0061] Reference Figure 3A and Figure 3B In some embodiments, insulating tape 16 covers the outside of the inner adhesive layer 13, and is located between the inner adhesive layer 13 and the outer adhesive layer 14. A portion of the insulating tape 16 extends beyond the outer adhesive layer 14 and the heat conductor 15, covering a section of the cable 11. This ensures that the inner adhesive layer 13 is enclosed by the insulating tape 16, which in turn encloses the thermistor 12, thus providing insulation between the thermistor 12 and the heat conductor 15. Therefore, there is no need to worry about insufficient insulation distance between the thermistor 12 and the heat conductor 15. In this embodiment, because a portion of the insulating tape 16 extends beyond the outer adhesive layer 14 and the heat conductor 15, covering a section of the cable 11, the creepage distance between the cable 11 and the heat conductor 15 is always less than the creepage distance between the thermistor 12 and the heat conductor 15. Therefore, as long as the creepage distance requirement between the cable 11 and the heat conductor 15 is met, the creepage requirement between the thermistor 12 and the heat conductor 15 can also be met. The creepage distance between the junction 113 of the portion of cable 11 covered by insulating tape 16 and the uncovered portion is closest to the heat conductor 15. As long as the creepage distance between this junction 113 and the heat conductor 15 meets the requirements, the creepage distance between any other location on cable 11 and the heat conductor 15 will also meet the requirements. The creepage distance between this junction 113 and the heat conductor 15 is as follows: Figure 3AAs shown, the creepage distance is from the outer surface of the portion extending from the junction 113 along the insulating tape 16 to the outer surface of the outer adhesive 14, and then from the outer surface of the outer adhesive 14 to the heat conductor 15. The creepage distance between the junction 113 of the cable 11 and the heat conductor 15 must be greater than or equal to 15 mm. Understandably, provided that the creepage distance between the junction 113 of the cable 11 and the heat conductor 15 is greater than 15mm, the longer the portion of the insulating tape 16 extending beyond the outer adhesive layer 14, the longer the section of the cable 11 covered by the insulating tape 16 extending beyond the outer adhesive layer 14 can be. This allows for a smaller thickness of the outer adhesive layer 14 between the cable 11 and the heat conductor 15. Similarly, the longer the portion of the insulating tape 16 extending beyond the outer adhesive layer 14, the smaller the thickness of the outer adhesive layer 14 and the inner adhesive layer 13 between the thermistor 12 and the heat conductor 15 can be. This results in higher heat transfer efficiency between the heat conductor 15 and the thermistor 12, and thus higher detection accuracy of the temperature detection device 10. In this embodiment, by extending the insulating tape 16 beyond the outer adhesive layer 14 and covering a section of the cable 11, the thickness of the outer adhesive layer 14 is reduced, thereby increasing the heat transfer efficiency between the thermistor 12 and the heat conductor 15, and improving the detection accuracy of the temperature detection device 10.
[0062] Reference Figure 2 and Figure 3A In some embodiments, the cable 11 further includes a rigid second segment 112 electrically connected between the first segment 111 and the thermistor 12. The first segment 111 is used for electrical connection with the power supply assembly 4. A portion of the second segment 112 extends to form an inner adhesive layer 13, an outer adhesive layer 14, and a heat conductor 15. Insulating tape 16 covers at least a portion of the second segment 112. Because the second segment 112 is rigid, the relative positional stability between the cable 11 and the heat conductor 15 can be effectively ensured, avoiding the risk of insufficient insulation distance between the cable 11 and the heat conductor 15 due to the second segment 112 bending too close to it, which could lead to electrical arcing or short circuits.
[0063] Reference Figure 3A In some embodiments, for ease of description, the length of the section of cable 11 covered by the insulating tape 16 extending beyond the outer layer of adhesive 14 is defined as D. To ensure that the insulation distance between the heat conductor 15 and the cable 11 meets the requirements, D ≥ 5mm. Since D ≥ 5mm, the distance between the junction position 113 of cable 11 and the heat conductor 15 can be guaranteed to be ≥ 5mm, thus ensuring that the insulation distance between the junction position 113 of cable 11 and the heat conductor 15 meets the requirements. The second section 112 is rigid, thereby effectively ensuring the stability of the relative position between cable 11 and heat conductor 15, ensuring that the insulation distance meets the requirements.
