Electronic device and vehicle

Abstract

The utility model discloses an electronic device and a vehicle, and relates to the technical field of electronic devices. According to the electronic device, good protection can be provided for the piezoelectric assembly, so that the reliability of the electronic device can be improved, and the working stability and accuracy of the electronic device can also be improved. The electronic device comprises a shell, a piezoelectric assembly and a first bonding piece. Wherein the shell is provided with a closed accommodating cavity; the piezoelectric component is fixed in the accommodating cavity; a first bonding piece is arranged between the piezoelectric assembly and the shell, and the piezoelectric assembly is bonded to the shell wall of the shell through the first bonding piece.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202423106562.2, filed on December 14, 2024, by PATEO Vehicle Connectivity Technology (Shanghai) Co., Ltd., entitled “An Electronic Device and Vehicle”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of electronic device technology, and more particularly to an electronic device and a vehicle. Background Technology

[0004] Piezoelectric ceramics are functional ceramic materials capable of converting mechanical energy and electrical energy into each other. In addition to piezoelectricity, piezoelectric ceramics also possess dielectric and elastic properties, and have been widely used in medical imaging, acoustic sensors, acoustic transducers, and ultrasonic motors. Piezoelectric ceramics are manufactured by utilizing the polarization caused by the relative displacement of the positive and negative charge centers within the material under mechanical stress, resulting in bound charges of opposite signs on the surfaces at both ends of the material. Piezoelectric ceramics also possess sensitive properties. Therefore, they can be used to manufacture ultrasonic transducers, underwater acoustic transducers, electroacoustic transducers, ceramic filters, and ceramic transformers.

[0005] Piezoelectric ceramics have a wide range of applications, but they share the common characteristics of ceramics, namely, low tensile and shear strength, which makes them brittle. This affects their use and the performance of devices made from them. Utility Model Content

[0006] One embodiment of this application provides an electronic device and a vehicle, wherein the electronic device includes a housing, a piezoelectric component, and a first adhesive member. The piezoelectric component is disposed within a closed accommodating cavity of the housing via the first adhesive member. This electronic device can provide good protection for the piezoelectric component, thereby improving the reliability of the electronic device and also improving the stability and accuracy of its operation.

[0007] Another embodiment of this application provides an electronic device and a vehicle, wherein the piezoelectric component can sense external vibrations and / or cause the components of the target device to be connected to the electronic device to vibrate, so that the electronic device can be used as an elastic wave sensor or a speaker component.

[0008] Another embodiment of this application provides an electronic device and a vehicle, wherein the same piezoelectric assembly includes at least two piezoelectric elements, and at least one of the structures, properties, and connection methods with the housing of the at least two piezoelectric elements is different, which can cause the piezoelectric assembly to generate vibrations of different frequencies and / or amplitudes, thereby driving the components of the target device to generate vibrations of different frequencies and / or amplitudes, and thus causing the components of the target device to emit sounds of different pitches.

[0009] Another embodiment of this application provides an electronic device and a vehicle, wherein a second adhesive is provided on the outside of the connecting wall of the housing, and the electronic device can be bonded to the target device by means of the second adhesive. This allows the connection area between the connecting wall of the housing and the target device to be as large as possible. In this way, during the vibration of the piezoelectric component, the sufficiency of vibration transmission to the target device can be improved, which is conducive to the vibration being transmitted to the target device as completely as possible. Alternatively, during the deformation of the connecting wall caused by the deformation of the target device, the deformation of the target device can be transmitted to the piezoelectric component as completely as possible, thereby improving the accuracy of the electronic device's operation.

[0010] Another embodiment of this application provides an electronic device and a vehicle, wherein a connecting wall of the housing is connected to a piezoelectric component on one side of its housing located within the cavity and to a target device on the other side of its housing located outside the cavity, thereby shortening the vibration transmission path between the piezoelectric component in the electronic device and the target device, which is beneficial to the vibration transmission between the piezoelectric component in the electronic device and the target device and improves the sensitivity of the electronic device.

[0011] Another embodiment of this application provides an electronic device and a vehicle, wherein a connector is provided on the housing, which can electrically connect the piezoelectric component to the connector. After the electronic device is installed on the target device, the electronic device can be electrically connected to the controller of the target device through the connector, which facilitates the electrical connection between the piezoelectric component and the controller.

[0012] Another embodiment of this application provides an electronic device and a vehicle, wherein a protective member is provided on the housing to surround the connector. During the process of electrically connecting the connector to the controller of the target device, the protective member can also be connected to a part in the target device that matches the protective member to block the opening of the protective member. Thus, the connector can be shielded and sealed by the protective member, thereby achieving waterproof and dustproof functions for the connector.

[0013] Another embodiment of this application provides an electronic device and vehicle, wherein a circuit board is disposed in a accommodating cavity, and a piezoelectric component can be electrically connected to the circuit board, and the circuit board can be electrically connected to a connector, thereby meeting the performance requirements of pull-out force and improving the safety and reliability of the electrical connection between the piezoelectric component and the connector.

[0014] Another embodiment of this application provides an electronic device and vehicle in which a piezoelectric component is electrically connected to a circuit board, and no other components are mounted on the circuit board. This allows the controller for controlling the piezoelectric component, signal processing circuits for processing the electrical signals generated by the piezoelectric component, etc., to be located outside the casing. This facilitates the design and modification of the controller, signal processing circuit, etc., according to the application environment of the electronic device, thereby improving the flexibility of the electronic device's application. Furthermore, compared to mounting the signal processing circuit, etc., outside the casing, avoiding the mounting of other components on the circuit board avoids the need for redundant protection circuits, thus saving costs.

[0015] Another embodiment of this application provides an electronic device and vehicle, wherein a controller electrically connected to a piezoelectric component is provided on a circuit board. The controller can control the piezoelectric component to generate vibration and / or process the electrical signals generated by the piezoelectric component. Furthermore, the controller is also housed within a sealed cavity, which also provides protection for the controller, thus eliminating the need for a separate protective casing or similar fixture.

[0016] Another embodiment of this application provides an electronic device and a vehicle, wherein a transmission circuit is provided between the controller and connector of the electronic device, which can control the transmission of data between the electronic device and the target device, thereby improving the data transmission rate between the electronic device and the target device and reducing the error rate during data transmission.

[0017] Another embodiment of this application provides an electronic device and vehicle, wherein a signal processing circuit electrically connected to a piezoelectric component is provided on a circuit board. The signal processing circuit can process the electrical signals generated by the piezoelectric component, thereby converting the electrical signals generated by the piezoelectric component into signals that can be received and recognized by a controller. At the same time, by placing both the piezoelectric component and the signal processing circuit inside a housing, electromagnetic shielding protection for circuits located outside the housing can be omitted, which is beneficial to improving anti-interference capability.

[0018] Another embodiment of this application provides an electronic device and vehicle, wherein a voltage regulator output circuit is provided for the signal processing circuit, which can supply power to the components in the signal processing circuit. Furthermore, the voltage regulator output circuit can precisely control the voltage applied to the signal processing circuit, which helps improve the accuracy of the voltage applied to the signal processing circuit, thereby improving the stability and reliability of the signal processing circuit's operation.

[0019] Another embodiment of this application provides an electronic device and a vehicle, wherein the circuit board is configured to include at least two sub-circuit boards. The presence of at least two sub-circuit boards increases the area of ​​the circuit board, allowing multiple circuits in the electronic device to be disposed on different sub-circuit boards. Furthermore, by stacking multiple sub-circuit boards at intervals within a receiving cavity, compared to configuring multiple sub-circuit boards as a single integrated circuit board, the dimensions of the electronic device in the closing direction perpendicular to the cover and the support member can be reduced. Moreover, the spacing between adjacent sub-circuit boards facilitates heat dissipation for the devices on the sub-circuit boards.

[0020] Another embodiment of this application provides an electronic device and vehicle, wherein the connecting component is configured as a conductive structure. While the first sub-circuit board and the second sub-circuit board are fixedly connected by the connecting component, the first sub-circuit board and the second sub-circuit board can also be electrically connected, which helps to save the wires and other materials used to make the electrical connection between the first sub-circuit board and the second sub-circuit board.

[0021] Another embodiment of this application provides an electronic device and a vehicle, wherein at least one of the cover and the carrier is provided with an abutment portion corresponding to the circuit board, which can press and fix the circuit board in the accommodating cavity; and can also transmit the external force on one of the cover and the carrier to the other through the abutment portion and the circuit board, thereby enabling the cover and the carrier to better resist deformation and breakage when subjected to external impact.

[0022] Another embodiment of this application provides an electronic device and a vehicle, wherein at least one of a cover and a carrier is provided with an abutment portion corresponding to a circuit board. After the cover is closed onto the opening of the carrier, the interiors of the cover and the carrier can abut against each other through the abutment portion, thereby allowing an external force on one of the cover and the carrier to be transmitted to the other through the abutment portion and the circuit board, thereby improving the ability of the cover and the carrier to resist deformation and breakage when subjected to external impact.

[0023] To achieve one or more of the above objectives, the electronic device provided in the first aspect of this application includes: a housing, a piezoelectric assembly, and a first adhesive member. The housing has a closed accommodating cavity; the piezoelectric assembly is fixed within the accommodating cavity; and the first adhesive member is disposed between the piezoelectric assembly and the housing, wherein the piezoelectric assembly is adhered to the housing wall via the first adhesive member.

