An ACF adhesive film layer with an expanded hole

Abstract

The utility model discloses a kind of ACF adhesive film layers with expansion hole, it is related to ACF adhesive film layer technical field, including ACF adhesive film layer, the ACF adhesive film layer includes adhesive film layer ontology, multiple expansion holes are passed through and set on the adhesive film layer ontology, multiple conductive balls are fixedly arranged in the adhesive film layer ontology, the conductive ball is distributed in adhesive film layer ontology, between adjacent expansion holes, each group The outside of conductive ball is wrapped with conductive thermoplastic plastic.The utility model melts gradually when using, in the process of heat pressing and adhering, the conductive thermoplastic plastic on the surface of conductive ball, to adapt the contact surface between conductive ball and electrode, so that current can flow along conductive thermoplastic plastic and conductive ball, expand contact area, improve the performance of conduction.

Description

Technical Field

[0001] This utility model relates to the field of ACF film layer technology, specifically to an ACF film layer with expansion pores. Background Technology

[0002] Anisotropic conductive film (ACF) is a transparent polymer bonding material with adhesive, conductive, and insulating properties. Its key characteristic is the significant difference in resistivity between the Z-axis electrical conduction direction and the XY insulating plane, enabling vertical conduction while maintaining horizontal insulation. The application of ACF involves precisely placing the film between the electronic components to be connected, such as between an IC chip and a substrate. Through a thermo-pressing process, applying appropriate temperature and pressure, the conductive particles in the ACF film form tight contact with the electrodes of the electronic components, thus achieving a vertical conductive connection.

[0003] Chinese Patent No. CN215815227U discloses an ACF film layer and film structure with expansion holes. The ACF film layer has multiple sets of expansion holes inside, and conductive balls are distributed between adjacent expansion holes in the film layer body. This is used to quickly disperse and position the conductive balls in the film layer body. The film portion filled in the expansion holes can insulate and isolate the laterally adjacent conductive balls, effectively reducing the possibility of lateral conduction and increasing the safe conductive area.

[0004] The shortcomings of the existing technical solutions are as follows: In the existing technology, conductive balls are mostly designed into spherical or near-spherical shapes. However, during hot-press bonding, the contact area between this type of conductive ball and the corresponding electrode is relatively small, which often limits the current flow efficiency and thus affects the full utilization of the conductive ball's conductivity. Utility Model Content

[0005] The purpose of this invention is to provide an ACF adhesive film layer with expansion holes to solve the technical problem in the prior art where the contact area between the conductive ball and the corresponding electrode is relatively small during hot pressing, which often limits the current flow efficiency.

[0006] The technical problem to be solved by this utility model can be achieved through the following technical solution:

[0007] An ACF film layer with expansion holes includes an ACF film layer, the ACF film layer includes a film layer body, the film layer body has multiple sets of expansion holes through it, and multiple sets of conductive balls are fixedly disposed inside the film layer body. The conductive balls are distributed in the film layer body and between adjacent expansion holes, and each set of conductive balls is wrapped with conductive thermoplastic plastic.

[0008] As a further embodiment of this invention, the conductive sphere is a polygonal sphere.

[0009] As a further embodiment of this invention: the conductive ball is made of metal, and the electrothermal plastic includes carbon black-filled plastic.

[0010] As a further embodiment of this utility model: a top release film is adhered to the top of the adhesive film layer body, and a bottom release film is adhered to the bottom of the adhesive film layer body.

[0011] As a further embodiment of this utility model: the longitudinal section of the expansion hole is narrow at both ends and wide in the middle.

[0012] As a further embodiment of this utility model: multiple sets of expansion holes are arranged equidistantly in the horizontal direction, and the expansion holes in adjacent rows are staggered.

[0013] The beneficial effects of this utility model are:

[0014] When this invention is used, during the hot-press bonding process, the conductive thermoplastic on the surface of the conductive ball gradually melts, thereby adapting to the contact surface between the conductive ball and the electrode. This allows current to flow along the conductive thermoplastic and the conductive ball, expanding the contact area and improving conductivity. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings.

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the longitudinal section structure of the expansion hole of this utility model;

[0018] Figure 3 This is a schematic diagram of the overall longitudinal section structure of this utility model.

