Memory cold plate and liquid cooling assembly provided with same

Abstract

The utility model relates to a memory cold plate and a liquid cooling assembly provided with the same, and a low-flow-resistance flow channel is formed by lowering a plurality of sections of second memory liquid passing pipes and matching the second memory liquid passing pipes with a first memory liquid passing pipe and a third memory liquid passing pipe. Space for arranging a liquid inlet pipeline and a liquid outlet pipeline is reserved at the positions of the liquid inlet and the liquid outlet, the height of the overlapping position of the liquid passing pipes is reduced, the positions of parts are concentrated, the height space of the whole liquid cooling assembly is reduced, and the space utilization rate of a server case is improved. And the CPU cold plate and the memory cold plate on the liquid cooling assembly provided with the cold plate are arranged through the cooperation of the liquid inlet pipe and the plurality of liquid outlet pipes, so that the combination of series connection and parallel connection of the flow channels in the liquid cooling assembly is realized, the flow resistance of the flow channels is reduced, and a better cooling effect is realized.

Description

Technical Field

[0001] This utility model belongs to the field of liquid cooling technology, and specifically relates to a memory cold plate and a liquid cooling assembly equipped with the cold plate. Background Technology

[0002] With the development of technologies such as artificial intelligence, the Internet of Things, and autonomous driving, the demand for servers is constantly increasing. Not only is the functional integration of various modules in servers becoming increasingly sophisticated, but the heat generation power of these modules is also gradually increasing. Traditional air-cooling technology is far from meeting the current heat dissipation needs of electronic components, especially central processing units and memory modules. How to rationally design the structure and arrange the airflow channels to dissipate heat for the entire system is a problem that the industry urgently needs to solve.

[0003] The common CPU cold plate + memory cold plate layout, as shown in patent CN108196655, has a simple flow channel layout between the memory cold plate and the CPU cold plate, resulting in high flow resistance and poor performance. In addition, the overall height of the memory cold plate is large, occupying more height space in the server. The current solution cannot be used in low-space servers. Utility Model Content

[0004] To address the problems existing in the prior art, this utility model proposes a memory cold plate and a liquid cooling assembly equipped with the cold plate, which changes the flow channel connection position structure and reduces the space occupied; and adopts a series and parallel layout to reduce the flow resistance value.

[0005] The objective of this utility model and the technical problem it solves are achieved through the following technical solution. According to this utility model, a memory cold plate is provided, comprising:

[0006] A first memory liquid inlet tube and a second memory liquid inlet tube, wherein the second memory liquid inlet tube has at least two sections in a direction parallel to the first memory liquid inlet tube, the height of the second memory liquid inlet tube is lower than the height of the first memory liquid inlet tube, and one inlet is provided on one section of the second memory liquid inlet tube, and the remaining sections each have one outlet.

[0007] A bridging component is provided between the first memory fluid passage and each segment of the second memory fluid passage. The bridging component includes a third memory fluid passage and a heat-conducting component, and the area between the corresponding bridging components on two adjacent segments of the second memory fluid passage is used to place the CPU cold plate.

[0008] As an improvement to the above technical solution, the end of the third memory liquid passage that is connected to the second memory liquid passage is lower than other positions.

[0009] As an improvement to the above technical solution, the first memory liquid passage, the second memory liquid passage, and the third memory liquid passage are integrated into one unit.

[0010] As an improvement to the above technical solution, the heat-conducting component is segmented, and the material and thickness of each segment of the heat-conducting component are set differently.

[0011] As an improvement to the above technical solution, a reinforcing beam is provided between the first memory liquid passage pipe and the second memory liquid passage pipe, and a connecting crossbeam is provided between two adjacent second memory liquid passage pipes.

[0012] As an improvement to the above technical solution, the first memory liquid inlet tube and the second memory liquid inlet tube are also provided with connecting ears, which are used for the fixed installation of the memory cold plate.

[0013] And a liquid cooling assembly comprising at least two CPU cold plates connected in series via connecting pipes and equipped with the aforementioned memory cold plates.

[0014] The CPU cold plate is located in the area between the corresponding bridge components on each adjacent second memory fluid pipe.