[0024] The electronic device provided in this application, by incorporating a piezoelectric component within a housing cavity, can function as either a vibration-generating drive or a vibration-detecting sensor. Furthermore, the closed housing cavity provides a sealed protective environment for the piezoelectric component, reducing the impact of dust and water on it and minimizing the risk of damage from impacts, thus improving the device's reliability. Simultaneously, attaching the piezoelectric component to the housing wall via a first adhesive ensures a tight connection, allowing vibrations generated by the piezoelectric component to be transmitted to the housing as completely as possible; or allowing deformations of the housing to act on the piezoelectric component as completely as possible, thereby enhancing the stability and accuracy of the device's operation. Therefore, the electronic device provided in this application provides excellent protection for the piezoelectric component, thereby improving its reliability and operational stability and accuracy.

[0025] A second aspect of the embodiments of this application provides a vehicle, which includes a vehicle body and the aforementioned electronic devices. The vehicle body includes multiple body panels, multiple interior trim pieces, and vehicle components connected to the body panels and / or interior trim pieces; at least one of the body panels, interior trim pieces, and vehicle components is provided with electronic devices. Attached Figure Description

[0026] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0027] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0028] Figure 2 Schematic cross-sectional view of the electronic device provided in the embodiments of this application Figure 1 ;

[0029] Figure 3 This is a schematic diagram of the structure of the carrier in the electronic device provided in the embodiments of this application;

[0030] Figure 4 This is a schematic diagram of the structure of a piezoelectric component in an electronic device provided in an embodiment of this application;

[0031] Figure 5 Schematic cross-sectional view of the electronic device provided in the embodiments of this application Figure 2 ;

[0032] Figure 6 A schematic diagram of a circuit in an electronic device provided in an embodiment of this application;

[0033] Figure 7 Schematic cross-sectional view of the electronic device provided in the embodiments of this application Figure 3 .

[0034] Explanation of reference numerals in the attached figures:

[0035] 1-Bearing component; 11-Receiving groove; 12-Protruding ring; 13-Snap fastener; 14-Abutting part; 15-Fixing post; 16-Connecting wall; 2-Cover body; 21-Groove; 22-Slot; 3-Piezoelectric assembly; 31-Base; 32-Piezoelectric component; 4-First adhesive component; 5-Second adhesive component; 6-Connector; 7-Protective component; 8-Circuit board; 81-Connecting through hole; 82-Connecting circuit; 83-First sub-circuit board; 84-Second sub-circuit board; 85-Connecting assembly; 9-Receiving cavity; 101-Wire; 102-Controller; 103-Transmission circuit; 104-Signal processing circuit; 105-Regulated output circuit; Z-Covering direction. Detailed Implementation

[0036] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this application; the terms “comprising” and “having”, and any variations thereof, in the specification and the foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0038] In the description of the embodiments of this application, technical terms such as "first," "second," and "third" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0039] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0040] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects are in an "or" relationship.

[0041] In the description of the embodiments of this application, the technical terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed, operated or used in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0042] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0043] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical term "contact" should be interpreted broadly, and can be direct contact, contact through an intermediate medium layer, contact between two contacting parties with substantially no interaction force, or contact between two contacting parties with interaction force.

[0044] The piezoelectric effect includes the direct piezoelectric effect and the inverse piezoelectric effect. When certain dielectrics are deformed by an external force along a certain direction, polarization occurs within them, resulting in opposite charges appearing on their two opposing surfaces. When the external force is removed, they return to their uncharged state; this phenomenon is called the direct piezoelectric effect. When the direction of the force changes, the polarity of the charges also changes. Conversely, when an electric field is applied along the polarization direction of the dielectric, these dielectrics will also deform; when the electric field is removed, the deformation disappears; this phenomenon is called the inverse piezoelectric effect.

[0045] Piezoelectric ceramics are functional ceramic materials manufactured based on the piezoelectric effect, capable of converting mechanical energy and electrical energy into each other. Like other ceramics, piezoelectric ceramics are brittle and easily break upon impact, which affects their usability and the reliability of devices using them. Therefore, there is a need for electronic devices that can improve the reliability of those employing piezoelectric ceramics.

[0046] This application provides an electronic device, with reference to... Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Figure 2 Schematic cross-sectional view of the electronic device provided in the embodiments of this application Figure 1 , Figure 3 This is a schematic diagram of the structure of a carrier in an electronic device provided in an embodiment of this application. The electronic device includes: a housing, a piezoelectric component 3, and a first adhesive component 4. The housing has a closed accommodating cavity 9; the piezoelectric component 3 is disposed within the accommodating cavity 9; the first adhesive component 4 is disposed between the piezoelectric component 3 and the housing, and the piezoelectric component 3 is bonded to the wall of the housing through the first adhesive component 4.

[0047] In this embodiment, the housing is used to support and protect other components within the electronic device. For ease of manufacturing and assembly, the housing can be configured to include a support member 1 and a cover 2. For example... Figure 1 , Figure 2 and Figure 3 As shown, the support member 1 can be configured as an approximately cuboid structure, and an approximately cuboid groove can be provided inside the support member 1, which serves as a receiving groove 11. One side of the support member 1 has an opening communicating with the receiving groove 11, so that the support member 1 becomes a box-shaped structure with an opening, and the piezoelectric component 3 and other components in the electronic device can be installed in the receiving groove 11 through the opening. Alternatively, the support member 1 can be configured as an approximately flat plate structure, and other components in the electronic device can be stacked on one side surface of the flat support member 1.

[0048] In this embodiment, the shape of the cover 2 can be set according to the shape of the support member 1. For example, as Figure 1 and Figure 2As shown, when the carrier 1 is a box-shaped structure with an opening, the cover 2 is used to cover the opening of the carrier 1 to seal it. For example, the cover 2 can be sealed to the edge of the opening of the carrier 1 by means of interference fit, bonding, welding, etc., so that a sealed accommodating cavity 9 is formed by the cover 2 and the carrier 1. Alternatively, when the carrier 1 is an approximately flat structure, along the covering direction Z of the cover 2 and the carrier 1, the cover 2 can be configured to have a side wall with a relatively long side wall, and the outer diameter of the cover 2 can be set to be smaller than the outer diameter of the carrier 1. The side wall of the cover 2 can be connected to the surface of the flat carrier 1 perpendicular to the covering direction Z, such as by bonding or welding the side wall of the cover 2 to the surface of the carrier 1 perpendicular to the covering direction Z, so that the cover 2 covers the carrier 1, thereby forming a closed accommodating cavity 9 by the cover 2 and the carrier 1. The specific structure of the carrier 1 and the cover 2 is not limited in the embodiments of this application.

[0049] For example, a third adhesive (not shown in the figure) can be provided between the cover 2 and the carrier 1, and the cover 2 and the carrier 1 are sealed together by the third adhesive. For instance, a layer of the third adhesive can be applied to the edge of the opening of the carrier 1, and then the cover 2 can be placed over the opening of the carrier 1 to bond and fix the cover 2 and the carrier 1 together by the third adhesive, and to seal the gap between the cover 2 and the carrier 1 by the third adhesive. The third adhesive can be made of materials with adhesive properties such as epoxy resin or silicone sealant.

[0050] Another example, such as Figure 2 and Figure 3 As shown, one of the cover 2 and the carrier 1 is provided with a groove 21, and the other is provided with a protruding ring 12 that matches the groove 21, with at least a portion of the protruding ring 12 extending into the groove 21. For example, the protruding ring 12 can be provided at the edge of the opening on the carrier 1, so that the protruding ring 12 surrounds the opening. Correspondingly, the groove 21 that matches the protruding ring 12 can be provided on the cover 2, and the groove 21 can be set as an annular groove. Alternatively, the groove can be provided at the edge of the opening on the carrier 1, and the groove can be set as an annular groove. Correspondingly, the protruding ring that matches the groove 21 can be provided on the cover 2. In this way, when the cover 2 is closed on the opening of the carrier 1, the protruding ring 12 can be inserted entirely into the groove 21, or a portion of the protruding ring 12 can be inserted into the groove 21, so that the cover 2 and the carrier 1 are connected by the fit of the groove 21 and the protruding ring 12. The protruding ring 12 and the groove 21 can also be connected by an interference fit to achieve a seal between the cover 2 and the carrier 1.

[0051] In another example, at least a portion of the third adhesive can be located between the groove 21 and the protruding ring 12. That is, the third adhesive is filled into the groove 21, and then the cover 2 is placed over the opening of the support member 1, so that the gap between the protruding ring 12 and the groove 21 is filled with the third adhesive. In this way, the third adhesive can not only seal the gap between the protruding ring 12 and the groove 21, but also bond and fix the walls of the protruding ring 12 and the groove 21.

[0052] Another example, such as Figure 1 As shown, one of the cover 2 and the support member 1 is provided with a slot 22, and the other is provided with a buckle 13 that matches the slot 22. The buckle 13 cooperates with the slot 22 to restrict the relative movement of the cover 2 and the support member 1. For example, the slot 22 can be provided on the cover 2, and the slot 22 can be a through hole or a groove 21 formed on the edge of the cover 2. Correspondingly, the buckle 13 that matches the slot 22 can be provided on the outer wall of the support member 1, and the buckle 13 can be set as a protrusion that matches the slot 22. Alternatively, the groove 21 that serves as the slot 22 can be provided on the outer wall of the support member 1, and correspondingly, the protrusion that matches the groove 21 and serves as the buckle 13 can be provided on the cover 2. In this way, during the process of covering the cover 2 with the opening of the support member 1, the buckle 13 can be engaged in the slot 22, so that the movement of the cover 2 relative to the support member 1 can be restricted by the slot 22 and the buckle 13, and the third adhesive between the cover 2 and the support member 1 can be pressed tightly, which is beneficial to improving the adhesion between the cover 2 and the support member 1.