[0064] Reference Figure 3A In some embodiments, D ≥ 5mm, and the thickness of the outer adhesive 14 between the cable 11 and the heat conductor 15 is less than 10mm. For example, in some embodiments, D ≥ 10mm, and the thickness of the outer adhesive 14 between the cable 11 and the heat conductor 15 is less than 5mm. It is understood that as long as the sum of D and the thickness of the outer adhesive 14 between the cable 11 and the heat conductor 15 is ≥ 15mm, the creepage distance requirement between the cable 11 and the heat conductor 15 can be effectively met.
[0065] Reference Figure 2 and Figure 3A In some embodiments, the outer adhesive 14 is generally cylindrical, and the heat conductor 15 is also generally cylindrical, with the heat conductor 15 fitted around the outer periphery of the outer adhesive 14. Because the outer adhesive 14 and the heat conductor 15 are both generally cylindrical, the processing and manufacturing of the outer adhesive 14 and the heat conductor 15 are facilitated.
[0066] To facilitate the connection between the heat conductor 15 and the temperature to be measured, refer to Figure 2 and Figure 3A In some embodiments, the heat conductor 15 includes a first part 151 and a second part 154. The first part 151 is fitted onto the outer periphery of the outer adhesive layer 14, and the second part 154 is connected to the first part 151. The second part 154 has an assembly port 155, through which it is connected to the structure to be measured, for example... Figure 1 The second part 154 is connected to the liquid cooling assembly 5 via the mounting port 155. In some embodiments, the mounting port 155 is a circular hole, that is, the overall structure of the heat conductor 15 is roughly similar to the structure of the OT terminal.
[0067] Reference Figure 2 and Figure 3A In some embodiments, the second part 154 is plate-shaped, which can increase the contact surface between the second part 154 and the structure to be measured, thereby improving the heat conduction efficiency between the heat conductor 15 and the structure to be measured, and thus improving the temperature detection accuracy of the temperature detection device 10.
[0068] It is understood that in some other embodiments, the outer adhesive 14 may also be prismatic or other shapes, and the heat conductor 15 may also be other shapes.
[0069] Furthermore, the shape of the inner adhesive 13 is not limited in this embodiment; for example, it can be the same as... Figure 2The elliptical cylindrical shape can be any other shape, as long as it can effectively cover the thermistor 12. In some embodiments, the temperature detection device 10 also includes a circuit board 17 with pads. The cable 11 is connected to the pads on the circuit board 17, and the thermistor 12 is connected to the traces on the circuit board 17, thereby realizing the electrical connection between the cable 11 and the thermistor 12. In this way, the circuit board 17 can effectively provide rigid support for the thermistor 12, reducing the risk of solder joint breakage due to mechanical vibration, cable bending, or external pulling compared to direct connection with the cable 11.
[0070] It should be noted that the temperature detection device 10 in this embodiment can not only effectively detect the temperature of the protective earth housing 2, liquid cooling components, etc., but also detect the problems of electronic devices on the high voltage side, and can also be used to detect the temperature of communication devices.
[0071] Figure 4 A cross-sectional view of another temperature detection device 10 provided in an embodiment of this application. Figure 4 Compared to the example Figure 3A The main difference in the embodiments is that, Figure 3A In this embodiment, the insulating adhesive tape 16 is disposed between the inner adhesive layer 13 and the outer adhesive layer 14, while Figure 4 In this embodiment, the insulating tape 16 is disposed between the outer adhesive layer 14 and the heat conductor 15. Specifically, refer to... Figure 4 Insulating tape 16 is wrapped around the outer layer of adhesive 14, and is located between the outer layer of adhesive 14 and the heat conductor 15. A portion of the insulating tape 16 extends beyond the heat conductor 15 and wraps around a section of the cable 11. Figure 3A Similar to the insulating tape 16 in the embodiment, the thickness of the inner adhesive layer 13 or outer adhesive layer 14 between the cable 11 and the heat conductor 15 can be effectively reduced by setting the insulating tape 16, thereby improving the heat conduction efficiency between the heat conductor 15 and the thermistor 12 and improving the detection accuracy of the temperature detection device 10.