[0015] The liquid inlet pipe includes a main liquid inlet pipe and a memory liquid inlet pipe. The main liquid inlet pipe is connected to one of the CPU cold plates, and the two ends of the memory liquid inlet pipe are respectively connected to the liquid inlet of any one of the remaining CPU cold plates and the liquid inlet on the second memory liquid inlet pipe.

[0016] The liquid outlet pipe includes a main liquid outlet pipe and a secondary liquid outlet pipe. The two ends of the secondary liquid outlet pipe are respectively connected to the secondary liquid outlet on the second secondary liquid passage pipe and the main liquid outlet pipe. The main liquid outlet pipe is used for the discharge of condensate after circulation.

[0017] As an improvement to the above technical solution, the CPU cold plate is floatingly connected to the first memory fluid pipe, and when a connecting beam is provided between two adjacent second memory fluid pipes, the CPU cold plate is simultaneously floatingly connected to the connecting beam.

[0018] As an improvement to the above technical solution, a sheet metal cover is also provided on the CPU cold plate, and an installation handle is detachably provided on the sheet metal cover.

[0019] As an improvement to the above technical solution, a multi-port connector is provided at the connection position between the liquid outlet pipe and the main liquid outlet pipe, and a quick connector is provided at the end of the main liquid inlet pipe and the main liquid outlet pipe extending out of the memory cold plate.

[0020] The beneficial effects of this utility model through the above technical solution are:

[0021] 1. In this utility model, the height of the second memory liquid inlet tube is set lower than that of the first memory liquid inlet tube on the memory cold plate. The second memory liquid inlet tube is segmented, and space is reserved at the inlet and outlet positions for arranging inlet and outlet pipes. This reduces the height of the pipe overlap, concentrates the position of components, reduces the overall height of the liquid cooling assembly, and improves the space utilization of the server chassis.

[0022] 2. This utility model also provides multiple liquid outlets for the memory cold plate. By coordinating the liquid inlet pipe and multiple liquid outlet pipes, the series and parallel connection of the flow channels in the liquid cooling component is realized, thereby reducing the flow resistance of the flow channels and achieving a better cooling effect.

[0023] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more obvious and understandable, preferred embodiments are given below, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of a novel circuit board cooling assembly device in the prior art.

[0025] Figure 2 This is a schematic diagram of the flow channel of the memory cold plate of this utility model.

[0026] Figure 3 Is Figure 2 The diagram shows a structural schematic of a memory cold plate with a connecting beam and a reinforcing beam installed on it.

[0027] Figure 4 This is a schematic diagram of the series-parallel hybrid flow channel of the memory cold plate of this utility model.

[0028] Figure 5 This is a schematic diagram of the third internal fluid passage structure of this utility model.

[0029] Figure 6 This is a schematic diagram of one embodiment of the third internal fluid passage of this utility model.

[0030] Figure 7 This is a top view of the third memory fluid inlet pipe and heat-conducting components in the memory cold plate.

[0031] Figure 8 This is a side view of the third memory fluid inlet pipe and heat-conducting components in the memory cold plate.

[0032] Figure 9 This is a schematic diagram of an embodiment of the series-parallel flow channel of the liquid cooling component in this utility model.

[0033] Figure 10 This is a schematic diagram of the structure of the liquid cooling component after installation.

[0034] Figure 11 This is a schematic diagram of the liquid cooling component before installation.

[0035] Figure 12 This is a schematic diagram of the floating connection structure of the CPU cold plate and memory cold plate of this utility model.

[0036] In the picture:

[0037] 1. Second memory fluid inlet pipe; 11. Inlet; 12. Outlet; 13. Connecting crossbeam; 14. Reinforcing beam; 2. First memory fluid inlet pipe; 21. Main inlet pipe; 22. Memory inlet pipe; 23. Main outlet pipe; 24. Memory outlet pipe; 25. Connecting pipe; 3. Third memory fluid inlet pipe; 31. Heat-conducting component; 4. CPU cold plate; 5. Connecting lug; 6. Floating screw; 7. Mounting handle; 8. Quick connector; 9. Multi-port connector. Detailed Implementation

[0038] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and preferred embodiments.