[0053] In the embodiments of this application, such as Figure 2 As shown, the piezoelectric component 3 can be fixedly disposed within the receiving cavity 9. The piezoelectric component 3 can be installed within the receiving cavity 9 by means of bonding, clamping, or other methods. In some embodiments, the piezoelectric component 3 can deform when a voltage is applied to it. In other embodiments, the piezoelectric component 3 can generate an electrical signal when an external force is applied to it, causing it to deform.

[0054] For example, a piezoelectric component 3 for generating vibration can be provided within the accommodating cavity 9. Alternatively, a piezoelectric component 3 for detecting vibration can also be provided within the accommodating cavity 9. Or, at least two piezoelectric components 3 can be provided simultaneously within the accommodating cavity 9, with at least one piezoelectric component 3 for generating vibration and at least another piezoelectric component 3 for detecting vibration. Alternatively, the same piezoelectric component 3 can be configured to both generate and detect vibration. The embodiments of this application do not limit the specific function and structure of the piezoelectric component 3.

[0055] In this embodiment, a first adhesive member 4 can be provided in the electronic device to bond and fix the piezoelectric component 3 within the accommodating cavity 9. For example, the first adhesive member 4 can be double-sided adhesive, which can bond the piezoelectric component 3 to the wall of the carrier 1 and place the piezoelectric component 3 within the accommodating cavity 9.

[0056] The electronic device provided in this application embodiment, because a piezoelectric component 3 is disposed within the housing cavity 9, can be used as a vibration-generating drive or a vibration-detecting sensor. Furthermore, by designing the housing cavity 9 as a closed cavity, a sealed protective environment is provided for the piezoelectric component 3, which helps reduce the impact of dust, water, etc., on the piezoelectric component 3 and also reduces the risk of damage from impacts, thus improving the reliability of the electronic device. Simultaneously, by bonding the piezoelectric component 3 to the housing wall using the first adhesive member 4, a tight connection between the piezoelectric component 3 and the housing is achieved, allowing the vibration generated by the piezoelectric component 3 to be transmitted to the housing as completely as possible; or allowing deformation of the housing to act on the piezoelectric component 3 as completely as possible, thereby improving the stability and accuracy of the electronic device's operation. Therefore, the electronic device provided in this application embodiment can provide good protection for the piezoelectric component 3, thereby improving the reliability, stability, and accuracy of the electronic device's operation.

[0057] In some possible embodiments of this application, reference is made to Figure 4 , Figure 4 This is a schematic diagram of the structure of a piezoelectric component in an electronic device provided in an embodiment of this application. The piezoelectric component 3 includes a substrate 31 and a piezoelectric element 32. The piezoelectric element 32 is attached to the substrate 31, and the substrate 31 is bonded to the shell wall of the outer casing.

[0058] In this embodiment, a substrate 31 and a piezoelectric element 32 can be provided in the piezoelectric assembly 3. The piezoelectric element 32 is provided on the substrate 31, and the shape of the substrate 31 can be set according to the shape of the piezoelectric element 32. The substrate 31 can be made of metal materials such as stainless steel and aluminum, or it can be made of rigid plastics such as polycarbonate (PC), polystyrene (PS), and polyformaldehyde (POM). This embodiment does not limit the specific material of the substrate 31. The substrate 31 can be set as a sheet structure. The piezoelectric element 32 can be made of lead zirconate titanate (PZT) piezoelectric ceramic sheet. The piezoelectric element 32 can be attached to the substrate 31. For example, the piezoelectric element 32 can be provided on one side surface of the substrate 31, or it can be provided on both opposite sides of the substrate 31.

[0059] For example, the substrate 31 can be bonded to the wall of the carrier 1. For instance, the area on the substrate 31 where the piezoelectric element 32 is not provided can be bonded to the wall of the carrier 1 to fix the substrate 31 to the wall, thereby fixing the piezoelectric assembly 3 to the shell wall of the housing.

[0060] In another example, the piezoelectric component 3 can be used as a driving device. That is, when a voltage is applied to the piezoelectric component 3, it can deform to drive the movement of other devices. Specifically, under the action of an applied electric field with the same or opposite polarization direction, the piezoelectric component 32 undergoes expansion and contraction deformation in the horizontal plane where the substrate 31 is located. At the same time, the substrate 31 is bonded to the wall of the support member 1, so that the two ends of the substrate 31 are fixed to the support member 1. This causes the substrate 31 to vibrate perpendicular to the horizontal plane, and then transmits the vibration to the support member 1 through the substrate 31, thereby causing the target device using the electronic device to vibrate and produce sound, etc.

[0061] In the above embodiments, since a base 31 is provided for the piezoelectric element 32, the piezoelectric component 3 can be fixed on the wall of the support member 1 through the base 31, and the deformation from the piezoelectric element 32 is carried by the base 31 to generate vibration, thereby transmitting the vibration to the support member 1, so that the target device has acoustic performance.

[0062] In some possible embodiments of this application, the orthographic projection of the piezoelectric element 32 onto the substrate 31 does not coincide with the bonding area between the substrate 31 and the wall.

[0063] In this embodiment, the area of ​​the substrate 31 can be set to be larger than the area of ​​the piezoelectric element 32. This way, after the piezoelectric element 32 is bonded to the substrate 31, there will still be an unused bonding area on the surface of the substrate 31 where the piezoelectric element 32 is located. Alternatively, if the piezoelectric element 32 is located on one side of the substrate 31 and not on the other side, the orthographic projection of the piezoelectric element 32 onto the other side of the substrate 31 where the piezoelectric element 32 is not located can not completely cover the other side of the substrate 31. The area on the other side of the substrate 31 not covered by the orthographic projection of the piezoelectric element 32 can be used as the bonding area. Then, the first adhesive 4 can be bonded to the bonding area on the substrate 31, so that the substrate 31 is bonded to the shell wall of the outer casing through the first adhesive 4. This ensures that the orthographic projection of the piezoelectric element 32 on the substrate 31 does not coincide with the bonding area of ​​the substrate 31 and the shell wall. In the above embodiments, since the orthographic projection of the piezoelectric element 32 on the substrate 31 does not coincide with the bonding area between the substrate 31 and the wall, the influence of the bonding area on the vibration (e.g., vibration amplitude) is reduced during the process of the piezoelectric element 32 generating vibration and driving the substrate 31 to vibrate, or during the process of the substrate 31 deforming with the deformation of the wall, thus reducing the impact on the sound characteristics of the mid-low frequencies.

[0064] In some other possible embodiments, the orthographic projection of the piezoelectric element 32 onto the substrate 31 coincides with the bonding area between the substrate 31 and the wall. This is beneficial for the acoustic performance of the piezoelectric assembly 3 in the mid-to-high frequencies.

[0065] In some possible embodiments of this application, the housing includes a connecting wall 16, and the piezoelectric assembly 3 is bonded to the side of the connecting wall 16 located within the accommodating cavity 9 by a first adhesive 4; the electronic device also includes a second adhesive 5, which is disposed on the side of the connecting wall 16 located outside the accommodating cavity 9, and the second adhesive 5 is used to bond the electronic device to the target device.

[0066] In this embodiment of the application, a second adhesive 5 can be provided in the electronic device to adhesively install the electronic device onto the target device.

[0067] For example, one wall of the housing can be used as the connecting wall 16, such as the wall of the box-shaped carrier 1 away from the opening of the receiving cavity 9. The piezoelectric assembly 3 can be bonded to the surface of the connecting wall 16 located inside the receiving cavity 9 using the first adhesive 4. The second adhesive 5 can be bonded to the surface of the connecting wall 16 located outside the receiving cavity 9, that is, the second adhesive 5 is located outside the carrier 1. For example, the second adhesive 5 can be double-sided adhesive.

[0068] In the above embodiments, since the piezoelectric component 3 and the second adhesive 5 are respectively disposed on opposite sides of the connecting wall 16 in the housing, when the electronic device is bonded to the target device by the second adhesive 5, the vibration transmission path between the piezoelectric component 3 in the electronic device and the target device can be shortened, which is beneficial to the vibration transmission between the piezoelectric component 3 in the electronic device and the target device and improves the sensitivity of the electronic device.

[0069] In some possible embodiments of this application, such as Figure 2 As shown, the area where the connecting wall 16 is bonded to the second adhesive 5 is greater than the area where the connecting wall 16 is bonded to the first adhesive 4.

[0070] In this embodiment, the opposing surfaces of the connecting wall 16 of the outer casing can be configured with different areas. For example, the area of ​​the surface of the connecting wall 16 outside the outer casing where the second adhesive 5 is disposed can be larger than the area of ​​the surface of the connecting wall 16 inside the outer casing where the first adhesive 4 is disposed.

