Flat plate type ejector pin demolding mechanism

Abstract

The utility model relates to the technical field of chip demolding, in particular to a flat plate type ejector pin demolding mechanism, which comprises an ejector pin flat plate, a jig and an air pipe joint, the ejector pin flat plate and the top end of the jig define a negative pressure cavity, and the ejector pin flat plate and the jig are detachably connected through the negative pressure cavity. The air pipe joint is arranged on the jig; wherein a plurality of ejector pins are arranged at the top end of the ejector pin flat plate in an array; a plurality of adsorption holes are formed in the top end of the ejector pin flat plate; and the air pipe joint, the negative pressure cavity and the adsorption hole are sequentially communicated. And the jig and the ejector pin flat plate are quickly disassembled and assembled in a negative pressure adsorption manner, so that the line changing time is greatly shortened. The blue film above the adsorption holes is adsorbed through negative pressure, and the adsorption force enables the blue film to move downwards. And meanwhile, the blue film can be effectively punctured through the pointed end structure of the ejector pin, and the downward movement smoothness of the blue film is improved. And the chips are limited by a plurality of ejector pins, so that efficient separation of the plurality of chips and the blue film is finally realized.

Description

Technical Field

[0001] This utility model relates to the field of chip stripping technology, specifically to a flat-plate ejector pin stripping mechanism. Background Technology

[0002] Chips are typically adhered to a blue film, therefore, chip removal is required before assembly. Existing removal equipment includes UV LED debonding machines and ejector pin removal devices. Regarding ejector pin removal devices, patent publication number CN216957989U discloses a separation mechanism for separating chips and films; see its background section for details. Figure 1 The blue film is adsorbed onto the top of the ejector cap by vacuum adsorption. The ejector pin extends upward from the inside of the ejector cap to break through the blue film and lift the chip, ultimately achieving separation of the chip and the blue film.

[0003] The method of directly lifting the chip with a single ejector pin has two drawbacks. First, the force area of ​​a single ejector pin is relatively small, making it easier to damage the chip during the lifting process. Second, when changing product models, the ejector pin needs to be re-aligned with the ejector pin hole on the ejector pin cap with high precision, which takes a long time to change the line.

[0004] Secondly, this patent avoids the technical problems of chip damage caused by ejector pins and long reflow times by eliminating ejector pins and adding protrusions for chip removal. However, a single blue film typically contains multiple chips. When the blue film is partially sucked into the stripping holes, it is difficult to ensure that the negative pressure is equal throughout the cavity during vacuum pump operation. This results in unequal suction forces at the stripping holes below the chips, causing a shift in the position of the entire blue film. Consequently, some chips are no longer directly above their corresponding stripping holes, making it difficult to guarantee a successful removal. Furthermore, using multiple stripping holes does not achieve complete chip and blue film removal, as the blue film area directly above the protruding structure remains adhered to the chip, resulting in poor removal performance. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a flat plate ejector pin demolding mechanism, which solves the technical problem of poor demolding effect of existing ejector pin demolding equipment.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the flat plate ejector plate demolding mechanism of this utility model includes an ejector plate, a fixture, and an air pipe connector.

[0009] The ejector plate and the top of the fixture form a negative pressure cavity, and the two are detachably connected through the negative pressure cavity.

[0010] The endotracheal connector is mounted on the fixture;

[0011] The top of the ejector plate is arrayed with multiple ejector pins; the top of the ejector plate is provided with multiple adsorption holes; the tracheal connector, the negative pressure cavity and the adsorption holes are connected in sequence.

[0012] Optionally, a stepped groove is formed on the inner wall of the fixture;

[0013] The bottom end of the ejector plate is provided with a stepped block; the stepped block is fitted into the stepped groove.

[0014] Optionally, the fixture is provided with a heater.

[0015] Optionally, a thermistor is provided inside the negative pressure cavity.

[0016] Optionally, the bottom end of the fixture is provided with a heat insulation element.

