Antenna integrator

Abstract

An antenna integrator comprises a signal integration circuit module and a heat conduction layer body, wherein the signal integration circuit module is arranged on a shell and is in signal connection between a plurality of signal input ports and a plurality of signal output ports, and the heat conduction layer body is arranged on the signal integration circuit module. A circuit substrate of the signal integration circuit module is provided with an electric insulation layer, and a first copper foil layer and a second copper foil layer which are respectively arranged on two opposite side surfaces of the electric insulation layer and are electrically connected with each other. The heat conduction layer body is arranged on the first copper foil layer or the second copper foil layer in a stacked mode. Through the structural design that the electric insulation layer of the circuit substrate is thinned to 0.1 mm-1mm, the whole signal integration circuit module can control the characteristic performance of a high frequency band (such as 5.8 GHz) more easily.

Description

Technical Field

[0001] This utility model relates to a communication device, and more particularly to an antenna integrator. Background Technology

[0002] The main function of an antenna integrator is to allow multiple transmitters to share a single antenna. It can be used to integrate the signals of two transmitters into a single signal output, which can simplify the antenna assembly process and significantly reduce the problem of interactive modulation distortion of the transmitted signal. It is one of the essential devices in an antenna system.

[0003] The frequency band and stability of an antenna integrator are limited by the structural design of the circuit board containing the antenna circuitry and the level of electromagnetic interference within the housing. To improve the stability of high-frequency bands (e.g., 5.8 GHz), manufacturers are actively working to improve the structure of antenna integrators. Utility Model Content

[0004] The purpose of this invention is to provide an antenna integrator that can improve the stability of high-frequency bands.

[0005] The present invention relates to an antenna integrator, comprising a housing, a plurality of signal input ports and signal output ports installed in the housing, a signal integration circuit module disposed in the housing and signal connected between the signal input ports and the signal output ports, and a heat-conducting layer disposed in the signal integration circuit module.

[0006] Each of the signal input ports can be used to receive an input signal. Each of the signal output ports can be used to output an output signal. The signal integration circuit module can be used to integrate and process the input signals from the signal input ports into the output signal, and output it from the signal output port.

[0007] The signal integration circuit module includes a circuit board and a plurality of electronic components electrically connected to the circuit board and used to cooperate in integrating and processing the input signal. The circuit board has an electrically insulating layer and a first copper foil layer and a second copper foil layer respectively disposed on two opposite sides of the electrically insulating layer and electrically connected to each other. The thickness of the electrically insulating layer is between 0.1 mm and 1 mm. The electronic components are electrically connected to one of the first copper foil layer and the second copper foil layer. A thermally conductive layer is stacked on the other of the first copper foil layer and the second copper foil layer.

[0008] The antenna integrator of this invention has a heat-conducting layer that is an aluminum plate, a copper plate, or a ceramic sheet.

[0009] The antenna integrator of this invention further includes an electromagnetic wave absorbing element disposed in the housing and located between the housing and the signal integration circuit module.

[0010] The antenna integrator of this invention further includes a grounding component disposed outside the housing and electrically connected to the second copper foil layer.

[0011] The beneficial effect of this utility model is that by thinning the electrical insulation layer of the circuit board to 0.1mm to 1mm, the entire signal integration circuit module can more easily control the characteristics of the high-frequency band (e.g., 5.8GHz). Attached Figure Description

[0012] Other features and effects of this utility model will be clearly presented in the embodiments with reference to the accompanying drawings, wherein:

[0013] Figure 1 This is a perspective view illustrating the structure of one embodiment of the antenna integrator of this utility model;

[0014] Figure 2 This is a three-dimensional diagram illustrating the structure of this embodiment;

[0015] Figure 3 This is a side sectional view illustrating the structure of this embodiment;

[0016] Figure 4 This is a functional block diagram illustrating the architecture of this embodiment;

[0017] Figure 5 It is an incomplete side sectional view schematic diagram illustrating the layered structure of a signal integration circuit module in this embodiment. Detailed Implementation

[0018] See Figure 1 , Figure 2 , Figure 3 , Figure 4 One embodiment of the antenna integrator 200 of this utility model is suitable for signal connection between multiple transmitters (not shown) and a shared transmitting antenna (not shown), and can be used to integrate the signals of the transmitters and transmit them externally via the shared transmitting antenna. The transmitters can be, for example, but not limited to, UHF (Ultra High Frequency) transmitters.

[0019] The antenna integrator 200 includes a metal housing 3, multiple signal input ports 4 exposed on the outer surface of the housing 3 for signal connection to the transmitters respectively, a signal output port 5 exposed on the outer surface of the housing 3 for signal connection to the shared transmitting antenna, a signal integration circuit module 6 disposed in the housing 3 and signal-connected between the signal input port 4 and the signal output port 5, a heat-conducting layer 7 disposed in the signal integration circuit module 6, a grounding element 8 disposed outside the housing 3 and electrically connected to the signal integration circuit module 6, and an electromagnetic wave absorbing element 9 disposed in the housing 3 and between the housing 3 and the signal integration circuit module 6. Each signal input port 4 can be used to conduct input signals from the corresponding transmitter.