[0071] For example, a portion of the surface of the connecting wall 16 located inside the housing can be used as the area for mounting the first adhesive 4, while other portions of the surface of the connecting wall 16 located inside the housing can be used as the area for mounting other devices, such as bases. The entire surface of the connecting wall 16 located outside the housing can be used as the surface for mounting the second adhesive 5. Alternatively, the connecting wall 16 can be extended (e.g., extending beyond the sidewall of the carrier 1 in a direction perpendicular to the Z-direction of the cover) so that the surface area of ​​the connecting wall 16 located outside the housing is larger than the surface area of ​​the connecting wall 16 located inside the housing. In this way, when the second adhesive 5 is mounted on the connecting wall 16, the second adhesive 5 can be a double-sided adhesive with a larger area, or the like.

[0072] In the above embodiments, since the surface area of ​​the connecting wall 16 outside the accommodating cavity 9 is greater than the surface area of ​​the connecting wall 16 inside the accommodating cavity 9, when the electronic device is bonded to the target device, the connection area between the connecting wall 16 and the target device can be increased. This allows the vibration generated by the piezoelectric component 3 to be transmitted to the target device more fully, or the deformation generated by the target device to be transmitted to the piezoelectric component 3 more completely, thereby improving the accuracy of the electronic device's operation.

[0073] In some possible embodiments of this application, such as Figure 2 and Figure 3 As shown, the electronic device also includes a connector 6 that extends through the housing from inside the cavity 9 to outside the cavity 9. The connector 6 is used for electrical connection with the controller of the target device.

[0074] In this embodiment of the application, a connector 6 can be provided in the electronic device to electrically connect the piezoelectric component 3 to the controller of the target device through the connector 6.

[0075] For example, connector 6 can be a metal pin that passes through the wall of carrier 1 or the wall of cover 2, so that part of the metal pin is outside the receiving cavity 9 and the other part is inside the receiving cavity 9. For example, both carrier 1 and cover 2 can be manufactured by injection molding. During injection molding, the metal pin can be placed in the mold to fix the metal pin in carrier 1 and / or cover 2.

[0076] In another example, the portion of the metal pin outside the receiving cavity 9 can be configured to facilitate insertion, so that the metal pin can be inserted into a socket that is electrically connected to the controller of the target device.

[0077] In another example, the portion of the metal pin located within the receiving cavity 9 can be electrically connected to the piezoelectric assembly 3. For instance, by extending the metal pin to a position close to the piezoelectric element 32 in the piezoelectric assembly 3, an elastic conductive element can be provided between the piezoelectric element 32 and the metal pin. One end of the elastic conductive element can be soldered to the piezoelectric element 32, and the other end can be soldered to the metal pin. Alternatively, the other end of the elastic conductive element can be wrapped around the metal pin before being soldered to it, so that the piezoelectric element 32 and the metal pin are electrically connected through the elastic conductive element.

[0078] Alternatively, a flexible connecting wire can be used, with one end soldered to the piezoelectric element 32 and the other end soldered to the metal pin. For example, the connecting wire can be wrapped around the metal pin multiple times before soldering, thus electrically connecting the piezoelectric component 3 and the connector 6 via the connecting wire. In this way, during the vibration of the piezoelectric component 3, the vibration can be absorbed and mitigated by the connecting wire or the elastic conductive element, and transmitted to the connector 6.

[0079] Alternatively, the metal pins can be extended to a position where they can abut against the piezoelectric element 32 and / or the base 31 in the piezoelectric assembly 3, so that both metal pins abut against the piezoelectric element 32, or one metal pin abuts against the piezoelectric element 32 and the other metal pin abuts against the base 31, thereby achieving an electrical connection between the metal pins and the piezoelectric assembly 3. The metal pins can also be soldered to the piezoelectric assembly 3. This allows the controller's electrical signals to be transmitted to the piezoelectric assembly 3 via the metal pins, or the electrical signals generated by the piezoelectric assembly 3 to be transmitted to the controller via the metal pins. The electrical connection method between the docking plug 6 and the piezoelectric assembly 3 in this embodiment is not limited.

[0080] In the above embodiment, since the connector 6 is provided on the housing, the piezoelectric component 3 can be connected to the portion of the connector 6 located within the accommodating cavity 9. After the electronic device is installed on the target device, the electronic device can be electrically connected to the controller of the target device through the connector 6, facilitating the electrical connection between the piezoelectric component 3 and the controller.

[0081] In some possible embodiments of this application, the housing has a protective member 7 that surrounds the portion of the connector 6 located outside the receiving cavity 9 around the periphery of the portion of the connector 6 located outside the receiving cavity 9.

[0082] In this embodiment of the application, a protective element 7 may be provided on the carrier 1 and / or the cover 2 to shield and protect the connector 6.

[0083] For example, the protective member 7 can be configured as an annular structure, surrounding the portion of the connector 6 located outside the receiving cavity 9. For instance, if the connector 6 is mounted on the carrier 1, the annular protective member 7 can extend from the carrier 1. Alternatively, if the connector 6 is mounted on the cover 2, the annular protective member 7 can extend from the cover 2. Or, a portion of the annular protective member 7 can extend from the cover 2, and another portion can extend from the carrier 1. Along the axial direction of the portion of the connector 6 located outside the receiving cavity 9, the length of the protective member 7 can be greater than the length of that portion.

[0084] In another example, the protective component 7 and the carrier component 1, as well as the protective component 7 and the cover 2, can be integrally injection molded, or they can be processed separately and then the protective component 7 is sealed and fixedly connected to the carrier component 1 and / or the cover 2. A snap-fit ​​structure can also be provided on the protective component 7, allowing it to snap into a socket in the target device during the electrical connection of the connector 6 to the controller of the target device.

[0085] In the above embodiments, since a protective member 7 is provided on the outer shell to surround the connector 6, during the process of electrically connecting the connector 6 to the controller of the target device, the protective member 7 can also be connected to a part in the target device that matches the protective member 7 to block the opening of the protective member 7. Thus, the connector 6 can be shielded and sealed by the protective member 7, thereby achieving the functions of waterproofing and dustproofing the connector 6.

[0086] In some possible embodiments of this application, such as Figure 2 As shown, the electronic device also includes a circuit board 8, which is disposed in the accommodating cavity 9. The piezoelectric component 3 is electrically connected to the circuit board 8 through a conductive element. The circuit board 8 is electrically connected to the portion of the connector 6 located in the accommodating cavity 9.

[0087] In this embodiment of the application, a circuit board 8 can be provided in an electronic device. For example, the circuit board 8 can be provided in a closed accommodating cavity 9.

[0088] In some implementations, no other components may be placed on the circuit board 8; only pads and traces for electrical connection with conductive elements may be provided on the circuit board. The conductive elements may be connecting wires or metal pins, etc. One end of the connecting wire may be soldered to the piezoelectric component 3, and the other end of the connecting wire may be soldered to a pad on the circuit board. Alternatively, one end of the metal pin may pass through a connection through-hole on the circuit board and be soldered to a pad on the circuit board, with the other end of the metal pin abutting against the piezoelectric component 3.

[0089] For example, the controller for controlling the piezoelectric component 3 and the signal processing circuit for processing the electrical signals generated by the piezoelectric component 3 can be located outside the housing. For instance, the controller and signal processing circuit can be located in the control system of the target device using the electronic device, or an independent control component can be located outside the housing, and the controller and signal processing circuit can be located in the independent control component. Different control components with different functions can be set according to different application scenarios of the electronic device, and then the control component is electrically connected to the connector 6 of the electronic device.

[0090] In some embodiments, the piezoelectric component 3 can be electrically connected to the circuit board 8 via flexible wires. The circuit board 8 can be electrically connected to the connector 6, for example, by soldering one end of the connector 6 located within the accommodating cavity 9 to the circuit board 8, or by electrically connecting the connector 6 to the circuit board 8 via wires, thereby electrically connecting the piezoelectric component 3 to the connector 6.

[0091] For example, such as Figure 2 As shown, a connection through-hole 81 can be provided on the circuit board 8 to partially match the portion of the connector 6 located within the receiving cavity 9. The circuit board 8 can be inserted into the connector 6 through the connection through-hole 81. A first pad can also be provided on the circuit board 8, and a second pad can be provided at the edge of the connection through-hole 81. The first pad and the second pad can be connected by a connection circuit 82, so that one end of the connection circuit 82 extends to the edge of the connection through-hole 81. The connector 6 can be soldered to the second pad to electrically connect the connection circuit 82 to the connector 6.

[0092] In another example, the piezoelectric element 32 in the piezoelectric assembly 3 can be electrically connected to the first pad using a flexible wire. One end of the wire is soldered to the piezoelectric element 32, and the other end is soldered to the first pad, thus electrically connecting the piezoelectric assembly 3 to the other end of the connecting circuit 82. For instance, a clearance notch can be provided at the edge of the circuit board 8, allowing the wire to extend from the piezoelectric element 32 through the clearance notch to the side of the circuit board 8 away from the piezoelectric element 32, before being soldered to the first pad. In this way, the soldering position of the wire to the first pad is on the surface of the circuit board 8. When soldering the wire and the first pad, the positions of the first pad and the wire can be easily determined using images captured by a camera, which helps improve the reliability of the soldering.