[0039] In the description of this utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0040] Reference Figure 1 To address the issues of the current liquid cooling structure's simple flow channel layout between the memory cold plate and CPU cold plate 44, resulting in high flow resistance and poor performance; and the large overall height of the memory cold plate, occupying more vertical space within the server, the specific embodiments of the memory cold plate and liquid cooling components of this utility model are as follows:

[0041] Reference Figure 2The CPU cold plate 4 includes a first memory fluid inlet pipe 2 and a second memory fluid inlet pipe 1, which are located at the two edges of the CPU cold plate 4. A bridging component is provided between the first memory fluid inlet pipe 2 and the second memory fluid inlet pipe 1, arranged parallel to the CPU cold plate 4 on both sides. The second memory fluid inlet pipe 1 has at least two segments parallel to the first memory fluid inlet pipe 2; preferably, it has three segments, with the two ends of the second memory fluid inlet pipe 1 corresponding to the two ends of the first memory fluid inlet pipe 2. One segment of the second memory fluid inlet pipe 1 has an inlet 11, and the remaining segments each have an outlet 12. The height of the second memory fluid inlet pipe 1 is lower than the height of the first memory fluid inlet pipe 2. The CPU cold plate 4 is positioned between the first memory fluid inlet pipe 2 and the second memory fluid inlet pipe 1, and the main inlet pipe 21 and the main outlet pipe 23 must form a series flow channel with the CPU cold plate 4 and the second memory fluid inlet pipe 1. In this application, two or more liquid outlets 12 are provided, inevitably resulting in overlapping pipe sections. By setting the height of the second liquid inlet pipe lower than the first liquid inlet pipe, the positions of the memory inlet pipe 22 and memory outlet pipe 24, which connect to the inlet 11 and outlet 12 on the second liquid inlet pipe, are lowered. This allows for better arrangement of the inlet and outlet pipes, reducing the overall height, concentrating the positions of components, and reducing the overall height of the liquid cooling assembly, thus improving the space utilization of the server chassis. Furthermore, the pipe exiting the CPU cold plate 4 is positioned higher than the pipe extending from the second memory liquid inlet pipe 1, naturally creating a misalignment between the two overlapping pipes. This reduces the overall height while avoiding height differences between pipes, reducing flow resistance within the pipes, and improving heat dissipation efficiency.

[0042] Reference Figure 4The bridging components are used to bridge the parallel first memory fluid inlet pipe 2 and the second memory fluid inlet pipe 1. A memory board is also disposed between the bridging components. Therefore, the bridging components include a third memory fluid inlet pipe 3 and a heat-conducting component 31. The third memory fluid inlet pipe 3 connects the first memory fluid inlet pipe 2 and the second memory fluid inlet pipe 1, and the heat-conducting component 31 dissipates heat from the memory board. Multiple bridging components are disposed between the first memory fluid inlet pipe 2 and each segment of the second memory fluid inlet pipe 1, and the area between adjacent bridging components on each segment of the second memory fluid inlet pipe 1 is used to place the CPU cold plate 4. In this embodiment, there are two locations for placing the CPU cold plate 4. Two sets of bridging components are installed on each side of the two CPU cold plate 4 areas. These bridging components are connected to three sections of the second memory liquid-passing pipe 1. This allows condensate to enter the middle section of the second memory liquid-passing pipe 1, which has an inlet 11. The condensate then flows through the third memory liquid-passing pipe 3, which is connected to this section, into the first memory liquid-passing pipe 2. After entering the first memory liquid-passing pipe 2, the condensate flows to both sides of the first memory liquid-passing pipe 2. Simultaneously, it flows through the third memory liquid-passing pipe 3, which is connected to the second memory liquid-passing pipe 1 on both sides, into the remaining section of the second memory liquid-passing pipe 1, which has an outlet 12. The condensate then flows out from the outlet 12 after circulating within the second memory liquid-passing pipe 1. This bridging component, connected to the segmented second memory liquid-passing pipe 1, uses multiple parallel flow channels, achieving faster and more efficient full circulation of condensate in different liquid-passing pipes.