[0020] The signal integration circuit module 6 can be used to integrate the input signal from the signal input port 4 into an output signal, and transmit it to the shared transmitting antenna via the signal output port 5, whereby the shared transmitting antenna transmits it externally. In this embodiment, the signal integration circuit module 6 can be, for example, but not limited to, a passive integrator.

[0021] See Figure 5 The signal integration circuit module 6 includes a circuit board 61 and a plurality of electronic components 62 electrically connected to the circuit board 61. The electronic components 62 can cooperate with the circuit board 61 to integrate and process the input signal into the output signal. Since there are many circuit structures for integrating and processing the input signal into the output signal in the signal integration circuit module 6, and these are existing technologies and not the focus of this invention, they will not be described in detail.

[0022] See Figure 3 , Figure 4 , Figure 5 The circuit board 61 has an electrically insulating layer 611, and a first copper foil layer 612 and a second copper foil layer 613 stacked on opposite upper and lower sides of the electrically insulating layer 611 and electrically connected to each other. In implementation, the electrically insulating layer 611 has through holes (not shown), and conductive materials (not shown) that electrically connect the first copper foil layer 612 and the second copper foil layer 613 are arranged in the through holes. The thickness of the electrically insulating layer 611 is between 0.1 mm and 1 mm.

[0023] exist Figure 3 , Figure 5 In the illustrated embodiment, the electronic component 62 is electrically connected to the first copper foil layer 612. The second copper foil layer 613 is electrically connected to the grounding member 8 via a wire (not shown) for grounding.

[0024] The heat-conducting layer 7 is sheet-shaped and attached to the second copper foil layer 613, and can be used to dissipate the heat generated by the signal integration circuit module 6. The heat-conducting layer 7 is, for example, but not limited to, an aluminum plate, a copper plate, or a ceramic sheet.

[0025] It should be noted that in other embodiments, the electronic component 62 may also be electrically connected to the second copper foil layer 613, and the thermally conductive layer 7 may be attached to the first copper foil layer 612.

[0026] The electromagnetic wave absorber 9 is sheet-shaped and covers one side of the first copper foil layer 612 of the circuit board 61 between the housing 3 and the circuit board 61. It can absorb the electromagnetic waves radiated by the signal integration circuit module 6 and prevent the electromagnetic waves radiated by the signal integration circuit module 6 from being reflected in the housing 3, thereby causing the intermodulation characteristics of the signal integration circuit module 6 to deteriorate.

[0027] In summary, by thinning the electrical insulating layer 611 of the circuit board 61 to 0.1mm to 1mm, the entire signal integration circuit module 6 can more easily control the characteristics of the high-frequency band (e.g., 5.8GHz), and the heat generated by the electronic components 62 can be more easily transmitted through the second copper foil layer 613 to the heat-conducting layer 7, thereby achieving good heat dissipation. Furthermore, the heat-conducting layer 7 can be used as a support structure for the thin-film circuit board 61, thereby reinforcing the physical structural strength of the signal integration circuit module 6. Therefore, the purpose of this invention is indeed achieved.

[0028] The above description is merely an embodiment of this utility model and should not be construed as limiting the scope of this utility model. Any simple equivalent changes and modifications made in accordance with the claims and description of this utility model shall still fall within the scope of this utility model.

Claims

1. An antenna integrator comprising a housing, a plurality of signal input ports mounted to the housing, a signal output port mounted to the housing and operable to output an output signal, and a signal integration circuit module disposed in the housing and signal connected between the signal input ports and the signal output port, each of the signal input ports being operable to receive an input signal, characterized by: The antenna integrator further comprises a heat-conducting layer body disposed in the signal integration circuit module, the signal integration circuit module being capable of integrating the input signal from the signal input port into the output signal and outputting from the signal output port, the signal integration circuit module comprising a circuit substrate, and a plurality of electronic components electrically connected to the circuit substrate and used for cooperating to integrate the input signal, the circuit substrate having an electrically insulating layer, and a first copper foil layer and a second copper foil layer disposed on two opposite sides of the electrically insulating layer and electrically connected to each other, the electrically insulating layer having a thickness of 0.1mm-1mm, the electronic components being electrically connected to one of the first copper foil layer and the second copper foil layer, and the heat-conducting layer body being laminated to the other one of the first copper foil layer and the second copper foil layer.

2. The antenna integrator of claim 1, wherein: The heat-conducting layer body is an aluminum plate, a copper plate or a ceramic sheet.

3. The antenna integrator of claim 1, wherein: The antenna integrator further comprises an electromagnetic wave absorber disposed in the housing and between the housing and the signal integration circuit module.

4. The antenna integrator of claim 1, wherein: The antenna integrator further comprises a grounding member disposed outside the housing and electrically connected to the second copper foil layer.

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