[0093] In the above embodiments, since a circuit board 8 is provided within the accommodating cavity 9, the piezoelectric component 3 can be electrically connected to the circuit board 8 via wires, and the circuit board 8 can then be electrically connected to the connector 6. This satisfies the performance requirements for the pull-out force of the wire connection, which is beneficial to improving the safety and reliability of the electrical connection between the piezoelectric component 3 and the connector 6. Furthermore, since no other components are provided on the circuit board 8, the controller for controlling the piezoelectric component 3 and the signal processing circuit for processing the electrical signals generated by the piezoelectric component 3 can be placed outside the housing. This facilitates the design and modification of the controller, signal processing circuit, etc., according to the application environment of the electronic device, which is beneficial to improving the flexibility of the electronic device application. At the same time, compared to placing the signal processing circuit, etc., outside the housing, not providing other components on the circuit board avoids the need for redundant protection circuits, which is beneficial to saving costs.

[0094] In some possible embodiments of this application, such as Figure 2 and Figure 3 As shown, at least one of the cover 2 and the carrier 1 is provided with an abutment portion 14. Along the covering direction Z of the cover 2 and the carrier 1, the abutment portion 14 extends to a position corresponding to the circuit board 8 and abuts against the circuit board 8 to restrict the movement of the circuit board 8 relative to the carrier 1.

[0095] In this embodiment, an abutment portion 14 may be provided on one of the cover 2 and the carrier 1, or an abutment portion 14 may be provided on both the cover 2 and the carrier 1, so that the circuit board 8 is fixed in the accommodating cavity 9 by applying force to the circuit board 8 through the abutment portion 14.

[0096] For example, along the closing direction Z of the cover 2 and the support member 1, a post serving as an abutment portion 14 can be provided inside the side wall of the cover 2, or a post serving as an abutment portion 14 can be provided inside the side wall of the support member 1. This allows the posts in the cover 2 and the support member 1 to correspond, and the gap between the corresponding posts on the cover 2 and the support member 1 is consistent with the thickness of the circuit board 8. Alternatively, along the closing direction Z of the cover 2 and the support member 1, if one side of the circuit board 8 abuts against the top of the cover 2 or the inner wall of the support member 1, an abutment portion 14 can be provided only on one side of the cover 2 or the support member 1 that does not abut against the other side of the circuit board 8. Alternatively, the side of the circuit board 8 closest to the cover 2 can abut against a protrusion forming a groove 21 on the cover 2, while an abutment portion 14 is provided on the support member 1. The circuit board 8 is then fixed by the abutment portion 14 on the support member 1 and the protrusion forming the groove 21 on the cover 2. In this way, after the cover 2 is placed over the opening of the support member 1, the abutment part 14 can be pressed against the circuit board 8 to press and fix the circuit board 8 in the accommodating cavity 9.

[0097] In another example, a fixing post 15 can be provided in the receiving cavity 9 of the carrier 1. Correspondingly, a through hole matching the fixing post 15 can be provided on the circuit board 8. The circuit board 8 can be inserted through the through hole onto the fixing post 15 so as to restrict the movement of the circuit board 8 in a direction perpendicular to the closing direction Z by the fixing post 15.

[0098] In the above embodiments, since at least one of the cover 2 and the support member 1 is provided with an abutment portion 14 corresponding to the circuit board 8, the circuit board 8 can be pressed and fixed in the accommodating cavity 9 by the abutment portion 14. Furthermore, the external force received by one of the cover 2 and the support member 1 can be transmitted to the other through the abutment portion 14 and the circuit board 8, thereby enabling the cover 2 and the support member 1 to better resist deformation and breakage when subjected to external impact.

[0099] In some possible embodiments of this application, reference is made to Figure 5 , Figure 5 Schematic cross-sectional view of the electronic device provided in the embodiments of this application Figure 2 At least one of the cover 2 and the support member 1 is provided with an abutment portion 14, which extends along the closing direction Z of the cover 2 and the support member 1. After the cover 2 is closed on the support member 1, the wall of the cover 2 or the wall of the support member 1 abuts against the abutment portion 14, or two corresponding abutment portions 14 abut against each other.

[0100] In this embodiment, the piezoelectric component 3 and the portion of the connector 6 located within the accommodating cavity 9 can be directly electrically connected via a wire. For example, an approximately U-shaped bend structure can be provided at one end of the connector 6 located within the accommodating cavity 9, and one end of the wire can be clamped and fixed within this U-shaped bend structure to electrically connect the wire to the connector 6. This eliminates the need for a separate circuit board 8 in the electronic device.

[0101] For example, along the closing direction Z of the cover 2 and the support member 1, a column serving as an abutment portion 14 can be provided inside the side wall of the cover 2, or a column serving as an abutment portion 14 can be provided inside the side wall of the support member 1, with the columns in the cover 2 and the support member 1 corresponding to each other. Alternatively, an abutment portion 14 can be provided inside the side wall of the support member 1, extending out of the receiving groove 11 along the closing direction Z, so that the abutment portion 14 on the support member 1 corresponds to the protrusion forming the groove 21 on the cover 2. Or, an abutment portion 14 can be provided on the side wall of the cover 2, extending into the receiving groove 11. In this way, after the cover 2 is placed over the opening of the support member 1, the corresponding abutting parts 14 can abut against each other, or the abutting part 14 on the cover 2 abuts against the bottom wall of the support member 1, or the abutting part 14 on the support member 1 abuts against the top of the cover 2, or abuts against the protrusion that forms the groove 21 on the cover 2.

[0102] In the above embodiments, since at least one of the cover 2 and the support member 1 is provided with an abutment portion 14 corresponding to the circuit board 8, after the cover 2 is closed over the opening of the support member 1, the interiors of the cover 2 and the support member 1 can abut against each other through the abutment portion 14. This allows the external force on one of the cover 2 and the support member 1 to be transmitted to the other through the abutment portion 14 and the circuit board 8, thereby improving the ability of the cover 2 and the support member 1 to resist deformation and breakage when subjected to external impact.

[0103] In some possible embodiments of this application, the electronic device includes one or more piezoelectric components 3; and / or, the shape of the piezoelectric component 3 includes at least one of the following: circular, rectangular, elliptical, irregular polygonal; and / or, the same piezoelectric component 3 includes at least two piezoelectric elements 32, and the at least two piezoelectric elements 32 are different in any of the following aspects: structure, properties, and connection method with the housing.

[0104] In this embodiment, a piezoelectric component 3 for generating vibration can be provided in the electronic device, which can then drive the components in the target device to vibrate and produce sound. Alternatively, a piezoelectric component 3 for detecting vibration can be provided in the electronic device, which can then detect the vibration generated by the components in the target device. Or, at least two piezoelectric components 3 for generating vibration or detecting vibration can be provided in the electronic device, or both piezoelectric components 3 for generating vibration and piezoelectric components 3 for detecting vibration can be provided simultaneously in the electronic device.

[0105] In this embodiment, the piezoelectric component 3 can be configured with different shapes. For example, both the piezoelectric sheet and the substrate 31 in the piezoelectric component 3 can be configured as circles, rectangles, squares, ellipses, and irregular polygons. Figure 4 As shown, the piezoelectric element 32 can be configured as an irregular hexagonal polygon, that is, one polarity of the piezoelectric element 32 is set as a rectangle with a larger area, and the other polarity of the piezoelectric element 32 is set as a rectangle with a smaller area, such that the smaller rectangle is adjacent to a corner of the larger rectangle. This application embodiment does not limit the specific shape of the piezoelectric component 3.

[0106] In this embodiment of the application, at least two piezoelectric elements 32 can be provided in the same piezoelectric component 3, and the performance of the at least two piezoelectric elements 32 can be different.

[0107] For example, the structures of the multiple piezoelectric elements 32 can be different. For instance, the number of stacked piezoelectric ceramic sheets in each piezoelectric element 32 can be different, or the area of ​​the orthographic projection of each piezoelectric element 32 onto the substrate 31 can be different.

[0108] Another example is that multiple piezoelectric elements 32 can have different properties. The properties of the piezoelectric element 32 include capacitance and dielectric constant. That is, multiple piezoelectric elements 32 can each be made of piezoelectric materials with different capacitance values, or they can each be made of piezoelectric materials with different dielectric constants.

[0109] In another example, multiple piezoelectric elements 32 can be connected to the connecting wall 16 of the housing in different ways. For instance, if the piezoelectric element 32 is provided on the side of the base 31 facing the connecting wall 16, the area of ​​the base 31 that does not have the piezoelectric element 32 can be bonded to the connecting wall 16, with a gap between the piezoelectric element 32 and the connecting wall 16. This gap can be greater than the amplitude of the piezoelectric assembly 3 along its thickness direction. If the piezoelectric element 32 is provided on the side of the base 31 facing the connecting wall 16, the surface of the piezoelectric element 32 away from the base 31 can also be fixedly connected to the connecting wall 16, such as by bonding the piezoelectric element 32 to the connecting wall 16.

[0110] In the above embodiments, since different numbers of piezoelectric components 3 are provided in the electronic device, the electronic device can function as a driving component capable of generating vibration or as a sensor capable of detecting vibration. Furthermore, by setting the piezoelectric components 3 to different shapes, a matching piezoelectric component 3 can be selected according to the shape or structure of the target device. Simultaneously, by making the structure, properties, and connection method with the housing of at least two piezoelectric elements 32 within the same piezoelectric component 3 different, the piezoelectric component 3 can generate vibrations of different frequencies and / or amplitudes, thereby driving the components of the target device to vibrate at different frequencies and / or frequencies, and consequently causing the components of the target device to emit sounds of different pitches.