[0043] Reference Figure 5 , Figure 6 In this embodiment, to accommodate the lower-height second memory liquid passage tube 1, the third memory liquid passage tube 3 is configured with an irregular shape, and the end of the irregular third memory liquid passage tube 3 that connects to the second memory liquid passage tube 1 is lower than other positions. Preferably, the end of the irregular third memory liquid passage tube 3 that connects to the second memory liquid passage tube 1 is configured as an "S" shape, with the higher end of the "S" shape integrally formed with other parts. This configuration allows the end of the liquid passage tube to be easily connected to a connection position corresponding to the height of the second memory liquid passage tube 1. Lowering the height of the connection position provides space for the placement of subsequent inlet and outlet pipes, thereby reducing the overall height of the solution. Furthermore, the irregular third memory liquid passage tube 3 can easily achieve integrated configuration with the first memory liquid passage tube 2 and the second memory liquid passage tube 1, reducing the processing steps and improving production efficiency.

[0044] Reference Figure 7In one embodiment of this application, the third memory fluid inlet pipe 3 is configured as a flat tube. The flat tube facilitates installation between different memory modules and allows for easy connection to the heat-conducting component 31. The heat-conducting component 31 is segmented, with each segment having a different material and thickness corresponding to the heat dissipation requirements of the memory board. This ensures a closer fit between the heat-conducting component 31 and the memory board positioned between adjacent heat-conducting components 31, achieving better heat dissipation without increasing the overall space of the memory cold plate.

[0045] In addition, in order to better concentrate the flow channel, the second memory liquid passage 1 is also provided with a protrusion extending towards the first memory liquid passage 2. The protrusion is used to change the direction of the liquid inlet 11 and / or the liquid outlet 12, so as to avoid increasing the overall height or width of the memory cold plate when the liquid inlet 11 and / or the liquid outlet 12 are located on the top or the other side of the second memory liquid passage 1.

[0046] Reference Figure 3 Since the first memory liquid passage tube 2 and multiple segments of the second memory liquid passage tube 1 are respectively arranged, a reinforcing beam 14 is also provided between the first memory liquid passage tube 2 and the second memory liquid passage tube 1 to strengthen and fix the relative position between the two memory liquid passage tubes and increase the stability between the two memory liquid passage tubes. Similarly, for the multiple segments of the second memory liquid passage tube 1, a connecting beam 13 is provided between two adjacent second memory liquid passage tubes 1, and the connecting beam 13 also serves to fix the position between the multiple segments of the second memory liquid passage tube 1. As one embodiment of this application, three reinforcing beams 14 are provided between the first memory liquid passage tube 2 and the second memory liquid passage tube 1. Two of the reinforcing beams 14 are provided at the two corresponding ends of the first memory liquid passage tube 2 and the second memory liquid passage tube 1, that is, the two short sides of the entire elongated memory cold plate form a fixed connection between the first memory liquid passage plate and the second memory liquid passage tube 1. The other reinforcing beam 14 is provided in the middle position to further fix and strengthen the overall structure in the middle position. After the first internal fluid passage 2 and the second internal fluid passage 1 are fixed by the connecting beam 13 and the reinforcing beam 14, they form a closed frame structure, which increases the structural strength and rigidity.

[0047] For the installation of the memory cold plate on the chassis, the first memory fluid inlet pipe 2 and the second memory fluid inlet pipe 1, which form the main structure of the closed frame, serve as the main mounting components. Therefore, the first memory fluid inlet pipe 2 and the second memory fluid inlet pipe 1 are also provided with connecting ears 5, which are fixed to the chassis with screws. Specifically, one fixing ear is provided at each end of the first memory fluid inlet pipe 2 and the second memory fluid inlet pipe 1, thereby fixing the four corners of the memory cold plate.