[0019] In the diagram: 1. Top release film; 2. ACF adhesive film layer; 201. Adhesive film layer body; 202. Expansion hole; 203. Conductive ball; 204. Conductive thermoplastic; 3. Bottom release film. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0021] like Figures 1-3 As shown, an ACF film layer with expansion holes includes an ACF film layer 2, which comprises a film layer body 201. Multiple sets of expansion holes 202 are formed through the film layer body 201. The longitudinal section of each expansion hole 202 is narrow at both ends and wide in the middle. The multiple sets of expansion holes 202 are arranged equidistantly laterally, and adjacent rows of expansion holes 202 are staggered to prevent the ACF film layer 2 from becoming laterally conductive. Multiple sets of conductive balls 203, made of metal, are fixedly disposed inside the film layer body 201. Conductive balls 203 are distributed within the adhesive film layer body 201 and between adjacent expansion holes 202. Each group of conductive balls 203 is wrapped with conductive thermoplastic plastic 204. The thermoplastic plastic includes carbon black-filled plastic. The carbon black-filled plastic needs to be made from a plastic resin with a low melting point, such as polyethylene (PE) or polypropylene (PP), and mixed with carbon black to form the filler plastic. This ensures that the carbon black-filled plastic will gradually melt when heated to 130-200°C. During the hot-press bonding process, the conductive thermoplastic plastic 204 on the surface of the conductive balls 203 will gradually melt, thereby adapting to the contact surface between the conductive balls 203 and the electrodes. This allows current to flow along the conductive thermoplastic plastic 204 and the conductive balls 203, expanding the contact area and improving conductivity.

[0022] To further improve conductivity, the conductive ball 203 is a polygonal sphere shape, so that the conductive ball 203 and the electrode have a certain contact surface during the hot-press bonding process. A top release film 1 is adhered to the top of the adhesive film layer body 201, and a bottom release film 3 is adhered to the bottom of the adhesive film layer body 201. The top release film 1 and the bottom release film 3 are responsible for protecting the adhesive areas on both sides of the adhesive film layer body 201, preventing external dust particles from contaminating both sides of the adhesive film layer body 201 before use.

[0023] To facilitate understanding of the embodiments of this solution by those skilled in the art, the working principle of the embodiments of this solution will now be explained in conjunction with specific application scenarios:

[0024] When using ACF adhesive film layer 2, first peel off the bottom release film 3 and the top release film 1 on the ACF adhesive film, and then precisely adhere the ACF adhesive film between electronic components, such as between an IC chip and a substrate. Through a hot-pressing process, appropriate temperature and pressure are applied to make the conductive balls 203 in the ACF adhesive film form a tight contact with the electrodes of the electronic components, thereby achieving a vertical conductive connection.

[0025] During the hot-press bonding process, the conductive thermoplastic 204 on the surface of the conductive ball 203 gradually melts, thereby adapting to the contact surface between the conductive ball 203 and the electrode, allowing current to flow along the conductive thermoplastic 204 and the conductive ball 203, expanding the contact area and improving the conductivity.

[0026] The above description provides a detailed account of one embodiment of the present invention. However, this description is merely a preferred embodiment and should not be construed as limiting the scope of the present invention. All equivalent variations and improvements made within the scope of the claims of the present invention should still fall within the patent coverage of the present invention.

Claims

1. An ACF adhesive film layer having an expanded hole, characterized by The application relates to an ACF film layer (2) comprising a film layer body (201) provided with a plurality of groups of expansion holes (202) and a plurality of groups of conductive balls (203) fixedly arranged in the film layer body (201), wherein the conductive balls (203) are wrapped with conductive thermoplastic plastic (204).

2. The ACF film layer having an expanded hole according to claim 1, wherein, The conductive balls (203) are polygonal spherical bodies.

3. The ACF film layer having an expanded hole according to claim 1, wherein, The conductive balls (203) are made of metal, and the conductive thermoplastic plastic comprises carbon black filled plastic.

4. The ACF film layer having an expanded hole according to claim 1, wherein, The film layer body (201) is adhered with a top release film (1) on the top and a bottom release film (3) on the bottom.

5. The ACF film layer having an expanded hole according to claim 1, wherein, The expansion holes (202) are in the shape of being narrow at both ends and wide in the middle in the longitudinal section.

6. The ACF film layer having an expanded hole according to claim 1, wherein, The plurality of groups of expansion holes (202) are arranged in the horizontal direction at equal intervals, and the upper and lower two adjacent rows of expansion holes (202) are staggered.

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