[0111] In some possible embodiments of this application, reference is made to Figure 6 , Figure 6 This is a schematic diagram of the circuit in the electronic device provided in the embodiments of this application. The electronic device also includes a signal processing circuit 104, which is disposed on the circuit board 8. The piezoelectric component 3 and the connector 6 are electrically connected through the signal processing circuit 104, which is used to process the electrical signals generated by the piezoelectric component 3.

[0112] In this embodiment, a signal processing circuit 104 can be provided on the piezoelectric component 3 to process the electrical signal generated by the piezoelectric component 3 when it deforms. For example, the signal processing circuit 104 can be disposed on the circuit board 8 and electrically connected to the connector 6.

[0113] In this embodiment, the signal processing circuit 104 can be configured as a circuit with functions such as voltage division, voltage amplification and switching, so as to process the electrical signal generated by the piezoelectric component 3 through the signal processing circuit 104, so as to convert the electrical signal generated by the piezoelectric component 3 into an electrical signal that can be recognized and received by other devices.

[0114] For example, a voltage divider circuit can be set in the signal processing circuit 104, such as using a resistor divider to reduce or distribute the voltage generated by the piezoelectric component 3, thereby distributing different voltage levels generated by the piezoelectric component 3 to different circuits or devices. For instance, the voltage divider circuit can be set according to the sensitivity of the electronic device to vibration. The voltage divider circuit can control the magnitude of the voltage input from the piezoelectric component 3 to the signal processing circuit 104, thereby reducing the risk of circuit overload damage due to excessive voltage generated by the piezoelectric component 3.

[0115] In another example, an amplifier circuit can be provided in the signal processing circuit 104 to amplify the voltage signal generated by the piezoelectric component 3 to the required amplitude, so as to facilitate the processing and utilization of the voltage signal generated by the piezoelectric component 3.

[0116] In another example, a switching circuit can be provided in the signal processing circuit 104 to modulate the analog signal generated by the piezoelectric component 3 into a digital pulse signal by means of the switching circuit's ability to conduct or cut off.

[0117] In the above embodiments, since a signal processing circuit 104 electrically connected to the piezoelectric component 3 is provided on the circuit board 8, the electrical signal generated by the piezoelectric component 3 can be processed by the signal processing circuit 104, thereby converting the electrical signal generated by the piezoelectric component 3 into a signal that can be received and recognized by other devices or circuits. At the same time, by placing the piezoelectric component and the signal processing circuit 104 inside the housing, electromagnetic shielding protection for the circuits outside the housing can be omitted, which is beneficial to improving the anti-interference capability.

[0118] In some possible embodiments of this application, such as Figure 6 As shown, the electronic device also includes a voltage regulator output circuit 105, which is disposed on the circuit board 8 and is electrically connected to the signal processing circuit 104 to supply power to the signal processing circuit 104.

[0119] In this embodiment, a voltage regulator output circuit 105 can be provided for the signal processing circuit 104 to supply power to the signal processing circuit 104. For example, the voltage regulator output circuit 105 can be a low-dropout regulator (LDO), which can supply power to the components in the signal processing circuit 104. For example, the LDO circuit can convert 12V to 3.3V or 5V and then apply it to the switching transistors and other components in the signal processing circuit 104.

[0120] In the above embodiments, since a voltage regulator output circuit 105 is provided for the signal processing circuit 104, the components in the signal processing circuit 104 can be powered through the voltage regulator output circuit 105. Furthermore, the voltage applied to the signal processing circuit 104 can be precisely controlled using the voltage regulator output circuit 105, which helps improve the accuracy of the voltage applied to the signal processing circuit 104, thereby improving the stability and reliability of the signal processing circuit 104's operation.

[0121] In some possible embodiments of this application, such as Figure 6 As shown, the electronic device also includes a controller 102, which is disposed on the circuit board 8. The piezoelectric component 3 and the connector 6 are electrically connected through the controller 102. The controller 102 is used to control the piezoelectric component 3 to generate vibration and / or process the electrical signals generated by the piezoelectric component 3.

[0122] In this embodiment, a controller 102 can be provided in the electronic device to control the operation of devices such as the piezoelectric component 3 in the electronic device. The controller 102 can be a unit with computing functions, which can interpret computer instructions and process data in computer software. For example, the controller 102 may include a microcontroller unit (MCU), and the MCU can be fixed on the circuit board 8.

[0123] For example, the controller 102 can be electrically connected to the piezoelectric element 32 in the piezoelectric assembly 3 via a wire 101. For instance, the piezoelectric element 32 can be electrically connected to a pad on the circuit board 8, and then that pad can be electrically connected to the controller 102. In this way, a voltage signal can be applied to the piezoelectric element 32 by the controller 102, causing the piezoelectric assembly 3 to generate vibrations matching the voltage signal. Alternatively, when the piezoelectric element 3 deforms and generates an electrical signal, the controller 102 can generate a control command based on the electrical signal and send the control command to other devices in the electronic device, or upload the control command to a target device using the electronic device.

[0124] In another example, the signal processing circuit 104 can be disposed between the piezoelectric component 3 and the controller 102, so that the controller 102 and the piezoelectric component 3 are electrically connected through the signal processing circuit 104, so that the electrical signal generated by the piezoelectric component 3 is processed by the signal processing circuit 104 and then transmitted to the controller 102.

[0125] In the above embodiments, since a controller 102 is provided on the circuit board 8 in the electronic device, the piezoelectric component 3 can be controlled to vibrate through the controller 102, and / or the electrical signals generated by the piezoelectric component 3 can be processed through the controller 102. Furthermore, the controller 102 is also located within the enclosed cavity 9 of the housing, and the housing can also provide protection for the controller 102, thereby saving the need for a protective shell or similar fixture for the controller 102.

[0126] In some possible embodiments of this application, such as Figure 6 As shown, the electronic device also includes a transmission circuit 103, which is disposed on the circuit board 8. The controller 102 and the connector 6 are electrically connected through the transmission circuit 103. The transmission circuit 103 is used to control the transmission of control signals from the connector 6 to the controller 102.

[0127] In this embodiment, a transmission circuit 103 can be provided in the electronic device to control the control signals transmitted to the controller 102. For example, the transmission circuit 103 can be a Controller Area Network (CAN) bus. The transmission circuit 103 can be mounted on the circuit board 8, with one part of the transmission circuit 103 electrically connected to the connector 6 and the other part electrically connected to the controller 102. Thus, after the electronic device and the controller of the target device are electrically connected via the connector 6, data transmission between the controller of the target device and the controller 102 of the electronic device can be controlled via the transmission circuit 103.

[0128] For example, a signal processing circuit 104, a voltage regulator output circuit 105, a controller 102, and a transmission circuit 103 can be simultaneously provided in an electronic device. The signal processing circuit 104 can be electrically connected to the piezoelectric component 3, the controller 102 can be electrically connected to the signal processing circuit 104, the controller 102 and the connector 6 can be electrically connected through the transmission circuit 103, and the voltage regulator output circuit 105 can be electrically connected to the signal processing circuit 104.

[0129] In the above embodiments, since a transmission circuit 103 is provided between the controller 102 of the electronic device and the connector 6, the transmission control can transmit data between the electronic device and the target device, which is beneficial to improve the data transmission rate between the electronic device and the target device and reduce the error rate in the data transmission process.

[0130] In some possible embodiments of this application, reference is made to Figure 7 , Figure 7 Schematic cross-sectional view of the electronic device provided in the embodiments of this application Figure 3 The circuit board 8 includes at least two spaced-apart sub-circuit boards, with adjacent sub-circuit boards fixedly connected by a connecting component 85; at least two sub-circuit boards are provided with a controller 102, a transmission circuit 103, a signal processing circuit 104, and a voltage regulated output circuit 105; the piezoelectric component 3 is electrically connected to at least one of the sub-circuit boards.

[0131] In this embodiment, the structural shape and number of circuit boards 8 can be configured according to the space of the cavity 9 inside the outer shell. For example, along the closing direction Z of the cover 2 and the support member 1, when the cavity 9 is relatively deep, the circuit board 8 can be configured as a structure of multiple smaller sub-circuit boards, and the multiple sub-circuit boards can be arranged in the cavity 9 along the closing direction Z.

[0132] For example, multiple sub-circuit boards can be stacked at intervals along the Z-direction of the cover in the receiving cavity 9. Connecting components 85 can be provided for the multiple sub-circuit boards to securely connect them. For instance, the connecting components 85 can be matching studs and nuts, which can be made of non-conductive plastic. The studs can be passed sequentially through the multiple sub-circuit boards, with nuts on the studs. Each circuit board 8 has nuts on both opposite sides, allowing the circuit board 8 to be fixed to the studs by the two nuts, thus securing the multiple sub-circuit boards together. Along the stacking direction of the multiple sub-circuit boards, the abutment portions 14 on the cover 2 and the carrier 1 can be configured to match the thickness between the two outermost sub-circuit boards, clamping and fixing the two outermost sub-circuit boards through the abutment portions 14, thereby securing the multiple sub-circuit boards within the receiving cavity 9.

[0133] In another example, the controller 102, transmission circuit 103, signal processing circuit 104, and voltage regulator output circuit 105 in the electronic device can be respectively disposed on at least two sub-circuit boards, that is, at least one of the controller 102, transmission circuit 103, signal processing circuit 104, and voltage regulator output circuit 105 can be disposed on each sub-circuit board. For example, the signal processing circuit 104 and voltage regulator output circuit 105 can be disposed on one sub-circuit board, and the controller 102 and transmission circuit 103 can be disposed on another sub-circuit board. Two or three of the controller 102, transmission circuit 103, signal processing circuit 104, and voltage regulator output circuit 105 disposed on multiple sub-circuit boards can be electrically connected by wire 101. And the piezoelectric component 3 can be electrically connected to the controller 102 and / or the signal processing circuit 104.