[0048] Reference Figure 9For the aforementioned memory cold plate structure, a liquid cooling assembly using this structure can be extended. The liquid cooling assembly also includes at least two sets of CPU cold plates 4 and inlet and outlet pipes made of flexible tubing. The inlet pipes include a main inlet pipe 21 and a memory inlet pipe 22. The main inlet pipe 21 is connected to the CPU cold plate 4 for the entry of condensate. The two ends of the memory inlet pipe 22 are respectively connected to the inlet ports 11 on the CPU cold plate 4 and the second memory liquid passage pipe 1. The outlet pipes include a main outlet pipe 23 and a memory outlet pipe 24. The two ends of the memory outlet pipe 24 are respectively connected to the memory outlet port 12 on the second memory liquid passage pipe 1 and the main outlet pipe 23. Multiple memory outlet pipes 24 are provided corresponding to the memory outlet port 12, and all multiple memory outlet pipes 24 are connected to the main outlet pipe 23. The main outlet pipe 23 is used for the discharge of condensate after circulation. A connecting pipe 25 is provided between the two sets of CPU cold plates 4 for the series connection between the two sets of CPU cold plates 4.

[0049] Reference Figure 4 In one embodiment of this application, the CPU cold plates 4 are configured as two sets. One set of CPU cold plates 4 is connected to the main liquid inlet pipe 21 and simultaneously connected to the other CPU cold plate 4 via a connecting pipe 25. The second CPU cold plate 4 is also connected to the second memory liquid inlet pipe 1 via the memory liquid inlet pipe 22. This forms a series flow channel between the main liquid inlet pipe 21, the two CPU cold plates 4, and the second memory liquid inlet pipe 1. This ensures that the condensate can flow smoothly and comprehensively through all CPU cold plates 4 and enter the memory cold plate. The memory inlet pipe 22 in the memory cold plate is connected to the inlet port 11 located on the middle section of the second memory liquid inlet pipe 1. The condensate flows through the third memory liquid inlet pipe 3, which is connected to this section, into the first memory liquid inlet pipe 2. After entering the first memory liquid inlet pipe 2, the condensate flows to both sides of the first memory liquid inlet pipe 2, and simultaneously enters the remaining section of the second memory liquid inlet pipe 1, which has outlet ports 12, through the third memory liquid inlet pipe 3 connected to the second memory liquid inlet pipe 1 on both sides. The memory outlet pipe 24, connected to the outlet ports 12 on the two remaining sections, is connected to the main outlet pipe 23 via a multi-port connector 9, thus achieving the discharge of the condensate. This parallel flow channel structure of the memory cold plate section is connected in series with the CPU section, forming a combined series and parallel flow channel connection method. This further reduces flow resistance, achieves faster and more efficient full flow of condensate in different liquid inlet pipes, and further increases condensation efficiency.

[0050] Reference Figure 10 , Figure 12When installing the liquid cooling components, the CPU cold plate 4 and the memory cold plate need to be installed together. However, the CPU cold plate 4 and the CPU, and the memory cold plate and the memory modules or other structures need to be fitted separately. Therefore, a floating connection is used between the CPU cold plate 4 and the first memory liquid pipe 2. Specifically, a connection structure with connection holes is provided on the first memory liquid pipe 2 corresponding to the CPU cold plate 4. A corresponding connection structure is also provided on the CPU cold plate 4. The two connection structures are floatingly connected by floating screws 6. To further increase the stability of this floating connection, a connection structure is provided on the connecting beam 13 between two adjacent second memory liquid pipes 1. Similarly, a corresponding connection structure is provided on one side of the CPU cold plate 4 corresponding to the second memory liquid pipe. The two connection structures are also connected by floating screws 6.

[0051] Reference Figure 11 In addition, a sheet metal cover is provided on the CPU cold plate 4, and a detachable mounting handle 7 is provided on the sheet metal cover. The liquid cooling assembly is placed on the server motherboard of the chassis through the mounting handle 7 and installed with screws. After installation, the mounting handle 7 is removed. This simplifies the installation process and does not occupy installation space.

[0052] To facilitate the installation of the entire liquid cooling assembly, quick-connect fittings are provided at the ends of the main inlet and outlet pipes that extend beyond the internal cold plate. These quick-connect fittings are mounted on the ends of the main inlet and outlet pipes via mounting bases, enabling rapid assembly and disassembly of the condensate section.