[0017] Optionally, the flat-plate ejector pin demolding mechanism further includes a connecting block and a wafer chuck;

[0018] The wafer chuck has the connecting block built into it;

[0019] The connecting block is embedded in the bottom end of the fixture, and the two form a heat-insulating cavity;

[0020] The heat insulation component is disposed within the heat insulation cavity.

[0021] Optionally, the flat-plate ejector pin demolding mechanism further includes a carrier plate, a rotary driver, and a conveyor belt;

[0022] The rotary drive is mounted on the carrier plate;

[0023] The wafer chuck is rotatably connected to the carrier plate;

[0024] The conveyor belt is wound around the side of the wafer chuck and the shaft of the rotary drive.

[0025] Optionally, a roller is rotatably connected to the carrier plate;

[0026] The roller is slidably connected to the outer wall of the conveyor belt; and the roller presses to tighten the conveyor belt.

[0027] (III) Beneficial Effects

[0028] The beneficial effects of this utility model are:

[0029] The top of the ejector plate is arrayed with multiple ejector pins. These pins increase the surface area on the chip that receives force, effectively preventing damage to the chip. The ejector pins can directly puncture the blue film, which is then adsorbed onto the bottom of the ejector pin, i.e., the top surface of the ejector plate. The blue film is completely separated from the chip, facilitating chip removal in the next process.

[0030] The ejector plate and the fixture are detachably connected through a negative pressure cavity. That is, the fixture can be quickly assembled and disassembled with the ejector plate by negative pressure adsorption. Different models of ejector plates can be installed according to the size of the chip to be processed, which greatly shortens the line change time.

[0031] The endotracheal connector, negative pressure cavity, and adsorption pore are sequentially connected. Negative pressure adsorbs the blue membrane above the adsorption pore, and the adsorption force causes the blue membrane to move downwards. Simultaneously, the pointed structure of the ejector pins effectively punctures the blue membrane, improving its downward movement. Multiple ejector pins then limit the chips, ultimately achieving efficient separation of multiple chips from the blue membrane. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the flat plate ejector pin demolding mechanism of this utility model;

[0033] Figure 2 This is an exploded view of the flat-plate ejector pin demolding mechanism of this utility model;

[0034] Figure 3 This is a schematic diagram of the structure of the ejector plate of this utility model.

[0035] [Explanation of Labels in the Attached Image]

[0036] 1: Ejector plate; 2: Air pipe connector; 3: Fixture; 31: Stepped groove; 4: Conveyor belt; 5: Carrier plate; 6: Wafer chuck; 7: Connecting block; 8: Rotary driver; 9: Heat insulation component; 10: Roller. Detailed Implementation

[0037] To better explain and facilitate understanding of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0039] Furthermore, in this utility model, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; "connection" can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0041] See Figure 1 This utility model provides a flat plate ejector plate demolding mechanism, which includes an ejector plate 1, a fixture 3, and an air pipe connector 2; the top ends of the ejector plate 1 and the fixture 3 form a negative pressure cavity, and the two are detachably connected through the negative pressure cavity; the air pipe connector 2 is disposed on the fixture 3; wherein, the top end of the ejector plate 1 is arranged with multiple ejector pins; multiple adsorption holes are opened on the top end of the ejector plate 1; the air pipe connector 2, the negative pressure cavity, and the adsorption holes are connected in sequence.

[0042] A thimble can be a single needle, or it can be like... Figure 3 The teeth shown are sufficient to allow the ejector pin to support the chip and puncture the blue film. The air tube connector 2 connects to an external vacuum pump. Before separating the chip and the blue film, place the iron ring or mother-daughter ring on the ejector pin plate 1; the iron ring or mother-daughter ring serves as a carrier for the chip.

[0043] The top of the ejector plate 1 is arrayed with multiple ejector pins. These multiple pins increase the force-bearing surface of the chip, effectively preventing the ejector pins from damaging the chip. The ejector pins can directly puncture the blue film, which is then adsorbed onto the bottom of the ejector pin, i.e., the top surface of the ejector plate 1. The blue film is completely separated from the chip, facilitating chip removal in the next process.