[0134] In the above embodiments, by configuring the circuit board 8 as having at least two sub-circuit boards, the area of ​​the circuit board 8 can be increased, thereby allowing multiple circuits in the electronic device to be respectively placed on different sub-circuit boards. Furthermore, by stacking multiple sub-circuit boards at intervals within the accommodating cavity 9, compared to configuring multiple sub-circuit boards as a single circuit board 8, the size of the electronic device in the closing direction Z perpendicular to the cover 2 and the support member 1 can be reduced. Moreover, the spacing between adjacent sub-circuit boards facilitates heat dissipation for the devices on the sub-circuit boards.

[0135] In some possible embodiments of this application, such as Figure 7 As shown, the sub-circuit board includes a first sub-circuit board 83 and a second sub-circuit board 84; the connecting component 85 includes a connector and a support member. The first sub-circuit board 83 and the second sub-circuit board 84 are respectively provided with pads that match the connector. The connector is electrically connected to the corresponding pads on the first sub-circuit board 83 and the second sub-circuit board 84 to electrically connect the first sub-circuit board 83 and the second sub-circuit board 84; the support member is sleeved on the connector and is located between the first sub-circuit board 83 and the second sub-circuit board 84.

[0136] In this embodiment of the application, a first sub-circuit board 83 and a second sub-circuit board 84 can be provided in the electronic device. For example, the second sub-circuit board 84 can be provided close to the piezoelectric component 3, and the first sub-circuit board 83 can be provided on the side of the second sub-circuit board 84 away from the piezoelectric component 3.

[0137] For example, the signal processing circuit 104 can be disposed on the surface of the second sub-circuit board 84 away from the piezoelectric component 3. The regulated output circuit 105 can be disposed on the surface of the second sub-circuit board 84 close to the piezoelectric component 3. The transmission circuit 103 can be disposed on the surface of the first sub-circuit board 83 close to the second sub-circuit board 84, and the controller 102 can be disposed on the surface of the first sub-circuit board 83 away from the second sub-circuit board 84.

[0138] Alternatively, the controller 102 and the signal processing circuit 104 can both be disposed on the surface of the first sub-circuit board 83 away from the second sub-circuit board 84. Alternatively, the controller 102 and the signal processing circuit 104 can be disposed on the surfaces of the first sub-circuit board 83 and the second sub-circuit board 84 away from the piezoelectric component 3, respectively. This facilitates the electrical connection between the piezoelectric component 3 and the signal processing circuit 104 via the wire 101, or the electrical connection between the piezoelectric component 3 and the controller 102 via the wire 101. Furthermore, it facilitates the acquisition of images of the surfaces of the first sub-circuit board 83 and the second sub-circuit board 84 away from the piezoelectric component 3 using a camera or similar means. By recognizing these images, it is possible to detect whether the electrical connections between the wire 101 and the signal processing circuit 104, the wire 101 and the controller 102, and the signal processing circuit 104 and the controller 102, etc., meet the requirements.

[0139] Alternatively, the signal processing circuit 104, the voltage stabilizing output circuit 105, the transmission circuit 103, and the controller 102 may be distributed on the two surfaces of the first sub-circuit board 83 and the two surfaces of the second sub-circuit board 84 in other ways. This application embodiment does not limit this.

[0140] Another example, such as Figure 7 As shown, when the conductor 101 extends from the piezoelectric component 3 to the surface of the first sub-circuit board 83 or the second sub-circuit board 84 away from the piezoelectric component 3, a clearance notch can be provided at the edge of the first sub-circuit board 83 or the second sub-circuit board 84. This allows the conductor 101 to extend from the piezoelectric component 32 through the clearance notch at the edge of the first sub-circuit board 83 or the second sub-circuit board 84 to the side of the first sub-circuit board 83 or the second sub-circuit board 84 away from the piezoelectric component 32. Then, the conductor 101 is soldered to the pad on the first sub-circuit board 83 or the second sub-circuit board 84. In this way, the soldering position of the conductor 101 and the pad is located on the upper surface of the first sub-circuit board 83 or the second sub-circuit board 84. After soldering the conductor 101 and the pad, the position of the pad and the conductor 101 can be easily determined by the image captured by the camera, so as to determine whether the soldering of the conductor 101 and the pad meets the requirements, which helps to improve the reliability of the soldering of the conductor and the pad.

[0141] In another example, the connecting component 85 can be configured as a structure of matching connectors and supports to electrically connect and fix the first sub-circuit board 83 and the second sub-circuit board 84 through the connectors and supports. For example, the connector can be made of a conductive metal and can be configured as a column, while the support can be made of insulating materials such as plastic and can be configured as a cylindrical structure that can be fitted onto the connector. Correspondingly, pads matching the connectors can be provided on the first sub-circuit board 83 and the second sub-circuit board 84, respectively. These pads can be in the form of through holes, through which the connectors can pass and be soldered, thereby electrically connecting the first sub-circuit board 83 and the second sub-circuit board 84 through the connectors. Alternatively, through-hole pads can be provided on the first sub-circuit board 83. One end of the connector passes through the pad on the first sub-circuit board 83 and is soldered to the first sub-circuit board 83 for fixation. Components are placed on the second sub-circuit board 84 using surface mount technology (SMT), and the other end of the connector is fixedly connected to the component on the second sub-circuit board 84, thereby electrically connecting and fixing the connector to the second sub-circuit board 84. For example, two circuits (such as controller 102, signal processing circuit 104, transmission circuit 103, and two voltage regulator output circuits 105) on two opposite surfaces of the sub-circuit boards can be correspondingly set with the same through-hole pad. In this way, after the connector passes through the pad, the connector can be soldered to the corresponding two circuits to electrically connect two circuits located on opposite surfaces of the same sub-circuit board through the connector. Alternatively, two circuits on two sub-circuits can also be electrically connected through the connector. Before welding the connector to the two sub-circuit boards, a cylindrical support can be fitted onto the connector to fix the support onto the connector and position the connector between the first sub-circuit board 83 and the second sub-circuit board 84, so that the first sub-circuit board 83 and the second sub-circuit board 84 are supported by the connecting assembly 85 and a gap is provided between the first sub-circuit board 83 and the second sub-circuit board 84.

[0142] In another example, the connecting assembly 85 can be configured to include a matching plug and socket. For instance, the plug can be a cylindrical structure, and the socket has a mating hole that matches the cylindrical plug. Both the plug and socket can be made of a conductive material. The plug can be soldered to the first sub-circuit board 83, and the socket can be soldered to the corresponding position on the second sub-circuit board 84. Alternatively, the plug can be soldered to the second sub-circuit board 84, and the socket can be soldered to the corresponding position on the first sub-circuit board 83. In this way, the corresponding plug and socket can be plugged in to electrically connect the plug and socket, thereby fixing and electrically connecting the first sub-circuit board 83 and the second sub-circuit board 84. Furthermore, the plug can be located on the same surface of one sub-circuit board (the plug does not penetrate the sub-circuit board), and the socket can be located on the same surface of another sub-circuit board (the socket does not penetrate the sub-circuit board), thereby reducing the surface area occupied by the plug and socket on the sub-circuit board, thus allowing more area on the sub-circuit board for circuit arrangement.

[0143] Another example, such as Figure 7 As shown, both the first sub-circuit board 83 and the second sub-circuit board 84 can be provided with connection through holes 81 that match the connector 6. Both the first sub-circuit board 83 and the second sub-circuit board 84 can be passed through the connection through holes 81 onto the connector 6. For example, both the first sub-circuit board 83 and the second sub-circuit board 84 can be soldered to the connector 6, or one of the first sub-circuit board 83 and the second sub-circuit board 84 can be soldered to the connector 6 to electrically connect the first sub-circuit board 83 and / or the second sub-circuit board 84 to the connector 6.

[0144] In the above embodiments, since the connecting component 85 is configured to be conductive, while the first sub-circuit board 83 and the second sub-circuit board 84 are fixedly connected by the connecting component 85, the first sub-circuit board 83 and the second sub-circuit board 84 can also be electrically connected, which is beneficial to saving the wires 101 and the like for setting the electrical connection between the first sub-circuit board 83 and the second sub-circuit board 84.

[0145] In addition, this application also provides a vehicle, which includes: a vehicle body and electronic devices provided in any of the above embodiments. The vehicle body includes multiple body panels, multiple interior trim pieces, and vehicle components connected to the body panels and / or interior trim pieces; at least one of the body panels, interior trim pieces, and vehicle components is provided with electronic devices.

[0146] In some possible embodiments of this application, the electronic devices provided in the embodiments of this application can be installed on a vehicle. The term "vehicle" or other similar terms used in the embodiments of this application include motor vehicles in a broad sense: for example, passenger / freight vehicles including SUVs, sedans, buses, off-road vehicles, tractors, trucks, special vehicles, buses, trucks, and various commercial vehicles; watercraft including various boats and ships, and aircraft; and including hybrid vehicles, electric vehicles, hybrid electric vehicles, hydrogen-powered vehicles, and other alternative fuel vehicles (e.g., fuels derived from resources other than petroleum). The embodiments of this application do not limit the type and structure of the vehicle.