[0053] In other embodiments of this utility model, the number of second memory liquid passages arranged in the direction parallel to the first memory liquid passage (e.g., four segments) and the number of CPU cold plates (e.g., three) can be increased. One segment of the second memory liquid passage is provided with a memory liquid inlet, and the remaining second memory liquid passages are all provided with memory liquid outlets. One CPU cold plate is connected to the main liquid inlet, and one of the remaining CPU cold plates is connected to the memory liquid inlet.

[0054] In other embodiments of this invention, the number of bridging components can be adjusted according to the number of heating elements inside the chassis.

[0055] The above description is merely a preferred embodiment of this utility model. Any simple modifications, equivalent changes, and alterations made by those skilled in the art to the above embodiments without departing from the technical scope of this utility model and based on its technical essence shall still fall within the scope of this utility model.

Claims

1. An internal memory cold plate characterized by, The application relates to a memory cooling plate. The second memory liquid passage pipe is provided with at least two sections in a direction parallel to the first memory liquid passage pipe, the height of the second memory liquid passage pipe is lower than that of the first memory liquid passage pipe, a liquid inlet is arranged on one section of the second memory liquid passage pipe, and one liquid outlet is arranged on each of the remaining sections. A bridging piece is arranged between the first memory liquid passage pipe and each section of the second memory liquid passage pipe, the bridging piece comprises a third memory liquid passage pipe and a heat conducting piece, and a region between the corresponding bridging pieces of two adjacent sections of the second memory liquid passage pipe is used for placing a CPU cooling plate.

2. The memory cold plate of claim 1, wherein, The end of the third memory liquid passage pipe, which is in communication with one end of the second memory liquid passage pipe, is lower than other positions.

3. The memory cold plate of claim 1, wherein, The first memory liquid passage pipe, the second memory liquid passage pipe and the third memory liquid passage pipe are integrally arranged.

4. The memory cold plate of claim 1, wherein, The heat conducting piece is arranged in sections, and the material and thickness of each section of the heat conducting piece are different.

5. The memory cold plate of claim 1, wherein, A reinforcing beam is further arranged between the first memory liquid passage pipe and the second memory liquid passage pipe, and a connecting beam is arranged between two adjacent second memory liquid passage pipes.

6. The memory cold plate of claim 1, wherein, Connecting ears are further arranged on the first memory liquid passage pipe and the second memory liquid passage pipe, and the connecting ears are used for fixedly mounting the memory cooling plate.

7. A liquid cooling assembly, characterized by, The application further relates to a memory cooling plate as claimed in any one of claims 1-6, at least two CPU cooling plates connected in series through connecting pipes, The CPU cooling plate is arranged in the region between the corresponding bridging pieces of each section of the second memory liquid passage pipe. An inlet pipe comprises a total inlet pipe and a memory inlet pipe, the total inlet pipe is in communication with one CPU cooling plate, and two ends of the memory inlet pipe are in communication with any one of the remaining CPU cooling plates and the liquid inlet on the second memory liquid passage pipe respectively. An outlet pipe comprises a total outlet pipe and a memory outlet pipe, two ends of the memory outlet pipe are in communication with the memory outlet on the second memory liquid passage pipe and the total outlet pipe respectively, and the total outlet pipe is used for discharging condensed liquid.

8. The liquid-cooled assembly of claim 7, wherein, The CPU cooling plate is in floating connection with the first memory liquid passage pipe, and when a connecting beam is arranged between two adjacent second memory liquid passage pipes, the CPU cooling plate is in floating connection with the connecting beam.

9. The liquid-cooled assembly of claim 7, wherein, A metal cover is further arranged on the CPU cooling plate, and a mounting handle is detachably arranged on the metal cover.

10. The liquid-cooled assembly of claim 7, wherein, A multi-way joint is further arranged at a position where the outlet pipe is connected with the total outlet pipe, and quick joints are further arranged at the ends of the total inlet pipe and the total outlet pipe, which extend out of one end of the memory cooling plate.

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