[0072] Figure 5A This is a schematic diagram of the structure of another temperature detection device 10 provided in an embodiment of this application. Figure 5B This is a schematic diagram of the structure of another temperature detection device 10 provided in the embodiments of this application. Figure 5A and Figure 5B Same as in the embodiments Figure 1 The main difference in the embodiments is that the structure of the heat conductor 15 of the temperature sensor is different. Apart from the heat conductor 15, the other structures can be referred to the previous embodiments, and will not be repeated here.
[0073] Reference Figure 5AIn some embodiments, the first part 151 of the heat conductor 15 has a cylindrical structure, that is, it is formed by connecting a bottom wall 152 and an outer peripheral wall 153. The outer peripheral wall 153 is fitted onto the outer peripheral surface of the outer adhesive 14, and the bottom wall 152 is attached to the axial bottom surface of the outer adhesive 14. The second part 154 is connected to the bottom wall 152, and the second part 154 is parallel and flush with the bottom wall 152. Thus, both the second part 154 and the bottom wall 152 of the first part 151 can be directly attached to the structure to be measured, thereby effectively increasing the contact area between the heat conductor 15 and the structure to be measured, thereby improving the heat conduction efficiency between the heat conductor 15 and the structure to be measured, and thus improving the detection accuracy of the temperature detection device 10.
[0074] Reference Figure 5B In some implementations, compared to Figure 1 Temperature detection device 10 in the embodiment, Figure 5B The structure of the heat conductor 15 is roughly similar to that of the UT terminal, that is, the assembly port 155 is roughly U-shaped.
[0075] Understandable Figure 1 as well as Figure 5A and Figure 5B These are just a few of the structural forms of the heat conductor 15; the heat conductor 15 can also be other shapes.
[0076] It should be noted that the temperature detection device 10 in this embodiment can be manufactured independently and applied to [various applications]. Figure 1 The electronic device 1 in the text can also be applied to other devices, such as... Figure 6 In addition to the battery pack in the embodiment, the temperature detection device 10 can also be used independently.
[0077] Figure 6 This is a simplified structural diagram of a battery pack 6 provided in an embodiment of this application.
[0078] Reference Figure 6 The battery pack 6 includes a housing 7 and multiple battery cells 9, a liquid cooling plate 8, and a temperature detection device 10 as described in any of the above embodiments, all located within the housing 7. A heat conductor 15 is disposed on the outer surface of the liquid cooling plate 8, for example, connected to the upper surface of the liquid cooling plate 8. The temperature detection device 10 is used to detect the temperature of the liquid cooling plate 8. Specifically, the heat conductor 15 can be disposed on the outer surface at the inlet of the liquid cooling plate 8 to detect the temperature of the coolant flowing into the liquid cooling plate 8, and on the outer surface at the outlet of the liquid cooling plate 8 to detect the temperature of the coolant flowing out of the liquid cooling plate 8. To increase the contact area between the heat conductor 15 and the liquid cooling plate 8, the heat conductor 15 can be configured as follows: Figure 5AWith the same structure, it is attached to the upper surface of the liquid cooling plate 8 via the bottom wall 152. In this embodiment, the cable 11 of the temperature detection device 10 can be connected to the power assembly on the circuit board 3 inside the battery pack 6, or it can be connected to the power assembly outside the battery pack 6, such as the power assembly inside the energy storage cabinet.