[0147] For example, a vehicle typically includes a frame, body, powertrain, and electrical system. The body and powertrain are both mounted on the frame, while the electrical system is mounted on both the body and frame. The body typically includes multiple body panels, multiple interior trim pieces, and multiple vehicle components. These body panels can be assembled to form the overall structure of the vehicle, such as a cabin or cargo compartment. Examples of body panels include doors, windows, hood, trunk lid, roof, front bumper, rear bumper, and fenders. Interior trim pieces are installed in the cabin and cargo compartment to enhance vehicle comfort and provide interfaces and equipment. Vehicle components are located within the cabin and cargo compartment and include seats, steering wheel, instrument panel, center console screen, armrest, and license plate.

[0148] In another example, electronic devices can be installed on at least one of the vehicle's body panels, interior trim, and vehicle components, i.e., the electronic devices can be fixed to the vehicle body by adhesive bonding. The electronic devices can be electrically connected to the vehicle's overall controller, i.e., connector 6 is plugged into the vehicle controller's socket, so that the vehicle controller applies a voltage signal to the electronic devices. This causes the piezoelectric element 32 in the electronic devices to vibrate in response to the voltage signal, thereby causing the body panels, interior trim, or vehicle components to vibrate and produce sound. Alternatively, during the deformation of the body panels, interior trim, or vehicle components due to vibration, the piezoelectric element 32 in the electronic devices can deform, causing the piezoelectric element 32 to generate an electrical signal, thereby detecting the vibration of the body panels, interior trim, or vehicle components.

[0149] The vehicle provided in this application embodiment has electronic devices installed on at least one of the body panels, interior trim, and vehicle components. Therefore, the electronic devices can drive the body panels, interior trim, or vehicle components in the vehicle body to vibrate, causing the vehicle to emit sound. Furthermore, the electronic devices can detect the vibrations of the body panels, interior trim, or vehicle components. This provides good protection for the piezoelectric component 3, thereby improving the reliability of the electronic devices and enhancing their operational stability and accuracy.

[0150] The above embodiments are merely illustrative of the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and all should be covered within the scope of the specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way.

Claims

1. An electronic device, characterized by comprising: The electronic device comprises: a housing having a closed accommodating cavity; a piezoelectric assembly arranged in the accommodating cavity; a first adhesive arranged between the piezoelectric assembly and the housing, the piezoelectric assembly being adhered to the housing wall through the first adhesive.

2. Electronic device according to claim 1, wherein, The piezoelectric assembly comprises a base and a piezoelectric element adhered to the base, the base being adhered to the housing wall.

3. The electronic device of claim 2, wherein, The piezoelectric element does not overlap the adhering area of the base and the housing wall in the orthographic projection of the base.

4. The electronic device of claim 1, wherein, The housing comprises a connecting wall, the piezoelectric assembly being adhered to one side of the connecting wall in the accommodating cavity through the first adhesive; The electronic device further comprises a second adhesive arranged on the other side of the connecting wall outside the accommodating cavity, the second adhesive being used to adhere the electronic device to a target device.

5. The electronic device of claim 4, wherein, The area of the connecting wall adhered to the second adhesive is greater than the area of the connecting wall adhered to the first adhesive.

6. The electronic device of claim 1, wherein, The electronic device further comprises a connector extending through the housing from the accommodating cavity to the outside, the connector being used to electrically connect with a controller of a target device.

7. The electronic device of claim 6, wherein, The piezoelectric assembly is electrically connected with the part of the connector in the accommodating cavity.

8. The electronic device of claim 6, wherein, The housing has a protective member thereon, the protective member surrounding the part of the connector outside the accommodating cavity.

9. The electronic device of claim 6, wherein, The electronic device further comprises a circuit board arranged in the accommodating cavity, the piezoelectric assembly being electrically connected with the circuit board through a conductive element, the circuit board being electrically connected with the part of the connector in the accommodating cavity.

10. The electronic device of claim 9, wherein, The circuit board has a connecting through hole matched with the connector, the circuit board being arranged on the connector through the connecting through hole; the circuit board has a connecting circuit, one end of the connecting circuit extending to the edge of the connecting through hole and being electrically connected with the connector, the piezoelectric assembly being electrically connected with the other end of the connecting circuit.

11. Electronic device according to claim 9 or 10, wherein The housing comprises a bearing member and a cover, the cover being closed on the bearing member to form the accommodating cavity with the bearing member; at least one of the cover and the bearing member is provided with an abutting portion, the abutting portion extending to a position corresponding to the circuit board in the closing direction of the cover and the bearing member and abutting against the circuit board to limit the movement of the circuit board relative to the bearing member.

12. The electronic device of claim 9, wherein, The electronic device further comprises a controller arranged on the circuit board, the piezoelectric assembly and the connector being electrically connected through the controller, the controller being used to control the piezoelectric assembly to generate vibration and / or process the electric signal generated by the piezoelectric assembly.

13. The electronic device of claim 12, wherein, The electronic device further comprises a transmission circuit arranged on the circuit board, the controller and the connector being electrically connected through the transmission circuit, the transmission circuit being used to control the transmission of the control signal transmitted from the connector to the controller.

14. The electronic device of claim 9, wherein, The electronic device further comprises a signal processing circuit arranged on the circuit board, the piezoelectric assembly and the connector are electrically connected through the signal processing circuit, and the signal processing circuit is configured to process the electrical signal generated by the piezoelectric assembly.

15. The electronic device of claim 14, wherein, The electronic device further comprises a voltage stabilizing output circuit arranged on the circuit board, the voltage stabilizing output circuit is electrically connected with the signal processing circuit, and the voltage stabilizing output circuit is configured to supply power to the signal processing circuit.

16. Electronic device according to any one of claims 12 to 15, wherein, The circuit board comprises at least two spaced and stacked sub-circuit boards, and adjacent two of the sub-circuit boards are fixedly connected through a connecting assembly; the at least two sub-circuit boards are provided with a controller, a transmission circuit, a signal processing circuit and a voltage stabilizing output circuit; and the piezoelectric assembly is electrically connected with at least one of the sub-circuit boards.

17. The electronic device of claim 16, wherein, The sub-circuit boards comprise a first sub-circuit board and a second sub-circuit board; the connecting assembly comprises a connecting piece and a supporting piece, and the first sub-circuit board and the second sub-circuit board are respectively provided with pads matched with the connecting piece; the connecting piece is electrically connected with the corresponding pads on the first sub-circuit board and the second sub-circuit board, so as to electrically connect the first sub-circuit board and the second sub-circuit board; and the supporting piece is sleeved on the connecting piece and located between the first sub-circuit board and the second sub-circuit board.

18. The electronic device of claim 16, wherein, The sub-circuit boards comprise a first sub-circuit board and a second sub-circuit board; the connecting assembly comprises a plug and a socket matched with each other, the plug is electrically connected on one of the first sub-circuit board and the second sub-circuit board, the socket is electrically connected on the other of the first sub-circuit board and the second sub-circuit board, and the plug and the socket are plugged to electrically connect the first sub-circuit board and the second sub-circuit board.

19. An electronic device according to any one of claims 1 to 10, wherein, In the case that a voltage is applied to the piezoelectric assembly, the piezoelectric assembly can generate deformation, and / or in the case that the piezoelectric assembly is deformed by an external force, the piezoelectric assembly can generate an electrical signal.

20. An electronic device according to any one of claims 1 to 10, wherein, The electronic device comprises one or more piezoelectric assemblies; And / or, the shape of the piezoelectric assembly comprises at least one of the following: a circle, a rectangle, an ellipse, an irregular polygon; And / or, the same piezoelectric assembly comprises at least two piezoelectric pieces, and at least two of the piezoelectric pieces are different in any one of the following aspects: structure, attribute, and connection mode with the shell.

21. Electronic device according to any one of claims 1 to 10, wherein, The shell comprises a bearing piece and a cover, the cover covers the bearing piece, and the cover and the bearing piece enclose the accommodation cavity.

22. The electronic device of claim 21, wherein, A third adhesive is arranged between the cover and the bearing piece, and the cover and the bearing piece are sealingly connected through the third adhesive.

23. The electronic device of claim 22, wherein, One of the cover and the bearing piece is provided with a groove, and the other is provided with a convex ring matched with the groove, at least a part of the convex ring extends into the groove, and at least a part of the third adhesive is located between the groove and the convex ring.

24. The electronic device of claim 21, wherein, One of the cover and the bearing piece is provided with a clamping groove, and the other is provided with a clamping buckle matched with the clamping groove, the clamping buckle is matched with the clamping groove to limit the relative movement of the cover and the bearing piece.

25. The electronic device of claim 21, wherein, At least one of the cover and the carrier is provided with an abutting portion extending along a closing direction of the cover and the carrier, and after the cover is closed on the carrier, the wall of the cover or the wall of the carrier abuts against the abutting portion, or two corresponding abutting portions abut against each other.

26. A vehicle characterized by Comprise: a vehicle body comprising a plurality of vehicle body panels, a plurality of interior trim pieces, and a vehicle component connected to the vehicle body panels and / or the interior trim pieces; the electronic device of any one of claims 1 to 25, the electronic device being provided on at least one of the vehicle body panels, the interior trim pieces, and the vehicle component.

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