[0044] The ejector plate 1 and fixture 3 are detachably connected via a negative pressure cavity. This means the fixture 3 can be quickly assembled and disassembled with the ejector plate 1 using negative pressure adsorption. Different models of ejector plates 1 can be installed according to the size of the chips to be processed, significantly reducing line changeover time. Specifically, the height, width, and other dimensions of the multiple ejector pins on different models of ejector plates 1 can be set as needed, achieving compatibility of the plate-type ejector plate demolding mechanism for demolding multiple products. In actual production, the corresponding model of ejector plate 1 can be selected for processing based on the model of the chip to be processed, enabling rapid line changeover.

[0045] The air tube connector 2, negative pressure cavity, and adsorption orifice are sequentially connected. Negative pressure adsorbs the blue film above the adsorption orifice, causing the blue film to move downwards. Simultaneously, the pointed structure of the ejector pin effectively punctures the blue film, improving its downward movement. Multiple ejector pins limit the chip's position, ultimately achieving efficient separation of multiple chips from the blue film. It should be noted that even if the suction force of each adsorption orifice is unequal, once the ejector pin punctures the blue film, the film in that area is depressurized, effectively preventing misalignment of the blue film and thus avoiding chip displacement. This prevents the ejector pin from damaging misaligned chips, improving the reliability of the equipment.

[0046] See Figure 2 The fixture 3 has a stepped groove 31 on its inner wall; the bottom end of the ejector plate 1 has a stepped block; the stepped block fits into the stepped groove 31. The stepped groove 31 and the stepped block cooperate through a fitting connection, enabling the fixture 3 to support and limit the ejector plate 1, while reserving a negative pressure cavity and realizing quick assembly and disassembly of the fixture 3 and the ejector plate 1. In this embodiment, the projection surface of the ejector plate 1 in the horizontal plane is located inside the projection surface of the fixture 3, that is, the fixture 3 can limit the horizontal displacement and vertical downward displacement of the ejector plate 1. Then, the connection strength between the ejector plate 1 and the fixture 3 is improved by negative pressure adsorption, ensuring that the two do not shift when the negative pressure is turned on when using the stepped quick assembly and disassembly structure, thereby ensuring that the position of the chip before and after separation from the blue film remains unchanged, effectively protecting the chip.

[0047] Furthermore, a heater is provided on fixture 3. The heater can be a heating rod or a heating plate. The heater can be placed in the negative pressure cavity or built into fixture 3. The heater conducts heat to the blue film through thermal conduction, heating the blue film and weakening the adhesive of the bonding agent, thereby making it easier for the chip and the blue film to be separated by negative pressure.

[0048] Secondly, a thermistor is installed inside the negative pressure cavity. The thermistor is used to monitor the temperature of the blue film, enabling precise control of the heating temperature by the heater, thus achieving the effect of demolding without damaging the chip.

[0049] In addition, a heat insulation element 9 is provided at the bottom of the fixture 3. The heat insulation element 9 can be a heat insulation pad made of materials such as glass fiber, asbestos, or silicate; in this embodiment, it is a heat insulation strip. The heat insulation element 9 can prevent or reduce the heat conduction of the fixture 3 to its lower components, effectively preventing the heat generated by the heater from affecting the temperature of the lower components.

[0050] Furthermore, the flat-plate ejector pin demolding mechanism also includes a connecting block 7 and a wafer chuck 6; the wafer chuck 6 has the connecting block 7 built into it; the connecting block 7 is embedded in the bottom end of the fixture 3, and the two form a heat-insulating cavity; a heat insulation component 9 is disposed within the heat-insulating cavity. Based on the heat insulation component 9, a heat-insulating cavity is further provided to further reduce heat conduction between the fixture 3 and the wafer chuck 6, ensuring that the heat generated by the heater does not affect the temperature of the lower components of the fixture 3, thus improving the reliability of the equipment heating.