[0079] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. An electronic device, comprising: The electronic device comprises a power supply component and a temperature detection device, the temperature detection device comprises a cable, a thermistor, an inner layer glue coated outside the thermistor, an outer layer glue coated outside the inner layer glue, and a heat conductor arranged outside the outer layer glue, the hardness of the inner layer glue is greater than that of the outer layer glue, the cable is electrically connected with the thermistor, part of the cable extends out of the inner layer glue, the outer layer glue and the heat conductor, the cable is electrically connected with the power supply component, and the heat conductor is used for contacting a to-be-measured temperature point of the electronic device.
2. The electronic device of claim 1, wherein, The inner layer glue has a Shore hardness of type B or type C, and the outer layer glue has a Shore hardness of type A.
3. The electronic device of claim 1, wherein, The inner layer glue is UV curing glue or thermosetting glue, and the outer layer glue is silica gel or UV curing glue.
4. The electronic device of any of claims 1-3, wherein, The temperature detection device further comprises an insulating adhesive paper, the insulating adhesive paper is arranged between the thermistor and the heat conductor, and the insulating adhesive paper is used for insulating and isolating the heat conductor from the thermistor and the cable.
5. The electronic device of claim 4, wherein, The insulating adhesive paper is coated outside the inner layer glue, the insulating adhesive paper is located between the inner layer glue and the outer layer glue, and part of the insulating adhesive paper extends out of the outer layer glue and coats a section of the cable.
6. The electronic device of claim 4, wherein, The insulating adhesive paper is coated outside the outer layer glue, the insulating adhesive paper is located between the outer layer glue and the heat conductor, and part of the insulating adhesive paper extends out of the heat conductor and coats a section of the cable.
7. The electronic device of claim 4, wherein, The insulating adhesive paper has a flame retardant level of UL94 V-1 or above.
8. The electronic device of claim 4, wherein, The thickness of the outer layer glue between the cable and the heat conductor is 3 mm-15 mm.
9. The electronic device of any of claims 1-3, wherein, The cable comprises a flexible first section and a rigid second section, the second section is electrically connected between the first section and the thermistor, the first section is used for electrical connection with the power supply component, and part of the second section extends out of the inner layer glue, the outer layer glue and the heat conductor.
10. The electronic device of any of claims 1-3, wherein, The to-be-measured temperature point of the electronic device comprises a shell of the electronic device or a liquid cooling component connected with the shell.
11. A temperature detecting device characterized by comprising: The temperature detection device comprises a cable, a thermistor, an inner layer glue coated outside the thermistor, an outer layer glue coated outside the inner layer glue, and a heat conductor arranged outside the outer layer glue, the cable is electrically connected with the thermistor, part of the cable extends out of the inner layer glue, the outer layer glue and the heat conductor, the cable is used for power supply for the thermistor, the heat conductor is used for contacting a to-be-measured temperature point, and the hardness of the inner layer glue is greater than that of the outer layer glue.
12. The temperature detecting device according to claim 11, wherein The inner layer glue has a Shore hardness of type B or type C, and the outer layer glue has a Shore hardness of type A.
13. The temperature detecting device according to claim 11 or 12, characterized in that, The temperature detection device further comprises an insulating adhesive paper, the insulating adhesive paper is coated outside the inner layer glue, the insulating adhesive paper is located between the inner layer glue and the outer layer glue, and part of the insulating adhesive paper extends out of the outer layer glue and coats a section of the cable.
14. The temperature detecting device according to claim 13, wherein The insulating adhesive paper has a flame retardant level of UL94 V-1 or above.
15. The temperature detecting device according to claim 13, wherein The thickness of the outer layer glue between the cable and the heat conductor is 3 mm-15 mm.
16. The temperature detecting device according to claim 11 or 12, characterized by The cable includes a flexible first segment and a rigid second segment, the second segment being electrically connected between the first segment and the thermistor, the first segment being used for electrical connection with a power supply assembly, and a part of the second segment extending out of the inner rubber, the outer rubber and the heat conductor.
17. A battery pack, characterized by The battery pack includes a shell, a plurality of battery cells, a liquid cooling plate and the temperature detection device as claimed in any one of claims 11-16 in the shell, the heat conductor being arranged on an outer surface of the liquid cooling plate, and the temperature detection device being used for detecting the temperature of the liquid cooling plate.