[0051] Secondly, the flat-plate ejector chip removal mechanism also includes a carrier plate 5, a rotary driver 8, and a conveyor belt 4. The rotary driver 8 is mounted on the carrier plate 5. The wafer chuck 6 is rotatably connected to the carrier plate 5. The conveyor belt 4 is wound around the side of the wafer chuck 6 and the shaft of the rotary driver 8. Specifically, the rotary driver 8 is a motor; the conveyor belt 4 is a sprocket or belt, and the side structure of the wafer chuck 6 is configured to conduct power to the conveyor belt 4, which can be achieved through meshing transmission. The rotary driver 8 drives the conveyor belt 4 to move, and the conveyor belt 4 in turn drives the wafer chuck 6 to rotate on the carrier plate 5, thereby adjusting the angle of the chip on the ejector plate 1 to facilitate the next process's chip removal.

[0052] Additionally, a roller 10 is rotatably connected to the carrier plate 5; the roller 10 is slidably connected to the outer wall of the conveyor belt 4; and the roller 10 presses to tighten the conveyor belt 4. The roller 10 can tighten the conveyor belt 4, enhancing the stability of the transmission.

[0053] It should be understood that the above description of the specific embodiments of this utility model is only for illustrating the technical route and features of this utility model, and its purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly. However, this utility model is not limited to the specific embodiments described above. All changes or modifications made within the scope of the claims of this utility model should be covered by the protection scope of this utility model.

Claims

1. A flat plate type ejection mechanism of a needle, characterized by comprising: The flat plate type ejector film stripping mechanism comprises a flat plate type ejector (1), a jig (3) and a tracheal joint (2); The flat plate type ejector (1) and the top end of the jig (3) form a negative pressure cavity, and the two are detachably connected through the negative pressure cavity; The tracheal joint (2) is arranged on the jig (3); The top end of the flat plate type ejector (1) is arranged with a plurality of ejectors in array; a plurality of suction holes are arranged on the top end of the flat plate type ejector (1); the tracheal joint (2), the negative pressure cavity and the suction holes are sequentially communicated; The blue film has a plurality of chips, and the ejector can pierce the blue film to make the blue film be adsorbed to the bottom end of the ejector.

2. The flat top ejection mechanism according to claim 1, wherein A stepped groove (31) is arranged on the inner wall of the jig (3); The bottom end of the flat plate type ejector (1) is arranged with a stepped block; the stepped block is embedded in the stepped groove (31).

3. The flat top ejection mechanism according to claim 1, wherein A heater is arranged on the jig (3).

4. The flat top ejection mechanism according to claim 3, wherein A thermistor is arranged in the negative pressure cavity.

5. The flat top ejection mechanism according to claim 3, wherein The bottom end of the jig (3) is arranged with a heat insulation piece (9).

6. The flat top ejection mechanism according to claim 5, wherein The flat plate type ejector film stripping mechanism further comprises a connecting block (7) and a wafer chuck (6); The wafer chuck (6) is built-in with the connecting block (7); The connecting block (7) is embedded in the bottom end of the jig (3), and the two form a heat insulation cavity; The heat insulation piece (9) is arranged in the heat insulation cavity.

7. The flat top ejection mechanism according to claim 6, wherein The flat plate type ejector film stripping mechanism further comprises a carrier plate (5), a rotary driver (8) and a conveying belt (4); The rotary driver (8) is mounted on the carrier plate (5); The wafer chuck (6) is rotationally connected to the carrier plate (5); The conveying belt (4) is arranged around the side surface of the wafer chuck (6) and the rotating shaft of the rotary driver (8).

8. The flat top ejection mechanism according to claim 7, wherein A roller (10) is rotationally connected to the carrier plate (5); The roller (10) is slidingly connected to the outer side wall of the conveying belt (4); and the roller (10) is pressed to tighten the conveying belt (4).

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